阅读说明：本技术 高耐热油墨用酚醛树脂及其制备方法和用途 (Phenolic resin for high-heat-resistance ink and preparation method and application thereof ) 是由 王步泉 于 2020-06-12 设计创作，主要内容包括：本发明公开了一种高耐热油墨用酚醛树脂及其制备方法和用途,所述酚醛树脂主要由甲酚、苯酚、甲醛、催化剂制成。本发明使油墨耐热性好。本发明公开了一种高性能光刻胶用酚醛树脂及其制备方法和用途,所述酚醛树脂主要由甲酚、甲醛、催化剂制成。本发明光刻胶感度好、耐蚀刻。(The invention discloses a phenolic resin for high heat-resistant ink, a preparation method and application thereof. The invention makes the ink have good heat resistance. The invention discloses a phenolic resin for a high-performance photoresist, a preparation method and application thereof. The photoresist has good sensitivity and is resistant to etching.)

1. A phenolic resin for high heat-resistant printing ink is characterized in that: the phenolic resin is mainly prepared from the following raw materials in parts by weight:

50-80 parts of cresol

20-50 parts of phenol

15-20 parts of formaldehyde

0.2-1 weight part of catalyst.

2. The phenolic resin for high heat resistant ink as claimed in claim 1, wherein: the cresol is selected from one or more of m-cresol, p-cresol or o-cresol.

3. The phenolic resin for high heat resistant ink as claimed in claim 1, wherein: the purity of the phenol is more than 99%.

4. The phenolic resin for high heat resistant ink as claimed in claim 1, 2 or 3, wherein: the formaldehyde is one or more of 37% formaldehyde, 92% paraformaldehyde and 96% paraformaldehyde.

5. The phenolic resin for high heat resistant ink as claimed in claim 1, 2 or 3, wherein: the catalyst is one or more of sulfuric acid, phosphoric acid and oxalic acid.

6. A method for preparing the phenolic resin for the high heat-resistant ink according to claim 1, which comprises the following steps: the method comprises the following steps: metering raw materials, heating for reaction, dehydrating, dephenolizing, cooling and granulating.

7. The method for preparing the phenolic resin for high heat resistant ink as claimed in claim 6, wherein: the dehydration is carried out at the temperature of 100-155 ℃; dephenolation was carried out at 155 ℃ and 190 ℃.

8. Use of the phenolic resin for high heat resistant ink according to claim 1 for preparing high heat resistant ink.

Technical Field

The invention relates to a phenolic resin and a preparation method and application thereof.

Background

The ink is an important material for printing processing, and the main components of the ink are a pigment, a binder, a filler, a diluent, an anti-skinning agent, an anti-offset agent, a slip agent and the like. Seventhly, one of the main components of the connecting material stone ink plays a role of a medium for dispersing a coloring material and an auxiliary material and is prepared by dissolving natural resin, synthetic resin, cellulose and the like in drying oil or a solvent. Because of certain fluidity, the ink forms a uniform thin layer after being printed, and a film layer with certain strength is formed after being dried, so that the pigment is difficult to fall off.

Typical current ink resins include phenolic resins, polyurethane resins, and aldehyde ketone resins. Phenolic resins are used in a wide variety of applications for economic and efficiency reasons, and they can be applied thinly, uniformly and rapidly to a substrate. But the problem of poor heat resistance generally exists at present, and the high-temperature baking requirement is difficult to meet.

Disclosure of Invention

The invention aims to provide a phenolic resin for high-heat-resistance ink, which enables the heat resistance of the ink to be good, and a preparation method and application thereof.

The technical solution of the invention is as follows:

a phenolic resin for high heat-resistant printing ink is characterized in that: the phenolic resin is mainly prepared from the following raw materials in parts by weight:

50-80 parts of cresol

20-50 parts of phenol

15-20 parts of formaldehyde

0.2-1 weight part of catalyst.

The cresol is selected from one or more of m-cresol, p-cresol and o-cresol, and the purity is more than 99%.

The purity of the phenol is more than 99%.

The formaldehyde is one or more of 37% formaldehyde, 92% paraformaldehyde and 96% paraformaldehyde, and the concentration deviation range is within 1%.

The catalyst is one or more of sulfuric acid, phosphoric acid and oxalic acid, and the purity of the catalyst is more than 99%.

A preparation method of phenolic resin for high heat-resistant ink is characterized by comprising the following steps: the method comprises the following steps: metering raw materials, heating for reaction, dehydrating, dephenolizing, cooling and granulating.

The dehydration is carried out at the temperature of 100-155 ℃; dephenolation was carried out at 155 ℃ and 190 ℃.

An application of phenolic resin for high heat-resistant ink in preparing high heat-resistant ink.

The invention makes the ink have good heat resistance.

And (3) detecting heat resistance:

the first condition is as follows:

base material: the thickness of the silicon wafer film is as follows: 15000 Angstrom prebake conditions: 110 ℃ 90S

Exposure: canon camera solvent: TMAH (2.38%). 70S

Post-baking conditions: 130 ℃ 120S

And a second condition:

base material: the thickness of the silicon wafer film is as follows: 15000 Angstrom prebake conditions: 110 ℃ 90S

Exposure: canon camera solvent: TMAH (2.38%). 70S

Post-baking conditions: 140 ℃ 120S

It can be seen that the resin of the present invention has a higher ability to maintain the original pattern at a high temperature and a higher heat resistance under the same heating conditions. The ink has better heat resistance, and images are less prone to deformation in the heating coating process of the ink, so that the ink is clearer and more attractive.

The invention is further illustrated by the following figures and examples.

FIG. 1 is a schematic diagram of a case where a general resin is resistant to heat under the conditions.

FIG. 2 is a schematic diagram of the heat resistance of the resin of the present invention under the conditions.

FIG. 3 is a schematic view showing the heat resistance of a conventional resin under the second condition.

FIG. 4 is a schematic diagram showing the heat resistance of the resin of the present invention under the second condition.

Detailed Description