阅读说明：本技术 一种建筑工程用防水保温板 (Waterproof insulation board for building engineering ) 是由 祝春夏 肖杰 于 2020-05-29 设计创作，主要内容包括：本发明公开了一种建筑工程用防水保温板,包括以下重量份的原料：改性酚醛树脂80-100份、空心玻化微珠22-30份、粉煤灰14-20份、聚丙烯酸酯乳液15-25份、聚丙烯纤维5-9份、羧甲基纤维素钠3-7份、发泡剂5.5-9份、表面活性剂4.5-7份；以改性酚醛树脂为基体,采用硅基改性剂对酚醛树脂进行改性,硅基改性剂与酚醛树脂发生醚化反应,得到了改性酚醛树脂,醚化降低了酚醛树脂的酸性,柔性的脂肪长链和有机硅键合在酚醛树脂上,大大提高了酚醛树脂的韧性,从而改性酚醛树脂与其余组分经混合、发泡、浇注成型后制备得到了高强度的保温板,另外,酚醛树脂上引入了具有低表面活性的有机硅,硅原子的存在赋予了保温板良好的疏水性,制备的保温板具有良好的防水性。(The invention discloses a waterproof insulation board for constructional engineering, which comprises the following raw materials in parts by weight: 80-100 parts of modified phenolic resin, 22-30 parts of hollow vitrified micro bubbles, 14-20 parts of fly ash, 15-25 parts of polyacrylate emulsion, 5-9 parts of polypropylene fiber, 3-7 parts of sodium carboxymethylcellulose, 5.5-9 parts of foaming agent and 4.5-7 parts of surfactant; the modified phenolic resin is used as a matrix, the phenolic resin is modified by adopting a silicon-based modifier, the silicon-based modifier and the phenolic resin are subjected to etherification reaction to obtain the modified phenolic resin, the acidity of the phenolic resin is reduced by etherification, a flexible fat long chain and organic silicon are bonded on the phenolic resin, and the toughness of the phenolic resin is greatly improved, so that the modified phenolic resin and the rest components are mixed, foamed and cast to form the high-strength insulation board, in addition, the organic silicon with low surface activity is introduced into the phenolic resin, the existence of silicon atoms endows the insulation board with good hydrophobicity, and the prepared insulation board has good waterproofness.)

1. The utility model provides a waterproof insulation board for building engineering which characterized in that: the feed comprises the following raw materials in parts by weight: 80-100 parts of modified phenolic resin, 22-30 parts of hollow vitrified micro bubbles, 14-20 parts of fly ash, 15-25 parts of polyacrylate emulsion, 5-9 parts of polypropylene fiber, 3-7 parts of sodium carboxymethylcellulose, 5.5-9 parts of foaming agent and 4.5-7 parts of surfactant.

2. The waterproof and heat-insulating board for the building engineering according to claim 1, characterized in that: the preparation method of the modified phenolic resin specifically comprises the following steps:

the reaction process is as follows:

s1 preparation of silicon-based modifier

Weighing 100mmol of 1,1,1,3,5,5, 5-heptamethyltrisiloxane and 100mmol of 105mmol of 6-chloro-1-hexene in a reaction kettle, adding the mixture into 700ml of isopropanol as a solvent, stirring and dissolving, introducing nitrogen for protection, then adding a metal platinum catalyst, continuously introducing nitrogen for keeping for 15-20min until air in the reaction kettle is completely replaced, closing the nitrogen, heating to 75-80 ℃ while stirring, carrying out hydrosilylation reaction for 8-10h, and after the reaction is finished, carrying out reduced pressure distillation to remove the solvent and unreacted 6-chloro-1-hexene, thus obtaining the silicon-based modifier shown in the formula A1;

s2 preparation of modified phenolic resin

Weighing 17-20g of silicon-based modifier A1, 125-140g of solid phenolic resin powder and 1.5-2L of solvent tert-amyl alcohol, adding into a reaction kettle, stirring and dissolving completely, adding 6-8g of alkali catalyst cesium carbonate, stirring and heating to 90-95 ℃ after adding, keeping the temperature for reaction for 3.5-5h, naturally cooling to room temperature after reaction, performing suction filtration, washing with water, and drying to obtain the modified phenolic resin shown in the formula A.

3. The waterproof and heat-insulating board for the building engineering according to claim 2, characterized in that: in step S1, the amount of chloroplatinic acid added is 12-15mmol as the metal platinum catalyst.

4. The waterproof and heat-insulating board for the building engineering according to claim 2, characterized in that: in step S2, the alkali catalyst is cesium carbonate, and the addition amount of the cesium carbonate is 6-8 g.

5. The waterproof and heat-insulating board for the building engineering according to claim 1, characterized in that: the foaming agent is n-hexane.

6. The waterproof and heat-insulating board for the building engineering according to claim 1, characterized in that: the surfactant is one of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate and hydroxypropyl methyl cellulose ether.

7. The waterproof and heat-insulating board for the building engineering according to claim 1, characterized in that: the preparation method of the waterproof insulation board comprises the following steps: adding the modified phenolic resin, the hollow vitrified micro bubbles, the fly ash, the polyacrylate emulsion, the polypropylene fiber and the sodium carboxymethylcellulose into a mixing barrel for premixing, then putting the premix into a stirrer, then adding the foaming agent and the surfactant, stirring and mixing uniformly, heating to 65-75 ℃, keeping the temperature and stirring for 15-20min, and then casting and molding to obtain the waterproof insulation board.

Technical Field

The invention belongs to the technical field of heat insulation materials, and particularly relates to a waterproof heat insulation board for building engineering.

Background

The heated board is the common materials who keeps apart indoor environment and external environment, and the heated board has the mortar often in its outside coating when using, plays the guard action, but the mortar water absorption performance is better, leads to the rainwater to soak easily to heated board department, and current heated board intensity is general, water-proof effects is not good enough, absorbs water after the rainwater soaks, leads to the life-span to reduce easily, influences building wall's security performance.

The phenolic aldehyde insulation board belongs to an organic thermosetting efficient insulation material, and particularly gradually improves the energy saving rate of buildings in recent years, the technical performance of the applied insulation material is higher and higher, and the market demand is larger and larger. In the application of heat-insulating materials for building, not only the physical and technical properties are required to be high, but also the fire-proof performance must be achieved. The phenolic insulation board produced by the phenolic resin has good fire penetration resistance, high temperature resistance and low smoke performance, but the phenolic insulation board has the biggest defects of high brittleness and high acidity. Because the brittleness of the phenolic aldehyde insulation board is large, the problems that the phenolic aldehyde insulation board has powder falling, low elasticity, low compression strength, substandard heat conductivity coefficient and the like exist when the phenolic aldehyde insulation board is used, and the inherent excellent fireproof performance cannot be well utilized, so that the expansion of the application technology of the product is influenced, and a lot of inconvenience is brought to transportation and construction. Because the acidity is large, the phenolic insulation board can have certain corrosivity when contacting with metal and cement-based materials, and the application range of the phenolic insulation board is limited.

Disclosure of Invention

The invention aims to provide a waterproof insulation board for building engineering.

The purpose of the invention can be realized by the following technical scheme:

a waterproof insulation board for constructional engineering comprises the following raw materials in parts by weight: 80-100 parts of modified phenolic resin, 22-30 parts of hollow vitrified micro bubbles, 14-20 parts of fly ash, 15-25 parts of polyacrylate emulsion, 5-9 parts of polypropylene fiber, 3-7 parts of sodium carboxymethylcellulose, 5.5-9 parts of foaming agent and 4.5-7 parts of surfactant.

Further, the preparation method of the modified phenolic resin specifically comprises the following steps:

the reaction process is as follows:

s1 preparation of silicon-based modifier

Weighing 100mmol1,1,1,3,5,5, 5-heptamethyltrisiloxane and 100mmol 105mmol 6-chloro-1-hexene into a reaction kettle, adding the mixture into 700ml isopropanol as a solvent, stirring and dissolving, introducing nitrogen for protection, then adding a metal platinum catalyst, continuously introducing nitrogen for keeping for 15-20min until air in the reaction kettle is completely replaced, closing the nitrogen, heating to 75-80 ℃ while stirring, carrying out a hydrosilylation reaction for 8-10h, and after the reaction is finished, carrying out reduced pressure distillation to remove the solvent and unreacted 6-chloro-1-hexene, thus obtaining the silicon-based modifier shown in the formula A1;

s2 preparation of modified phenolic resin

Weighing 17-20g of silicon-based modifier A1, 125-140g of solid phenolic resin powder and 1.5-2L of solvent tert-amyl alcohol, adding into a reaction kettle, stirring and dissolving completely, adding 6-8g of alkali catalyst cesium carbonate, stirring and heating to 90-95 ℃ after adding, keeping the temperature for reaction for 3.5-5h, naturally cooling to room temperature after reaction, performing suction filtration, washing with water, and drying to obtain the modified phenolic resin shown in the formula A.

Further, in step S1, the amount of the chloroplatinic acid added is 12-15 mmol.

Further, in step S2, the alkali catalyst is cesium carbonate, and the addition amount of the cesium carbonate is 6 to 8 g.

Further, the foaming agent is n-hexane.

Further, the surfactant is one of sodium dodecyl benzene sulfonate, sodium dodecyl sulfate and hydroxypropyl methyl cellulose ether.

Further, the preparation method of the waterproof insulation board comprises the following steps: adding the modified phenolic resin, the hollow vitrified micro bubbles, the fly ash, the polyacrylate emulsion, the polypropylene fiber and the sodium carboxymethylcellulose into a mixing barrel for premixing, then putting the premix into a stirrer, then adding the foaming agent and the surfactant, stirring and mixing uniformly, heating to 65-75 ℃, keeping the temperature and stirring for 15-20min, and then casting and molding to obtain the waterproof insulation board.

The invention has the beneficial effects that:

the invention provides a waterproof insulation board for building engineering, which takes modified phenolic resin as a matrix and adopts a silicon-based modifier to modify the phenolic resin, and specifically comprises the following steps: firstly, 1,1,1,3,5,5, 5-heptamethyltrisiloxane and 6-chloro-1-hexene are taken as raw materials, hydrosilylation reaction is carried out under the catalysis of a metal platinum catalyst chloroplatinic acid to prepare a silicon-based modifier containing chlorine substitution, then under the catalysis of an alkali catalyst cesium carbonate, the silicon-based modifier and phenolic resin are subjected to etherification reaction to obtain a modified phenolic resin, the etherification reduces the acidity of the phenolic resin, a flexible fat long chain and organosilicon are bonded on the phenolic resin, the toughness of the phenolic resin is greatly improved, so that the modified phenolic resin and the rest components are mixed, foamed and cast to prepare the high-strength insulation board, in addition, organosilicon with low surface activity is introduced into the phenolic resin, the existence of silicon atoms endows the insulation board with good hydrophobicity and low water absorption, the prepared heat-insulation board has good waterproofness.

Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.