阅读说明：本技术 废弃环氧树脂再利用制备导热金属基板的工艺 (Process for preparing heat-conducting metal substrate by recycling waste epoxy resin ) 是由 吴国庆 江奎 何新荣 唐剑 叶鹏飞 于 2020-06-16 设计创作，主要内容包括：本发明涉及一种废弃环氧树脂再利用制备导热金属基板的工艺,包括步骤：将含废弃环氧树脂的硅藻土进行研磨,将得到的研磨后颗粒利用等离子流工艺进行碳化形成石墨层,之后加入其他原料组分,混合成为树脂胶泥,然后对树脂胶泥进行处理,得到导热金属基板。本发明针对含废弃环氧树脂的硅藻土进行研磨处理及等离子化,提升导热金属基板之效能；本发明有效地将含环氧树脂的硅藻土再利用,使得垃圾变资源物,可以有效避免废弃含环氧树脂的硅藻土造成环境毒害,也避免将废弃含环氧树脂的硅藻土送到焚化炉进行焚烧处理而制造出额外的二氧化碳,减缓地球暖化的效应,为地球与人类争取更好的环境。(The invention relates to a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, which comprises the following steps: grinding diatomite containing waste epoxy resin, carbonizing the obtained ground particles by using a plasma jet process to form a graphite layer, adding other raw material components, mixing to form resin cement, and treating the resin cement to obtain the heat-conducting metal substrate. The invention carries out grinding treatment and plasmatization on the diatomite containing the waste epoxy resin, thereby improving the efficiency of the heat-conducting metal substrate; the invention effectively recycles the diatomite containing the epoxy resin, so that the waste becomes resource materials, the environment poison caused by the waste diatomite containing the epoxy resin can be effectively avoided, the extra carbon dioxide produced by burning the waste diatomite containing the epoxy resin in an incinerator is also avoided, the effect of global warming is relieved, and better environment is strived for the earth and human beings.)

1. A process for preparing a heat-conducting metal substrate by recycling waste epoxy resin is characterized by comprising the following steps: grinding diatomite containing waste epoxy resin, carbonizing the obtained ground particles by using a plasma jet process to form a graphite layer, adding other raw material components, mixing to form resin cement, and treating the resin cement to obtain the heat-conducting metal substrate.

2. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the grinding is to grind the diatomite containing the waste epoxy resin to 1-4 μm.

3. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the plasma jet process comprises the step of treating the ground particles in a 1300-1500 ℃ high-temperature environment by adopting plasma jet.

4. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the other raw material components comprise epoxy resin, a curing agent, an accelerator, a heat-conducting filler and a solvent.

5. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the other raw material components comprise epoxy resin, dicyandiamide, dimethyl imidazole and aluminum oxide.

6. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin as claimed in claim 5, wherein: the other raw material components comprise the following components in percentage by weight: 13-22% of epoxy resin, 1% of dicyandiamide, 0-0.1% of dimethyl imidazole and 70% of aluminum oxide.

7. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the treatment comprises the steps of gluing, baking, cutting, superposing and heating forming.

8. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 1, wherein: the treatment comprises the step of heat curing the resin mastic into a wafer.

9. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 8, wherein: the diameter of the round cake is 40-60mm, and the thickness of the round cake is 8-12 mm.

10. The process for preparing a heat-conducting metal substrate by recycling the waste epoxy resin according to claim 9, wherein: the diameter of the round cake is 50mm, and the thickness of the round cake is 10 mm.

Technical Field

The invention relates to the technical field of heat-conducting metal substrates, in particular to a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, and particularly relates to a heat-conducting metal substrate with good heat dissipation performance formed by recycling diatom ooze which is a byproduct in the process flow of producing epoxy resin and matching with proper materials.

Background

The heat-conducting metal substrate is a new material formed by combining different types of metal foils with epoxy resin and heat-conducting filler by applying an advanced material preparation technology. The heat-conducting metal substrate is mainly a metal circuit board material, belongs to an electronic general assembly, and has the characteristics of excellent heat dissipation, high mechanical strength, good processing performance and the like. The circuit substrate mainly applied to LED lighting materials is used as a requirement for carrying and circuit design, but the service life of the circuit substrate is reduced due to long-term lighting and heat storage of LED lamp particles, and the heat-conducting metal substrate with the heat-radiating function is generated correspondingly.

The propylene glycol and the epoxy chloropropane can be synthesized into propylene glycol type epoxy resin. When the repeating unit is less than 2 (n < 2), it is a low molecular weight epoxy resin having a softening point of less than 50 ℃ and is also called a basic type of propylene glycol type epoxy resin (e.g., NPEL-128 from Nanya plastics). When the repeating unit is between 2 and 5 (n ═ 2-5), it is a medium molecular weight epoxy resin, which has a softening point between about 50 ℃ and 95 ℃. When the repeating unit is more than 5 (n is more than 5), the epoxy resin is high molecular weight epoxy resin, and the softening point of the epoxy resin is more than 100 ℃. In the process for synthesizing the low molecular weight epoxy resin with the repeating unit less than 2 (n is less than 2), sodium chloride is generated in the process because a large amount of sodium hydroxide is used, so that the sodium chloride which is insoluble in the epoxy resin can be filtered completely. The process used porous diatomaceous earth for filtration, but this also produced epoxy-containing diatomaceous earth.

The diatomite containing epoxy resin is a harmful waste, and the produced manufacturers must deal with the qualified and qualified places according to the law of environmental protection and control by waste pollution. The most common mode is to send the epoxy resin to an incinerator for incineration treatment, so as to avoid the environmental toxicity caused by the waste epoxy resin. Incineration is the least economical and produces more carbon dioxide, increasing carbon emissions and causing global warming. How to effectively recycle diatomite containing epoxy resin to change garbage into resource substances and change waste into valuable is a problem to be solved.

Disclosure of Invention

The invention aims to provide a process for preparing a heat-conducting metal substrate by recycling waste epoxy resin, which recycles diatom ooze which is a byproduct in the process flow of producing the epoxy resin, and combines with proper materials to form the heat-conducting metal substrate with good heat dissipation performance, so that garbage is changed into resources, and a better environment is strived for the earth and human beings.

In order to achieve the above object, the present invention provides a process for preparing a heat conductive metal substrate by recycling waste epoxy resin, comprising the steps of: grinding diatomite containing waste epoxy resin, carbonizing the obtained ground particles by using a plasma jet process to form a graphite layer, adding other raw material components, mixing to form resin cement, and treating the resin cement to obtain the heat-conducting metal substrate.

Preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the grinding is to grind the diatomite containing the waste epoxy resin to 1-4 μm. The diatomite containing epoxy resin has diatomite with particle size (150-200 μm), which is not suitable for use in heat-conducting metal substrate because of too large particle size. Generally, epoxy resins provide bonding force, but have poor thermal conductivity, and only rely on thermal conductive fillers to improve thermal conductivity. When the heat conductive filler particles are smaller, the gaps between the particles are smaller, and the heat conductive capability is relatively improved. The average particle size of diatomaceous earth for filtration is about 120 μm, particles are too large to be suitable as a heat conductive filler, and the average particle size of the heat conductive filler is about 1 to 4 μm, so that it is necessary to first reduce the particles of diatomaceous earth to a corresponding size; a fine grinding unit is added, and epoxy resin-containing diatomaceous earth (about 60% of diatomaceous earth and 40% of epoxy resin in composition) is placed in a grinder to be finely ground into particles having a diameter of about 1-4 μm, thereby increasing the filling capacity.

Preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the plasma jet process comprises the step of carrying out 1300-1500 ℃ high-temperature environment treatment on the ground particles by adopting plasma jet. Fluorescent tubes in life are also applied to plasma flow; in a general fluorescent lamp, a filament coil made of tungsten is used at two ends, then low-pressure argon (or argon-neon mixed gas) and mercury vapor are filled in the tube, and a silver substance is coated on the inner wall of the tube; after the power is on, the current will flow through the filament to heat and release electrons, and further change the gas in the tube into a plasma flow state, and the temperature of the low-temperature plasma flow is 103-104K. The invention uses plasma current to carbonize the epoxy resin on the surface of the diatomite particles to form a graphite layer, and changes the non-heat-conducting surface resin into the easily heat-conducting property by the heat-conducting capability of the graphite, thereby improving the efficiency of the heat-conducting metal substrate.

Preferably, in the process of preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the other raw material components comprise the epoxy resin, a curing agent, an accelerator, a heat-conducting filler and a solvent.

Preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the other raw material components include epoxy resin, dicyandiamide, dimethylimidazole and aluminum oxide. Further preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the other raw material components comprise, by weight: 13-22% of epoxy resin, 1% of dicyandiamide, 0-0.1% of dimethyl imidazole and 70% of aluminum oxide. Wherein, the weight percentage of the diatomite containing the waste epoxy resin is 8 percent to 16 percent, and the weight of the dimethyl imidazole does not include the endpoint of 0 percent.

Preferably, in the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin, the treatment comprises the steps of gluing, baking, cutting, overlapping and heating forming.

Preferably, in the process for preparing the heat-conductive metal substrate by recycling the waste epoxy resin, the treatment includes a step of heating and curing the resin mastic into a round cake. Further preferably, the diameter of the tortilla is 40-60mm and the thickness of the tortilla is 8-12 mm. Still more preferably, the diameter of the tortilla is 50mm and the thickness of the tortilla is 10 mm.

The technical scheme provided by the invention has the following beneficial effects: (1) the invention carries out grinding treatment and plasmatization on the diatomite containing the waste epoxy resin, thereby improving the efficiency of the heat-conducting metal substrate; according to the increase and decrease of the proportion of the epoxy resin and the filler, 16 percent of the diatomite containing the epoxy resin after grinding can be recycled; (2) the method emphasizes on the unchanged existing process flow, avoids influencing the existing line of a workshop and saves the arrangement and construction cost of factory equipment, so the diatomite containing the epoxy resin is separately treated, and the diatomite is uniformly mixed in a mixing tank which can be manually or automatically metered after the treatment; (3) the invention effectively avoids environmental toxicity caused by the waste diatomite containing the epoxy resin, also avoids the extra carbon dioxide produced by burning the waste diatomite containing the epoxy resin in an incinerator, slows down the effect of global warming and produces a pile of slag; the invention effectively recycles the diatomite containing the epoxy resin, so that garbage is changed into resource objects, and better environment is strived for by the earth and human beings.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a process flow diagram for preparing a heat-conducting metal substrate by recycling waste epoxy resin provided by the invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

The experimental procedures in the following examples are conventional unless otherwise specified. The test materials used in the following examples were purchased from a conventional reagent store unless otherwise specified. In the quantitative tests in the following examples, three replicates were set, and the data are the mean or the mean ± standard deviation of the three replicates.

As shown in fig. 1, the present invention provides a process for preparing a heat conductive metal substrate by recycling waste epoxy resin, comprising the following steps.

The diatomite containing the waste epoxy resin and having the particle size of 150-200 mu m (the epoxy resin containing the diatomite and the diatom ooze) is finely ground in a grinding machine to be ground into particles with the particle size of 1-4 mu m, then the plasma jet process is used for carrying out 1300-1500 ℃ high-temperature environment treatment, the epoxy resin on the surfaces of the diatomite particles is carbonized to form a graphite layer, the non-heat-conducting surface layer resin is changed into a product with the property of easy heat conduction, and the diatomite (thermal plasma liquid) after grinding and plasma jet treatment is obtained.

According to the weight percentage, 8 to 16 percent of diatomite (thermal plasma liquid) after grinding and plasma flow treatment, 13 to 22 percent of epoxy resin, 1 percent of dicyandiamide, 0 to 0.1 percent of dimethyl imidazole and 70 percent of alumina are evenly mixed to form the resin daub.

Gluing the resin daub, baking, cutting into pieces, superposing, heating for forming, heating and curing into a round cake with the diameter of 40-60mm and the thickness of 8-12 mm. Heating to 140 deg.C, placing in iron plate (25 + -1 deg.C), measuring time and surface temperature, and observing heat dissipation capability.

The following will further explain the process for preparing the heat-conducting metal substrate by recycling the waste epoxy resin provided by the invention with reference to specific embodiments.