Anti-warping device for bearing wafer
阅读说明:本技术 一种承载晶圆的防翘曲装置 (Anti-warping device for bearing wafer ) 是由 徐权锋 于 2020-06-23 设计创作,主要内容包括:本发明公开了一种承载晶圆的防翘曲装置,其结构包括晶圆盒、凹槽、放置槽、底板、通槽和调节定位装置,本发明通过将调节定位装置设置于通槽内侧中部,便可通过第一旋钮带动第一螺纹杆在螺纹座上进行转动,使得连接座上的固定夹沿着限位座进行前后滑动,实现对固定的直径距离进行调节,再对活动夹沿着横杆上的滑槽上进行左右滑动,并且通过第二旋钮带动第二螺纹杆进行螺纹固定,实现对固定的左右间距进行调节,便于调节,固定性强,通过横杆前端中部设置有限位槽,并且限位槽内径表面与活动夹进行滑动配合,便于进行限位滑动,保证滑动的稳定性。(The invention discloses a warping-proof device for bearing a wafer, which structurally comprises a wafer box, a groove, a placing groove, a bottom plate, a through groove and an adjusting and positioning device.)
1. A warping prevention device for bearing a wafer comprises a wafer box (1), a groove (2) and a placing groove (3), wherein the groove (2) is embedded in the middle of the top end of the wafer box (1);
the method is characterized in that: the adjusting and positioning device (6) is arranged in the middle of the inner side of the through groove (5), the adjusting and positioning device (6) comprises a first knob (61), a first threaded rod (62), a threaded seat (63), a limiting seat (64), a connecting seat (65), a cross rod (66), a fixing clamp (67), a sliding groove (68) and a fixing mechanism (69), the middle of the front end of the first knob (61) is connected with the first threaded rod (62), the outer diameter surface of the first threaded rod (62) is in threaded fit with the threaded seat (63), the threaded seat (63) is fixed with the rear end of the top of the limiting seat (64), the front end of the outer side of the first threaded rod (62) is in rotating fit with the connecting seat (65), the connecting seat (65) is tightly fixed with the middle of the rear end of the cross rod (66), the middle of the front end of the cross rod (66) is locked and fixed with the fixing clamp (67) through a bolt, the middle part of the inner sides of the left end and the right end of the cross rod (66) is provided with the sliding groove (68), and the middle part of the inner side of the sliding groove (68) is provided with the fixing mechanism (69).
2. The wafer lift apparatus of claim 1, wherein: the threaded seat (63) and the middle part of the inner side of the through groove (5) are fixed with each other.
3. The wafer lift apparatus of claim 2, wherein: the left end and the right end of the inner side of the groove (2) are embedded with placing grooves (3), and the middle part of the rear end of the wafer box (1) penetrates through the through groove (5).
4. The wafer lift apparatus of claim 2, wherein: the fixing mechanism (69) comprises a second knob (691), a second threaded rod (692) and a movable clamp (693), wherein the middle of the front end of the second knob (691) is connected with the second threaded rod (692), and the second threaded rod (692) is in threaded fit with the middle of the rear end of the movable clamp (693).
5. The wafer lift apparatus of claim 4, wherein: the second threaded rod (692) is slidably fitted along the inner diameter surface of the slide groove (68).
6. The wafer lift apparatus of claim 2, wherein: the first knob (61) is externally provided with a rubber sleeve, and the surface of the rubber sleeve is provided with anti-skid lines.
7. The wafer lift apparatus of claim 2, wherein: the sliding grooves (68) and the fixing mechanisms (69) are arranged in two groups and are distributed in parallel and opposite.
8. The wafer lift apparatus of claim 2, wherein: the middle part of the inner side of the fixing clamp (67) is provided with a clamping groove, and the inner diameter surface of the clamping groove is smooth.
9. The wafer lift apparatus of claim 2, wherein: the middle part of the front end of the cross rod (66) is provided with a limit groove, and the inner diameter surface of the limit groove is in sliding fit with the movable clamp (693).
10. The wafer lift apparatus of claim 5, wherein: the middle part of the inner side of the movable clamp (693) is provided with a clamp groove, and the inner diameter surface of the clamp groove is smooth.
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a warping prevention device for bearing a wafer.
Background
After the wafer is ground, the thickness of the wafer is reduced, particularly the thickness of the edge of the wafer is very small, the wafer is placed in a wafer box, the wafer is warped, the wafer is easily damaged, and the wafer is prevented from being warped after being ground and placed through a warping prevention device for bearing the wafer.
Under the condition that needs use the warpage prevention device who bears the weight of the wafer, because the size is placed to current warpage prevention device internal diameter and is the fixed form, the wafer diameter size of different batches or different models is step-by-step the same to the wafer is difficult to closely laminate with inside standing groove and places, and the dislocation appears rocking easily in the removal process, leads to the wafer to collide with the wearing and tearing.
Disclosure of Invention
Technical problem to be solved
In order to overcome prior art not enough, the warp-proof device who bears wafer has now been proposed, has solved under the condition that needs use the warp-proof device who bears wafer, because the size is placed to current warp-proof device internal diameter is the fixed form, and the wafer diameter size step-by-step the same of different batches or different models to the wafer is difficult to closely the laminating with inside standing groove and places, and the removal in-process appears rocking the off-position easily, leads to the problem of wafer colliding with wearing and tearing.
(II) technical scheme
The invention is realized by the following technical scheme: the invention provides a wafer-bearing warping-preventing device, which comprises a wafer box, a groove, a placing groove and an adjusting and positioning device, wherein the groove is embedded in the middle of the top end of the wafer box, the adjusting and positioning device is arranged in the middle of the inner side of the through groove, the adjusting and positioning device comprises a first knob, a first threaded rod, a threaded seat, a limiting seat, a connecting seat, a cross rod, a fixing clamp, a sliding groove and a fixing mechanism, the middle part of the front end of the first knob is connected with the first threaded rod, the outer diameter surface of the first threaded rod is in threaded fit with the threaded seat, the threaded seat is mutually fixed with the rear end of the top of the limiting seat, the front end of the outer side of the first threaded rod is in rotating fit with the connecting seat, the connecting seat is tightly fixed with the middle part of the rear end of the cross rod, the middle part of the front end of the cross rod is locked with the fixing, the threaded seat is fixed with the middle part of the inner side of the through groove.
Furthermore, the left end and the right end of the inner side of the groove are embedded with placing grooves, and a through groove penetrates through the middle of the rear end of the wafer box.
Furthermore, fixed establishment includes second knob, second threaded rod and activity and presss from both sides, second knob front end middle part is connected with the second threaded rod, second threaded rod and activity press from both sides rear end middle part screw-thread fit, the second threaded rod is along spout internal diameter surface sliding fit.
Furthermore, a rubber sleeve is arranged outside the first knob, and anti-skid grains are arranged on the surface of the rubber sleeve.
Furthermore, the sliding grooves and the fixing mechanisms are arranged in two groups and are distributed in parallel and opposite.
Furthermore, a clamping groove is formed in the middle of the inner side of the fixing clamp, and the inner diameter surface of the clamping groove is smooth.
Furthermore, a limiting groove is formed in the middle of the front end of the cross rod, and the inner diameter surface of the limiting groove is in sliding fit with the movable clamp.
Furthermore, a clamping groove is formed in the middle of the inner side of the movable clamp, and the inner diameter surface of the clamping groove is smooth.
Furthermore, the bottom plate is made of PVC plastic.
Furthermore, the first threaded rod is made of stainless steel.
(III) advantageous effects
Compared with the prior art, the invention provides the warping prevention device for bearing the wafer, which has the following beneficial effects:
the method has the advantages that: through setting up adjusting positioning device in leading to inboard middle part of groove, alright drive first threaded rod through first knob and rotate on the screw thread seat for fixation clamp on the connecting seat slides around going on along spacing seat, realizes adjusting fixed diametral distance, slides from side to side on the spout on the horizontal pole is pressed from both sides along the activity again, and drives the second threaded rod through the second knob and carries out the thread tightening, realizes adjusting fixed controlling the interval, and the regulation of being convenient for, the fixity is strong.
The advantages are two: be provided with the spacing groove through horizontal pole front end middle part to spacing inslot diameter surface carries out sliding fit with the activity clamp, is convenient for carry out spacing slip, guarantees gliding stability.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the adjusting and positioning device of the present invention;
FIG. 3 is a schematic top view of the adjusting and positioning device of the present invention;
FIG. 4 is a schematic left-side view of the adjusting and positioning device of the present invention;
fig. 5 is a schematic structural diagram of the fixing mechanism of the present invention.
In the figure: the device comprises a wafer box-1, a groove-2, a placing groove-3, a bottom plate-4, a through groove-5, an adjusting and positioning device-6, a first knob-61, a first threaded rod-62, a threaded seat-63, a limiting seat-64, a connecting seat-65, a cross rod-66, a fixing clamp-67, a sliding groove-68, a fixing mechanism-69, a second knob-691, a second threaded rod-692 and a movable clamp-693.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the present invention provides a warpage preventing apparatus for carrying a wafer: comprises a wafer box 1, a
Referring to fig. 2, the adjusting and positioning device 6 includes a
Referring to fig. 1 and 2 in combination, the
Referring to fig. 2 and 3, the
Fig. 4 shows a schematic side view of the adjusting and positioning device 6, which shows the
Wherein, the
Wherein, the sliding groove 68 and the
Wherein, the middle part of the inner side of the
Wherein, the middle part of the front end of the
Wherein, the middle part of the inner side of the
The
The first threaded
The patent states: the material of the
The working principle is as follows:
firstly, placing an anti-warping device for bearing a wafer at a proper position, and carrying out bottom support placement on a wafer box 1 through a
secondly, when the ground wafers are required to be stored and placed, because the inner diameter placing sizes of the existing anti-warping devices are fixed, the diameter sizes of wafers of different batches or different types are the same step by step, and the wafers are difficult to be tightly attached and placed with the inner placing groove 3, and the wafers are easy to shake and run during moving, so that the wafers are collided and abraded, the adjusting and positioning device 6 is arranged in the middle of the inner side of the through groove 5, then the
thirdly, after finishing adjusting, alright insert the standing groove 3 in wafer and the wafer box 1 that need place and place to carry out dual supplementary fixed through
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described, and the standard parts used in the present invention are all available on the market, the special-shaped parts can be customized according to the description and the accompanying drawings, the specific connection mode of each part adopts the conventional means of bolt and rivet, welding and the like mature in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, and the details are not described herein.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
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