阅读说明：本技术 用于测试图像与设计对准的设计文件选择 (Design file selection for test image to design alignment ) 是由 B·布拉尔 于 2020-02-06 设计创作，主要内容包括：本发明提供用于选择一或多个设计文件以供在测试图像与设计对准中使用的方法及系统。一种方法包含通过将第一及第二组图像与针对样品产生的测试图像进行比较而识别所述第一及第二组图像中的哪一组图像最佳匹配所述测试图像。所述第一及第二组图像分别包含所述样品上的第一及第二组设计层中的经图案化特征的图像,所述第一与第二组设计层是彼此不同的。所述方法还包含：通过将所述经识别组的图像与设计文件进行比较而为所述样品选择最佳匹配所述经识别组的图像的所述设计文件；及存储所述经选择设计文件的信息以供在一过程中使用,在所述过程中将所述经选择设计文件中的经图案化特征与在所述过程中针对样品产生的测试图像中的经图案化特征对准。(Methods and systems are provided for selecting one or more design files for use in testing image and design alignment. A method includes identifying which of first and second sets of images best matches a test image generated for a sample by comparing the first and second sets of images to the test image. The first and second sets of images include images of patterned features in first and second sets of design layers, respectively, on the sample, the first and second sets of design layers being different from one another. The method further comprises: selecting the design file for the sample that best matches the identified set of images by comparing the identified set of images to the design file; and storing information of the selected design file for use in a process in which patterned features in the selected design file are aligned with patterned features in a test image generated for a sample in the process.)

1. A system configured to select one or more design files for use in testing image and design alignment, comprising:

one or more computer systems configured for:

obtaining first and second sets of images of a sample, wherein the first and second sets of images comprise images of patterned features in first and second sets of design layers, respectively, on the sample, and wherein the first and second sets of design layers are different from each other;

identifying which of the first and second sets of images best matches a test image generated for the sample by comparing the first and second sets of images to the test image;

selecting one or more of the design files for the sample that best match the identified set of images by comparing the identified set of images to design files; and

storing information of the selected one or more design files for use in a process in which patterned features in the selected one or more design files are aligned with patterned features in a test image generated for a sample in the process to thereby align the test image with the one or more design files.

2. The system of claim 1, wherein the first and second sets of images are generated for two or more discrete locations on the sample.

3. The system of claim 1, further comprising an output acquisition subsystem configured to perform the process on the sample by: directing energy to the sample; detecting energy from the sample; and generating an output in response to the detected energy, wherein the patterned features in the design layer formed on the sample are not resolved in the generated output.

4. The system of claim 1, wherein the first set of design layers includes at least one of the design layers formed below at least one of the design layers in the second set of design layers.

5. The system of claim 4, wherein the process is a light-based process in which light detected from the sample is responsive to the at least one of the design layers formed below the at least one of the design layers in the second set of design layers.

6. The system of claim 1, further comprising an electron beam imaging system configured for generating the first and second sets of images, wherein the process is a light-based process.

7. The system of claim 6, wherein the first and second sets of images are generated utilizing first and second sets of imaging parameters of the electron beam imaging system, respectively, thereby causing the patterned features of first and second ones of the images in the first and second sets to be different from one another.

8. The system of claim 7, wherein the first and second sets of imaging parameters comprise different acceleration voltages.

9. The system of claim 1, wherein the process comprises detecting energy from the sample in two or more modes, and wherein the one or more computer systems are further configured for performing the acquiring, the identifying, the selecting, and the storing separately for each of the two or more modes.

10. The system of claim 1, further comprising one or more components configured for generating the first and second sets of images by simulating images generated in the process performed on the sample for the first and second sets of design layers.

11. The system of claim 1, wherein the first and second sets of design layers comprise different combinations of the design layers.

12. The system of claim 1, further comprising an optical imaging system configured for generating the first and second sets of images, wherein the process is a light-based process.

13. The system of claim 1, further comprising a charged particle beam imaging system configured for generating the first and second sets of images, wherein the process is a light-based process.

14. The system of claim 1, wherein the process comprises determining locations of defects detected on the specimen in design coordinates based on results of aligning the test image with the one or more design files.

15. The system of claim 1, wherein the process is a verification process.

16. The system of claim 1, wherein the process is a metrology process.

17. The system of claim 1, wherein the sample is a wafer.

18. A non-transitory computer-readable medium storing program instructions executable on a computer system for performing a computer-implemented method for selecting one or more design files for use in testing image to design alignment, wherein the computer-implemented method comprises:

obtaining first and second sets of images of a sample, wherein the first and second sets of images comprise images of patterned features in first and second sets of design layers, respectively, on the sample, and wherein the first and second sets of design layers are different from each other;

identifying which of the first and second sets of images best matches a test image generated for the sample by comparing the first and second sets of images to the test image;

selecting one or more of the design files for the sample that best match the identified set of images by comparing the identified set of images to design files; and

storing information of the selected one or more design files for use in a process in which patterned features in the selected one or more design files are aligned with patterned features in a test image for a sample generated in the process to thereby align the test image with the one or more design files.

19. A computer-implemented method for selecting one or more design files for use in testing image and design alignment, comprising:

obtaining first and second sets of images of a sample, wherein the first and second sets of images comprise images of patterned features in first and second sets of design layers, respectively, on the sample, and wherein the first and second sets of design layers are different from each other;

identifying which of the first and second sets of images best matches a test image generated for the sample by comparing the first and second sets of images to the test image;

selecting one or more of the design files for the sample that best match the identified set of images by comparing the identified set of images to design files; and

storing information of the selected one or more design files for use in a process in which patterned features in the selected one or more design files are aligned with patterned features in a test image for a sample generated in the process to thereby align the test image with the one or more design files.

Technical Field

The present invention relates generally to methods and systems for selecting one or more design files for use in testing image and design alignment.

Background

The following description and examples are not admitted to be prior art by virtue of their inclusion in this section.

IC designs may be developed using methods or systems such as Electronic Design Automation (EDA), Computer Aided Design (CAD), and other Integrated Circuit (IC) design software. The methods and systems may be used to generate a database of circuit patterns based on an IC design. The circuit pattern database contains data representing a plurality of layouts of various layers of the IC. The data in the circuit pattern database may be used to determine the layout of a plurality of reticles. The layout of a reticle typically includes a plurality of polygons that define features in a pattern on the reticle. Each photomask is used to fabricate one of the various layers of the IC. The layers of the IC may include, for example, junction patterns in semiconductor substrates, gate dielectric patterns, gate electrode patterns, contact patterns in inter-level dielectrics, and interconnect patterns on metallization layers.

Fabricating semiconductor devices, such as logic and memory devices, typically includes processing a substrate, such as a semiconductor wafer, using numerous semiconductor fabrication processes to form various features and multiple levels of semiconductor devices. For example, photolithography is a semiconductor fabrication process that involves transferring a pattern from a reticle to a resist disposed on a semiconductor wafer. Additional examples of semiconductor fabrication processes include, but are not limited to, Chemical Mechanical Polishing (CMP), etching, deposition, and ion implantation. Multiple semiconductor devices may be fabricated in an arrangement on a single semiconductor wafer and then separated into individual semiconductor devices.

Inspection processes are used at various steps during a semiconductor manufacturing process to detect defects on wafers to facilitate higher yield and therefore higher profit in the manufacturing process. Inspection is always an important part of the fabrication of semiconductor devices such as ICs. However, as the size of semiconductor devices decreases, inspection becomes even more important to the successful manufacture of acceptable semiconductor devices, as smaller defects can lead to device failure.

However, as design rules shrink, semiconductor manufacturing processes may operate closer to the limits of the performance capabilities of the processes. In addition, as design rules shrink, smaller defects can have an impact on the electrical parameters of the device, which drives more sensitive inspection. Thus, as design rules shrink, the population of potential yield-related defects detected by inspection grows dramatically, and the population of nuisance defects detected by inspection also increases dramatically. As a result, more and more defects may be detected on the wafer, and the correction process to eliminate all defects may be difficult and expensive.

Recently, inspection systems and methods have been increasingly designed to focus on the relationship between defects and design, since the impact on the design of a sample will determine whether and how important the defects are. For example, some methods have been developed for aligning inspection and design coordinates. One such method depends on verifying the accuracy of the registration of the system coordinates with respect to the design. Another such method involves post-processing alignment of the inspection image tiles and associated design clips.

The latest pattern and design technology known as Pixel points (Pixel points) available from KLA corporation of mibeda, california provides highly accurate coordinates of defects in the design space. This technique relies on design goals that closely match the image of the sample (e.g., produced by an optical inspection tool). Finding the correct design file combination is critical to qualifying for coordinate placement accuracy. Currently, the user must select the design files that are most likely to benefit the Pattern and Design Alignment (PDA) through trial and error and based on knowledge about the wafer processing.

However, there are several drawbacks to the currently used methods for selecting design files for use in design and image alignment. For example, wafer processing is becoming more complex, and almost everyone who wishes to find a matching design file for a given process level does not have this information or can understand it sufficiently enough to select the correct design file based thereon. In addition, the optical image is generally not resolved, and the situation becomes even worse when moving to smaller design rules. The fact that the structures from the previous layers are visible in the optical patch image (when light penetrates the wafer) also makes it substantially difficult to find the correct design layer to perform the PDA. Using a relatively large stack containing tens of design files is often not possible because the file size can become quite large and it will take too long to process those files.

Accordingly, it would be advantageous to develop systems and/or methods for selecting one or more design files for use in testing image and design alignment that do not have one or more of the disadvantages described above.

Disclosure of Invention

The following description of various embodiments should not be viewed as limiting the subject matter of the appended claims in any way.

One embodiment relates to a system configured to select one or more design files for use in testing image and design alignment. The system includes one or more computer systems configured for acquiring first and second sets of images of a sample. The first and second sets of images include images of patterned features in first and second sets of design layers, respectively, on the sample, and the first and second sets of design layers are different from one another. The one or more computer systems are also configured for identifying which of the first and second sets of images best matches a test image generated for the sample by comparing the first and second sets of images to the test image. In addition, the computer system is configured for selecting one or more of the design files for the sample that best match the identified set of images by comparing the identified set of images to the design files. The computer system is further configured for storing information of the selected one or more design files for use in a process in which patterned features in the selected one or more design files are aligned with patterned features in a test image generated for a sample in the process to thereby align the test image with the one or more design files. The system may be further configured as described herein.

Another embodiment relates to a computer-implemented method for selecting one or more design files for use in testing image and design alignment. The method includes the acquiring, identifying, selecting and storing steps described above. Each of the steps of the methods described above may be further performed as described further herein. Additionally, the methods described above may include any other steps of any other methods described herein. Further, the methods described above may be performed by any of the systems described herein.

Additional embodiments relate to a non-transitory computer-readable medium storing program instructions executable on a computer system for performing a computer-implemented method for selecting one or more design files for use in testing image and design alignment. The computer-implemented method includes the steps of the method described above. The computer-readable medium may be further configured as described herein. The steps of the computer-implemented method may be performed as further described herein. Additionally, the computer-implemented method for which the program instructions may be executed may include any other step of any other method described herein.

Drawings

Other objects and advantages of the invention will become apparent upon reading the following detailed description and upon reference to the drawings in which:

FIG. 1 is a flow chart illustrating one embodiment of steps that may be performed by system embodiments described herein;

FIG. 2 is a schematic diagram illustrating a plan view of one example of patterned features in different design files of a sample, test images of the sample, and images in the first and second sets described herein;

FIGS. 3 and 4 are schematic diagrams illustrating side views of embodiments of systems configured as described herein; and is

Fig. 5 is a block diagram illustrating one embodiment of a non-transitory computer-readable medium storing program instructions executable on a computer system for performing one or more of the computer-implemented methods described herein.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof have been shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the drawings and detailed description thereto are not intended to limit the invention to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the present invention as defined by the appended claims.

Detailed Description

The terms "design," "design data," and "design information" as used herein generally refer to the physical design (layout) of an IC as well as data derived from the physical design through complex simulations or simple geometric and Boolean (Boolean) operations. In addition, the image of the reticle and/or derivatives thereof acquired by the reticle inspection system may be used as a "proxy" or "agents" for the design. In any of the embodiments described herein that use a design, such a reticle image or derivative thereof may be used as a substitute for the design layout. The design may include any other design data or design data agents described in commonly owned U.S. patent No. 7,570,796 issued to safaar (Zafar) et al on 8.4.2009 and commonly owned U.S. patent No. 7,676,077 issued to Kulkarni (Kulkarni) et al on 3.9.2010, both of which are incorporated herein by reference as if fully set forth. In addition, the design data may be standard cell library data, integration layout data, design data for one or more layers, derivatives of design data, and all or part of chip design data.

However, in general, design information or data cannot be generated by imaging a wafer with a wafer inspection system. For example, the design pattern formed on the wafer may not accurately represent the design of the wafer, and the wafer inspection system may not be able to generate an image of the design pattern formed on the wafer with sufficient resolution so that the image may be used to determine information about the wafer design. Thus, in general, design information or design data cannot be generated using a verification system. In addition, "design" and "design data" described herein refer to information and data that is generated by a semiconductor device designer in the design process and thus may be well used in the embodiments described herein before the design is printed on any physical wafer.

It should be noted that the terms "first" and "second" are not used herein to indicate priority, preference, order, or order. Alternatively, the terms "first" and "second" are used merely to indicate that two elements are different from each other. In addition, use of the terms "first" and "second" is not intended to limit the invention to two of any one of the elements described using those terms. For example, even though some embodiments are described herein with respect to "first and second" sets of images, the invention is not limited to only first and second sets of images, and it will be clear to one of ordinary skill in the art how the invention can be extended to third, fourth, etc. sets of images. The same applies to the other "first and second" elements of the embodiments.

Turning now to the drawings, it should be noted that the figures are not drawn to scale. In particular, the scale of some of the elements of the figures are greatly exaggerated to emphasize characteristics of the elements. It should also be noted that the figures are not drawn to the same scale. Elements shown in more than one figure that may be similarly configured have been indicated using the same reference numbers. Unless otherwise mentioned herein, any of the elements described and shown may include any suitable commercially available element.

Embodiments described herein relate generally to IC design file selection for Pattern and Design Alignment (PDA) on optical and possibly other tools. The latest patterns and design techniques known as pixel points available from KLA corporation of mibeda, california provide highly accurate coordinates of defects in the design space. This technique relies on design goals that closely match the image of the sample (e.g., produced by an optical inspection tool). Finding the correct design file combination is critical to qualifying for coordinate placement accuracy. The embodiments described herein are particularly suited for finding which design file(s) should be used to best match the image and design file(s) generated by a tool, such as an optical tool.

One embodiment relates to a system configured to select one or more design files for use in testing image and design alignment. The term "test image" as used herein is generally defined as any output (e.g., signal, image, etc.) generated for a sample in a process performed on the sample. The test image may include output of any suitable size for the processes described herein, such as an image tile, a job region, a frame, a strip region image, and so forth. The test image will typically be the output generated for the sample by the actual tool, e.g., one that uses the actual physical sample itself to generate the output for the sample. Some embodiments of actual tools that may be used to generate test images are described further herein. However, the test image may also be generated without using an actual sample. For example, the test image may be a simulated image of the sample, which may or may not be generated using the actual image of the sample, e.g., where the image generated with the actual sample is used to render a different image of the actual sample. Any suitable components described herein may be used to generate the simulated image.

The system includes one or more computer systems configured for acquiring first and second sets of images of a sample. The first and second sets of images include images of patterned features in first and second sets of design layers, respectively, on the sample. The first and second sets of design layers are different from each other. In particular, the first and second sets of images may be acquired using parameters that cause patterned features shown in the first and second sets of images to come from different design layers on the sample. The different design layers in the first and second sets of design layers need not be mutually exclusive of each other. For example, both the first and second sets of images may include images of patterned features formed on the uppermost design layer on the sample, while only one of the first and second sets of images may show patterned features formed on an underlying design layer on the sample. Parameters that cause patterned features in the first and second sets of images to be different from each other may be selected based on information about the image generation process, and some suitable examples are further described herein. In the case where the images in the first and second sets are acquired using actual tools and physical samples, the parameters may be determined based on information about the sample, such as the materials that may be formed on the sample and the expected characteristics of such materials, such as depth, composition, refractive index, electron absorption characteristics, and the like. In the case where one or more components configured to simulate an image are used to acquire images in the first and second sets, the parameters may be determined based on information of the sample (e.g., design data for different combinations of design layers formed on the sample).

Acquiring the first and second sets of images may include generating images using actual physical tools or simulating one or more components of the images. However, acquiring the first and second sets of images may alternatively include acquiring the images from another method or system that generated the images or from a storage medium in which the first and second sets of images have been stored by another method or system that generated the first and second sets of images.

In one embodiment, the first and second sets of images are generated for two or more discrete locations on the sample. For example, as shown in step 100 in fig. 1, a computer system may be configured for selecting one or more locations on a sample and acquiring first and second sets of images of those locations. Two or more discrete locations on the sample may be selected based on information of the sample, such as which locations on the sample are expected to have different patterned features formed therein, and locations on the sample that are expected to have differences in patterned features formed therein due to process or sample variations. In general, different discrete locations may be selected to capture as much variation of patterned features formed on a sample as possible, whether caused by design or due to some margination.

The positions may be discrete in the sense that they are at least spaced apart from each other, as long as they do not have overlapping regions. In this way, acquiring the first and second sets of images does not include scanning a relatively large area on the sample, such as an entire die or strip region. Alternatively, generating the first and second sets of images may be performed in a move-acquire-measure type process in which the sample is not imaged while the image generation subsystem or system is moved between discrete locations on the sample, even though "measuring" involves some scanning over a relatively small area.

In another embodiment, the system includes an output acquisition subsystem configured to perform a process on a sample by: directing energy to the sample; detecting energy from the sample; and generating an output in response to the detected energy, and wherein the patterned features in the design layer formed on the sample are not resolved in the generated output. The output acquisition subsystem may be configured as described herein. The energy may comprise light, electrons, charged particles, and the like, as further described herein. The term "unresolved" as used herein interchangeably with "unresolved" means that the patterned features have a smaller dimension than the resolution of the output acquisition subsystem used to generate the output for the sample in the process as described above. In this output generation process, even if the output is responsive to patterned features, the patterned features cannot be clearly seen in any image generated from the output. In this way, even if the output or detected energy is responsive to the patterned feature, the output or image generated therefrom cannot be used to determine characteristics of the patterned feature, such as size, shape, texture, etc.

The generated output, or any test image generated therefrom, is therefore not usable to identify the design file of the patterned features in the test image. In other words, because patterned features are not resolved in the test image, attempting to use the test image alone to identify the correct design file for the PDA can be quite difficult, if not impossible. This problem caused by unresolved patterned features in the test image may be more complicated when the test image is responsive to patterned features formed on more than one design layer on the sample and when the patterned features in the test image may match patterned features formed in more than one design layer on the sample (e.g., due to the unresolved nature of the patterned features in the test image and similarities between the patterned features on multiple design layers). Furthermore, the person, method, or system selecting the design file may not have access to information regarding which design layers have been formed on the sample. However, the embodiments described herein make it possible to select the correct design file for use in a PDA even when the patterned features in the test image are not resolved, the test image is responsive to patterned features in multiple design files of a design layer formed on a sample, the patterned features in the test image match patterned features in more than one design file, and the design layer formed on the sample is unknown.

In some embodiments, the first set of design layers includes at least one of the design layers formed below at least one of the design layers in the second set of design layers. For example, the first set of design layers may include the uppermost design layer and the underlying design layer of the sample, while the second set of design layers may include only the uppermost design layer. In another example, the first set of design layers may include one design layer (not necessarily the uppermost design layer, as the uppermost design layer formed on the sample may not necessarily be known) and the underlying design layer of the sample, while the second set of design layers may include only the one design layer. In another example, the first set of design layers may include one design layer and two underlying design layers of the sample, while the second set of design layers may include only the one design layer.

The first and second sets of design layers may be selected to account for the uncertainty in which design layers correspond to the patterned features to which the test image responds. For example, in processes described herein involving alignment of a test image with a design file, the test image may be responsive to patterned features of an uppermost layer and one or more underlying layers (most likely only one underlying layer, but also likely two underlying layers or more than two underlying layers) formed on a sample. Thus, to determine which design file(s) to apply to test images and design alignments, embodiments described herein may select first and second sets of design layers such that one of the sets includes one or more layers underlying the design layers included in both of the sets. In this way, the layer or layers whose patterned features affect the test image may be determined, as described further herein. The order in which the design layers are formed on the sample, and thus which layers underlie others, can generally be determined from the design data for the sample.

In one such embodiment, the process is a light-based process, wherein light detected from the sample is responsive to at least one of the design layers formed below at least one of the design layers in the second set of design layers. For example, in the processes described herein in which a test image is aligned with one or more design files, light-based processes, in particular, are easier to produce an output that is responsive not only to the uppermost layer formed on a sample, but also to the underlying layer(s) formed on the sample. This may be the case when one or more of the wavelengths of light used in the process penetrate the uppermost surface on the sample and light returning from below the uppermost surface is detected in the process. As described herein, such imaging of patterned features on an underlying layer has complicated the determination of which design file(s) correspond to the patterned features in a test image in the past. As also described further herein, the embodiments described herein mitigate any such complications and make possible, practical, reliable, and accurate identification of design files corresponding to patterned features to which test images are responsive.

In additional embodiments, the first and second sets of design layers include different combinations of design layers. For example, as described herein, the design layers included in the first and second sets are not necessarily mutually exclusive. In particular, as further described herein, one design layer may be included in both the first and second sets, while one or more layers underlying the one design layer may be included in only one of the first and second sets. Any of the different combinations of design layers may include one or more design layers. In other words, one of the different combinations may include only one design layer. However, it is not expected that each of the different combinations will include only one design layer, each of which is different from each other. In other words, at least one of the first and second sets of design layers will likely include multiple design layers.

In another embodiment, the system includes an electron beam imaging system configured for generating first and second sets of images, and the process is a light-based process. For example, the first and second sets of images may be generated by a defect re-inspection tool, such as a Scanning Electron Microscope (SEM), at several locations on the sample. The electron beam imaging system and light-based process may be further configured as described herein. Thus, embodiments described herein may be configured for using SEM tools to select the correct design files for a PDA through an optical tool. As such, the embodiments described herein may be configured for use with imaging systems of a type different from the system that will perform the process including the PDA. Although the imaging system that generates the first and second sets of images does not necessarily use a different type of energy than the energy used by the process in which the alignment is performed, using an electron beam imaging system to generate the first and second sets of images may be advantageous for the embodiments described herein because such systems are generally capable of acquiring images at a higher resolution than the system that will perform the process described herein.

In one such embodiment, first and second sets of images are generated utilizing first and second sets of imaging parameters, respectively, of an electron beam imaging system, thereby causing first and second sets of patterned features in the images in the first and second sets to be different from one another. For example, in addition to being able to have a higher resolution than would typically be used to perform a process in which test images are aligned with a design, the electron beam imaging system described herein is also suitable for generating the first and second sets of images because it has imaging parameters that can be adjusted to change the design layer on a sample imaged by the electron beam imaging system. In particular, by imaging the sample with different imaging parameters, the electron beam imaging system may generate an image responsive to only one or more layers, some of which are located below the uppermost layer formed on the sample. Although some examples of suitable adjustable imaging parameters are described further herein, the imaging parameters used to generate the first and second sets of images may be any imaging parameters of an electron beam imaging system that cause the system to image different sets of design layers on a sample.

In another such embodiment, the first and second sets of imaging parameters include different acceleration voltages. For example, the first and second sets of images may be SEM images collected at different acceleration voltages (e.g., a relatively low voltage to thereby image only a current (e.g., uppermost) layer on the sample and a relatively high voltage to thereby image a previous (e.g., underlying) layer on the sample in addition to the current layer). Accordingly, embodiments described herein may be configured for collecting SEM image data at different acceleration voltages to find the correct design file that should be used on a tool (e.g., an optical tool) for a PDA, which may be performed as described further herein. Different acceleration voltages may be selected based on the characteristics of the electron beam imaging system and the characteristics of the sample. For example, based on estimated or expected characteristics of layers formed above an underlying layer (e.g., thicknesses, materials, and patterned features formed above the underlying layer), one of ordinary skill in the art can select appropriate acceleration voltages to generate the first and second sets of images described herein.

In one such example, as shown in fig. 2, design files 200 and 202 may be used for different layers on a sample. The design file 200 may be for a current or uppermost layer on a sample, and the design file 202 may be for a previous or underlying layer on the sample. As shown from the test image 204 generated for the sample on which the current and previous layers have been formed, it is not possible to determine which of the patterned features in the design files 200 and 202 correspond to patterned features in the test image based solely on the test image. Specifically, in the example shown in FIG. 2, based on the test image itself, it is not possible to determine that more than one design layer is needed to successfully execute the PDA. In other words, it is not possible to determine that both design files 200 and 202 are needed for the PDA based solely on the test image itself, thus resulting in the PDA being executed with less than all of the required design files. If the missing design file is not used for alignment, it may introduce an offset error in the x-direction when aligning the test image with the design. The offset error may be on the order of greater than 10nm and will have a negative impact on the sensitivity of the optical inspection (or other) tool (or the process performed using such alignment results). In particular, if test image 204 is aligned with design file 200, the alignment will introduce an offset in the x-direction. The offset will be correct only when the design layer 202 is added to the design file for alignment.

Embodiments described herein use first and second sets of images that include patterned features formed on different layers on a sample to find the correct design file for such alignment. For example, SEM images 206 and 208 are taken with different acceleration voltages, which causes patterned features in the first and second sets of images to be different from each other. In particular, SEM image 206 taken with a lower acceleration voltage, as compared to SEM image 208, shows only the patterned features in design file 200. In contrast, SEM image 208, taken with a higher acceleration voltage, shows patterned features in both design files 200 and 202, as compared to SEM image 206. These SEM images may then be compared to the design files and test images to determine which SEM image best matches the test image and which design file(s) correspond to the SEM images. Based on the information, patterned features (and design files containing them) to which the test image responds may be identified. For example, as can be seen by comparing the low and high acceleration voltage SEM images, design files, and test images shown in fig. 2, not only is design file 200 needed to perform good alignment of the test images with the design. In particular, in the example shown in fig. 2, SEM images of previous layers help the embodiments described herein find the correct design file for alignment.

In another embodiment, the system includes one or more components configured for generating the first and second sets of images by simulating images generated in a process performed on the sample for the first and second sets of design layers. For example, based on design clips from the same location (in x and y) of multiple design files, different combinations of these design layers may be rendered and the resulting simulated images may be used in the comparisons described further herein. Thus, embodiments described herein may use rendered images of possible design layer combinations and compare those to test (e.g., optical) images to select the best match, as described further herein.

The one or more components may be models, software, hardware, etc. executed by one or more computer systems. In some examples, the one or more components may perform forward type simulations of processes involved in fabricating design layers on a sample. For example, simulating an image may include simulating an appearance of a design layer when the design layer is printed on a sample. In other words, the simulated image may include generating a simulated representation of the sample on which the design layer is printed. One example of an empirically trained process model that may be used to generate simulated samples includes SEMulator 3D, which is commercially available from Coventor corporation of cari, north carolina. An example of a rigorous lithography simulation model is Prolith, which is commercially available from KLA corporation and can be used with SEMulator 3D products. However, any suitable model of any of the processes involved in generating an actual sample from a design file may be used to generate a simulated sample. In this way, a design file may be used to simulate the appearance that a sample on which a corresponding design layer has been formed will be in sample space (not necessarily the appearance of such a sample to an imaging system). Thus, the simulated representation of the sample may represent the appearance of the sample in 2D or 3D space of the sample.

The simulated representation of the sample may then be used to generate simulated first and second sets of images showing the appearance of the sample with the design layer printed thereon in the first and second sets of images of the sample. The first and second sets of images may be generated using a model such as WINsim, which is commercially available from KLA corporation and may use an Electromagnetic (EM) wave solver to rigorously model the response of the verifier. Such simulations may be performed using any other suitable software, algorithms, methods, or systems known in the art.

In other examples, the one or more components may include a Deep Learning (DL) -type model configured for inferring the first and second sets of images from the first and second sets of design layers. In other words, the one or more components may be configured to transform (by inference) one or more design files into first and second sets of images to be generated for the sample in a process in which test image and design alignment is performed. The one or more components may include any suitable DL model or network known in the art, including, for example, neural networks, CNNs, generative models, and the like. The one or more components may also be configured as described in the following commonly owned U.S. patent application publications: 2017/0140524 No. issued on 2017, month 5 and 18 days of Karlsandi (Karsenti) et al, 2017/0148226 No. issued on 2017, month 5 and 25 days of Zhang (Zhang) et al, 2017/0193400 No. issued on 2017, month 6 days of Bhaska (Bhaskar) et al, 2017/0193680 No. issued on 2017, month 6 days of Zhang et al, 2017/0194126 No. issued on 2017, month 6 days of Bashel et al, 2017/0200260 No. issued on 2017, month 13 days of Bashel et al, 2017/0200264 No. issued on 2017, month 13 days of Pack (Park) et al, 2017/0200265 No. issued on 2017, month 13 days of Bashel et al, 2017/0345140 No. issued on 2017, month 11 and 30 days of Zhang et al, 2017/0351952 No. issued on 2017, 868 No. issued on 2017, month 12, month 7, 19 No. issued on 2018, 2018/0107928 No. issued on 2017, month 19, 2018/0293721 issued on 11.2018 of Gupta (Gupta), et al, 2018/0330511 issued on 15.2018 of Ha (Ha), et al, 2019/0005629 issued on 3.2019 of dandyana (Dandiana), et al, and 2019/0073568 issued on 7.2019 of He (He), et al, which patent application publications are generally incorporated herein by reference as if fully set forth. The embodiments described herein may be further configured as described in these patent application publications. Additionally, embodiments described herein may be configured to perform any of the steps described in these patent application publications.

In some embodiments, the system includes an optical imaging system configured for generating first and second sets of images, and the process is a light-based process. For example, while the use of an electron beam imaging system to generate images for selection of design files for use in non-electron beam processes may be one particularly advantageous configuration of the embodiments described herein, other variations are possible. One variation is to use a light-based system to generate first and second sets of images for selecting a design file for use in a light-based process. Such a configuration may be advantageous when a light-based system is easily accessible, which has a relatively high resolution (e.g., such that patterned features on a sample are not below the resolution of the resolution and are higher than the resolution of a system performing the light-based process) and is capable of imaging patterned features of an underlying layer on the sample. Such an optical imaging system may be configured as further described herein, and in some examples may use a light source that emits x-rays that may be directed to the sample (e.g., using relatively high resolution optical tools of wavelengths in the range of about 10 nm). The first and second sets of images produced by such an optical imaging system may be otherwise used to select a design file for use in a light-based process for testing alignment of the images with the design as described herein.

In another embodiment, the system includes a charged particle beam imaging system configured for generating first and second sets of images, and the process is a light-based process. For example, in addition to electron beam imaging systems, other charged particle beam imaging systems can also be used in the embodiments described herein to generate the first and second sets of images. Those charged particle beam imaging systems may be configured as further described herein.

The computer system is also configured for identifying which of the first and second sets of images best matches the test image by comparing the first and second sets of images to the test image generated for the sample. For example, as shown in step 102 in fig. 1, a computer system may be configured for matching different sets of images with a test image of a sample. The comparison may be performed in any suitable manner (e.g. for any location for which images in the first and second sets were generated, the test image generated at that location is overlaid and aligned with the images in the first set generated for the same location on the sample and the other image is subtracted from one image to generate a difference image showing the difference between the test image and the images in the first set; and the same steps are repeated for the test image and the images in the second set generated for the same location).

The identifying may also include determining a metric of how well each of the first and second sets of images matches its corresponding test image based on the comparison results. For example, any difference between a test image and two images generated at the same location on a sample may be quantified using a difference image generated, for example, as described above. The difference may be any quantifiable difference between images, such as a shift or misregistration, a difference in a characteristic (e.g., shape, size, contrast, etc.) of the image portion in response to the patterned feature. The difference may also be any qualitative difference, such as the inability to align the test image with the images in the first and second sets at the same sample location, identifying that one of the images appears to be unresponsive to it but is imaged in the other of the images, or appears to affect patterned features of the other of the images. A measure of how well each of the first and second sets of images match the test image may be determined based on either or both of quantitative and qualitative differences. For example, quantitative and/or qualitative differences between images may be used to generate scores or rankings that indicate how well the images match each other and may be used as a measure of how well different sets of images match a test image. Based on this score, ranking, or metric, it can be easily identified which set of images in the first and second sets of images best matches the test image.

The computer system is further configured for selecting one or more design files for the sample that best match the identified set of images by comparing the identified set of images to the design files. For example, as shown in step 104 in fig. 1, the computer system may be configured for selecting a design file for the set of images for the sample that best matches the test image. In this way, low or high voltage SEM images may be matched to design files. The selecting may also include determining a metric of how well patterned features in the design file match patterned features in the identified set of images based on a result of comparing the identified set of images to the design file. Determining the metrics and selecting one or more design files that best match the identified set of images may be performed in other ways as described above. Since the first and second sets of images may have resolved patterned features that will be present in the various design files of the sample, this step should be a relatively straight-forward matching process. If the first and second sets of images are simulated images generated by one or more components described herein, the comparing and selecting steps may simply involve identifying which design layer(s) were used to simulate the identified set of images, such as by comparing the identified set of images that best match the test images to a record of which set of images were used to simulate which design file(s). In this way, a set of design files (which may include only one design file for only one design layer or more than one design file for more than one design layer on a sample) that best matches the test image may be identified and selected for use in aligning the test image to the design to be performed in a process, such as the process described herein.

In some embodiments, the computer system is configured for displaying to a user a first and second set of images (e.g., low and high acceleration voltage SEM images), test images (e.g., optical images of different wavelengths and apertures), and possibly design files. This display may appear similar to that shown in fig. 2, although fig. 2 shows this information for only one location, it may be modified to show this information for more than one location on the sample, either simultaneously or sequentially. As can be seen from this display of information, the user can easily determine the design file and SEM image that best match the test image. The computer system may also be configured for receiving from the user a selection of the correct combination of design files that best matches the first and second sets of images and the test image for a given pattern. In additional embodiments, different combinations of design files for simulating images as described herein may be ranked by a computer system from low error to high error. Given certain constraints (e.g., the number of design layers allowed), the computer system may select a combination of one or more design layers. Alternatively, the computer system may display the various combinations and their errors to the user and receive a selection of the best combination of one or more design files from the user for use in a process.

The computer system is also configured for storing information of the selected one or more design files for use in a process in which patterned features in the selected one or more design files are aligned with patterned features in a test image generated for a sample in the process to thereby align the test image with the one or more design files. The sample for which the process including the alignment of the design file with the test image is performed may be of the same type as the sample used to select the design file. For example, the sample and the sample used to select a design file may be subjected to the same fabrication process prior to performing the process thereon. The process performed using the selected design file may also be performed on any sample involved in selecting the design file.

As shown in step 106 of FIG. 1, the computer system may be configured for storing information of the selected design file for use in a process. The computer system may be configured to store the information in a recipe or by generating a recipe in which the process of aligning the test image with the design is to be performed. A "recipe" (as that term is used herein) may be generally defined as a set of instructions that may be used by a tool to perform a process on a sample. In this way, generating a recipe may include generating information on how the process is to be performed, which may then be used to generate instructions for performing the process. The information of the selected design file stored by the computer system may include any information (e.g., file name and location where it is stored) that may be used to identify, access and/or use the selected design file. The stored information for the selected design file may also include the actual design file itself, and the actual design file may include any of the design data or information described further herein.

The computer system may be configured for storing the information of the selected design file in any suitable computer-readable storage medium. The information may be stored with any of the results described herein and may be stored in any manner known in the art. The storage medium may comprise any of the storage media described herein or any other suitable storage medium known in the art. After the information has been stored, it can be accessed in a storage medium and used by any of the method or system embodiments described herein, formatted to be displayed to a user, used by another software module, method or system, and so forth. For example, embodiments described herein may generate an inspection recipe as described above. The inspection recipe can then be stored and used by the system or method (or another system or method) to inspect the sample or other sample to thereby generate information (e.g., defect information) for the sample or other sample.

In one embodiment, the process includes detecting energy from a sample in two or more modes, and the one or more computer systems are configured for performing acquisition, identification, selection, and storage separately for each of the two or more modes. For example, some tools and processes are configured to generate outputs (e.g., images) for a sample using different modes of the tools and processes. Examples of such patterns and definitions of patterns are further provided herein. The outputs generated for the samples in each of the modes may appear different from one another. For example, an image generated in one mode may appear different from an image generated in another mode. In some examples, those differences may result from different modes responding to different design layers formed on the sample. For example, one mode may be responsive to patterned features formed only on the uppermost design layer, while another mode may be responsive to patterned features formed on the uppermost design layer in addition to the underlying design layer. Thus, it may be appropriate to use different combinations of design files to align test images generated using different patterns with the design. As such, the computer system can be configured to perform the steps described herein separately for different modes to be used in the process performed on the sample. In particular, the steps described herein may be performed separately for test images generated with or for different modes. In addition to using different sets of test images, the steps may be performed in other ways for different modes as described herein.

In one embodiment, the process is a verification process. In some embodiments, the process includes determining a location in the design coordinates of a defect detected on the specimen based on results of aligning the test image with one or more design files. For example, a PDA can be run on an optical inspection tool using a selected set of design files. The verification process may be performed in any suitable manner. For example, the term "inspection process" is used herein to refer generally to a process in which defects are detected on a sample. Detecting defects on a specimen can be performed in a variety of different ways, including, for example, comparing or applying a threshold to an output generated by an inspection tool or system for the specimen, and determining that any output having a value above the threshold corresponds to a potential defect or defect candidate and that any output not having a value above the threshold does not correspond to a potential defect or defect candidate.

Potential defects or defect candidates identified by the inspection process typically include both actual or real defects and nuisance or nuisance defects. "nuisance defects" (as the term is used interchangeably herein with "nuisance") are generally defined as defects that are detected on a specimen as defects but are not actually actual defects on the specimen. Alternatively, "nuisance defects" can be detected due to non-defect noise sources on the sample (e.g., line edge roughness, relatively small Critical Dimension (CD) variations in patterned features, thickness variations, etc.) and/or due to marginalization of the inspection system itself or its configuration for inspection.

Thus, the goal of the inspection is not generally to detect disruptive defects on the sample. Instead, the goal of inspection is to detect real defects in general and defects of interest (DOI) in particular. One way that has been shown to successfully separate DOI from perturbations is to determine the location of detected defect candidates relative to design information of the sample. For example, by aligning the test image with one or more design files, the location of defect candidates (including any sink candidates determined to be defects or DOIs) may be determined in the design coordinates (i.e., coordinates of the design relative to the specimen). Aligning the test image with the selected design file may be performed in a number of different ways. For example, in some embodiments, the aligning includes maximizing a cross-correlation between the test image and the selected design file. The cross-correlation used in the alignment may comprise any suitable cross-correlation known in the art, such as a normalized cross-correlation. Aligning the test image with the selected design file of the specimen may also be performed as described in the above-incorporated patent to kulcanni. Embodiments described herein may be configured to perform any of the alignments described in this patent.

In another embodiment, the process is a metering process. For example, the metrology process may be performed using one of the systems described further herein. The metrology process may be light-based, electron-based, or other charged particle beam-based. In some metrology processes, the output generated for a sample during the metrology process is compared to the sample's corresponding design file, e.g., to determine relative measurements, measure overlay errors, generate difference images for defect localization, measurement, or characterization, etc. Typically, the metrology process will be performed at a higher resolution than the inspection process, which should enable the correct design file to be easily and straightforwardly identified for use in the metrology process from only the output generated for the sample in the metrology process (i.e., from only the test image). However, if the metrology tool is unable to resolve patterned features formed on the sample for any foreseen or unforeseen reasons and/or if there is uncertainty as to which design file(s) contain patterned features to which the test image responds (e.g., because the metrology process may generate output responsive to more than one design layer on the sample), the design files that should be used in the metrology process for testing the alignment of the image and the design may be identified using the embodiments described herein. Embodiments described herein may identify suitable design files for a metrology process in the same manner as described further herein. The embodiments described herein may also be used to identify suitable design files for any other process performed on a sample in which a test image is aligned with a design file.

In one embodiment, the sample is a wafer. The wafer may comprise any wafer known in the semiconductor art. Although some embodiments may be described herein with respect to a wafer or wafers, embodiments are not limited in the samples in which they may be used. For example, the embodiments described herein may be used for samples such as reticles, flat panels, Personal Computer (PC) boards, and other semiconductor samples.

The embodiments described herein have several advantages over other methods and systems for PDAs. For example, currently used methods and systems use trial and error to find the correct design file to match a test image (e.g., an optical image). The correct design file depends on the mode used to generate the test image. The test images alone may make it substantially difficult to identify the correct design file because most structures are unresolved. Embodiments described herein use the first and second sets of images (e.g., SEM images) described herein to help find design layers and their design files, which may include both current and previous layers, for which the intended test image is responsive. Using the embodiments described herein to select design files for a PDA used in processes such as inspection, metrology, etc. will improve defect location accuracy and thus improve the sensitivity of such processes to critical DOIs because the number of nuisance events will be reduced.

One configuration that may be used for the system embodiments described herein is shown in fig. 3. The system includes an optical (light-based) subsystem 300, the optical (light-based) subsystem 300 including at least a light source and a detector. The light source is configured to generate light that is directed to the sample. The detector is configured to detect light from the sample and to generate an output in response to the detected light. The optical subsystem shown in fig. 3 may be configured and used as the output acquisition subsystem and optical imaging system described herein. The system embodiment shown in fig. 3 may also be configured for performing light-based processes, inspection processes, and metrology processes as further described herein.

In one embodiment, the optical subsystem includes an illumination subsystem configured to direct light to the sample 302. The illumination subsystem includes at least one light source. For example, as shown in fig. 3, the illumination subsystem includes a light source 304. In one embodiment, the illumination subsystem is configured to direct light at one or more incident angles (which may include one or more oblique angles and/or one or more normal angles) to the sample. For example, as shown in fig. 3, light from light source 304 is directed through optical element 306 and then through lens 308 to beam splitter 310, beam splitter 310 directing light at a normal angle of incidence to sample 302. The angle of incidence may include any suitable angle of incidence, which may vary depending on, for example, the sample and the characteristics of the process to be performed on the sample.

The illumination subsystem may be configured to direct light at different times at different incident angles to the sample. For example, the optical subsystem may be configured to alter one or more characteristics of one or more elements of the illumination subsystem such that light may be directed to the sample at a different angle of incidence than that shown in fig. 3. In one such example, the optical subsystem may be configured to move the light source 304, the optical element 306, and the lens 308 such that light is directed to the sample at different angles of incidence.

In some examples, the optical subsystem may be configured to direct light to the sample at more than one angle of incidence simultaneously. For example, the illumination subsystem may include more than one illumination channel, one of the illumination channels may include a light source 304, an optical element 306, and a lens 308 as shown in fig. 3, and another of the illumination channels (not shown) may include similar elements that may be configured differently or identically, or may include at least a light source and possibly one or more other components, such as those described further herein. If this light is directed to the sample at the same time as other light, one or more characteristics (e.g., wavelength, polarization, etc.) of the light directed to the sample at different angles of incidence may be different so that the light resulting from illumination of the sample at different angles of incidence may be distinguished from one another at the detector.

In another example, the illumination subsystem may include only one light source (e.g., source 304 shown in fig. 3), and light from the light source may be separated into different optical paths (e.g., based on wavelength, polarization, etc.) by one or more optical elements (not shown) of the illumination subsystem. The light in each of the different optical paths may then be directed to the sample. Multiple illumination channels may be configured to direct light to the sample simultaneously or at different times (e.g., when different illumination channels are used to sequentially illuminate the sample). In another example, the same illumination channel may be configured to direct light having different characteristics to the sample at different times. For example, in some examples, optical element 306 may be configured as a spectral filter, and properties of the spectral filter may be changed in various different ways (e.g., by swapping out the spectral filter) so that different wavelengths of light may be directed to the sample at different times. The illumination subsystem may have any other suitable configuration known in the art for directing light having different or the same characteristics to the sample at different or the same incident angles, sequentially or simultaneously.

In one embodiment, light source 304 may be a broadband plasma (BBP) light source. In this way, the light generated by the light source and directed to the sample may comprise broadband light. However, the light source may include any other suitable light source, such as any suitable laser known in the art configured to generate light at any suitable wavelength known in the art. In addition, the laser may be configured to produce monochromatic or nearly monochromatic light. In this way, the laser may be a narrow band laser. The light source may also comprise a polychromatic light source that produces light at a plurality of discrete wavelengths or wavelength bands.

Light from the optical element 306 may be focused by a lens 308 to a beam splitter 310. Although lens 308 is shown in FIG. 3 as a single refractive optical element, in practice, lens 308 may include several refractive and/or reflective optical elements that in combination focus light from the optical element to the sample. The illumination subsystem shown in fig. 3 and described herein may include any other suitable optical elements (not shown). Examples of such optical elements include, but are not limited to, polarizing components, spectral filters, spatial filters, reflective optical elements, apodizers, beam splitters, diaphragms, and the like, which may include any such suitable optical elements known in the art. Additionally, the system may be configured to alter one or more of the elements of the illumination subsystem based on the type of illumination to be used.

The optical subsystem may also include a scanning subsystem configured to cause the light to scan over the sample. For example, the optical subsystem may include a stage 312 on which the sample 302 is disposed. The scanning subsystem may include any suitable mechanical and/or robotic assembly (including stage 312) that may be configured to move the sample so that light may be scanned over the sample. Additionally, or alternatively, the optical subsystem may be configured such that one or more optical elements of the optical subsystem perform some scanning of the light over the sample. The light may be scanned over the sample in any suitable manner.

The optical subsystem further includes one or more detection channels. At least one of the one or more detection channels includes a detector configured to detect light from the sample due to illumination of the sample by the optical subsystem and to generate an output in response to the detected light. For example, the optical subsystem shown in fig. 3 includes two detection channels, one of which is formed by collector 314, element 316 and detector 318 and the other of which is formed by collector 320, element 322 and detector 324. As shown in fig. 3, the two detection channels are configured to collect and detect light at different collection angles. In some examples, one detection channel is configured to detect specularly reflected light, and another detection channel is configured to detect light that is not specularly reflected (e.g., scattered, diffracted, etc.) from the sample. However, two or more of the detection channels may be configured to detect the same type of light (e.g., specularly reflected light) from the sample. Although fig. 3 shows an embodiment of an optical subsystem that includes two detection channels, the optical subsystem may include a different number of detection channels (e.g., only one detection channel or two or more detection channels). Although each of the light collectors is shown in fig. 3 as a single refractive optical element, each of the light collectors may include one or more refractive optical elements and/or one or more reflective optical elements.

The one or more detection channels may include any suitable detector known in the art, such as a photomultiplier tube (PMT), a Charge Coupled Device (CCD), and a Time Delay Integration (TDI) camera. The detector may also comprise a non-imaging detector or an imaging detector. If the detectors are non-imaging detectors, each of the detectors may be configured to detect certain characteristics of the light (such as intensity) but may not be configured to detect such characteristics as a function of position within the imaging plane. Thus, the output produced by each of the detectors included in each of the detection channels of the optical subsystem may be a signal or data, but not an image signal or image data. In such examples, a computer subsystem (such as computer subsystem 326 of the system) may be configured to generate an image of the sample from the non-imaging output of the detector. However, in other examples, the detector may be configured as an imaging detector configured to generate an imaging signal or image data. As such, the system may be configured to generate the outputs and/or images described herein in a number of ways.

It should be noted that FIG. 3 is provided herein to generally illustrate the configuration of an optical subsystem that may be included in the system embodiments described herein. Obviously, modifications may be made to what is described hereinTo optimize the performance of the system, as is typically performed when designing commercial systems. In addition, for example, 29xx, 39xx, Voyager available from KLA may be used^TMAnd Puma^TMThe system described herein is implemented by an existing optical system of a series of tools (e.g., by adding the functionality described herein to the existing optical system). For some such systems, the methods described herein may be provided as optional functionality of the system (e.g., in addition to other functionality of the system). Alternatively, the systems described herein may be designed "from scratch" to provide a completely new system.

The computer subsystem 326 of the system may be coupled to the detector of the optical subsystem in any suitable manner (e.g., via one or more transmission media, which may include "wired" and/or "wireless" transmission media) such that the computer subsystem may receive the output, images, etc., generated by the detector during scanning of the sample. The computer subsystem 326 may be configured to perform a number of functions using the output of the detector, images, etc., as described herein, as well as any other functions further described herein. Such a computer subsystem may be further configured as described herein.

This computer subsystem (as well as the other computer subsystems described herein) may also be referred to herein as a computer system. Each of the computer subsystems or systems described herein may take various forms, including a personal computer system, image computer, mainframe computer system, workstation, network appliance, internet appliance, or other device. In general, the term "computer system" may be broadly defined to encompass any device having one or more processors that execute instructions from a memory medium. The computer subsystem or system may also include any suitable processor known in the art, such as a parallel processor. Additionally, a computer subsystem or system may include a computer platform with high speed processing and software as a standalone tool or a networked tool.

If the system includes more than one computer subsystem, the different computer subsystems may be coupled to each other such that images, data, information, instructions, etc., may be sent between the computer subsystems, as further described herein. For example, computer subsystem 326 may be coupled to computer subsystem 328 (as shown by the dashed lines in FIG. 1) by any suitable transmission medium, which may include any suitable wired and/or wireless transmission medium known in the art. Two or more of such computer subsystems may also be operatively coupled by a shared computer-readable storage medium (not shown).

Another configuration that may be used with the system embodiments described herein is shown in fig. 4. The system includes an electron beam subsystem 400, the electron beam subsystem 400 including at least an electron beam source and a detector. The electron beam source is configured to generate electrons that are directed to the sample. The detector is configured to detect electrons from the sample and generate an output in response to the detected electrons. The electron beam subsystem shown in fig. 4 may be configured and used as the output acquisition subsystem, electron beam imaging system, and charged particle beam imaging system described herein. The system embodiment shown in fig. 4 may also be configured for performing an inspection process and a metrology process as further described herein. As shown in fig. 4, the electron beam subsystem is coupled to a computer subsystem 402.

As also shown in fig. 4, the electron beam subsystem includes an electron beam source 404, the electron beam source 404 configured to generate electrons that are focused through one or more elements 408 to the sample 406. The electron beam source may include, for example, a cathode source or emitter tip, and the one or more elements 408 may include, for example, a gun lens, an anode, a beam limiting aperture, a gate valve, a beam current selection aperture, an objective lens, and a scanning subsystem, all of which may include any such suitable element known in the art.

Electrons (e.g., secondary electrons) returning from the sample may be focused by one or more elements 410 to a detector 412. One or more elements 410 may include, for example, a scanning subsystem, which may be the same scanning subsystem included in element 408.

The electron beam subsystem may include any other suitable elements known in the art. In addition, the electron column may be further configured as described in the following U.S. patents: 8,664,594, 4-month-4-year 2014 to ginger (Jiang et al, 8,692,204, 4-month-8-year 2014 to small island (Kojima) et al, 8,698,093, 4-month-15-year 2014 to gubens (Gubbens) et al, and 8,716,662, 5-month-6-year 2014 to mcdonald (MacDonald) et al, which are incorporated by reference as if fully set forth herein.

Although the electron beam subsystem is shown in fig. 4 as being configured such that electrons are directed to and scattered from the sample at an oblique angle of incidence and at another oblique angle, it is understood that the electron beam may be directed to and scattered from the sample at any suitable angle. In addition, the electron beam subsystem may be configured to generate images of the sample using multiple modes (e.g., at different illumination angles, collection angles, etc.). The multiple modes of the electron beam subsystem may differ in any image generation parameter of the subsystem.

The computer subsystem 402 may be coupled to the detector 412 as described above. The detector may detect electrons returning from the surface of the sample, thereby forming an electron beam image of the sample. The electron beam image may comprise any suitable electron beam image. The computer subsystem 402 may be configured to perform any of the functions described herein using the output of the detector and/or the electron beam image. The computer subsystem 402 may be configured to perform any additional step(s) described herein. The system including the electron beam subsystem shown in fig. 4 may be further configured as described herein.

It should be noted that fig. 4 is provided herein to generally illustrate the configuration of an electron beam subsystem that may be included in the embodiments described herein. Just as with the optical subsystem described above, the electron beam subsystem configuration described herein may be altered to optimize the performance of the electron beam subsystem, as is typically performed when designing commercial systems. Additionally, the systems described herein may be implemented using existing e-beam tools, such as the edrxxx series of tools available from KLA corporation (e.g., by adding the functionality described herein to an existing e-beam system). For some such systems, the methods described herein may be provided as optional functionality of the system (e.g., in addition to other functionality of the system). Alternatively, the systems described herein may be designed "from scratch" to provide a completely new system.

In addition to optical and electron beam subsystems, the systems described herein may include ion beam subsystems. Such a subsystem may be configured as shown in fig. 4, except that the electron beam source may be replaced with any suitable ion beam source known in the art. Additionally, the system may include any other suitable ion beam tool, such as those included in commercially available Focused Ion Beam (FIB) systems, Helium Ion Microscopy (HIM) systems, and Secondary Ion Mass Spectroscopy (SIMS) systems.

As described above, the optical, electron beam, and ion beam subsystems are configured for scanning energy (e.g., light, electrons, etc.) over the physical version of the sample, thereby generating an output for the physical version of the sample. In this manner, the optical, electron beam, and ion beam subsystems may be configured as "real" subsystems, rather than "virtual" subsystems. However, the storage media (not shown) and computer subsystem 328 shown in FIG. 3 may be configured as a "virtual" system. In particular, the storage media and computer subsystems may be configured as a "virtual" inspection system, as described in commonly assigned U.S. patent No. 8,126,255 to basaler et al, on day 28, 2, 2012 and commonly assigned U.S. patent No. 9,222,895 to Duffy et al, on day 29, 12, 2015, both of which are incorporated by reference herein as if fully set forth. The embodiments described herein may be further configured as described in these patents.

The optical, electron beam, and ion beam subsystems described herein may be configured to utilize multiple modes or "different modalities" to generate output for a sample. In general, the "mode" or "modality" (those terms are used interchangeably herein) of an optical, electron beam, or ion beam subsystem may be defined by the parameter values of the subsystem used to generate an output and/or image for a sample. Thus, the different modes may differ in the value of at least one of the parameters of the subsystem (other than the location on the sample at which the output is generated). For example, in an optical subsystem, different modes may be illuminated using at least one different wavelength of light. The modes may differ in illumination wavelength, as further described herein (e.g., by using different light sources, different spectral filters, etc. for different modes). In another example, different modes may use different illumination channels of the optical subsystem. For example, as described above, the optical subsystem may include more than one illumination channel. As such, different illumination channels may be used for different modes. The modes may also or alternatively differ in one or more collection/detection parameters of the optical subsystem. The optical subsystem may be configured to scan the sample with different modes in the same scan or different scans (e.g., depending on the ability to scan the sample using multiple modes simultaneously).

In a similar manner, the electron beam image may include images produced by the electron beam subsystem utilizing two or more different values of a parameter of the electron beam subsystem. For example, the electron beam subsystem may be configured to generate an output for a sample utilizing multiple modes or "different modalities". Multiple modes or different modalities of the electron beam subsystem may be defined by parameter values of the electron beam subsystem for generating an output and/or image for the sample. Thus, the different modes may differ in the value of at least one of the electron beam parameters of the electron beam subsystem. For example, one mode may be illuminated using at least one angle of incidence that is different from at least one angle of incidence used for illumination of another mode.

In one embodiment, the test image is generated by an inspection subsystem. For example, the optical and electron beam imaging subsystems described herein may be configured as inspection subsystems. In another embodiment, the test image is generated by a metrology or defect review subsystem. For example, the optical and electron beam imaging subsystems described herein may be configured as metrology or defect re-inspection subsystems. In particular, the embodiments of the optical and electron beam subsystems described herein and shown in fig. 3 and 4 may be modified in one or more parameters to provide different imaging capabilities depending on the application for which they are to be used. In one such example, the optical subsystem shown in fig. 3 may be configured to have higher resolution if it is to be used for metrology rather than inspection. In other words, the embodiments of the subsystem shown in fig. 3 and 4 describe some general and various configurations of optical or electron beam subsystems that can be tailored in several ways that will be apparent to those skilled in the art to produce optical or electron beam subsystems with different imaging capabilities more or less suited to different applications.

Each of the embodiments of the system may be further configured in accordance with any (any) of the other embodiments described herein.

Another embodiment relates to a computer-implemented method for selecting one or more design files for use in testing image and design alignment. The method includes steps for each of the functions of the computer system described above. Each of the steps of the method may be performed as further described herein. The method may also include any other steps that may be performed by the computer subsystems and/or systems described herein. The steps of the method are performed by one or more computer systems, which may be configured in accordance with any of the embodiments described herein. Additionally, the methods described above may be performed by any of the system embodiments described herein.

Additional embodiments relate to a non-transitory computer-readable medium storing program instructions executable on a computer system for performing a computer-implemented method for selecting one or more design files for use in testing image and design alignment. One such embodiment is shown in fig. 5. In particular, as shown in fig. 5, a non-transitory computer-readable medium 500 includes program instructions 502 that are executable on a computer system 504. The computer-implemented method may include any step of any method described herein.

Program instructions 502 implementing methods such as those described herein may be stored on the computer-readable medium 500. The computer readable medium may be a storage medium such as a magnetic or optical disk, a magnetic tape, or any other suitable non-transitory computer readable medium known in the art.

The program instructions may be implemented in any of a variety of ways including program step-based techniques, component-based techniques, and/or object-oriented techniques, among others. For example, program instructions may be implemented using ActiveX controls, C + + objects, JavaBeans, Microsoft Foundation classes ("MFC"), SSE (streaming SIMD extensions), or other techniques or methods, as desired.

Computer system 504 may be configured according to any of the embodiments described herein.

Further modifications and alternative embodiments of various aspects of the invention will be apparent to those skilled in the art in view of this description. For example, methods and systems are provided for selecting one or more design files for use in testing image and design alignment. Accordingly, this description is to be construed as illustrative only and is for the purpose of teaching those skilled in the art the general manner of carrying out the invention. It is to be understood that the forms of the invention shown and described herein are to be taken as the presently preferred embodiments. As will be fully apparent to those skilled in the art after having the benefit of this description of the invention, elements and materials may be substituted for those illustrated and described herein, parts and processes may be reversed, and certain features of the invention may be utilized independently. Changes may be made in the elements described herein without departing from the spirit and scope of the invention as described in the following claims.