阅读说明：本技术 柔性基板及其制作方法以及电子装置 (Flexible substrate, manufacturing method thereof and electronic device ) 是由 周黎斌 任竹运 于 2018-02-07 设计创作，主要内容包括：本发明公开一种柔性基板的制作方法,包括以下步骤：提供一刚性基板；在所述刚性基板上形成至少一个图案化的光阻层；在每个光阻层上形成柔性基底；朝向所述刚性基板远离所述柔性基底一侧发射激光,使得所述激光通过所述刚性基板后照射到所述光阻层,所述柔性基底及所述光阻层从所述刚性基板剥离,进而形成所述柔性基板。由于在刚性基板形成光阻层,使得所述柔性基板更容易剥离,提高了所述柔性基板的剥离效率,避免在剥离过程中对所述柔性基底上的结构造成损坏,进而提高了柔性基板的制程良率。本发明亦提供一种柔性基板和电子装置。(The invention discloses a manufacturing method of a flexible substrate, which comprises the following steps: providing a rigid substrate; forming at least one patterned photoresist layer on the rigid substrate; forming a flexible substrate on each photoresist layer; and emitting laser towards one side of the rigid substrate, which is far away from the flexible substrate, so that the laser irradiates the photoresist layer after passing through the rigid substrate, and the flexible substrate and the photoresist layer are stripped from the rigid substrate, thereby forming the flexible substrate. The flexible substrate is easier to strip due to the fact that the photoresist layer is formed on the rigid substrate, stripping efficiency of the flexible substrate is improved, damage to the structure on the flexible substrate in the stripping process is avoided, and the process yield of the flexible substrate is improved. The invention also provides a flexible substrate and an electronic device.)

A manufacturing method of a flexible substrate is characterized by comprising the following steps:

providing a rigid substrate;

forming at least one patterned photoresist layer on the rigid substrate;

forming a flexible substrate on each photoresist layer; and

and emitting laser towards one side of the rigid substrate, which is far away from the flexible substrate, so that the laser irradiates the photoresist layer after passing through the rigid substrate, and the flexible substrate and the photoresist layer are stripped from the rigid substrate, thereby forming the flexible substrate.

The method of claim 1, wherein the photoresist layer includes a trench extending through the photoresist layer, each flexible substrate includes a main body and at least one extension extending from a side of the main body, each extension being received in one of the trenches and connected to the rigid substrate.

The method of claim 1, wherein said forming at least one patterned photoresist layer on said rigid substrate comprises:

coating a photo-resist material on at least one configured area of the rigid substrate;

curing the photoresist material;

exposing the photoresist material from one side of a photomask by light; and

and developing the photoresist material after exposure treatment to form the photoresist layer.

The method of claim 1, wherein said forming a flexible substrate over each photoresist layer comprises the steps of:

coating a flexible material on the photoresist layer;

and curing the flexible material to form the flexible substrate.

The method of claim 1, wherein the flexible substrate is made of polyimide.

The method of claim 1, wherein the laser light has a wavelength of 308 nm.

The method of claim 1, wherein the rigid substrate is glass.

The method of claim 1, wherein the photoresist layer is made of a positive photoresist material.

The flexible substrate is characterized by comprising a flexible substrate and a patterned photoresist layer, wherein the flexible substrate is arranged on the photoresist layer.

The flexible substrate of claim 9, wherein the flexible substrate comprises a main body and an extension portion extending from a side of the main body, the photoresist layer is disposed on a side of the main body, the photoresist layer comprises at least one groove extending through the photoresist layer, and each extension portion is received in one of the grooves.

The flexible substrate of claim 10, wherein the photoresist layer comprises at least a plurality of spaced apart photoresist portions, each two spaced apart photoresist portions forming one of the grooves.

The flexible substrate of claim 9, wherein the photoresist layer is made of a positive photoresist material.

The flexible substrate of claim 9, wherein the flexible base is made of polyimide.

An electronic device comprising the flexible substrate according to any one of claims 9 to 13.