阅读说明：本技术 一种使用蚀刻刀排除小孔废料的方法 (Method for removing small-hole waste materials by using etching knife ) 是由 王春生 李永泉 谢东升 于 2021-08-10 设计创作，主要内容包括：本发明提供了一种使用蚀刻刀排除小孔废料的方法,其通过蚀刻刀在双面胶和离型膜整体形成的复合产品的表面排布对应的小孔,使得小批量制作的样品的制作成本降低。其包括如下步骤：a通过第一蚀刻刀在带有保护膜的离型膜上切出第一直径的小孔,之后用保护膜拉掉离型膜孔的废料；b在离型膜的第一面复合双面胶,离型膜第二面复合底膜,使双面胶通过离型膜孔与底膜粘合；c之后通过第二蚀刻刀再在对应于离型膜孔的位置切第二直径的小孔,用底膜拉掉离型膜及双面胶小孔；第一直径数值小于第二直径的数值,第二直径的数值等于预设小孔的直径数值。(The invention provides a method for removing small-hole waste materials by using an etching knife, which arranges corresponding small holes on the surface of a composite product formed by integrally forming double-sided adhesive and a release film by using the etching knife, so that the manufacturing cost of samples manufactured in small batches is reduced. Which comprises the following steps: a, cutting a small hole with a first diameter on a release film with a protective film by a first etching knife, and then pulling away waste materials of the release film hole by the protective film; b, compounding a double-sided adhesive tape on the first surface of the release film, and compounding a bottom film on the second surface of the release film, so that the double-sided adhesive tape is bonded with the bottom film through a release film hole; c, cutting a small hole with a second diameter at a position corresponding to the release film hole by using a second etching knife, and pulling off the release film and the small hole of the double-sided adhesive tape by using the bottom film; the value of the first diameter is smaller than that of the second diameter, and the value of the second diameter is equal to that of the preset small hole.)

1. A method for removing pinhole scraps by using an etching knife, which is characterized by comprising the following steps:

a, cutting a small hole with a first diameter on a release film with a protective film by a first etching knife, and then pulling away waste materials of the release film hole by the protective film;

b, compounding a double-sided adhesive tape on the first surface of the release film, and compounding a bottom film on the second surface of the release film, so that the double-sided adhesive tape is bonded with the bottom film through a release film hole;

c, cutting a small hole with a second diameter at a position corresponding to the release film hole by using a second etching knife, and pulling off the release film and the small hole of the double-sided adhesive tape by using the bottom film;

the value of the first diameter is smaller than that of the second diameter, and the value of the second diameter is equal to that of the preset small hole.

2. A method of using an etching blade to remove small-hole debris as in claim 1, wherein: the basement membrane is a PET original membrane.

3. A method of using an etching blade to remove small-hole debris as in claim 1, wherein: the difference between the first diameter and the second diameter is-0.5 mm.

4. A method of using an etching blade to remove small-hole debris as in claim 1, wherein: the first etching knife and the second etching knife are both bottom-to-top flaring etching knives.

5. A method of using an etching blade to remove small-hole debris as in claim 1, wherein: when the second etching knife is operated, the knife setting operation is carried out in advance, so that the circle centers of the second etching knife and the first etching knife corresponding to the position of the small hole are overlapped.

6. The method of claim 4, wherein the removing of the small-hole waste material by using an etching knife comprises: the first etching knife and the second etching knife are the same etching knife, and the thickness of the bottom film is larger than that of the protective film, so that the bottom film cannot penetrate through the holes punched by the second etching knife.

7. The method of claim 4, wherein the removing of the small-hole waste material by using an etching knife comprises: the taper of the second etching knife is larger than that of the first etching knife, so that the undercutting depths of the first etching knife and the second etching knife are the same, and the punching requirement can be met.

8. A method of using an etching blade to remove small-hole debris as in claim 1, wherein: the first etching knife is externally connected with a first servo driving structure, the first servo driving structure comprises horizontal XY coordinate movement and Z-direction vertical movement, the first servo driving structure sets movement parameters according to an array arranged by the small holes, and the first servo driving structure vertically moves in the Z direction once after moving once in place, so that punching operation with a first diameter is completed.

9. A method of using an etching blade to remove small-hole debris as in claim 8, wherein: the second etching knife is externally connected with a second servo driving structure, the second servo driving structure comprises horizontal XY coordinate movement and Z-direction vertical movement, the second servo driving structure sets movement parameters according to the array of the small holes, and the second servo driving structure vertically moves in the Z direction once after moving once in place, so that punching operation of a second diameter is completed.

10. A method of using an etching blade to remove small-bore waste as claimed in claim 9, wherein: the first servo driving mechanism and the second servo driving mechanism are driven to adjust through external parameters, and the adjustment is rapidly carried out according to the array small holes of the product shape, so that the product meeting the requirements of customers is rapidly produced.

Technical Field

The invention relates to the technical field of die cutting, in particular to a method for removing small-hole waste materials by using an etching knife.

Background

The double-sided adhesive tape with a plurality of small holes distributed on the surface of the product is compounded with the release film, the small holes penetrate through the double-sided adhesive and the release film, and when the small-batch production of samples is carried out, because the actual structure of the product is not determined, the aperture and the interval of the small holes are likely to change, the hardware die is directly manufactured, the cost is high, and therefore, a processing method for the small-batch production at the sample stage, which can reduce the cost, is urgently needed to be found.

Disclosure of Invention

Aiming at the problems, the invention provides a method for removing small-hole waste materials by using an etching knife, which arranges corresponding small holes on the surface of a composite product integrally formed by double-sided adhesive and a release film by using the etching knife, so that the manufacturing cost of samples manufactured in small batches is reduced.

A method for removing pinhole scraps by using an etching knife, which is characterized by comprising the following steps:

a, cutting a small hole with a first diameter on a release film with a protective film by a first etching knife, and then pulling away waste materials of the release film hole by the protective film;

b, compounding a double-sided adhesive tape on the first surface of the release film, and compounding a bottom film on the second surface of the release film, so that the double-sided adhesive tape is bonded with the bottom film through a release film hole;

c, cutting a small hole with a second diameter at a position corresponding to the release film hole by using a second etching knife, and pulling off the release film and the small hole of the double-sided adhesive tape by using the bottom film;

the value of the first diameter is smaller than that of the second diameter, and the value of the second diameter is equal to that of the preset small hole.

It is further characterized in that:

the bottom film is a PET original film;

the difference between the first diameter and the second diameter is-0.5 mm;

the first etching knife and the second etching knife are both bottom-to-top flaring etching knives;

the second etching knife carries out tool setting operation in advance when in operation, so that the circle centers of the second etching knife and the first etching knife corresponding to the position of the small hole are superposed;

preferably, the first etching knife and the second etching knife are the same, and the thickness of the bottom film is larger than that of the protective film, so that the bottom film cannot penetrate through the holes punched by the second etching knife;

the taper of the second etching knife is larger than that of the first etching knife, so that the undercutting depths of the first etching knife and the second etching knife are the same, and the punching requirement can be met;

the first etching knife is externally connected with a first servo driving structure, the first servo driving structure comprises horizontal XY coordinate movement and Z-direction vertical movement, the first servo driving structure sets movement parameters according to an array of the small holes, and the first servo driving structure vertically moves in the Z direction once after moving once in place, so that punching operation with a first diameter is completed;

the second etching knife is externally connected with a second servo driving structure, the second servo driving structure comprises horizontal XY coordinate movement and Z-direction vertical movement, the second servo driving structure sets movement parameters according to the array of the small hole arrangement, and the second servo driving structure vertically moves in the Z direction once after moving once in place, so that punching operation with a second diameter is completed;

the driving of the first servo driving mechanism and the second servo driving mechanism is adjusted through external parameters, and the adjustment is rapidly carried out according to the array small holes of the product shape, so that the product meeting the requirements of customers is rapidly produced;

in the step b, the base film is compounded and then the double-sided adhesive tape is compounded, or the base film and the double-sided adhesive tape are compounded at the same time.

After the technical scheme is adopted, the small hole with the first diameter is cut on the release film with the protective film through the etching knife, waste materials of the release film hole are pulled away through the protective film, then the double-faced adhesive tape and the bottom film are compounded on the two surfaces of the release film respectively, the double-faced adhesive tape is enabled to be adhered to the bottom film through the small hole with the first diameter, then the small hole with the second diameter is punched on the double-faced adhesive tape and the release film through the etching knife, then the bottom film drives the waste materials of the holes on the double-faced adhesive tape and the release film to be discharged, and then the corresponding product is obtained, the corresponding small holes are distributed on the surface of the composite product formed by integrally forming the double-faced adhesive tape and the release film through the etching knife, and the manufacturing cost of samples manufactured in small batches is reduced.

Drawings

FIG. 1 is a schematic diagram of a product structure suitable for use in the present invention;

FIG. 2 is a schematic diagram of the inventive process scheme;

FIG. 3 is a diagram of the process steps for forming the product of the present invention;

the names corresponding to the sequence numbers in the figure are as follows:

the PET film comprises a release film 10, a protective film 11, a double-sided adhesive tape 20, a PET original film 30, a first etching knife 40 and a second etching knife 50.

Detailed Description

A method for removing pinhole scraps by using an etching knife, which is shown in fig. 2 and 3, and comprises the following steps:

a, cutting a small hole with a first diameter on a release film 10 with a protective film 11 by a first etching knife 40, and then pulling away waste materials of the release film hole by the protective film 10;

b, compounding a double-sided adhesive tape 20 on the first surface of the release film 11, and compounding a base film on the second surface of the release film 10, so that the double-sided adhesive tape 20 is stuck with the base film through a release film hole;

c, cutting a small hole with a second diameter at the position corresponding to the release film hole by using a second etching knife 50, and pulling off the small holes of the release film 10 and the double-sided adhesive tape 20 by using the bottom film 30;

the value of the first diameter is smaller than that of the second diameter, and the value of the second diameter is equal to that of the preset small hole.

The specific embodiment is as follows:

a, cutting a first small hole with the diameter of 1.5mm on a release film 10 with a protective film 11 by a first etching knife 40, and then pulling away waste materials of the release film hole by the protective film 11;

b, compounding a double-sided adhesive tape 20 on the upper surface of the release film 10, compounding a PET original film 30 on the lower surface of the release film 10, compounding a base PET original film 30 and then compounding the double-sided adhesive tape 20, or compounding the PET original film 30 and the double-sided adhesive tape 20 simultaneously, so that the double-sided adhesive tape 20 is adhered to the PET original film 30 through a release film hole;

c, cutting a small hole with a second diameter of 2.0mm at the position corresponding to the release film hole by a second etching knife 50, and pulling off the small holes of the release film 10 and the double-sided adhesive tape 20 by using the PET original film 30;

the second diameter has a value equal to the diameter of the predetermined orifice.

Wherein, the first etching knife 40 and the second etching knife 50 are both bottom-to-top flaring etching knives;

the second etching blade 50 is operated in advance so that the centers of the second etching blade 50 and the first etching blade 40 at the positions corresponding to the holes coincide with each other.

In specific implementation, the first etching knife 40 and the second etching knife 50 are the same etching knife, and the thickness of the bottom film is greater than that of the protective film, so that the bottom film cannot penetrate through the holes punched by the second etching knife 50.

In another embodiment, the taper of the second etching blade 50 is greater than the taper of the first etching blade 40, so that the undercutting depths of the first etching blade 40 and the second etching blade 50 are the same, and the requirement of punching can be met.

In specific implementation, the first etching knife 40 is externally connected with a first servo driving structure, the first servo driving structure comprises horizontal XY coordinate movement and Z-direction vertical movement, the first servo driving structure sets movement parameters according to an array of the small holes, and the first servo driving structure vertically moves in the Z direction once after moving once in place, so that punching operation with a first diameter is completed; the second etching knife 50 is externally connected with a second servo driving structure, the second servo driving structure comprises horizontal XY coordinate movement and Z-direction vertical movement, the second servo driving structure sets movement parameters according to the array of the small hole arrangement, and the second servo driving structure vertically moves in the Z direction once after moving once in place, so that punching operation with a second diameter is completed; the first servo driving mechanism and the second servo driving mechanism are driven to adjust through external parameters, and the adjustment is rapidly carried out according to the array small holes of the product shape, so that the product meeting the requirements of customers is rapidly produced.

It cuts the aperture of first diameter on the release liner that has the protection film through the etching knife, later pull away the waste material from the type membrane hole with the protection film, later compound double faced adhesive tape respectively at two surfaces from the type membrane, the basement membrane, make the double faced adhesive tape see through the aperture of first diameter and adhere to the basement membrane, later on double faced adhesive tape with from type epimembranal aperture through the etching knife punching out second diameter, then drive double faced adhesive tape and waste discharge from the hole waste material on the type membrane through the basement membrane, and then obtain corresponding product, it arranges corresponding aperture on the surface of the compound product that double faced adhesive tape and release liner formed wholly through the etching knife, make the cost of manufacture of the sample of small batch preparation reduce.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.