阅读说明：本技术 发光装置 (Light emitting device ) 是由 林小郎 蔡宗翰 于 2020-02-20 设计创作，主要内容包括：本发明公开一种发光装置,包含多个发光元件、多个颜色转换元件以及保护层。多个颜色转换元件设置在多个发光元件的至少一部分上,保护层设置在多个颜色转换元件上,其中保护层可以包含一种多层结构。(The invention discloses a light-emitting device, which comprises a plurality of light-emitting elements, a plurality of color conversion elements and a protective layer. The plurality of color conversion elements are disposed on at least a portion of the plurality of light emitting elements, and the protective layer is disposed on the plurality of color conversion elements, wherein the protective layer may comprise a multilayer structure.)

1. A light emitting device, comprising:

a plurality of light emitting elements;

a plurality of color conversion elements disposed on at least a portion of the plurality of light emitting elements; and

a protective layer disposed on the plurality of color conversion elements;

wherein the protective layer is a multilayer structure.

2. The light-emitting device according to claim 1, wherein the multi-layer structure comprises an organic layer and a first inorganic layer disposed thereon.

3. The light-emitting device according to claim 2, wherein a thickness of the organic layer is larger than a thickness of the first inorganic layer.

4. The light-emitting device according to claim 2, wherein the multilayer structure further comprises a second inorganic layer, and wherein the organic layer is provided between the first inorganic layer and the second inorganic layer.

5. The light-emitting device according to claim 4, wherein a thickness of the first inorganic layer is different from a thickness of the second inorganic layer.

6. The light-emitting apparatus according to claim 1, wherein the plurality of color conversion elements are provided only on the at least a part of the plurality of light-emitting elements.

7. The light-emitting device according to claim 6, wherein the plurality of color conversion elements output red light, green light, or a combination of red light and green light.

8. The light-emitting apparatus according to claim 1, wherein the plurality of color conversion elements are provided on the plurality of light-emitting elements, respectively.

9. The light-emitting apparatus according to claim 1, wherein the plurality of light-emitting elements emit blue light.

10. The light-emitting device according to claim 1, wherein the multilayer structure comprises at least one insulating layer.

11. The light-emitting device according to claim 1, wherein the multilayer structure comprises at least one conductive layer.

12. The light-emitting device according to claim 1, wherein the protective layer has a top surface, and wherein the top surface comprises a plurality of pits.

13. The light-emitting device according to claim 12, wherein positions of the plurality of pits correspond to the plurality of color conversion elements.

14. The light-emitting apparatus according to claim 1, further comprising:

and the blue light blocking layer is arranged on the protective layer.

15. The light-emitting apparatus according to claim 1, further comprising a plurality of cavities, wherein the plurality of color conversion elements are respectively disposed in the plurality of cavities.

16. The light-emitting device according to claim 1, wherein the plurality of color conversion elements are provided on a surface of a flat layer.

17. The light-emitting apparatus according to claim 1, wherein a thickness of the protective layer is larger than a thickness of one of the plurality of color conversion elements.

18. The light emitting apparatus of claim 1, wherein the protective layer has one or more distributed bragg reflector layers.

19. The light-emitting device according to claim 1, wherein the protective layer comprises a distributed bragg reflector layer and an organic filter.

20. The light-emitting device according to claim 1, wherein the protective layer comprises a distributed bragg reflector layer, an inorganic conductive layer, and an organic filter interposed between the distributed bragg reflector layer and the inorganic conductive layer.

Technical Field

The present invention relates to a light emitting device, and more particularly, to a light emitting device that may have a protective layer of an inorganic-organic multilayer structure.

Background

The reliability of Quantum Dot (QD) materials in electronic devices is still not good enough. Exposure to moisture or oxygen can degrade the performance of the quantum dots and cause the quantum dots to fail to function properly. Since the requirement for a protective layer for quantum dots is very high in various quantum dot-organic light emitting device structures, conventional quantum dot-organic light emitting device (QD-OLED) structures also cannot effectively protect the quantum dots from damage.

In the fabrication process of quantum dot-organic light emitting devices, the requirements for light resistance, heat resistance, water resistance, oxygen resistance, and chemical resistance are challenged and necessary. Therefore, the quantum dot layer in various quantum dot-organic light emitting device structures is not well protected by the protective structure from light, heat, moisture, oxygen and chemicals.

Disclosure of Invention

Accordingly, the present invention is directed to a light emitting device to solve the problems encountered in the prior art.

According to an embodiment of the present invention, the light emitting device may include a plurality of light emitting elements, a plurality of color conversion elements, and a protective layer. A plurality of color conversion elements may be disposed on at least a portion of the plurality of light emitting elements, and a protective layer may be disposed on the plurality of color conversion elements, wherein the protective layer may be a multilayer structure.

Drawings

Fig. 1A is a schematic structural diagram of a cross-sectional view of a light-emitting device according to an embodiment of the present invention.

Fig. 1B is a schematic diagram of a cross-sectional view of a light-emitting device according to a first embodiment variation of the present invention.

Fig. 1C is a schematic view of a cross-sectional view of a light-emitting device according to another first embodiment variation of the present invention.

Fig. 2 is a schematic diagram of a top view of a pixel in a light emitting device according to another embodiment of the present invention.

Fig. 3 is a schematic diagram of a cross-sectional view of a protective layer according to various modified embodiments of the present invention.

Fig. 4 is a schematic diagram of a cross-sectional view of a light emitting device according to various modified embodiments of the present invention.

Fig. 5 is a schematic diagram of a cross-sectional view of a plurality of light emitting elements in a light emitting device according to another embodiment of the present invention.

Fig. 6 is a schematic diagram of a cross-sectional view of a plurality of quantum dots in a light emitting device according to another embodiment of the present invention.

Fig. 7 is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 8A is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 8B is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 9 is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 10A is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 10B is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 10C is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 10D is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 10E is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 10F is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 10G is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Fig. 10H is a schematic diagram of a cross-sectional view of a light emitting device according to another embodiment of the present invention.

Description of reference numerals: 100-a light emitting device; 101-pixels; 102-red sub-pixel; 103-green sub-pixel; 104-blue sub-pixel; 106-a pixel defining layer; 107. 108, 109-pits; 110-a light emitting element; 111-an electrode layer; 111' -a cathode; 112-anode layer, electrode layer; 112' -a connecting element; 113-a light-emitting layer; 113' -a monolithic layer; 114-a light emitting diode; 116. 117, 118-cavity; 115-a spacer; 120-a color conversion element; 121. 122-quantum dots; 129-inorganic layer; 130-a protective layer; 139-top surface; 131-an inorganic layer; 131f — an inorganic layer; 131 t-surface; 132-an organic layer; 132 f-filter; 132 t-top surface; 133-inorganic layer; 133 f-conductive layer; 134-organic layer; 134 f-organic layer; 140-a protective layer; 141-a transistor; 142-a semiconductor layer; 143-a drain; 144-source; 145-gate; 150-a planarization layer; 151-surface; 160-black matrix; i-an inorganic layer; an O-organic layer; tg, To, Tp1, Tp 2-thickness.

Detailed Description

The following detailed description of the present disclosure is provided in conjunction with specific embodiments and accompanying drawings, and in order to make the disclosure more clear and understandable, the following figures are schematic views that may be simplified and characterized by elements that may not be drawn to scale. The number and size of the elements in the drawings are merely illustrative, and are not intended to limit the scope of the present invention.

Certain terms are used throughout the description and following claims to refer to particular elements. It will be understood by those skilled in the art that electronic device manufacturers may refer to elements by different names, and that this document does not intend to distinguish between elements that are functionally the same, but that have different names. When the terms "comprises," "comprising," and/or "having" are used in this specification, they specify the presence of stated features, regions, steps, operations, and/or elements, but do not preclude the presence or addition of one or more other features, regions, steps, operations, elements, and/or groups thereof.

When an element such as a layer or region is referred to as being "on" or extending "onto" another element (or variations thereof), it can be directly on or extend directly onto the other element or intervening elements may also be present. On the other hand, when an element is referred to as being "directly on" or extending "directly onto" another element (or variations thereof), there are no intervening elements present between the two. Also, when an element is referred to as being "coupled" to another element (or variations thereof), it can be directly connected to the other element or indirectly connected (e.g., electrically connected) to the other element through one or more elements.

It should be noted that the technical solutions provided in the following different embodiments can be used alternatively, combined or mixed with each other to form another embodiment without departing from the spirit of the present invention.

Fig. 1A is a schematic structural diagram of a cross-sectional view of a light emitting device 100 according to an embodiment of the invention. The light emitting device 100 may include a plurality of light emitting elements 110, a Pixel Defining Layer (PDL)106, a plurality of spacers 115, a plurality of color conversion elements 120, and a protective layer 130, but the present invention is not limited thereto. The spacer 115 may be optionally provided corresponding to the Pixel Defining Layer (PDL)106 so as not to shield the light emitting region.

In one embodiment, the light emitting element 110 may include an Organic Light Emitting Diode (OLED), a Light Emitting Diode (LED), a micro light emitting diode (micro LED), a mini LED or a quantum dot light emitting diode (QLED), a fluorescent light (phosphor), a phosphorescent light (phosphor), or other suitable materials, and the materials may be arranged and combined arbitrarily, but the present invention is not limited thereto. The light emitting element 110 may emit blue light of a main peak (maximum peak) wavelength ranging from 440 nanometers (nm) to 470 nanometers for blue light, or blue light of a main wavelength (maximum peak) ranging from 450 nanometers ± 10 nanometers to obtain better optical performance, but the present invention is not limited thereto.

In another embodiment, the light emitting element 110 may emit a mixed light. For example, mixed light is formed by mixing blue light having a main peak wavelength (maximum peak value) in a range of 461 nm to 473 nm and another blue light having a main peak wavelength (maximum peak value) in a range of 440 nm to 460 nm, wherein in the stacked structure of the light emitting element 110, two light emitting elements (e.g., light emitting layers) may be included, one of which may emit blue light having a main peak (maximum peak value) wavelength at about 450 nm and the other of which may emit blue light having a main peak (maximum peak value) wavelength of about 467 nm, but the present invention is not limited thereto. The light emitting elements may be vertically stacked or horizontally disposed (e.g., side-by-side) within one electronic unit. In some embodiments, the light emitting element 110 may comprise one or more light emitting elements.

One light emitting element 110 may include a first electrode layer 111, a second electrode layer 112, and a light emitting layer 113. When the light emitting element 110 is an organic light emitting diode, the light emitting layer 113 may include, but is not limited to, for example, a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an Emission Layer (EL), an Electron Transport Layer (ETL), an Electron Injection Layer (EIL), and/or a Charge Generation Layer (CGL). The emissive layer may comprise a suitable organic light emitting material and may be used to produce a suitable blue light. In addition, depending on the type of the first electrode layer 111, the first electrode layer 111 may include one of a cathode and an anode, and the second electrode layer 112 may be a corresponding anode or cathode. The light emitting layer 113 may or may not contact the adjacent spacer 115.

The second electrode layer 112 may be disposed on the passivation layer 140, and the connection element 112' may penetrate through the passivation layer 140 to electrically connect the second electrode layer 112 to the transistor 141 of the light emitting device 100. The passivation layer 140 may be an insulating passivation layer, and the material of the passivation layer 140 may be similar to the passivation layer 130, for example. In one embodiment, the second electrode layer 112 may be formed simultaneously with the connection elements 112' as an integrally formed element. In another embodiment, the second electrode layer 112 may be formed after the connection element 112' is formed.

For example, the transistor 141 may be a Thin Film Transistor (TFT) responsible for the on/off state of the light emitting element 110. The first electrode layer 111 and the second electrode layer 112 electrically connected to the transistor 141 can be used to control the on/off state of the corresponding light emitting element 110. In other embodiments, the above layers may be added or removed as desired, but the invention is not limited thereto. The first electrode layer 111 may include a common electrode for the plurality of light emitting elements 110.

The thin film transistor 141 can be used as a switching element for driving the light emitting element 110 in the light emitting device 100. The thin film transistor 141 may include a semiconductor layer 142, a drain electrode 143, a source electrode 144, and a gate electrode 145. The semiconductor layer includes a semiconductor material such as silicon or a metal oxide, but the present invention is not limited thereto. For example, the semiconductor layer may include amorphous silicon, polycrystalline silicon, or Indium Gallium Zinc Oxide (IGZO). The semiconductor layer may include a source contact, a drain contact, and a channel disposed between the source contact and the drain contact in one thin film transistor 141. The drain and the source are electrically connected to the semiconductor layer, respectively. The gate electrode is separated from the channel by a gate dielectric layer. The gate electrode, the source electrode, and the drain electrode may include a conductive material (e.g., a metal, but the present invention is not limited thereto). Note that the structure of the thin film transistor 141 shown in fig. 1 is for illustration only, and does not limit the possible types or structures of the thin film transistor 141 of the present invention, so that any other suitable TFT structure is possible instead of the thin film transistor 141 shown. For example, a top gate thin film transistor or a bottom gate thin film transistor may be used as the thin film transistor in the modified embodiment.

Fig. 1B is a schematic diagram of a cross-sectional view of a light-emitting device according to a first embodiment variation of the present invention. As shown in fig. 1B, the light emitting elements 110 may include micro light emitting diodes or mini light emitting diodes 114, a cathode 111' and an anode layer 112 without spacers. In other words, the second electrode layer may comprise the anode layer 112. The micro or mini light emitting diodes 114 may be of a vertical type and may share a common cathode layer, i.e. for example the first electrode layer 111 may be located above the micro or mini light emitting diodes.

Fig. 1C is a schematic diagram of a cross-sectional view of a light-emitting device 100 according to another first embodiment variation of the present invention. As shown in fig. 1C, the plurality of light emitting elements 110 may include a plurality of micro or mini light emitting diodes 114, a cathode 111' and an anode layer without spacers. For example, the second electrode layer 112 may comprise an anode layer. The micro or mini light emitting diodes 114 may be flip-type and may share a common cathode layer, i.e. for example the first electrode layer 111 may be located on top of the micro or mini light emitting diodes 114. Both the cathode 111' and anode layers may be disposed below the pixel defining layer 106 and are therefore coplanar. Micro-leds or mini-leds 114 may be disposed within insulating layer 146.

The color conversion element 120 may comprise a wavelength conversion element to adjust the output light of the light emitting device 100. For example, the color conversion element 120 may include quantum dots, phosphorescent materials, dyes, or filters. The quantum dots may be composed of a semiconductor nanocrystal structure and may include CdSe, CdS, CdTe, ZnSe, ZnTe, ZnS, HgTe, InAs, Cd1-xZnxSe1-ySy, CdSe/ZnS, InP, and GaAs, but the present invention is not limited thereto. The particle size of the quantum dots is typically between 1 nm and 30 nm, 1 nm and 20 nm, or 1 nm and 10 nm. When the quantum dots 121, 122 are excited by the input light, the input light will be converted into the emission light of other colors by the quantum dots. The color of the emitted light can be tuned by changing the material or size of the quantum dots. In some embodiments, the quantum dots may comprise spherical particles, rod-like particles, or particles having any other suitable shape, so long as the quantum dots can emit light having a suitable color. The color conversion element 120 may be used to output visible light. For example, the color conversion element 120 may output blue light, cyan light, green light, yellow light, red light, or a combination thereof, but the present invention is not limited thereto. In the present invention, the above output light can be regarded as the final visible light of the light emitting device 100 perceived by the user (observer).

A plurality of color conversion elements 120 may be disposed on at least a portion of the plurality of light emitting elements 110 and defined by the pixel defining layer 106. In one embodiment, a plurality of color conversion elements 120 may be disposed on the plurality of light emitting elements 110, respectively. For example, one color conversion element 120 is disposed on one light emitting element 110, but the present invention is not limited thereto. In another embodiment, the plurality of color conversion elements 120 may be disposed on only a portion of the plurality of light emitting elements 110. Alternatively, in yet another embodiment, not every light emitting element 110 has a color conversion element 120 disposed thereon, although the invention is not limited thereto.

The protective layer 130 may be disposed on the plurality of color conversion elements 120 to protect the light emitting element 110 or the color conversion elements 120 from damage, such as damage caused by moisture or oxygen. The protective layer 130 may be in the form of a multi-layer structure, such as a stacked structure including a plurality of layers. In one embodiment, the protective layer 130 may have a top surface 139. For example, the protective layer 130 may include at least one inorganic layer 131 having a thickness of Ti1, and at least one organic layer 132 having a thickness To. The inorganic layer 131 may be a functional inorganic layer, and the organic layer 132 may be a functional organic layer.

In another embodiment, at least one inorganic layer 133 of Ti2 thickness in the protective layer 130 may cover the light emitting element 110 in a conformal manner, such that such inorganic layer 133 in the protective layer 130 may be uneven. In yet another embodiment, if an inorganic layer 131 is on an organic layer 132 having a top surface 132t, the inorganic layer 131 will also have a surface 131t accordingly. One organic layer 132 may be stacked on one inorganic layer 133, or one inorganic layer 131 may be disposed on one organic layer 132. Another inorganic layer 129 may be present between the protective layer 130 and the color conversion element 120. The thickness of each Ti1, To, or Ti2 may be determined To be above or below the color conversion element 120.

The organic layer 132 may include an organic material, and may provide a surface for the inorganic layer 131 positioned on top of the organic layer 132, so that the inorganic layer 131 may also have a surface. For example, the organic layer 132 may be a filter layer having a thickness of 2 micrometers (μm) to 3 micrometers in order for the light emitting device 100 to improve its optical performance, but the present invention is not limited thereto. Alternatively, the organic layer 132 may comprise a transparent polymeric material. For example, the polymeric material may comprise an acrylic material or a methacrylic material.

Fig. 2 is a schematic diagram of a top view of a pixel 101 in a light-emitting device 100 according to another embodiment of the present invention. In general, the organic layer 132 may span at least two subpixels, such as the red subpixel 102, the green subpixel 103, or further the blue subpixel 104, or may span three or more subpixels, so the pixel 101 may have three or more subpixels of different colors. The protective layer 130 is transparent to light of a particular wavelength, such as blue, cyan, green, yellow, or red light.

Fig. 3 is a schematic diagram of a cross-sectional view of a protective layer 130 according to various modified embodiments of the present invention. In the modified embodiment a1 of the present invention, the protection layer 130(I) may be composed of a single organic layer 132 and a single inorganic layer 131 on the organic layer 132. This configuration can have the simplest structure that satisfies the requirements of the protective layer 130. In another variation of the present invention a2, the protection layer 130(II) may also be composed of a single organic layer 132 sandwiched between a first inorganic layer 131 and a second inorganic layer 133. The top inorganic layer 131 in this configuration may serve as a barrier layer for the organic layer 132 to allow it to safely pass through the process steps at a later stage of the process. The organic layer 132, in this configuration, may also provide a strong support for the inorganic layer 131 at the bottom. The bottom inorganic layer 133 in this configuration, in turn, may serve as a buffer layer between the organic layer 132 and the color conversion element 120.

In another modified example a3, the protective layer 130(III) may further include three inorganic layers 131, 133, 135. In yet another variation a4, protective layer 130(IV) may include at least two organic layers 132, 134, and at least two inorganic layers 131, 133. In still another variation A5, protective layer 130(V) may include a functional organic layer 134f as the topmost layer. For example, the functional organic layer 134f may be a filter layer. In another modification a5 ', the protective layer 130 (V') may include a functional inorganic layer 131f as the topmost layer. For example, the functional inorganic layer 131f may be a Distributed Bragg Reflector (DBR) layer. In other variation embodiments, the protective layer (VI) may include six to nine layers, in which the respective inorganic layers I and organic layers O may be alternately arranged with each other.

In a modified embodiment of the protective layer 130, the thickness of the organic layer 132 may be greater than the thickness of the inorganic layer 131. Or the thickness of the first inorganic layer 131 may be equal to or different from the thickness of the second inorganic layer 133. In one embodiment, thinner inorganic layers are easier to form, and in another embodiment, thicker inorganic layers help to better protect the light emitting device 100. In general, the light transmittance of the protective layer 130 with respect to red light may be 50% or more to obtain better optical performance. In order to obtain better optical performance, the transmittance of the protective layer 130 with respect to green light may be 30% or more. For better optical performance, the transmittance of the protective layer 130 with respect to blue light may be 24% or more.

The inorganic layer may include an insulating material or may include a conductive material. Insulating material, e.g. of thicknessTo 1 micron distributed Bragg reflector layer, which may help improve light emitting device 100Optical properties. The protective layer 130 may include one or more insulating inorganic layers.

Referring back to fig. 1, in the case of IR drop due to insufficient driving voltage caused by long-distance conduction, the conductive material may be used as an auxiliary electrode to help improve IR drop of the electrode layers 111 and 112 on top of the light emitting element 110 in the light emitting device 100. The conductive material may comprise a metal layer, for example of thicknessTo

The silver thin film, the alloy layer of (a) may be, for example, a magnesium-indium thin film or may be a transparent conductive material, such as Indium Tin Oxide (ITO) or Indium Gallium Zinc Oxide (IGZO). The conductive inorganic layer may be any inorganic layer in the protective layer.

Fig. 4 is a schematic diagram of a cross-sectional view of a light emitting device 100 according to various modified embodiments of the present invention. In a variant embodiment B1, the protection layer 130 may include a distributed bragg reflector layer 131f and an organic filter 132 f. On one hand, this simple configuration may have the advantages of both a distributed bragg reflector and a filter to improve the optical performance of the light emitting device 100; on the other hand, this simple configuration again contributes to simplifying the process of manufacturing the light-emitting device 100. The inorganic layer 129 may be positioned between the protective layer 130 and the light emitting element 110.

In another modification B2, the protective layer 130 may include a distributed bragg reflector layer 131f, an inorganic conductive layer 133f, and an organic filter 132f interposed between the distributed bragg reflector layer 131f and the inorganic conductive layer 133 f. In one aspect, this simple configuration may combine the advantages of both a distributed bragg reflector layer and a filter to improve the optical performance of the light emitting device 100 with the advantages of a conductive layer to improve the IR drop problem of the electrode layers 111, 112 of the light emitting device 100. And on the other hand, also contributes to simplification of the manufacturing steps for manufacturing the light emitting device 100. In yet another variation B3, the protection layer 130 may include a pair of distributed bragg reflector layers 131f and 133f to form a gain resonator. This arrangement helps to form a laser-like output light and helps to improve the optical performance of the light emitting device 100.

The topmost layer of the protective layer 130 may include one of an organic material or an inorganic layer. The lowermost layer of the protective layer may include one of an organic material and an inorganic layer. The protective layer 130 may include a pair of distributed bragg reflector layers for concentrating the output wavelength of light of the light emitting device 110.

Referring to fig. 5 and fig. 1, fig. 5 is a schematic diagram illustrating a cross-sectional view of a plurality of light emitting elements 110 in a light emitting device 100 according to another embodiment of the invention. In an embodiment, a plurality of color conversion elements 120 may be disposed on the overall layer 113' serving as a light emitting layer. This configuration helps simplify the process of manufacturing the light emitting device 100 by omitting the mask for defining the pattern of the light emitting element 110. In another variation, multiple color conversion elements 120 may be disposed on corresponding light emitting layers 113, that is, the side-by-side structure and the formation of the spacers 115 may be before the formation of the light emitting layers 113, so the light emitting layers 113 may be continuously on top of the spacers 115, and the color conversion elements 120 may be isolated by the Pixel Definition Layer (PDL) 106. The spacers 115 may be provided corresponding to the Pixel Definition Layer (PDL)106 as necessary, but not limited thereto. In yet another embodiment, the spacer 115 may be disposed on top of the first electrode 111, the light emitting layer 113, and the protective layer 130 as needed. The spacer 115 is formed to prevent the quantum dot material from overflowing before curing.

Please refer to fig. 6 and fig. 1. Fig. 6 is a schematic diagram of a cross-sectional view of a plurality of quantum dots 121, 122, 123 in a light emitting device 100 according to another embodiment of the present invention. In the embodiment shown in fig. 1, the blue subpixel 104 may be devoid of a color conversion element. Such a configuration can help simplify the process of manufacturing the light emitting device by omitting the step of forming the color conversion element 120 in the blue sub-pixel 104. Referring to the variation of fig. 6, a color conversion element 123 may be disposed in the blue sub-pixel 104. This configuration may help to adjust the blue component of the output light or to adjust the wavelength shift of the blue subpixel 104.

Please refer to fig. 5 and 7. Fig. 7 is a schematic diagram of a cross-sectional view of a light emitting device 100 according to another embodiment of the present invention. In a variant embodiment of fig. 5, the light emitting device 100 may have a plurality of cavities 116, 117 to accommodate each different color conversion element 120, e.g. quantum dots 121, 122, such that the color conversion elements 120 may be arranged separately and individually in the cavities 116, 117.

Optionally, each of the quantum dots 121 and 122 can be fully filled in one cavity, or in another variation of the embodiment shown in fig. 7, the quantum dots 121 and 122 can be filled in the cavities 116 and 117, respectively. If the quantum dots 121, 122 fill the cavities 116, 117, respectively, the adjacent spacers 115 help to avoid the problem of the quantum dot material overflowing before it is cured. The spacers 115 may be provided corresponding to the Pixel Definition Layer (PDL)106 as necessary, but not limited thereto. As shown, the thickness of the organic layer 132 is generally greater than the height of the spacers 115. FIG. 5 is a schematic diagram of an over-coating structure of a blue OLED with a continuous light-emitting layer. FIG. 7 shows a side-by-side structure of the discontinuous light emitting layer.

Please refer back to fig. 1 again. The thickness To of the organic layer 132 may be generally greater than the thickness Tg of the color conversion element 120. For example, if the color-converting element 120 is disposed in the cavity 116, 117, the organic layer 132 may typically have a thickness To in the range of 2 microns To 50 microns, and the color-converting element 120, e.g., quantum dots 121, 122, etc., may typically have a thickness Tg in the range of 1 micron To 10 microns (measured from the top surface To the bottom surface of the color-converting element 120 received in the cavity 116 or 117). Further, the ratio (Tg/To) of the thickness Tg of the color conversion element 120 To the thickness To of the organic layer 132 may be in the range of 10% To 150%.

Referring to fig. 1, 8A and 8B, fig. 8A or 8B is a schematic diagram of a cross-sectional view of a light emitting device 100 according to another embodiment of the present invention. In one variation of the embodiment of fig. 1, the protection layer 130 may have a top surface 131t, while the top surface 131t may be substantially flat and without pits to vertically correspond to the sub-pixels 102, 103, 104. The thickness of the protection layer 130 may be determined by the top surface 131t of the inorganic layer 131 in the vertical direction to the interface between the color conversion element 120 and the inorganic layer 133 in the sub-pixel 102 and the sub-pixel 103. Such a configuration may help simplify the manufacturing method of the light emitting device 100.

In another variation embodiment as shown in fig. 8A, the top surface 131t may contain a pit 109 to correspond to and overlap the blue subpixel 104. The pits 109 help to reduce the areal thickness Tp of the protective layer 130 to increase the intensity of light so that quantum dots may not be needed in one sub-pixel. The thickness Tp of the protective layer 130, if no color conversion element is present in the cavity 118, may be determined by the distance in the vertical direction in the blue sub-pixel 104 from the bottom to the top surface 131t of the cavity 118. In one embodiment, different pixels may therefore have different (Tg/Tp) ratios, with or without cavities or pits.

In another variation embodiment as shown in fig. 8B, the top surface 131t may contain a plurality of pits 107, 108, 109 to correspond to, and overlap, respectively, different subpixels such as red subpixel 102, green subpixel 103, or blue subpixel 104. The pits 107, 108, 109 may help to reduce the thickness Tp1 of the protective layer 130 area to increase the intensity of light, so that dual light emitting elements may not be needed in one sub-pixel. If the color conversion element 120 is present in the cavity 117, the thickness Tp2 of the protective layer 130 may be determined by the distance from the inorganic layer 129 to the top surface 131t in the red sub-pixel 102 or the green sub-pixel 103 in the vertical direction. When Tp1 > Tp2, the intensity of the blue light of the blue sub-pixel 104 may become stronger because the blue light of the blue sub-pixel 104 may not pass through the quantum dots. When Tp2 > Tp1, the output light of the blue sub-pixel 104 may be less bluish because a thicker Tp2 may consume more blue light.

Fig. 9 is a schematic diagram of a cross-sectional view of a light emitting device 100 according to another embodiment of the present invention. In one embodiment, the color conversion element 120 may be disposed on a surface 151 of the planarization layer 150. The planarization layer 150 may fill the cavities 116, 117 and has a top surface 151. Each color conversion element 120, e.g., quantum dot 121, quantum dot 122, may be in direct contact with the top surface 151 and may be completely covered by the organic layer 132. Since the quantum dots 121, 122 are not disposed in the cavities 116, 117, the possibility that the variable depth of the cavities 116, 117 may adversely affect the optical performance of the light emitting device 110 may be reduced accordingly. In fig. 9, the quantum dots 121 or 122 may not be accommodated in the cavities 116 and 117, but the planarization layer 150 may fill the cavities 116 and 117. Suitable materials for the planarization layer 150 may include inorganic materials such as silicon oxide, silicon nitride, silicon oxynitride, metal oxides, or may include organic materials such as polyimide, acrylate, epoxy, poly (methyl methacrylate), benzocyclobutene, or polyester.

Please refer to fig. 10A, fig. 10B, fig. 10C, fig. 10D, fig. 10E, fig. 10F, fig. 10G and fig. 10H. Fig. 10A, 10B, 10C, 10D, 10E, 10F, 10G, or 10H are schematic diagrams of cross-sectional views of a light-emitting device 100 according to another embodiment of the present invention. There is an optional black matrix 160 in the light emitting device 100 of these embodiments. The optional black matrix 160 may be located between two adjacent sub-pixels and may help to reduce crosstalk of light from adjacent sub-pixels.

For example, in the variation embodiment C1 shown in fig. 10A, the black matrix 160 may be disposed in the organic layer 132 and may be located above the color conversion element 120. The black matrix 160 may be trapezoidal in shape. Or in the modified embodiment C2 shown in fig. 10B, the black matrix 160 and the color conversion element 120 may both be disposed in the organic layer 132 and may be located above the planarization layer 150, so that the black matrix 160 directly contacts the color conversion element 120, the planarization layer 150, and the organic layer 132. In fig. 10B, the quantum dots 121 or 122 may not be accommodated in the cavity 116 or may not be accommodated in the cavity 117, and the planarization layer 160 may fill the cavity 116, 117. In addition, the black matrix 160 may be interposed between two adjacent quantum dots.

Alternatively, in the modified embodiment C3 shown in fig. 10C, if the filter 134f is used as an organic layer, the black matrix 160 may be interposed between two adjacent filters 134 f. Each black matrix 160 may be disposed on top of the corresponding spacer 115, and one sheet of the filter 134f may be disposed on top of a corresponding one of the light emitting elements 110, and may also be in direct contact with the color conversion element 120. The black matrix 160 may be trapezoidal in shape. In addition, the filter 134f and the black matrix 160 may extend laterally to each other together. This configuration helps simplify the process of manufacturing the light emitting device. Alternatively, in the modified embodiment C4 shown in fig. 10D, the DBR layer 131f may be used as the topmost layer. The introduction of the DBR layer 131f may help improve the optical performance of the light emitting device 100. In another embodiment, the spacer 115 may be optionally omitted, depending on design requirements.

Alternatively, in the modified embodiment C5 shown in fig. 10E, if the filter 134f is used as an organic layer and the color conversion element 120 is disposed on the flat layer 150, the black matrix 160 may be interposed between two adjacent filters 134f, or may be interposed between two adjacent quantum dots 121 and 122. Each black matrix 160 may be disposed on top of the planarization layer 150, and each filter 134f may also be disposed on top of the planarization layer 150. The black matrix 160 may be trapezoidal in shape. This configuration may help to provide a better light path.

Alternatively, in the modified embodiment C6 shown in fig. 10F, if the filter 134F and the organic layer 132 are present at the same time and the color conversion element 120 is disposed under the organic layer 132, the filter 134F and the black matrix 160 may be disposed on the top surface of the organic layer 132. The black matrix 160 may be interposed between two adjacent filters 134f, and may have an inverted trapezoidal shape. Both the filter 134f and the organic layer 132 may provide protection, so this configuration helps provide a more robust protective layer. Alternatively, in the variant embodiment C7 shown in fig. 10G, the variant embodiment C6 may further include a distributed bragg reflector layer 131f as the topmost layer. The introduction of the distributed bragg reflector layer 131f helps to improve the optical performance of the light emitting device 100.

Alternatively, in the modified embodiment C8 shown in fig. 10H, if the filter 134f and the organic layer 132 are both present and the color conversion element 120 is disposed on the planarization layer 150, the filter 134f and the black matrix 160 may be both on top of the organic layer 132, and both the organic layer 132 and the color conversion element 120 may be disposed on top of the planarization layer 150. The black matrix 160 may have an inverted trapezoidal shape. This arrangement also helps to provide a robust protective layer.

Please refer back to fig. 3 again. The light-emitting device 100 may further include a blue blocking layer disposed on the uppermost inorganic layer I, as illustrated in variation a5 or variation a 5'. Since the conversion efficiency of the color conversion element 120 is not 100%, a part of the light emitted from the light emitting element 120 may not be completely converted by the color conversion element 120 as described above, and thus, the spectrum of the sub-pixel output light may include a target wavelength and sub-wavelengths. The target wavelength may represent converted light and the sub-wavelengths may represent unconverted light. Sub-wavelengths in the output light may compromise the optical performance of the light emitting device 100.

In the present invention, an optional blue blocking layer may help block the leakage sub-wavelengths in the output light. The blue blocking layer may be a filter layer 134f or a distributed bragg reflector layer 131 f. In another variation, the blue blocking layer may be the topmost layer of the protective layer 130.

The types of structures exemplified in table 1 may be combined as necessary to produce various alternative embodiments.

TABLE 1

Type I	Type II	Type III
			Luminescent layer	Monolithic layer	Side by side
Black matrix	Is provided with	Is free of
			Blue light blocking layer	Optical filter	Distributed Bragg reflector
Colorless organic layer	Is provided with	Is free of
			Planarization layer	Is provided with	Is free of
Pit	Is provided with	Is free of

In summary, the present invention provides quantum dot layers in various quantum dot-organic light emitting device structures having protective multilayer structures. The novel protection structure can ensure that the fragile quantum dots in the quantum dot-organic light-emitting device can be well protected, so that the fragile quantum dots can have strong protection force on light, heat, moisture, oxygen and chemical substances, and various problems encountered in the field at present can be overcome.

The above description is only an example of the present invention, and is not intended to limit the present invention, and it is obvious to those skilled in the art that various modifications and variations can be made in the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.