Device for accelerating curing of bonding glue of photovoltaic module

文档序号:1050541 发布日期:2020-10-13 浏览:8次 中文

阅读说明:本技术 一种加速光伏组件粘接胶固化的装置 (Device for accelerating curing of bonding glue of photovoltaic module ) 是由 徐晓华 连重炎 李涛 刘林 卢海江 于 2020-06-10 设计创作,主要内容包括:本发明公开了一种加速光伏组件粘接胶固化的装置,包括固化平台,所述固化平台的上方设置有热辐射装置和加湿器,所述热辐射装置发射热辐射,所述加湿器向下喷射雾化水汽,所述热辐射装置的上方竖直设置有气缸,所述气缸的底端固定连接热辐射装置和加湿器,且气缸的顶端固定在机架上。本技术方案提出的一种加速光伏组件粘接胶固化的装置利用环形热辐射装置和环形加湿器同时作用于光伏组件接线盒安装用粘接胶,提供高温高湿环境来加速其固化。同时,组件下方加热板,可提高粘接胶与组件粘接面的固化速率,经过综合作用,可大大缩短固化时间,缩短组件生产总时间,无需大量固化车来临时装载组件来等待组件固化,节约大量工厂占地面积。(The invention discloses a device for accelerating curing of bonding glue of a photovoltaic module, which comprises a curing platform, wherein a heat radiation device and a humidifier are arranged above the curing platform, the heat radiation device emits heat radiation, the humidifier sprays atomized water vapor downwards, an air cylinder is vertically arranged above the heat radiation device, the bottom end of the air cylinder is fixedly connected with the heat radiation device and the humidifier, and the top end of the air cylinder is fixed on a rack. The device for accelerating curing of the bonding glue of the photovoltaic module, which is provided by the technical scheme, utilizes the annular heat radiation device and the annular humidifier to simultaneously act on the bonding glue for mounting the junction box of the photovoltaic module, and provides a high-temperature and high-humidity environment to accelerate curing of the bonding glue. Simultaneously, the hot plate below the subassembly can improve the solidification rate of bonding glue and subassembly bonding face, through the combined action, can shorten curing time greatly, shortens the subassembly production total time, need not a large amount of solidification cars and comes the temporary loading subassembly to wait for the subassembly solidification, practices thrift a large amount of factory floor areas.)

1. The utility model provides a device of photovoltaic module bonding glue solidification with higher speed, includes solidification platform (1), its characterized in that, the top of solidification platform (1) is provided with heat radiation device (2) and humidifier (3), heat radiation device (2) transmission heat radiation, humidifier (3) downward spray atomizing steam, the vertical cylinder (4) that is provided with in top of heat radiation device (2), bottom fixed connection heat radiation device (2) and humidifier (3) of cylinder (4), and the top of cylinder (4) is fixed in the frame.

2. The device for accelerating the curing of the photovoltaic module adhesive according to claim 1, wherein the heat radiation device (2) comprises a reflector (21), a heat radiation source (22) is fixedly connected in the reflector (21), and the reflector (21) focuses heat radiation to the opening of the reflector (21).

3. The device for accelerating the curing of the photovoltaic module adhesive according to claim 2, wherein the reflector (21) is annular, and the cover opening is located at the bottom end of one side close to the center of the annular.

4. The device for accelerating the curing of the photovoltaic module adhesive according to claim 3, wherein the humidifier (3) is annular, and the humidifier (3) and the reflector (21) are coaxially arranged.

5. The device for accelerating the curing of the photovoltaic module adhesive according to any one of claims 1 to 4, wherein a heating plate (5) is fixedly connected to the top of the curing platform (1), and the heating plate (5) is positioned right below the heat radiation device (2).

Technical Field

The invention belongs to the technical field of photovoltaic module production, and particularly relates to a device for accelerating curing of a photovoltaic module bonding adhesive.

Background

Photovoltaic module terminal box installation mainly leans on the bonding glue to be connected on the subassembly, but the curing time of bonding glue is very long, under usual temperature and humidity environment (25 ℃, 50% RH), generally need 24 hours just can solidify the 2mm degree of depth, only accomplish preliminary curing, the subassembly just can get into next process, in order not to influence subsequent production like this, need set up the dolly specially and place uncured subassembly in order to wait for the solidification, general mill requires to solidify and can get into next process after 24 hours.

The assembly is cured by adopting common temperature and humidity conditions and a trolley placing mode, and has two biggest defects: 1. the trolley occupies a large area of a factory, and the land and construction cost of the factory are improved; 2. the assembly can enter the next procedure after being cured for 24 hours after being installed on the junction box, and the production period is long.

Disclosure of Invention

The invention provides a device for accelerating curing of a bonding adhesive of a photovoltaic module, aiming at the problems in the prior art.

The invention solves the technical problems through the following technical means: the utility model provides a device of solidification is glued to photovoltaic module bonding with higher speed, includes the solidification platform, the top of solidification platform is provided with heat radiation device and humidifier, heat radiation device transmission heat radiation, the humidifier sprays atomizing steam downwards, heat radiation device's top is vertical to be provided with the cylinder, the bottom fixed connection heat radiation device and the humidifier of cylinder, and the top of cylinder is fixed in the frame.

Furthermore, the heat radiation device comprises a reflecting cover, a heat radiation source is fixedly connected in the reflecting cover, and the reflecting cover focuses heat radiation to the cover opening of the reflecting cover.

Furthermore, the reflector is annular, and the cover opening of the reflector is positioned at the bottom end of one side close to the center of the annular.

Furthermore, the humidifier is annular, and humidifier and bowl coaxial setting.

Furthermore, the top fixedly connected with hot plate of solidification platform, and the hot plate is located heat radiating means under.

The invention has the beneficial effects that: the device for accelerating curing of the bonding glue of the photovoltaic module, which is provided by the technical scheme, utilizes the annular heat radiation device and the annular humidifier to simultaneously act on the bonding glue for mounting the junction box of the photovoltaic module, and provides a high-temperature and high-humidity environment to accelerate curing of the bonding glue.

Simultaneously, the hot plate below the subassembly can improve the solidification rate of bonding glue and subassembly bonding face, through the combined action, can shorten curing time greatly, shortens the subassembly production total time, need not a large amount of solidification cars and comes the temporary loading subassembly to wait for the subassembly solidification, practices thrift a large amount of factory floor areas.

Drawings

FIG. 1 is a schematic structural diagram of an apparatus for accelerating curing of a photovoltaic module bonding adhesive according to the present invention;

FIG. 2 is a schematic view showing the structure and operation of a heat radiation device according to the present invention;

FIG. 3 is a schematic cross-sectional view of an apparatus for accelerating the curing of a photovoltaic module adhesive according to the present invention;

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

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