阅读说明：本技术 显示装置及显示面板 (Display device and display panel ) 是由 李清亮 于 2020-06-28 设计创作，主要内容包括：本发明公开了一种显示装置及显示面板,显示面板具有显示区和位于所述显示区的至少一侧的非显示区,显示面板包括：薄膜晶体管阵列基板,薄膜晶体管阵列基板包括有机填充层和平坦化层,有机填充层位于非显示区的凹槽内,平坦化层覆盖有机填充层和薄膜晶体管阵列基板与显示区对应的部分；像素定义层,像素定义层覆盖平坦化层的至少一部分；发光功能层,发光功能层设置在薄膜晶体管阵列基板与显示区对应的部分；光阻层,光阻层覆盖发光功能层和像素定义层的至少一部分；无机材料层,无机材料层设置于薄膜晶体管阵列基板上；固化胶层,固化胶层设置在光阻层与非显示区对应的部分,并覆盖无机材料层。(The invention discloses a display device and a display panel, wherein the display panel is provided with a display area and a non-display area positioned on at least one side of the display area, and comprises: the thin film transistor array substrate comprises an organic filling layer and a planarization layer, wherein the organic filling layer is positioned in the groove of the non-display area, and the planarization layer covers the organic filling layer and the part of the thin film transistor array substrate corresponding to the display area; a pixel defining layer covering at least a portion of the planarization layer; the light emitting function layer is arranged on the part of the thin film transistor array substrate corresponding to the display area; a light resistance layer covering at least a part of the light emitting function layer and the pixel defining layer; the inorganic material layer is arranged on the thin film transistor array substrate; and the curing adhesive layer is arranged on the part of the light resistance layer corresponding to the non-display area and covers the inorganic material layer.)

1. A display panel having a display region and a non-display region on at least one side of the display region, the display panel comprising:

the thin film transistor array substrate comprises an organic filling layer and a planarization layer, wherein the organic filling layer is positioned in the groove of the non-display area, and the planarization layer covers the organic filling layer and the thin film transistor array substrate corresponding to the display area;

a pixel defining layer covering at least a portion of the planarization layer;

the light-emitting functional layer is arranged on the part of the thin film transistor array substrate corresponding to the display area;

a light-blocking layer covering at least a portion of the light-emitting functional layer and the pixel defining layer;

the inorganic material layer is arranged on the thin film transistor array substrate;

and the curing adhesive layer is arranged on the part of the light resistance layer corresponding to the non-display area and covers the inorganic material layer.

2. The display panel according to claim 1, wherein the cured adhesive layer covers the inorganic material layer, and a distance between a side of the cured adhesive layer adjacent to the display area and a side of the inorganic material layer adjacent to the display area is at least 200 μm.

3. The display panel of claim 1, wherein the thickness of the cured adhesive layer is between 30 microns and 200 microns.

4. The display panel of claim 1, further comprising a polarizer, wherein the polarizer is located on the photoresist layer, and a side of the polarizer close to the non-display area is attached to a side of the cured adhesive layer close to the display area.

5. The display panel according to claim 1, wherein the inorganic material layer is formed by filling an inorganic material in the trench.

6. The display panel according to claim 5, wherein the trench is formed by performing a patterning process on the planarization layer, the pixel defining layer, and the light blocking layer at one time, or wherein the trench is formed by performing a patterning process on the pixel defining layer and the light blocking layer at one time.

7. The display panel according to claim 5, wherein a material of the inorganic material layer comprises at least one of silicon oxide or silicon nitride.

8. The display panel according to any one of claims 1 to 7, wherein the cured adhesive layer is formed by curing an adhesive material by ultraviolet irradiation.

9. The display panel according to claim 8, further comprising an encapsulation layer disposed between the photoresist layer and the polarizer, the encapsulation layer comprising an inorganic film and an organic film alternately stacked.

10. A display device comprising the display panel according to any one of claims 1 to 9 and a touch-sensitive component, wherein the touch-sensitive component is disposed on the display panel or integrated in the display panel.

Technical Field

The invention relates to the technical field of display, in particular to a display device and a display panel.

Background

The OLED (Organic Light-Emitting Diode) has the advantages of Light weight, self-luminescence, wide viewing angle, low driving voltage, high luminous efficiency, low power consumption, high response speed and the like, and has an increasingly wide application range.

Foldable display panels, particularly dynamically Foldable display panels, have become a new technology that manufacturers compete with each other. At present, an organic film structure is added to a film of an Array substrate or a flexible PI substrate is used to replace a traditional glass substrate, so that the dynamic bending capability can be improved, and the common technical means for realizing the flexible and bendable function of the display panel is provided. However, the Bending process may cause cracks (Crack) in the bonding area (Pad bonding) lines, which may cause the problem that the display panel is not lit or abnormal in display.

Therefore, a new technical solution is needed to solve the above technical problems.

Disclosure of Invention

The embodiment of the invention provides a display device and a display panel, which are used for solving the problem that the display panel is not lightened or abnormal in display caused by cracks generated in the dynamic bending process of the display panel.

An embodiment of the present invention provides a display panel, where the display panel has a display area and a non-display area located on at least one side of the display area, and the display panel includes:

the thin film transistor array substrate comprises an organic filling layer and a planarization layer, wherein the organic filling layer is positioned in the groove of the non-display area, and the planarization layer covers the organic filling layer and the thin film transistor array substrate corresponding to the display area;

a pixel defining layer covering at least a portion of the planarization layer;

the light-emitting functional layer is arranged on the part of the thin film transistor array substrate corresponding to the display area;

a light-blocking layer covering at least a portion of the light-emitting functional layer and the pixel defining layer;

the inorganic material layer is arranged on the thin film transistor array substrate;

and the curing adhesive layer is arranged on the part of the light resistance layer corresponding to the non-display area and covers the inorganic material layer.

In the display panel provided in the embodiment of the present invention, the cured adhesive layer covers the inorganic material layer, and a distance between one side of the cured adhesive layer close to the display area and one side of the inorganic material layer close to the display area is at least 200 micrometers.

In the display panel provided by the embodiment of the invention, the thickness of the cured adhesive layer is between 30 micrometers and 200 micrometers.

In the display panel provided by the embodiment of the invention, the display panel further comprises a polarizer, the polarizer is positioned on the light resistance layer, and one side surface of the polarizer, which is close to the non-display area, is attached to one side surface of the curing adhesive layer, which is close to the display area.

In the display panel provided in the embodiment of the present invention, the inorganic material layer is formed by filling an inorganic material in the trench.

In the display panel provided in the embodiment of the present invention, the trench is formed by performing a single patterning process on the planarization layer, the pixel defining layer, and the photoresist layer, or the trench is formed by performing a single patterning process on the pixel defining layer and the photoresist layer.

In the display panel provided by the embodiment of the invention, the material of the inorganic material layer includes at least one of silicon oxide or silicon nitride.

In the display panel provided by the embodiment of the invention, the curing adhesive layer is formed by irradiating a curing adhesive material with ultraviolet light.

In the display panel provided in the embodiment of the present invention, the display panel further includes an encapsulation layer, the encapsulation layer is disposed between the photoresist layer and the polarizer, and the encapsulation layer includes an inorganic film and an organic film that are alternately stacked.

An embodiment of the present invention further provides a display device, which includes the display panel and the touch device, where the touch device is disposed on the display panel or integrated in the display panel.

In the display panel provided in the embodiment of the present invention, the cured adhesive layer covering the inorganic material layer is disposed on the photoresist layer, so that the non-display area can be structurally reinforced, thereby improving the problem of poor lighting or abnormal display of the display panel caused by cracks generated during the dynamic bending process of the display panel.

In order to make the aforementioned and other objects of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;

fig. 2 is another schematic structural diagram of a display panel according to an embodiment of the invention;

fig. 3 is a schematic diagram of a display device according to an embodiment of the invention.

Detailed Description

For purposes of clarity, technical solutions and advantages of the present invention, the present invention will be described in further detail with reference to the accompanying drawings, wherein like reference numerals represent like elements, and the following description is based on the illustrated embodiments of the present invention and should not be construed as limiting the other embodiments of the present invention which are not described in detail herein. The word "embodiment" as used herein means an example, instance, or illustration.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1, an embodiment of the invention provides a display panel, in which a display panel 100 has a display area AA and a non-display area NA located on at least one side of the display area AA, and the display panel 100 includes a thin film transistor array substrate 10, a pixel defining layer 20, a light emitting functional layer 30, a photoresist layer 40, an inorganic material layer 50, and a cured adhesive layer 60.

Specifically, the thin film transistor array substrate 10 includes an organic filling layer 101 and a planarization layer 102, the organic filling layer 101 is located in the groove 101a of the non-display area NA, and the planarization layer 102 covers the organic filling layer 101 and the thin film transistor array substrate 10 corresponding to the display area AA. The groove 101a is formed by performing a photolithography process on the thin film transistor array substrate 10. The organic filling layer 101 is made of organic materials, and the organic filling layer 101 arranged in the non-display area NA can effectively reduce the bending stress of the non-display area NA and improve the bending performance. The thin film transistor array substrate 10 further includes a substrate, a buffer layer, a gate insulating layer, a gate electrode, an active layer, a source-drain metal layer, a passivation layer, etc. (not shown in the drawings). The structure of the thin film transistor array substrate belongs to the prior art, and is not described herein again.

The pixel defining layer 20 covers at least a portion of the planarization layer 102. The light emitting function layer 30 is disposed on a portion of the thin film transistor array substrate 10 corresponding to the display area AA, that is, an opening is disposed at a position of the pixel defining layer 20 corresponding to the display area AA, and the light emitting function layer 30 is disposed in the opening. The light-emitting function layer 30 includes an anode layer 301, a light-emitting layer 302, and a cathode layer 303. The material of the anode layer 301 includes Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO). The pixel defining layer 20 may be an organic layer or an inorganic layer, but is preferably an organic layer, and the pixel defining layer 20 is more preferably composed of one of BCB (benzocyclobutene), acrylic polymer, and polyimide. The cathode layer 303 may be composed of any one of magnesium, silver, aluminum, calcium, and alloys thereof. Note that, in order to improve the light-emitting performance of the light-emitting layer 302, a first auxiliary functional layer (not shown) may be provided between the anode layer 301 and the light-emitting layer 302, and the first auxiliary functional layer may have a multilayer structure, which is a hole-type auxiliary functional layer. For example, a hole injection layer, a hole transport layer, and a hole blocking layer. And a second auxiliary functional layer (not shown) is provided between the light emitting layer 302 and the cathode layer 303, the second auxiliary functional layer being an electron-type auxiliary functional layer, which also has a multilayer structure and may include an electron transport layer, an electron injection layer, and a hole blocking layer. The anode layer 301 is electrically connected to a source drain metal layer (not shown) on the tft array substrate 10 through a via hole.

The light blocking layer 40 covers at least a portion of the light emitting function layer 30 and the pixel defining layer 20.

And the inorganic material layer 50, the inorganic material layer 50 is disposed on the thin film transistor array substrate 10. The inorganic material layer 50 is formed by filling an inorganic material in the trench 501. The material of the inorganic material layer 50 includes at least one of silicon oxide or silicon nitride. Inorganic materials are filled in the grooves 501, so that damage to the display panel caused by invasion of water and oxygen can be effectively prevented.

Further, the trench 501 is formed by performing a patterning process on the planarization layer 102, the pixel defining layer 20, and the photoresist layer 40 once. For example, a predetermined mask is irradiated with ultraviolet light to remove the photoresist layer 40 corresponding to the bottom of the trench 501. The planarization layer 102 and the pixel defining layer 20 corresponding to the bottom of the trench 501 are removed using an etching process. As shown in fig. 1, in this embodiment, the side of the trench 501 is configured as a "Z" structure, that is, the width of the etched planarization layer 102 is smaller than the width of the etched pixel defining layer 20, and the width of the etched pixel defining layer 20 is smaller than the width of the etched photoresist layer 40, so as to effectively increase the contact area between the side of the trench 501 and the planarization layer 102, the pixel defining layer 20 and the photoresist layer 40, and further improve the adhesion between the inorganic material layer and the planarization layer 102, and between the pixel defining layer 20 and the photoresist layer 40.

Alternatively, in the embodiment of the present invention, referring to fig. 2, the trench 501 is formed by performing a patterning process on the pixel defining layer 20 and the photoresist layer 40. That is, the trench 501 in the embodiment of the present invention is formed by etching only the pixel defining layer 20 and the photoresist layer 40. For example, a predetermined mask is irradiated with ultraviolet light to remove the photoresist layer 40 corresponding to the bottom of the trench 501. The pixel defining layer 20 corresponding to the bottom of the trench 501 is removed using an etching process. In this embodiment, the material of the planarization layer 102 is an inorganic substance, for example, the material of the planarization layer 102 is silicon nitride (SiNx) or silicon oxide (SiOx). In the embodiment, the material of the planarization layer 102 and the material filled in the trench 501 are both inorganic substances, which can effectively improve the adhesion between the inorganic material layer 50 and the planarization layer 102, thereby improving the stability of the display panel.

Referring to fig. 1 or fig. 2, the display panel 100 in the embodiment of the invention further includes a cured adhesive layer 60, wherein the cured adhesive layer 60 is disposed on a portion of the photoresist layer 40 corresponding to the non-display area NA and covers the inorganic material layer 50. Specifically, the cured adhesive layer 60 covers the inorganic material layer 50, and a distance d between a side of the cured adhesive layer 60 close to the display area AA and a side of the inorganic material layer 50 close to the display area AA is at least 200 μm. For example, a distance d between one side of the cured adhesive layer 60 close to the display area AA and one side of the inorganic material layer 50 close to the display area AA is any one of 200 micrometers, 210 micrometers, 220 micrometers, 230 micrometers, 240 micrometers, 250 micrometers, 260 micrometers, 270 micrometers, 290 micrometers, 300 micrometers, 320 micrometers, or 350 micrometers. The thickness of the cured adhesive layer 60 is between 30 microns and 200 microns. For example, the thickness of the cured bondline 60 is any one of 30 microns, 40 microns, 50 microns, 60 microns, 70 microns, 80 microns, 100 microns, 130 microns, 150 microns, 170 microns, 190 microns, or 200 microns. The cured adhesive layer 60 is disposed on the portion of the photoresist layer 40 corresponding to the non-display area NA, so as to structurally reinforce the non-display area NA, thereby improving the problem of circuit breakage of the non-display area NA during bending. Wherein the curing glue layer is formed by irradiating the curing glue material by ultraviolet light. Specifically, the curing glue material consists of 40-60% of monomer, 1-6% of initiator and 40-60% of prepolymer by mass. Specifically, the photoinitiator absorbs ultraviolet light under the irradiation of ultraviolet light to generate active free radicals or cations to initiate the polymerization and crosslinking chemical reaction of monomers, so that the adhesive is quickly changed from liquid to solid. Wherein the monomer comprises isobornyl acrylate, isobornyl methacrylate, monoethylene glycol diacrylate, neopentyl glycol diacrylate and the like. The initiator includes diphenylacetone and the like. Prepolymers include epoxy acrylates, urethane acrylates, polyether acrylates, polyester acrylates, acrylics, and the like.

Since the material of the inorganic material layer 50 is inorganic and the material of the cured adhesive layer 60 is organic, the adhesion between the inorganic material layer 50 and the cured adhesive layer 60 is poor. Therefore, in order to effectively improve the adhesion between the cured adhesive layer 60 and the inorganic material layer 50 and the photoresist layer 40, at least one groove is formed on the inorganic material layer 50 near the first surface of the cured adhesive layer 60 for increasing the contact area between the inorganic material layer 50 and the cured adhesive layer 60, so as to improve the contact area between the inorganic material layer and the cured adhesive layer 60 and improve the stability of the display panel 100.

Further, with reference to fig. 1 or fig. 2, the display panel 100 in the embodiment of the present invention further includes a polarizer 70, wherein the polarizer 70 is located on the photoresist layer 40 and covers the display area AA, and a side of the polarizer 70 close to the non-display area NA is attached to a side of the cured adhesive layer 60 close to the AA display area. The polarizer 70 is used to reduce the reflectivity of the display panel 100, so as to achieve the effect of black integration when the panel is turned off. One side of the cured adhesive layer 60 is attached to one side of the polarizer 70, so that the bending stress of the non-display area NA can be effectively reduced. It should be noted that, in the embodiment of the present invention, a distance between a side of the polarizer 70 close to the non-display area NA and a side of the cured adhesive layer 60 close to the AA display area may also be greater than zero.

Optionally, the display panel 100 of the present invention further includes an encapsulation layer 80, wherein the encapsulation layer 80 is disposed between the photoresist layer 40 and the polarizer 70, and the encapsulation layer 80 includes an inorganic film and an organic film that are alternately stacked. For example, the encapsulation layer is formed by sequentially laminating an inorganic thin film, an organic thin film, and an inorganic thin film. Because the outer layer of the structure of the packaging layer 80 is an inorganic film, the display area AA can be effectively sealed and isolated, and further the adverse effect of the external corrosive gas such as water and the like on the display area AA can be effectively avoided.

Referring to fig. 3, an embodiment of the invention further includes a display device, and the display device 200 includes the display panel 100 and the touch device 110, wherein the touch device 110 is disposed on the display panel 100 or integrated with the display panel 110. The structure of the display panel 100 is as above, and will not be described herein.

In the display panel provided in the embodiment of the present invention, the cured adhesive layer covering the inorganic material layer is disposed on the photoresist layer, so that the non-display area can be structurally reinforced, thereby improving the problem of poor lighting or abnormal display of the display panel caused by cracks generated during the dynamic bending process of the display panel.

In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.