Coil electronic component
阅读说明：本技术 线圈电子组件 (Coil electronic component ) 是由 梁主欢 姜炳守 车允美 文炳喆 于 2019-10-22 设计创作，主要内容包括：本公开提供了一种线圈电子组件。所述线圈电子组件包括：主体,具有彼此相对的第一表面和第二表面以及彼此相对的第三表面和第四表面；绝缘基板,设置在主体内；第一线圈部和第二线圈部,分别设置在绝缘基板的相对表面上；第一引出部,连接到第一线圈部并且从第一表面和第三表面暴露；第二引出部,连接到第二线圈部并且从第二表面和第三表面暴露；以及第一外电极和第二外电极,分别覆盖第一引出部和第二引出部。绝缘基板包括：支撑部,支撑第一线圈部和第二线圈部；第一尖端,从主体的第一表面和第三表面暴露并且支撑第一引出部,以及第二尖端,从主体的第二表面和第三表面暴露并且支撑第二引出部。(The present disclosure provides a coil electronic assembly. The coil electronic component includes: a body having first and second surfaces opposite to each other and third and fourth surfaces opposite to each other; an insulating substrate disposed within the body; a first coil portion and a second coil portion respectively provided on opposite surfaces of the insulating substrate; a first lead out portion connected to the first coil portion and exposed from the first and third surfaces; a second lead-out portion connected to the second coil portion and exposed from the second surface and the third surface; and first and second external electrodes covering the first and second lead-out portions, respectively. The insulating substrate includes: a support portion supporting the first coil portion and the second coil portion; a first tip exposed from the first and third surfaces of the body and supporting the first lead out portion, and a second tip exposed from the second and third surfaces of the body and supporting the second lead out portion.)
1. A coil electronics assembly, the coil electronics assembly comprising:
a body having first and second surfaces opposite to each other and third and fourth surfaces opposite to each other and connecting the first and second surfaces to each other;
an insulating substrate disposed within the body;
a first coil portion and a second coil portion respectively provided on opposite surfaces of the insulating substrate;
a first lead-out portion connected to one end of the first coil portion and exposed from the first and third surfaces of the main body;
a second lead part connected to one end of the second coil part and exposed from the second and third surfaces of the body; and
a first external electrode and a second external electrode respectively covering the first lead-out portion and the second lead-out portion,
wherein the insulating substrate includes:
a support portion supporting the first coil portion and the second coil portion;
a first tip exposed from the first and third surfaces of the body and supporting the first lead out portion, an
A second tip exposed from the second and third surfaces of the body and supporting the second lead out portion.
2. The coil electronic assembly according to claim 1, wherein the insulating substrate has a thickness of 10 μm to 30 μm.
3. The coil electronic assembly of claim 1, wherein each of the first lead out and the second lead out has a width narrower than a width of the body.
4. The coil electronic assembly of claim 1, wherein the first lead-out portion extends from the first surface of the body to be led out to the third surface of the body, and the second lead-out portion extends from the second surface of the body to be led out to the third surface of the body.
5. The coil electronic assembly of claim 1, wherein the first and second lead-out portions are not disposed on the fourth surface of the body.
6. The coil electronics assembly of claim 1 further comprising:
a first dummy lead-out portion provided on a surface of the insulating substrate opposite to the first lead-out portion; and
and a second dummy lead-out portion provided on a surface of the insulating substrate opposite to the second lead-out portion.
7. The coil electronic component of claim 1, wherein each of the first and second external electrodes includes a first layer covering a respective one of the first and second lead out portions and a second layer covering the first layer.
8. The coil electronic assembly of claim 7, wherein a recess is disposed on a surface of the first layer.
9. The coil electronic assembly of claim 8, wherein the recess is disposed in an area on the first layer overlying the insulating substrate.
10. The coil electronic assembly of claim 7, wherein the first layer comprises nickel, and
the second layer includes tin.
11. The coil electronic assembly of claim 7, wherein the second layer is in direct contact with the insulating substrate through the recess.
12. The coil electronic component of claim 1, wherein each of the first and second outer electrodes has a width narrower than a width of the body.
13. The coil electronic component of claim 1, wherein the first and second outer electrodes extend from the first and second surfaces of the body, respectively, to be disposed on the third surface of the body.
14. The coil electronic component of claim 1, wherein the first and second outer electrodes are not disposed on the fourth surface of the body.
15. The coil electronics assembly of claim 1 further comprising:
an insulating layer disposed on a surface of the body.
16. The coil electronic component of claim 15, wherein the insulating layer is disposed in an area other than an area where the first and second outer electrodes are disposed.
17. The coil electronic component according to claim 15, wherein the insulating layer is formed using an oxide including at least one selected from the group consisting of iron, niobium, silicon, chromium, and an alloy thereof.
18. The coil electronic assembly of claim 1, wherein the body comprises metallic magnetic powder particles.
19. The coil electronic component of claim 18, wherein the metallic magnetic powder particles comprise at least one of iron, niobium, silicon, chromium, and alloys thereof.
20. A coil electronics assembly, the coil electronics assembly comprising:
a body having first and second surfaces opposite to each other and third and fourth surfaces opposite to each other and connecting the first and second surfaces to each other;
an insulating substrate disposed within the body;
a first coil portion and a second coil portion respectively provided on opposite surfaces of the insulating substrate;
a first lead-out portion provided on the insulating substrate, connected to one end of the first coil portion, and exposed from the first surface and the third surface of the main body;
a second lead-out part disposed on the insulating substrate, connected to one end of the second coil part, and exposed from the second and third surfaces of the body; and
a first external electrode and a second external electrode respectively covering the first lead-out portion and the second lead-out portion,
wherein each of the first and second external electrodes includes a first conductive layer disposed on a corresponding one of the first and second lead-out parts and a second conductive layer covering the first conductive layer, and
the first conductive layer has a recess on a portion of the insulating substrate exposed from the body.
21. The coil electronic component of claim 20, wherein the first conductive layer comprises nickel, and
the second conductive layer includes tin.
22. The coil electronic assembly of claim 20 wherein the first outer electrode extends from the first surface onto the third surface of the body, and
the second external electrode extends from the second surface onto the third surface of the body.
23. The coil electronic assembly of claim 22 wherein the first outer electrode is disposed only on the first and third surfaces of the body of the outer surfaces of the body, and
the second external electrode is disposed only on the second surface and the third surface of the body among the outer surfaces of the body.
24. The coil electronics assembly of claim 20 further comprising:
a first dummy lead-out portion disposed on a surface of the insulating substrate opposite to the first lead-out portion, exposed from the first surface and the third surface, and covered by the first external electrode; and
a second dummy lead-out portion disposed on a surface of the insulating substrate opposite to the second lead-out portion, exposed from the second surface and the third surface, and covered by the second external electrode.
25. The coil electronics assembly of claim 20 wherein the first and second coil portions and the insulating substrate are perpendicular or substantially perpendicular to the third surface or the fourth surface.
26. The coil electronic assembly of claim 20, wherein the second conductive layer is in direct contact with the insulating substrate through the recess.
27. A coil electronics assembly, the coil electronics assembly comprising:
a body having first and second surfaces opposite to each other and third and fourth surfaces opposite to each other and connecting the first and second surfaces to each other;
an insulating substrate disposed within the body;
a first coil portion and a second coil portion respectively provided on opposite surfaces of the insulating substrate;
a first lead-out portion provided on the insulating substrate, connected to one end of the first coil portion, and exposed from the first surface and the third surface of the main body;
a second lead-out part disposed on the insulating substrate, connected to one end of the second coil part, and exposed from the second and third surfaces of the body;
first and second external electrodes covering the first and second lead-out portions, respectively; and
an oxide layer covering a portion of the body.
28. The coil electronic component of claim 27, wherein the oxide layer comprises an oxide of a material selected from the group consisting of iron, niobium, silicon, chromium, and alloys thereof.
29. The coil electronic assembly of claim 27, wherein the oxide layer comprises an oxide of a constituent of metallic magnetic powder particles disposed within the body.
30. The coil electronic component of claim 27, wherein each of the first and second outer electrodes includes a first conductive layer disposed on a respective one of the first and second lead outs and a second conductive layer covering the first conductive layer.
31. The coil electronic component of claim 29, wherein a thickness of the oxide layer is less than a thickness of the first conductive layer.
32. The coil electronic assembly of claim 29, wherein the first conductive layer comprises nickel, and
the second conductive layer includes tin.
33. The coil electronics assembly of claim 27 wherein the first and second coil portions and the insulating substrate are perpendicular or substantially perpendicular to the third surface or the fourth surface.
34. The coil electronic component of claim 27, wherein the oxide layer covers an entire outer surface of the body except for an area of the outer surface covered by the first and second outer electrodes.
Technical Field
The present disclosure relates to a coil electronic assembly.
Background
Recently, as Information Technology (IT) devices such as communication devices, display devices, and the like are increasingly miniaturized and slimmed, research into technologies that promote miniaturization and slimness of various elements such as inductors, capacitors, transistors, and the like used in such IT devices is continuously being conducted. In this regard, inductors have been rapidly replaced by sheets having a small size and high density, which can be automatically surface-mounted. In addition, a thin film type device manufactured by forming coil patterns on the top and bottom surfaces of an insulating substrate through a plating process and laminating, pressing, and curing magnetic sheets in which magnetic powder particles and resin are mixed on the upper and lower portions of the coil patterns has been developed.
However, as the sheet size of the thin film type inductor has also decreased, the volume of the body has decreased. Therefore, a space for forming the coil in the body is also reduced, and the number of turns of the formed coil is reduced.
As described above, when the area where the coil is formed is reduced, it may be difficult to secure high inductance and the width of the coil may be reduced. Therefore, the DC resistance and the AC resistance may increase, and the quality factor Q may decrease.
In order to achieve high inductance and high quality factor Q despite the reduction in sheet size, the coil needs to be formed so as to occupy as large an area as possible in a miniaturized body. In addition, it is required to improve inductor performance such as inductance L, quality factor Q, and the like by increasing the area of the inner coil and making magnetic flux flow smoothly.
Disclosure of Invention
An aspect of the present disclosure is to provide a coil electronic assembly that can achieve high inductance by increasing an area where coil portions are formed within the same sheet size despite a reduction in sheet size.
An aspect of the present disclosure is to provide a coil electronic component that can improve performance such as inductance L, quality factor Q, and the like by significantly reducing the influence of interference of a mounting substrate and external electrodes with a flow of magnetic flux.
An aspect of the present disclosure is to provide a coil electronic component that can achieve an improvement in performance by increasing the area of a core portion in a coil portion, the degree of freedom in design of an edge portion between the outermost portion of the coil portion and the outside of a main body (the degree of freedom in design is limited as the sheet size is reduced), and the like.
According to an aspect of the present disclosure, a coil electronic component includes: a body having first and second surfaces opposite to each other and third and fourth surfaces opposite to each other and connecting the first and second surfaces to each other; an insulating substrate disposed within the body; a first coil portion and a second coil portion respectively provided on opposite surfaces of the insulating substrate; a first lead-out portion connected to one end of the first coil portion and exposed from the first and third surfaces of the main body; a second lead part connected to one end of the second coil part and exposed from the second and third surfaces of the body; and first and second external electrodes covering the first and second lead-out portions, respectively. The insulating substrate includes: a support portion supporting the first coil portion and the second coil portion; a first tip exposed from the first and third surfaces of the body and supporting the first lead out, and a second tip exposed from the second and third surfaces of the body and supporting the second lead out.
According to an aspect of the present disclosure, a coil electronic device includes: a body having first and second surfaces opposite to each other and third and fourth surfaces opposite to each other and connecting the first and second surfaces to each other; an insulating substrate disposed within the body; a first coil portion and a second coil portion respectively provided on opposite surfaces of the insulating substrate; a first lead-out portion provided on the insulating substrate, connected to one end of the first coil portion, and exposed from the first surface and the third surface of the main body; a second lead-out part disposed on the insulating substrate, connected to one end of the second coil part, and exposed from the second and third surfaces of the body; and first and second external electrodes covering the first and second lead-out portions, respectively. Each of the first and second external electrodes includes a first conductive layer disposed on a corresponding one of the first and second lead out portions and a second conductive layer covering the first conductive layer. The first conductive layer has a recess on a portion of the insulating substrate exposed from the body.
According to an aspect of the present disclosure, a coil electronic device includes: a body having first and second surfaces opposite to each other and third and fourth surfaces opposite to each other and connecting the first and second surfaces to each other; an insulating substrate disposed within the body; a first coil portion and a second coil portion respectively provided on opposite surfaces of the insulating substrate; a first lead-out portion provided on the insulating substrate, connected to one end of the first coil portion, and exposed from the first surface and the third surface of the main body; a second lead-out part disposed on the insulating substrate, connected to one end of the second coil part, and exposed from the second and third surfaces of the body; first and second external electrodes covering the first and second lead-out portions, respectively; and an oxide layer covering a portion of the body.
The body may be 1608-sized or smaller.
The coil part may be formed perpendicular or substantially perpendicular to the first and second surfaces of the body.
The coil part may be formed to be upright at an angle of 80 to 100 degrees with respect to the third surface or the fourth surface of the body.
The first external electrode covering the first lead out portion may be formed to extend to the first and third surfaces of the body but may not be formed on the fourth surface of the body, and the second external electrode covering the second lead out portion may be formed to extend to the second and third surfaces of the body but may not be formed on the fourth surface of the body.
Drawings
The above and other aspects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic perspective view illustrating a coil portion of a coil electronics assembly according to an embodiment in the present disclosure;
FIG. 2 is a cross-sectional view taken along line I-I' of the coil electronics assembly shown in FIG. 1;
fig. 3 is a sectional view taken along line II-II' of the coil electronics assembly shown in fig. 2 according to an example embodiment in the present disclosure; and
fig. 4 is a sectional view taken along line II-II' of the coil electronics assembly shown in fig. 2 according to another example embodiment in the present disclosure.
Detailed Description
The terminology used herein to describe the embodiments of the disclosure is not intended to limit the scope of the disclosure. The articles "a" and "an" are singular, since they have a single referent, however, use of the singular herein does not exclude the presence of more than one referent. In other words, a number of elements of the disclosure referred to in the singular can be one or more, unless the context clearly dictates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
In the description of the embodiments, in the case where any one element is described as being formed on (or under) another element, such description includes both the case where two elements are formed in direct contact with each other and the case where two elements are in indirect contact with each other such that one or more other elements are interposed between the two elements. In addition, when one element is described as being formed on (or under) another element, such description may include the case where one element is formed on the upper side or the lower side with respect to the other element.
In addition, the size of components in the drawings may be exaggerated for convenience of description. In other words, since the sizes and thicknesses of components in the drawings are arbitrarily illustrated for convenience of description, the following embodiments are not limited thereto.
In the drawings, the X direction will be defined as a first direction or a length direction, the Y direction will be defined as a second direction or a width direction, and the Z direction will be defined as a third direction or a thickness direction.
Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The same or corresponding elements will be denoted by the same corresponding reference numerals throughout, and will be described in detail no more than once regardless of the reference numerals.
Various types of electronic components are used in electronic devices. Various types of coil components may be appropriately used among these electronic components for the purpose of removing noise and the like.
In electronic devices, the coil assembly may be used as, for example, a power inductor, a High Frequency (HF) inductor, a general magnetic bead, a magnetic bead for high frequency (GHz magnetic bead), a common mode filter, and the like.
Hereinafter, the present disclosure will be described assuming that the coil
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