阅读说明：本技术 一种线路板上料装置、方法、贴膜设备和智能工控设备 (Circuit board feeding device and method, film sticking equipment and intelligent industrial control equipment ) 是由 郑晓静 赵小雨 李玉雄 于 2021-08-03 设计创作，主要内容包括：本发明涉及线路板贴保护膜领域,尤其涉及一种线路板上料装置及方法和贴膜设备。该装置包括上料机架、线路板供料机构、上料驱动机构和上料机械手；上料机械手包括机械手上板、机械手下板和上料吸盘；机械手下板与机械手上板固定连接,机械手下板设置有吸盘定位孔、线路板定位凸起和线路板定位凹槽,上料吸盘嵌合于吸盘定位孔中；机械手上板内设置有吸气通道,吸气通道两端分别与真空装置和上料吸盘相连通；该装置在搬移线路板时采用线路板定位凸起和线路板定位凹槽对其进行定位避免线路板受到扰动时产生滑移,提高线路板搬移精度。(The invention relates to the field of circuit board protective film pasting, in particular to a circuit board feeding device and method and film pasting equipment. The device comprises a feeding rack, a circuit board feeding mechanism, a feeding driving mechanism and a feeding manipulator; the feeding manipulator comprises a manipulator upper plate, a manipulator lower plate and a feeding sucker; the lower manipulator plate is fixedly connected with the upper manipulator plate, the lower manipulator plate is provided with a sucker positioning hole, a circuit board positioning bulge and a circuit board positioning groove, and the feeding sucker is embedded in the sucker positioning hole; an air suction channel is arranged in the upper plate of the manipulator, and two ends of the air suction channel are respectively communicated with the vacuum device and the feeding sucker; when the circuit board is moved, the circuit board positioning protrusion and the circuit board positioning groove are used for positioning the circuit board, so that the circuit board is prevented from sliding when disturbed, and the circuit board moving precision is improved.)

1. A circuit board feeding device is characterized by comprising a feeding rack (31), a circuit board feeding mechanism (32), a feeding driving mechanism (33) and a feeding manipulator (34); the driving end of the feeding driving mechanism (33) is connected with the feeding manipulator (34) and drives the feeding manipulator (34) to be respectively connected with the circuit board feeding mechanism (32) and the feeding station; the feeding manipulator (34) comprises a manipulator upper plate (35), a manipulator lower plate (36) and a feeding sucker (37); the manipulator lower plate (36) is fixedly connected with the manipulator upper plate (35), the manipulator lower plate (36) is provided with a sucker positioning hole (361), a circuit board positioning bulge (362) and a circuit board positioning groove (363), and the feeding sucker (37) is embedded in the sucker positioning hole (361); an air suction channel is arranged in the manipulator upper plate (35), and two ends of the air suction channel are respectively communicated with the vacuum device and the feeding sucker (37); the side surface of the circuit board positioning bulge (362) is matched with the central hole of the circuit board, the inner side surface of the circuit board positioning groove (363) is matched with the outer end surface of the circuit board body, and the air suction end of the feeding sucker (37) is contacted with the upper surface of the circuit board.

2. A circuit board loading device according to claim 1, wherein a plurality of loading suction cups (37) are respectively located at the circuit board positioning protrusion (362) and the circuit board positioning recess (363).

3. The circuit board feeding device according to claim 1, wherein the feeding driving mechanism (33) comprises a left-right driving component (331), a front-back driving component (332), an up-down driving component (333) and a driving bottom plate (334); the driving end of the left and right driving component (331) is connected with the front and rear driving component (332), and the driving end of the front and rear driving component (332) is connected with the upper and lower driving component (333); the driving end of the up-down driving component (333) is connected with a driving bottom plate (334), and the driving bottom plate (334) is connected with the manipulator upper plate (35).

4. A circuit board loading device according to claim 3, wherein the driving base plate (334) is provided with a driving guide post guide sleeve (335) and a driving spring (336); a guide sleeve in the driving guide post guide sleeve (335) is fixed on the driving bottom plate (334), and a guide post in the driving guide post guide sleeve (335) is connected with the manipulator upper plate (35); two ends of the driving spring (336) are respectively contacted with the upper surface of the manipulator upper plate (35) and the lower surface of the driving bottom plate (334).

5. A circuit board loading apparatus according to claim 3, wherein the left and right driving assemblies (331), the front and rear driving assemblies (332) and the up and down driving assemblies (333) are driven by a motor or an air cylinder.

6. A circuit board loading method is characterized in that the method adopts the circuit board loading device, and the method comprises the following steps:

1) the first film sticking device cuts off and blanks the bottom film to the moving jig, and the moving device drives the moving jig to move to the feeding station;

2) the feeding driving mechanism (33) drives the feeding manipulator (34) to move to a discharge hole of the circuit board feeding mechanism (32) to suck the circuit board, at the moment, the circuit board positioning protrusion (362) is matched with a central hole of the circuit board, and the inner side surface of the circuit board positioning groove (363) is matched with the outer end surface of the circuit board body;

3) the feeding driving mechanism (33) drives the feeding manipulator (34) to move to the feeding station to blank the circuit board above the bottom film, and the bottom of the circuit board is attached to the bottom film to complete the feeding process of the circuit board.

7. The circuit board film pasting equipment is characterized by comprising a workbench, a moving device (1) fixed on the workbench, a first film pasting device (2), a circuit board feeding device (3) and a second film pasting device (4); the circuit board loading device (3) is as defined in claim 1; the workbench is provided with a bottom film pasting station, a feeding station and a top film pasting station; the moving device (1) is provided with a moving jig, the moving device (1) drives the moving jig to move to the bottom surface film pasting station, the feeding station and the top surface film pasting station respectively, and the first film pasting device (2), the circuit board feeding device (3) and the second film pasting device (4) are connected with the bottom surface film pasting station, the feeding station and the top surface film pasting station respectively; the moving device (1) is used for driving the moving jig to move to different stations; the first film sticking device (2) is used for punching the protective film onto the moving jig; the circuit board feeding device (3) is used for feeding the circuit board above the bottom surface protective film; the second film sticking device (4) is used for sticking the top surface protective film to the top surface of the circuit board; the second film sticking device (4) comprises a film supplying mechanism (5) and a film cutting mechanism (6); the film supply mechanism (5) comprises a supply disc (51), a fixed clamping head (52), a movable clamping head (53) and a material receiving disc (54); the fixed clamping head (52) comprises a fixed cylinder (55) and a fixed head (56), the fixed cylinder (55) is fixed on the workbench, the output end of the fixed cylinder is connected with the upper and lower fixed heads (56), and the inner side surfaces of the upper and lower fixed heads (56) are contacted with the upper and lower surfaces of the protective film; the movable clamping head (53) comprises a clamping head driving element (531), a movable air cylinder (532) and a movable head (533); the driving end of a clamping head driving element (531) is connected with a movable air cylinder (532), the output end of the movable air cylinder (532) is respectively connected with upper and lower movable heads (533), and the inner side surfaces of the upper and lower movable heads (533) are respectively contacted with the upper and lower surfaces of the protective film; the cutting end of the film cutting mechanism (6) is contacted with the protective film between the fixed clamping head (52) and the movable clamping head (53).

8. The circuit board film laminating equipment is characterized in that the film cutting mechanism (6) comprises a film cutting rack (61), a lower cutting head (62) and an upper cutting head (63), wherein the lower cutting head (62) and the upper cutting head (63) are distributed oppositely up and down; the lower cutting head (62) comprises a lower cutting cylinder (64) and a lower cutting die (65), and the output end of the lower cutting cylinder (64) is connected with the lower end of the lower cutting die (65); the upper end of the lower cutting die (65) is provided with a main body cutting head (66) and a central hole cutting head (67), the main body cutting head (66) and the central hole cutting head (67) both protrude out of the upper surface of the lower cutting die (65), and the shapes and relative positions of the main body cutting head (66) and the central hole cutting head (67) respectively correspond to the outer contour shape of the top surface film of the circuit board, the central hole shape of the top surface film of the circuit board and the relative positions of the top surface film of the circuit board and the central hole shape of the top surface film of the circuit board; the cutting ends of the main body cutting head (66) and the central hole cutting head (67) are contacted with the lower surface of the protective film; the upper cutting head (63) comprises an upper cutting cylinder (631) and an upper cutting die (632), and the output end of the upper cutting cylinder (631) is connected with the upper cutting die (632); the bottom surface of the upper cutting die (632) is a plane, the bottom surface of the upper cutting die (632) is provided with an upper air suction hole (633), and the upper air suction hole (633) is communicated with a vacuum device; the bottom surface of the upper cutting die (632) is contacted with the upper surface of the protective film; the output end of the undercut cylinder (64) is provided with a lower bottom plate (641), a front and rear limiting block (642) and a left and right limiting block (643); the lower surface of the lower bottom plate (641) is connected with the output end of the lower cutting cylinder (64), and the upper surface of the lower bottom plate (641) is connected with the lower surface of the lower cutting die (65); the two front and rear limiting blocks (642) are respectively fixed at the front and rear sides of the undercut die (65), limiting steps are arranged at the inner sides of the front and rear limiting blocks (642), the inner side surfaces of the front and rear directions of the two limiting steps are respectively contacted with the front and rear side surfaces of the undercut die (65), and the lower surfaces of the limiting steps are contacted with the upper surface of the undercut die (65); the left and right limiting blocks (643) are respectively fixed on the left and right sides of the undercut die (65), and the inner side surfaces of the left and right limiting blocks (643) in the left and right direction are respectively contacted with the side surfaces of the undercut die (65) in the left and right direction.

9. An intelligent industrial control device, comprising a processor, wherein the processor performs the method of claim 6.

10. A non-transitory computer readable carrier medium storing program instructions, which when executed by a processor, cause the processor to perform the method of claim 6.

Technical Field

The invention relates to the field of circuit board protective film pasting, in particular to a circuit board feeding device, a circuit board feeding method, a circuit board film pasting device and intelligent industrial control equipment.

Background

The circuit board is also called as a circuit board, and conductive patterns and holes are arranged on a base material and used for replacing a chassis of the traditional electronic components and realizing the mutual connection between the electronic components, thereby greatly reducing the errors of wiring and assembly and improving the automation level and the production efficiency. In the production process of the printed circuit board, the circuit board needs to be protected, and a common method is to attach protective films on the top surface and the bottom surface of the circuit board.

The Chinese invention patent application (publication No. CN112601378A, published as 20210402) discloses an automatic film sticking machine based on a PCB (printed Circuit Board) soft board, which comprises a machine body, wherein a working cavity is arranged in the machine body, a feeding cavity is communicated between the right wall surface of the lower side of the working cavity and the right end surface of the machine body, a feeding mechanism is fixedly arranged on the right end surface of the machine body at the position corresponding to the feeding cavity, the feeding mechanism can convey a protective film to be stuck to the inner part of the working cavity, and a moving rod capable of horizontally moving in any direction is arranged on the upper wall surface of the working cavity in a sliding manner. The material throwing failure caused by the adhesion of the protective films is effectively prevented, and the production efficiency is improved.

The prior art has the following defects: the circuit board is moved to the feeding station by directly sucking the top surface of the circuit board through the sucking disc, the circuit board is not positioned in the moving process, the circuit board can slide relative to the sucking disc when being disturbed in the moving process, and the moving precision of the circuit board is reduced.

Disclosure of Invention

In view of the above problems, an object of the present invention is to: the circuit board feeding device and the method have the advantages that when the circuit board is moved, the circuit board positioning protrusions and the circuit board positioning grooves are used for positioning the circuit board, so that the circuit board is prevented from sliding when disturbed, and the circuit board moving precision is improved.

Another object of the invention is: the equipment is adopted to automatically complete the pulling-out process and the fixing process of the protective film, so that the labor intensity of workers is reduced, and the film supply efficiency is improved; the lower cutting die is provided with the main body cutting head and the central hole cutting head, and simultaneously, the central hole shape and the outline shape of the circuit board are cut off, so that the number of film cutting devices is reduced, and the film cutting efficiency is improved.

In order to achieve the purpose, the invention adopts the following technical scheme:

a circuit board feeding device comprises a feeding rack, a circuit board feeding mechanism, a feeding driving mechanism and a feeding manipulator; the driving end of the feeding driving mechanism is connected with the feeding manipulator and drives the feeding manipulator to be respectively connected with the circuit board feeding mechanism and the feeding station; the feeding manipulator comprises a manipulator upper plate, a manipulator lower plate and a feeding sucker; the lower manipulator plate is fixedly connected with the upper manipulator plate, the lower manipulator plate is provided with a sucker positioning hole, a circuit board positioning bulge and a circuit board positioning groove, and the feeding sucker is embedded in the sucker positioning hole; an air suction channel is arranged in the upper plate of the manipulator, and two ends of the air suction channel are respectively communicated with the vacuum device and the feeding sucker; the side surface of the circuit board positioning bulge is matched with a central hole of the circuit board, the inner side surface of the circuit board positioning groove is matched with the outer end surface of the circuit board body, and the air suction end of the feeding sucker is contacted with the upper surface of the circuit board.

Preferably, the plurality of feeding suckers are respectively positioned at the positions of the circuit board positioning bulges and the circuit board positioning grooves. The feeding driving mechanism comprises a left driving component, a right driving component, a front driving component, a rear driving component, an upper driving component, a lower driving component and a driving bottom plate; the left and right driving component driving ends are connected with the front and rear driving components, and the front and rear driving component driving ends are connected with the upper and lower driving components; the driving end of the upper and lower driving components is connected with a driving bottom plate, and the driving bottom plate is connected with the upper plate of the manipulator.

Preferably, the driving bottom plate is provided with a driving guide pillar guide sleeve and a driving spring; a guide sleeve in the driving guide post and guide sleeve is fixed on the driving bottom plate, and a guide post in the driving guide post and guide sleeve is connected with the upper plate of the manipulator; two ends of the driving spring are respectively contacted with the upper surface of the upper plate of the manipulator and the lower surface of the driving bottom plate. The left and right driving components, the front and back driving components and the up and down driving components are driven by motors or air cylinders.

In addition, the invention also discloses a circuit board loading method, which adopts the circuit board loading device and comprises the following steps:

1) the first film sticking device cuts off and blanks the bottom film to the moving jig, and the moving device drives the moving jig to move to the feeding station;

2) the feeding driving mechanism drives the feeding manipulator to move to a discharge port of the circuit board feeding mechanism to suck the circuit board, the circuit board positioning protrusion is matched with a central hole of the circuit board, and the inner side surface of the circuit board positioning groove is matched with the outer end surface of the circuit board body;

3) the feeding driving mechanism drives the feeding manipulator to move to the feeding station to enable the circuit board to be blanked above the bottom surface film, and the bottom surface of the circuit board is attached to the bottom surface film to complete the feeding process of the circuit board.

In addition, the invention also discloses intelligent industrial control equipment which comprises a processor and is characterized in that the processor executes the method.

Additionally, a non-transitory computer readable carrier medium storing program instructions that, when executed by a processor, cause the processor to perform the method is also disclosed.

In addition, the invention also discloses circuit board film pasting equipment which comprises a workbench, a moving device, a first film pasting device, a circuit board feeding device and a second film pasting device, wherein the moving device, the first film pasting device, the circuit board feeding device and the second film pasting device are fixed on the workbench; the workbench is provided with a bottom film pasting station, a feeding station and a top film pasting station; the moving device is provided with a moving jig, the moving device drives the moving jig to move to the bottom film pasting station, the feeding station and the top film pasting station respectively, and the first film pasting device, the circuit board feeding device and the second film pasting device are connected with the bottom film pasting station, the feeding station and the top film pasting station respectively; the moving device is used for driving the moving jig to move to different stations; the first film sticking device is used for punching the protective film onto the moving jig; the circuit board feeding device is used for feeding the circuit board to the position above the bottom surface protective film; the second film sticking device is used for sticking the top surface protection film to the top surface of the circuit board.

In order to solve the problems that after the protective film of the feeding disc is manually pulled out to a set position, the pulled protective film is fixed by a manual operation clamp for a film cutting mechanism to cut the film, the labor intensity of workers is increased, and the film feeding efficiency is reduced, the invention discloses a second film sticking device which comprises a film feeding mechanism and a film cutting mechanism; the film supply mechanism comprises a supply disc, a fixed clamping head, a movable clamping head and a material receiving disc; the fixed clamping head comprises a fixed cylinder and a fixed head, the fixed cylinder is fixed on the workbench, the output end of the fixed cylinder is connected with the upper fixed head and the lower fixed head, and the inner side surfaces of the upper fixed head and the lower fixed head are contacted with the upper surface and the lower surface of the protective film; the movable clamping head comprises a clamping head driving element, a movable air cylinder and a movable head; the driving end of the clamping head driving element is connected with a movable air cylinder, the output end of the movable air cylinder is respectively connected with the upper movable head and the lower movable head, and the inner side surfaces of the upper movable head and the lower movable head are respectively contacted with the upper surface and the lower surface of the protective film; the cutting end of the film cutting mechanism is in contact with the protective film between the fixed clamping head and the movable clamping head.

The invention discloses a film cutting mechanism, which aims to solve the problems that the number of film cutting equipment is increased and the film cutting efficiency is reduced by adopting two lower cutting dies and cutting the shape of a central hole of a circuit board and the shape of the outline of the circuit board for two times respectively; the lower cutting head comprises a lower cutting cylinder and a lower cutting die, and the output end of the lower cutting cylinder is connected with the lower end of the lower cutting die; the upper end of the lower cutting die is provided with a main body cutting head and a central hole cutting head, the main body cutting head and the central hole cutting head both protrude out of the upper surface of the lower cutting die, and the shapes and relative positions of the main body cutting head and the central hole cutting head respectively correspond to the outer contour shape of the circuit board top film, the shape of the central hole of the circuit board top film and the relative positions of the main body cutting head and the central hole cutting head; the cutting ends of the main body cutting head and the central hole cutting head are in contact with the lower surface of the protective film; the upper cutting head comprises an upper cutting cylinder and an upper cutting die, and the output end of the upper cutting cylinder is connected with the upper cutting die; the bottom surface of the upper cutting die is a plane, and the bottom surface of the upper cutting die is provided with an upper air suction hole which is communicated with a vacuum device; the bottom surface of the upper cutting die is contacted with the upper surface of the protective film.

Preferably, the output end of the undercutting cylinder is provided with a lower bottom plate, a front limiting block, a rear limiting block and a left limiting block and a right limiting block; the lower surface of the lower bottom plate is connected with the output end of the undercutting cylinder, and the upper surface of the lower bottom plate is connected with the lower surface of the undercutting die; the front and rear limiting blocks are respectively fixed on the front and rear sides of the undercut die, the inner sides of the front and rear limiting blocks are provided with limiting steps, the inner sides of the front and rear directions of the two limiting steps are respectively contacted with the front and rear sides of the undercut die, and the lower surfaces of the limiting steps are contacted with the upper surface of the undercut die; the left and right limiting blocks are fixed on the left and right sides of the undercut die respectively, and the inner side surfaces of the left and right limiting blocks in the left and right directions are in contact with the side surfaces of the left and right directions of the undercut die respectively.

The circuit board feeding device and the method adopting the technical scheme have the advantages that:

when the circuit board is moved by the feeding manipulator, the circuit board positioning protrusion is matched with the central hole of the circuit board, and the inner side surface of the circuit board positioning groove is matched with the outer end surface of the circuit board body, so that the circuit board is limited, the circuit board is prevented from sliding due to disturbance when being moved, and the moving precision of the circuit board is improved.

The circuit board film pasting equipment disclosed by the invention has the advantages that:

1. the protective film is pulled out to a set length and is finished by the movable clamping head, the protective film is fixed by the fixed clamping head, namely, the pulling-out process and the fixing process of the protective film are automatically finished by equipment without manual participation; thereby reducing the labor intensity of workers and improving the film supply efficiency.

2. The undercut die is provided with the main body cutting head and the central hole cutting head, so that the outline shape of the top surface film of the circuit board and the central hole shape of the top surface film of the circuit board can be cut simultaneously, namely, the central hole shape of the circuit board and the outline shape of the circuit board can be cut simultaneously only by one undercut die, the number of film cutting devices is reduced, and the film cutting efficiency is improved.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board film pasting device.

Fig. 2 is a schematic diagram of a product structure of the circuit board.

Fig. 3-5 are schematic structural diagrams of the circuit board feeding device.

Fig. 6-9 are schematic structural views of a second film sticking device.

Detailed Description

The following describes in detail embodiments of the present invention with reference to the drawings.

Example 1

A circuit board film laminating device shown in fig. 1 comprises a workbench, a moving device 1 fixed on the workbench, a first film laminating device 2, a circuit board feeding device 3 and a second film laminating device 4; the workbench is provided with a bottom film pasting station, a feeding station and a top film pasting station; the moving device 1 is provided with a moving jig, the moving device 1 drives the moving jig to move to the bottom surface film pasting station, the feeding station and the top surface film pasting station respectively, and the first film pasting device 2, the circuit board feeding device 3 and the second film pasting device 4 are connected with the bottom surface film pasting station, the feeding station and the top surface film pasting station respectively; the moving device 1 is used for driving the moving jig to move to different stations; the first film sticking device 2 is used for punching the protective film onto the moving jig; the circuit board feeding device 3 is used for feeding a circuit board to the position above the bottom surface protective film; the second film sticking device 4 is used for sticking the top surface protective film to the top surface of the circuit board;

the product flow direction of the circuit board is as follows: the first film pasting device 2, the moving device 1, the circuit board feeding device 3 and the second film pasting device 4.

Fig. 2 is a schematic diagram of a product structure of the circuit board. The circuit board product comprises a circuit board a, a top surface film b and a bottom surface film c, wherein the top surface film b and the bottom surface film c are respectively attached to the top surface and the bottom surface of the circuit board a.

As shown in fig. 3 and 4, the circuit board feeding device 3 includes a feeding rack 31, a circuit board feeding mechanism 32, a feeding driving mechanism 33, and a feeding manipulator 34; the driving end of the feeding driving mechanism 33 is connected with the feeding manipulator 34 and drives the feeding manipulator 34 to be respectively connected with the circuit board feeding mechanism 32 and the feeding station; the feeding manipulator 34 comprises a manipulator upper plate 35, a manipulator lower plate 36 and a feeding sucker 37; the manipulator lower plate 36 is fixedly connected with the manipulator upper plate 35, the manipulator lower plate 36 is provided with a sucker positioning hole 361, a circuit board positioning bulge 362 and a circuit board positioning groove 363, and the feeding sucker 37 is embedded in the sucker positioning hole 361; an air suction channel is arranged in the manipulator upper plate 35, and two ends of the air suction channel are respectively communicated with the vacuum device and the feeding sucker 37; the side surface of the circuit board positioning protrusion 362 is matched with the central hole of the circuit board, the inner side surface of the circuit board positioning groove 363 is matched with the outer end surface of the circuit board body, and the air suction end of the feeding sucker 37 is contacted with the upper surface of the circuit board. The plurality of feeding suckers 37 are respectively positioned at the positions of the circuit board positioning bulges 362 and the circuit board positioning grooves 363; the feeding driving mechanism 33 comprises a left and right driving component 331, a front and rear driving component 332, an up and down driving component 333 and a driving bottom plate 334; the driving end of the left and right driving component 331 is connected with the front and rear driving component 332, and the driving end of the front and rear driving component 332 is connected with the up and down driving component 333; the driving end of the up-down driving component 333 is connected with a driving bottom plate 334, and the driving bottom plate 334 is connected with the manipulator upper plate 35;

as shown in fig. 5, the driving base plate 334 is provided with a driving guide sleeve 335 and a driving spring 336; the guide sleeve in the driving guide post guide sleeve 335 is fixed on the driving bottom plate 334, and the guide post in the driving guide post guide sleeve 335 is connected with the manipulator upper plate 35; two ends of the driving spring 336 are respectively contacted with the upper surface of the manipulator upper plate 35 and the lower surface of the driving bottom plate 334; the left and right driving units 331, the front and rear driving units 332, and the up and down driving unit 333 are driven by motors or air cylinders.

Circuit board loading attachment 3 is at the course of the work: 1) the first film sticking device 2 cuts and blanks the bottom film to the moving jig, and the moving device 1 drives the moving jig to move to a feeding station; 2) the feeding driving mechanism 33 drives the feeding manipulator 34 to move to the discharge hole of the circuit board feeding mechanism 32 to suck the circuit board, at the moment, the circuit board positioning protrusion 362 is matched with the central hole of the circuit board, and the inner side surface of the circuit board positioning groove 363 is matched with the outer end surface of the circuit board body; 3) the feeding driving mechanism 33 drives the feeding manipulator 34 to move to the feeding station to blank the circuit board above the bottom film, and the bottom of the circuit board is attached to the bottom film to complete the feeding process of the circuit board.

The circuit board feeding device 3 solves the problems that a sucking disc is adopted to directly suck the top surface of a circuit board to move the circuit board to a feeding station, the circuit board is not positioned in the moving process, the circuit board can slide relative to the sucking disc when being disturbed in the moving process, and the moving precision of the circuit board is reduced. When the feeding manipulator 34 moves the circuit board, the circuit board positioning protrusion 362 is matched with the central hole of the circuit board, and the inner side surface of the circuit board positioning groove 363 is matched with the outer end surface of the circuit board body, so that the circuit board is limited and prevented from sliding due to disturbance when being moved, and the moving precision of the circuit board is improved.

As shown in fig. 6 and 7, the second film sticking device 4 comprises a film supply mechanism 5 and a film cutting mechanism 6; the film feeding mechanism 5 comprises a feeding disc 51, a fixed clamping head 52, a movable clamping head 53 and a receiving disc 54; the fixed clamping head 52 comprises a fixed cylinder 55 and a fixed head 56, the fixed cylinder 55 is fixed on the workbench, the output end of the fixed cylinder is connected with the upper and lower fixed heads 56, and the inner side surfaces of the upper and lower fixed heads 56 are contacted with the upper and lower surfaces of the protective film; the movable clamping head 53 comprises a clamping head drive element 531, a movable cylinder 532 and a movable head 533; the driving end of the clamping head driving element 531 is connected with a movable cylinder 532, the output end of the movable cylinder 532 is respectively connected with the upper and lower movable heads 533, and the inner side surfaces of the upper and lower movable heads 533 are respectively contacted with the upper and lower surfaces of the protective film; the cutting end of the film cutting mechanism 6 is contacted with the protective film between the fixed clamping head 52 and the movable clamping head 53. The clamping head driving element 531 includes a clamping driving cylinder 534 and a clamping driving base plate 535; the output end of the clamp driving cylinder 534 is connected with the clamp driving base plate 535, and the clamp driving base plate 535 is connected with the movable cylinder 532; the inner side surfaces of the fixed head 56 and the movable head 533 which are positioned at the upper part are both planes, and the inner side surfaces of the fixed head 56 and the movable head 533 which are positioned at the lower part are both triangular conical surfaces; both the fixed head 56 and the movable head 533 are of resilient material.

The film supply mechanism 5 is in operation: 1) the clamping head driving element 531 drives the movable air cylinder 532 to move to the discharge end of the film supply mechanism 5 to clamp one end of the protective film; 2) the clamping head driving element 531 drives the movable air cylinder 532 to move to a set position so that the protective film extends to a set length, and the fixed air cylinder 55 drives the fixed head 56 to clamp the other end of the protective film so as to fix the protective film; 3) the film cutting mechanism 6 cuts off and blanks the fixed protective film to complete the film supply process of the protective film.

The film feeding mechanism 5 solves the problems that the film feeding mechanism adopts the manual work to pull out the protective film of the feeding disc to a set position, and then the manual operation clamp fixes the pulled-out protective film for the film cutting mechanism to cut the film, so that the labor intensity of workers is increased, and the film feeding efficiency is reduced. In this way, the pulling-out of the protective film to the set length is completed by the movable clamping head 53, and the fixing of the protective film is completed by the fixed clamping head 52, i.e. the pulling-out process and the fixing process of the protective film are automatically completed by the equipment without manual participation; thereby reducing the labor intensity of workers and improving the film supply efficiency.

As shown in fig. 6, 8 and 9, the film cutting mechanism 6 includes a film cutting frame 61, a lower cutting head 62 and an upper cutting head 63, wherein the lower cutting head 62 and the upper cutting head 63 are distributed oppositely; the lower cutting head 62 comprises a lower cutting cylinder 64 and a lower cutting die 65, and the output end of the lower cutting cylinder 64 is connected with the lower end of the lower cutting die 65; the upper end of the lower cutting die 65 is provided with a main body cutting head 66 and a central hole cutting head 67, the main body cutting head 66 and the central hole cutting head 67 both protrude out of the upper surface of the lower cutting die 65, and the shapes and relative positions of the main body cutting head 66 and the central hole cutting head 67 respectively correspond to the outer contour shape of the circuit board top film, the central hole shape of the circuit board top film and the relative positions of the circuit board top film and the central hole shape of the circuit board top film; the cut ends of the main body cutting head 66 and the central hole cutting head 67 are in contact with the lower surface of the protective film; the upper cutting head 63 comprises an upper cutting cylinder 631 and an upper cutting die 632, and the output end of the upper cutting cylinder 631 is connected with the upper cutting die 632; the bottom surface of the upper cutting die 632 is a plane, the bottom surface of the upper cutting die 632 is provided with an upper air suction hole 633, and the upper air suction hole 633 is communicated with a vacuum device; the bottom surface of the upper cutting die 632 is in contact with the upper surface of the protective film.

The output end of the undercut cylinder 64 is provided with a lower bottom plate 641, a front and rear limiting block 642 and a left and right limiting block 643; the lower surface of the lower base plate 641 is connected with the output end of the undercutting cylinder 64, and the upper surface of the lower base plate 641 is connected with the lower surface of the undercutting die 65; the two front and rear limiting blocks 642 are respectively fixed at the front and rear sides of the undercut die 65, limiting steps are arranged at the inner sides of the front and rear limiting blocks 642, the inner side surfaces in the front and rear directions of the two limiting steps are respectively contacted with the front and rear side surfaces of the undercut die 65, and the lower surfaces of the limiting steps are contacted with the upper surface of the undercut die 65; the left and right limiting blocks 643 are fixed on the left and right sides of the undercut die 65 respectively, and the inner side surfaces of the left and right limiting blocks 643 in the left and right direction are in contact with the side surfaces of the undercut die 65 in the left and right direction respectively.

The output end of the upper cutting cylinder 631 is provided with an upper bottom plate 6311 and an upper guide post guide sleeve 6312; the output end of the upper cutting cylinder 631 is connected with the upper surface of the upper bottom plate 6311, and the lower surface of the upper bottom plate 6311 is connected with the upper cutting die 632; a guide sleeve in the upper guide post guide sleeve 6312 is fixed on the film cutting machine frame 61, and a guide post in the upper guide post guide sleeve 6312 is connected with the upper bottom plate 6311; the upper base plate 6311 is provided with a positioning guide pillar 6313, and an outer cylindrical surface of the positioning guide pillar 6313 is matched with a corresponding groove in the moving jig.

A cutting head driving assembly 68 is also arranged above the upper cutting head 63, and the cutting head driving assembly 68 comprises a cutting head driving cylinder 681, a cutting head guide rail slide block 682 and a cutting head driving bottom plate 683; the output end of the head cutting driving cylinder 681 is connected with a head cutting driving bottom plate 683, the head cutting driving bottom plate 683 is connected with an upper cutting cylinder 631, and the head cutting driving bottom plate 683 is connected with a slide block in a head cutting guide rail slide block 682; a collecting box 611 is fixedly arranged on the film cutting frame 61, and the collecting box 611 is used for collecting the waste protective film; the film cutting frame 61 is also fixedly provided with a plurality of collecting box limiting blocks 612, and the inner side surfaces of the plurality of collecting box limiting blocks 612 are respectively contacted with the front side end surface, the rear side end surface, the left side end surface and the right side end surface of the collecting box 611. An upward pushing cylinder 613 and an upper pushing post guide sleeve 614 are further arranged below the film cutting machine frame 61, the output end of the upward pushing cylinder 613 is connected with the film cutting machine frame 61 on the bottom surface of the lower cutting head 62, a guide post in the upper pushing post guide sleeve 614 is fixed on a workbench, and a guide sleeve in the upper pushing post guide sleeve 614 is connected with the film cutting machine frame 61 on the bottom surface of the lower cutting head 62.

The film cutting mechanism 6 is in the working process: 1) the downward cutting cylinder 64 extends out to drive the downward cutting die 65 to move upwards to the film cutting station, and the cutting cylinder 631 drives the upward cutting die 632 to move downwards to the film cutting station; 2) the cutting end of the main body cutting head 66 is in contact with the lower surface of the protective film to cut the outer contour shape of the circuit board top film, and the cutting end of the central hole cutting head 67 is in contact with the lower surface of the protective film to cut the central hole shape of the circuit board top film; the upper suction hole 633 at the bottom of the upper cutting die 632 sucks the top film after the film cutting is finished; 3) the top cutting driving assembly 68 drives the upper cutting die 632 to move to the top surface film pasting station to blank the top surface film to the top surface of the circuit board, and the film cutting process is completed.

The film cutting mechanism 6 solves the problems that two lower cutting dies are adopted and the shapes of the central hole of the circuit board and the outline of the circuit board are respectively cut twice, the number of film cutting devices is increased, and the film cutting efficiency is reduced. The undercut die 65 is provided with the main body cutting head 66 and the central hole cutting head 67, so that the outline shape of the top surface film of the circuit board and the central hole shape of the top surface film of the circuit board can be cut simultaneously, namely, the central hole shape of the circuit board and the outline shape of the circuit board can be cut simultaneously only by one undercut die, the number of film cutting devices is reduced, and the film cutting efficiency is improved.