阅读说明：本技术 具有选择器电压补偿的磁性随机存取存储器 (Magnetic random access memory with selector voltage compensation ) 是由 C.J.佩蒂 T-Y.刘 A.阿尔-沙马 Y.铉 于 2019-12-04 设计创作，主要内容包括：本发明题为“具有选择器电压补偿的磁性随机存取存储器。”本文提供了磁性随机存取存储器(MRAM)电路。在一个示例性具体实施中,MRAM电路包括耦合到与选择器元件串联的磁性隧道结(MTJ)元件的控制电路。所述控制电路被配置为当所述选择器元件处于导电状态下时调节通过所述选择器元件的电流。所述电路还包括补偿电路,所述补偿电路被配置为基于对通过所述选择器元件的电流的调节来补偿处于所述导电状态下的所述选择器元件上的偏置电压。输出电路也被配置为报告MTJ元件的磁化状态。(The invention provides a magnetic random access memory with selector voltage compensation. "Magnetic Random Access Memory (MRAM) circuits are provided herein. In one example implementation, an MRAM circuit includes a control circuit coupled to a Magnetic Tunnel Junction (MTJ) element in series with a selector element. The control circuit is configured to regulate current through the selector element when the selector element is in a conductive state. The circuit also includes a compensation circuit configured to compensate a bias voltage on the selector element in the conductive state based on an adjustment of a current through the selector element. The output circuit is also configured to report the magnetization state of the MTJ element.)

1. A circuit, the circuit comprising:

a control circuit coupled to a Magnetic Tunnel Junction (MTJ) element in series with a selector element and configured to regulate current through the selector element when the selector element is in a conductive state;

a compensation circuit configured to compensate a bias voltage on the selector element in the conductive state based on an adjustment of the current through the selector element; and is

An output circuit configured to report a magnetization state of the MTJ element.

2. The circuit of claim 1, the circuit comprising:

the control circuit configured to initiate at least two current adjustments comprising different limits on current through the selector element; and is

The compensation circuit configured to compensate the bias voltage on the selector element using an arithmetic operation calculated at the at least two current adjustments to reduce an effect of the bias voltage.

3. The circuit of claim 2, the compensation circuit comprising:

a capacitor coupled at a first terminal to a sense voltage corresponding to a combined voltage drop across the selector element and the MTJ element;

a switching element configured to couple a second terminal of the capacitor to a reference potential during a first one of the two current adjustments to charge the capacitor according to the sense voltage;

the switching element is configured to decouple the capacitor from the reference potential prior to a second of the two current adjustments; and is

The compensation circuit is configured to subtract the sense voltage from the first of the two current adjustments and subtract the sense voltage from the second of the two current adjustments to reduce an effect of the bias voltage on the selector element.

4. The circuit of claim 2, the compensation circuit comprising:

a first switching element configured to charge a first capacitor with a sense voltage resulting from a first one of the two current adjustments, wherein the sense voltage corresponds to a combined voltage drop across the selector element and the MTJ element;

a second switching element configured to charge a second capacitor with the sense voltage generated by a second of the two current adjustments;

a readout circuit coupled to the first capacitor and the second capacitor and configured to subtract a voltage present on the first capacitor from a voltage present on the second capacitor to reduce an effect of the bias voltage on the selector element.

5. The circuit of claim 1, wherein the current adjustment comprises a ramp current directed through the MTJ element and the selector element, and the circuit comprises:

the compensation circuit configured to compensate for the bias voltage on the selector element by subtracting an effect of the bias voltage on the selector element during the ramp current.

6. The circuit of claim 5, the compensation circuit comprising:

a capacitor coupled to a sense voltage corresponding to a combined voltage drop across the selector element and the MTJ element;

a readout circuit configured to determine the magnetization state of the MTJ element based on a current induced through the capacitor by the sense voltage during the ramp current.

7. The circuit of claim 6, the readout circuit comprising:

a current mirror connected in series with the capacitor and configured to sense a current induced through the capacitor to determine the magnetization state of the MTJ element.

8. The circuit of claim 6, the readout circuit comprising:

a resistor coupled in series with the capacitor, the resistor configured to establish a voltage for sensing the current induced through the capacitor to determine the magnetization state of the MTJ element.

9. The circuit of claim 1, wherein the MTJ element comprises a spin-transfer-torque (STT) MTJ element, and wherein the selector element is a two-terminal device comprising a chalcogenide ovonic threshold switch or a volatile conductive bridge.

10. A memory circuit, the memory circuit comprising:

a Magnetic Tunnel Junction (MTJ) element having a changeable magnetization state;

a selector element coupled in series with the MTJ element and having an offset voltage when activated;

a control circuit coupled to the selector element and configured to generate a voltage across the selector element and the MTJ element to activate the selector element during a read operation;

the control circuit is configured to reduce an effect of the bias voltage of the selector element during the read operation to output an indication of a current magnetization state of the MTJ element.

11. The memory circuit of claim 10, the memory circuit comprising:

the control circuit configured to initiate at least two current adjustments during the read operation, the at least two current adjustments comprising different limits on current through the MTJ element and the selector element; and is

The control circuit configured to compensate for the bias voltage on the selector element by subtracting an effect of the bias voltage resulting from the at least two current adjustments.

12. The memory circuit of claim 11, the control circuit comprising:

a first switching element configured to charge a first capacitor with a sense voltage resulting from a first one of the two current adjustments, wherein the sense voltage corresponds to a combined voltage drop across the selector element and the MTJ element;

a second switching element configured to charge a second capacitor with the sense voltage generated by a second of the two current adjustments;

a control circuit configured to subtract the voltage present on the first capacitor from the voltage present on the second capacitor to subtract the effect of the bias voltage on the selector element.

13. The memory circuit of claim 11, the control circuit comprising:

a capacitor coupled at a first terminal to a sense voltage corresponding to a combined voltage drop across the selector element and the MTJ element;

a switching element configured to couple a second terminal of the capacitor to a reference potential during a first one of the two current adjustments to charge the capacitor according to the sense voltage;

the switching element is configured to decouple the capacitor from the reference potential prior to a second of the two current adjustments; and is

The control circuit is configured to compensate the bias voltage on the selector element in a resulting voltage indicated at the first terminal of the capacitor, the compensation comprising subtracting between the sense voltage from the first one of the two current adjustments and the sense voltage from the second one of the two current adjustments.

14. The memory circuit of claim 10, the memory circuit comprising:

the control circuit configured to direct a ramp current through the MTJ element and the selector element and compensate for the bias voltage on the selector element by subtracting an effect of the bias voltage on the selector element during the ramp current.

15. The memory circuit of claim 14, the control circuit comprising:

a capacitor coupled to a sense voltage corresponding to a combined voltage drop across the selector element and the MTJ element; and is

The control circuit is configured to determine the magnetization state of the MTJ element based on a current induced through the capacitor by the sense voltage during the ramp current.

16. The memory circuit of claim 10, wherein the MTJ element comprises a spin-transfer-torque (STT) MTJ element, and wherein the selector element is a two-terminal device comprising a chalcogenide ovonic threshold switch or a volatile conductive bridge.

17. A memory array, the memory array comprising:

a plurality of memory cells in a cross-point arrangement having columns and rows, wherein the memory cells each include a Magnetic Tunnel Junction (MTJ) element in series with a selector element;

a control circuit configured to establish a read voltage for a selected memory cell, the read voltage activating an associated selector element to pass a read current;

the control circuit is configured to limit the read current of the associated selector element to one or more predetermined current magnitude values; and is

An output circuit coupled to a sense output of the control circuit and configured to indicate a state of the selected memory cell by: compensating at least a bias voltage of the associated selector element to determine a magnetization state of the associated MTJ element.

18. The memory array of claim 17, the memory array comprising:

the control circuit configured to establish at least two current levels through the associated MTJ element and the associated selector element; and is

The output circuit configured to compensate for the bias voltage of the associated selector element by subtracting the effects of the bias voltage resulting from the at least two current levels.

19. The memory array of claim 18, the output circuitry comprising:

a capacitor coupled to the sense output through a first terminal;

a switching element configured to couple a second terminal of the capacitor to a reference potential during a first one of the current levels to charge the capacitor according to a voltage at the sensing output;

the switching element configured to decouple the capacitor from the reference potential before a second one of the current levels; and is

Wherein the output circuit is configured to compensate the bias voltage of the associated selector element with a resulting voltage indicated at the first terminal of the capacitor, the compensation comprising a subtraction between the voltage at the sensing output from the first one of the current levels and the voltage at the sensing output from the second one of the current levels.

20. The memory array of claim 17, wherein the MTJ element comprises a spin-transfer-torque (STT) MTJ element, and wherein the selector element is a two-terminal device comprising a chalcogenide ovonic threshold switch or a volatile conductive bridge.

Technical Field

Aspects of the present disclosure relate to the field of magnetic random access memory devices employing magnetic tunnel junction elements.

Background

Magnetic Random Access Memory (MRAM) is an emerging memory/storage technology that has the potential to provide a low power and non-volatile alternative to Random Access Memory (RAM) technologies such as static RAM (sram) and dynamic RAM (dram). MRAM can also be used in mass storage environments, such as solid State Storage Drives (SSDs). However, MRAM has proven difficult to incorporate into DRAM competing devices. DRAM devices typically have a density and cost per bit that exceeds most other competing memory technologies.

A variety of approaches are available for MRAM-based memories. One such method includes a cross-point configuration, which is also applicable in resistive RAM technology. In a cross-point configuration, the memory cells are arranged as a large array coupled via rows and columns, with a memory cell at each junction of a row and column. However, with these emerging memory technologies (e.g., MRAM), cross-point configurations can be difficult to form in high density configurations. Difficulties can arise when memory cells are individually arranged with selection circuitry that isolates each cell during programming operations. Some MRAM implementations have a three-terminal transistor coupled to each memory cell, which significantly increases the associated component count while reducing the target density of the MRAM device.

SUMMARY

Magnetic Random Access Memory (MRAM) circuits are provided herein. In one example implementation, an MRAM circuit includes a control circuit coupled to a Magnetic Tunnel Junction (MTJ) element in series with a selector element. The control circuit is configured to regulate current through the selector element when the selector element is in a conductive state. The circuit also includes a compensation circuit configured to compensate a bias voltage on the selector element in the conductive state based on the adjustment of the current through the selector element. The output circuit is also configured to report the magnetization state of the MTJ element.

Drawings

Many aspects of the disclosure can be better understood with reference to the following drawings. While several implementations are described in connection with these drawings, the disclosure is not limited to the implementations disclosed herein. On the contrary, it is intended to cover all alternatives, modifications, and equivalents.

FIG. 1 illustrates a memory array and associated circuitry in an implementation.

FIG. 2 illustrates a memory cell in an implementation.

FIG. 3 illustrates an example control and output circuit of a memory cell in an implementation.

FIG. 4 illustrates an example control and output circuit of a memory cell in a particular implementation.

FIG. 5 illustrates example signaling and performance of a memory cell in an implementation.

FIG. 6 illustrates an example control and output circuit of a memory cell in a particular implementation.

FIG. 7 illustrates example signaling and performance of a memory cell in an implementation.

FIG. 8 illustrates example operations of a memory cell in a particular implementation.

FIG. 9 illustrates example features of a selector element in an implementation.

Detailed Description

Several memory storage technologies have emerged that can replace conventional transistor-based memories and memory devices. These memory storage technologies include Resistive Random Access Memory (RRAM), Phase Change Memory (PCM), and Magnetic Random Access Memory (MRAM), among others. Among other things, MRAM has the potential to provide a lower power alternative to embedded SRAM and offer a cost-effective, non-volatile replacement for stand-alone DRAM. To compete with or replace DRAM, MRAM must be formed as a sufficiently dense array. This can be challenging due to the low cost and high density of DRAM, and MRAM must be made to exhibit low error levels of DRAM. A cross-point array is one way to implement a dense array of MRAMs. An MRAM cell typically has two memory states representing binary bits, where each state has a substantially linear current-voltage relationship. Thus, separate or independent selection devices are typically used to electrically isolate the MRAM cells in the array from one another. These selection devices may include three-terminal transistor selectors, such as negative/positive metal oxide semiconductor transistors. However, the inclusion of a transistor selector for each memory cell can greatly increase cell size and reduce the density of the MRAM array due to the large size of the selector and the need to route gate control lines to each memory cell. In addition, since the cell resistances with the two MRAM states described above typically differ by a factor of only 2-3 in resistance value, any selector employed should have a non-linear characteristic. This non-linear characteristic will correspond to a high resistance at low voltage and a low resistance at high voltage. Additionally, a desired selector may also have a threshold switching characteristic, wherein once a threshold switching condition (such as a threshold voltage) is met, the selector remains in the selected state with some degree of hysteresis.

As discussed herein, an MRAM cell includes a non-volatile memory (NVM) element that may be formed from one or more magnetic elements that store data as one or more magnetic states. MTJ devices typically employ spin-polarized current to reversibly switch the magnetization state of a ferromagnetic layer. The MTJ operates using Tunneling Magnetoresistance (TMR), which is a magnetoresistive effect. MTJs are typically composed of two layers of ferromagnetic material separated by a thin insulator layer through which electrons can quantum-mechanically tunnel from one ferromagnetic layer into the other. One ferromagnetic layer of an MTJ may be referred to as a fixed layer (pinned layer) having a fixed magnetization state, while the other ferromagnetic layer of the MTJ includes a free layer that can change in magnetization state. The intermediate layer, which comprises a thin insulator separating two ferromagnetic layers, may be formed of an oxide material or other suitable electrical insulator. Electrical terminals can be formed to interface the free and fixed layers of the MTJ with other components in the circuit.

Perpendicular or parallel arrangements of MTJ elements, which refer to a type of magnetic anisotropy associated with a preferred alignment direction of magnetic moments within the MTJ elements with respect to a surface of a corresponding semiconductor substrate, may be used in MRAM cells. A first type of MTJ configuration includes a uniform perpendicular Spin Transfer Torque (STT) arrangement, which typically includes a 2-terminal device formed of at least three stacked layers of material. The three layers include a tunnel barrier layer disposed between the fixed layer and the free layer. The free layer and the fixed layer are coupled to two terminals of the STT MTJ. Other types of MTJs include spin-orbit torque (SOT) MTJ elements that can be used in three-terminal Spin Hall Effect (SHE) MRAM cells.

MTJ elements, such as the STT MTJ elements described above, may generally be placed in two different states, which may correspond to different logic or data values stored in the MTJ elements. These states depend on the magnetization state of the MTJ element, which corresponds to the value of the magnetic resistance currently exhibited by the MTJ element. The changeable magnetization state of the MTJ elements discussed herein can be changed between two states, a parallel state and an anti-parallel state. The parallel state occurs when the free layer and the fixed layer of the MTJ element are in the same magnetization state. The anti-parallel state occurs when the free layer and the fixed layer of the MTJ element are in different magnetization states. Data values may be assigned to magnetization states, such as logic '0' for an anti-parallel state and logic '1' for a parallel state, among other configurations.

Turning now to an enhanced structure for implementing an MRAM device employing MTJ elements, fig. 1 is presented. Fig. 1 is a system diagram illustrating a memory system 110 including a memory array 100 and various peripheral circuits. The peripheral circuitry includes various controls, interfaces, and sensing circuitry. In FIG. 1, system 100 also includes row decoder circuitry 120, column decoder circuitry 130, sense circuitry 140, output circuitry 150, and buffer circuitry 160. Various communication links and signal lines are shown in fig. 1, but the specific implementation of these lines may vary. Typically, row and column signal lines will be employed in the memory array 110 to form a cross-point memory arrangement. The cross-point memory arrangement includes a memory cell located at each junction of a row and a column. Thus, memory array 110 may include a number of rows'm' and a number of columns 'n', creating an'm' by 'n' array of junctions each corresponding to a single memory cell. Although MRAM-type memory cells are discussed in fig. 1, other memory technologies may be employed in a cross-point memory arrangement.

FIG. 1 also includes an example memory cell detail view 101. Detailed view 101 shows a component level view of a portion of memory array 110, but this view is simplified for clarity. Typically, the associated components of detailed view 101 are formed onto a semiconductor substrate using techniques that exist in semiconductor wafer processing and micromachining, such as photolithography, diffusion, deposition, epitaxial growth, etching, annealing, ion implantation, and the like. Detailed view 101 includes row lines 114 and column lines 115. An optional MRAM cell 111 is positioned at a physical junction between a row line 114 and a column line 115. The optional MRAM cell 111 includes an MTJ element 112 and a selector element 113. More details regarding these elements are discussed below. The detailed view 101 is provided as an example configuration of memory cells in a cross-point memory. Each junction of a row and column in a cross-point memory, such as memory array 110, may include a similar arrangement of MRAM cells, as shown in the detailed view 101. Further, various interconnects, metallization, insulators, terminals, and other elements may be included during implementation of the memory array 110.

The row decoder 120 and column decoder 130 will typically be coupled to control circuitry configured to control read, write, and erase operations, as well as other operations. The row decoder 120 and column decoder 130 each include line selection circuitry and logic to enable/disable particular rows and columns of the memory array 110 as directed by the control circuitry. The line selection circuitry may include selection transistors, buffers, inverters, current and voltage limiter circuitry, transmission gates, and other similar circuitry. In this way, memory cells in the memory array 110 can be read, written, or erased.

During a read operation, the sensing circuit 140 senses the output of the selected memory cell. The sensing circuit 140 may include sense amplifiers, comparators, level shifters, and various other support circuits. The sensing circuit 140 provides a representation of the output of the selected memory cell to the output circuit 150. The output circuit 150 includes an output circuit to interpret the representation into a data value, which may include various enhancement circuits described below in fig. 2, 3, 4, and 6. These data values may comprise binary values having voltage levels corresponding to the desired logical representation. As will be discussed below, the output circuit 150 may reduce or eliminate the effect of the selector elements on the sense voltage when reading a data bit from the memory array 110. Buffer 160 may include digital memory elements included for storing data bits determined by output circuit 150 prior to transmission to one or more external systems via data link 161. In some examples, portions of column decoder 130, sensing circuitry 140, output circuitry 150, and buffer 160 may be combined into circuit blocks or shared over similar circuit components.

Turning now to a detailed implementation of the optional memory cell 111 from FIG. 1, along with various support circuits, FIG. 2 is provided. Fig. 2 represents a single "junction" in a cross-point memory array, along with associated row/column driver circuitry and memory cells. In particular, fig. 2 includes a circuit 200 that includes a current control circuit 210, a current mirror 212, an output circuit 220, an optional MRAM cell 230, a row driver 240, and a column driver 241. The optional MRAM cell 230 may include an example implementation of the optional memory cell 111 from fig. 1, where the MTJ element 112 and the selector element 113 of fig. 1 are represented by an MRAM element 231 and a selector 238, respectively. The optional MRAM cell 230 may be referred to as a "1S-1 MTJ" type MRAM cell, which is formed from a single selector (S) and a single MTJ element. Optional MRAM cells 230 may be formed at the row/column junctions of a cross-point memory array, such as seen with respect to row lines 114 and column lines 115 in fig. 1. Thus, row line 251 may correspond to row line 114 in FIG. 1, and column line 252 may correspond to column line 115 in FIG. 1. Other memory cells at the row/column junctions of fig. 1 may have a similar arrangement as seen in fig. 2, although variations are possible.

The MRAM element 231 includes an MTJ element 232, which in this example is an STT type MTJ element. MTJ232 is erased, written, and read using corresponding electrical pulses. However, these electrical pulses are typically bipolar in nature, which refers to a control voltage or control current that may be applied by the column driver 242 and the row driver 241 on the MRAM elements 231 in either the first polarity or the second polarity. To prevent accidental erasing, writing and reading of other MRAM elements of a selected row or column when a corresponding electrical pulse is generated, a selector 238 is included in series with the MRAM elements 231.

Selector 238 is a two terminal selector element that includes the bipolar selector of fig. 2. The selector 238 may comprise a chalcogenide ovonic threshold switch or a volatile conductive bridge, although other techniques may be used. Once a threshold condition (such as a threshold voltage (V)) is exceeded_t) And the selector 238 is placed in a conductive state, the selector 238 forms a conductive (e.g., low relative resistance) bridge between the two terminals of the selector 238. After the selector 238 is activated by the exceeding of the threshold condition, the selector 238 remains in the enabled state having a low resistance relative to the disabled state as long as there is sufficient current or voltage across the selector 238. Once there is not sufficient current or voltage (such as falling below the hysteresis threshold), the selector 238 changes to the inactive state (high relative resistance). Then, the conductive path between the two terminals of the selector 238 is collapsed or deactivated. The hysteresis characteristic may be controlled in selector 238. The amount of hysteresis exhibited by the selector 238 is directly related to the voltage applied to the MRAM element 231. Specifically, when 'on', the selector 238 acts as a voltage source in series with the MTJ232 including the MRAM element 231. The magnitude of the voltage source corresponds to the holding voltage, referred to herein as the bias voltage, also referred to herein as V_OFFSET. This bias voltage can interfere with accurate reading of the current magnetization state of MTJ 232.

An example feature of the selector 238 is shown in fig. 9. Fig. 9 includes a graph 900 illustrating characteristics of the selector 238 at various voltages and currents. The vertical axis of the graph 900 corresponds to the selector current, or current currently passing through the selector 238. The horizontal axis of the graph 900 corresponds to the selector voltage or the voltage currently across the selector 238. The lower left and upper right quadrants of the graph 900 are shown to illustrate the bipolar nature of the selector 238. The lower left quadrant shows the current with a negative selector (-I)_{Selector device}) With the negative polarity and the upper left quadrant shown with positive selector current (+ I)_{Selector device}) Positive polarity. In other examples, the associated polarities may be reversed, and the bipolar nature of the selector 238 is generally symmetrical about the polarity.

Graph 900 shows selector 238 being negativeCurrent-voltage (IV) curves for both polarity and positive polarity. The IV curve is represented by curve portion 901-904 in fig. 9. Selector 238 exhibits a non-linear response in graph 900. The 'off' state of selector 238 corresponds to high device resistance and low leakage current (I) at low applied voltages_lk). This 'off' state is represented by curve portion 903-904 in the graph 900. The 'on' state of selector 238 corresponds to a high applied voltage of (>V_t) Lower device resistance and is represented by curve portion 901-902 in graph 900. R_sonCorresponding to the slope of the corresponding curve portion, R_sonIncluding the 'on' resistance of the selector 238 for each polarity. The selector 238 exhibits a threshold switching characteristic in which a threshold voltage (V)_t) Once exceeded (>V_t) Then the selector 238 changes from a high resistance 'off' state (curve portion 903- > 904) to a low resistance 'on' state (curve portion 901- > 902).

The hysteresis characteristics of the selector 238 are also shown in the graph 900. The hysteresis characteristic in graph 900 corresponds to a point on the voltage axis obtained by extrapolating the selector 'on' state current-voltage (IV) curve. In particular, the hysteresis corresponds to the applied voltage being allowed to drop to V_h(which is lower than Vt) and then V_tThe position of being exceeded. In addition, the hysteresis characteristic has a corresponding current limit (I)_h) Below this current limit, the selector may switch state to an 'off' state. The actual performance of selector 238 and the 'on' and 'off' resistance values will vary based on manufacturing variations, device dimensions, and other implementation-specific details. Thus, the bias voltage exhibited by the selector 238 when in the 'on' state may also vary. Examples herein provide an enhancement compensation technique for reducing the effect of the bias voltage of the selector 238 and compensating for bias voltage variations between different selectors in the array.

Returning to fig. 2, an example circuit 200 is shown. In operation, current (I) is limited by current mirror 212 positioned on the "low" potential side of circuit 200_LIMIT) Through various portions of the circuit 200. The low side of the circuit 200 is referred to in fig. 2 as the low sideV_LOWCorresponding to the end of the circuit that is coupled to a low potential or voltage (i.e., 0V in the typical case). The current drawn by the current mirror 212 varies based on the current limit set by the current control circuit 210, and the control of this limit value is discussed in more detail below. The current control circuit 210 is thus configured to limit the current through the optional MRAM cell 230. In one embodiment, control circuit 210 limits the read current employed during a read operation of optional MRAM cell 230. In operation, current mirror 212 mirrors any current limit set by current control circuit 210 from the left hand side of current mirror 212 to the right hand side of current mirror 212 due to the particular coupling of the gates of transistors 213 and 214. This current is drawn through the optional MRAM cell 230 and other series connected circuits and interconnects, such as unselected row lines and unselected column lines. The row driver 241 and the column driver 242 are coupled to associated row lines 251 and column lines 252, which form a series circuit with the optional MRAM cell 230.

At the current (I)_LIMIT) Exhibits a sense voltage (referred to herein as V) at the current mirror 212 for sensing the state of the MTJ232_SENSE). The sensing voltage can be expressed as: v_Sensing＝V_Reading-V_Biasing-I_{Extreme limit}(R_S+R_MRAM) Which is represented as formula 203 in fig. 2. V_READApplied as a supply voltage to column driver 242, V_OFFSETIs the voltage on the selector 238, R_SIs the series resistance of the line and component in series with MTJ232, and R_MRAMIs the resistance currently exhibited by MRAM element 231. The resistance (R) currently exhibited by the MRAM element 231_MRAM) Reflects the magnetization state of MTJ232 and thus represents a data or bit value stored within MRAM element 231.

Voltage (V) across optional MRAM cell 230_COMBINED) Corresponds to I_LIMIT*R_MRAM。I_LIMITIs usually set so that V_COMBINEDBetween about 0.1-0.3V to protect against read disturb (inadvertent writing/programming during read operations). Thus, V_OFFSETShould vary by less than about 10-30mAnd V. In practice, it is difficult to manufacture the selector at such a specific V_OFFSETWithin the range. For example, if the bias voltage of the selector is 1.3V, V will be_OFFSETControl to 10-30mV will mean that V is adjusted_OFFSETControlled to be within less than 2.5 percent. Advantageously, the examples herein compensate for variations in the bias voltage of a selector (such as selector 238 shown in fig. 2). These examples include compensation circuit 320 in fig. 3, compensation circuit 420 in fig. 4, and compensation 620 in fig. 6, among other examples. The examples presented herein substantially eliminate the change in the selector VOFFSET. This enlarged margin can be used for other sources of variation, such as MRAM diameter variation. The examples provided herein will be useful for producing stand-alone MRAM products in the 16-64Gb range for DRAM replacement.

Three example implementations for sensing the magnetization state of the MTJ 230 of the optional MRAM cell 232 are shown below. In each exemplary implementation, the output circuit 220 has a circuit for sensing V_SENSEAnd current control circuit 210 controls current mirror 212 to obtain a corresponding I_LIMITMagnitude. In particular, the following example imposes multiple current limits (I)_LIMIT) And sense V_SENSEHow to follow I_LIMITAnd changes accordingly. Due to V_OFFSETWith I_LIMITThe variation is constant, so that V can be compensated in the final result_OFFSET. In many cases, the compensation refers to a reduction in V_OFFSETTo V_SENSEThe influence of (c). This corresponds to V in the above formula_SENSERelative to I_LIMITThe mathematical derivative of (a), equation 203.

Fig. 3 is provided to illustrate a first example implementation 300. In fig. 3, the output circuit 220 includes a compensation circuit 320. The compensation circuit 320 includes a capacitor 321 and a current sensing circuit 322 coupled to a low potential (e.g., ground). In this example, the capacitance value is C_aCapacitor 321 is coupled to V of fig. 2_SENSEAn electrical node. Further, the current control circuit 210 is configured to apply a ramp current 301 to the circuit 200. The ramp current 301 is at a constant rate dI_LIMITDt cause I_LIMITRamping, e.g. I in FIG. 3_{LIMIT_RAMP}Indicated. From V_SENSECapacitor current (I) delivered to ground through capacitor 331_CAP) Corresponds to V_SENSEThe derivative of (c). In particular, I_CAP＝dV_SENSE/dt＝C_a*dI_LIMIT/dt*(R_S+R_MRAM). Once I is determined_CAPThen it may be based on the determined R_MRAMTo determine the magnetization state of MRAM cell 231. Advantageously, sensing I_CAPInstead of V_SENSEReduces or eliminates V in equation 203_OFFSET(and associated selector device to device variations).

In FIG. 2, current sensing circuit 322 may be used to sense I_CAP. In one example, current sensing circuit 322 may include a current mirror similar to that shown for current mirror 212. The reference current of the current mirror can be used for sensing I_CAPThe state of (1). In another example, current sensing circuit 322 may include a resistor having a particular resistance (such as 50-100 kilo ohms) coupled to a terminal of capacitor 321. Current sensing circuit 322 may then use a comparator or other similar circuit to sense the voltage drop across the resistor. This voltage drop can be used to determine I_CAP。

However, due in part to sensing I_CAPThe implementation shown in fig. 3 is challenging. Another example implementation 400 of the output circuit 220 is presented in fig. 4. In FIG. 4, for I_LIMITTo determine V_SENSEThe sample of (1). Then subtract V_SENSETo obtain a result. The result corresponds to a discrete differential type of equation 203 and is then used to determine the magnetization state of MRAM cell 231. As with the circuit and technique of FIG. 3, the result determined by the circuit of FIG. 4 also reduces or eliminates V in equation 203_OFFSET(and associated selector device to device variations).

In fig. 4, the output circuit 220 includes a compensation circuit 420. The compensation circuit 420 includes a number of transistor-based switching elementsSelectively providing presence at V to capacitors 425 and 426_SENSEThe voltage of (c). In fig. 4, no direct measurement of the current through the capacitive element is performed as in fig. 3. Instead, capacitors 425 and 426 minus V are used_SENSETo produce V, to produce_OUTThis reduces or eliminates V_OFFSETThe influence of (c).

The first switching element (transistor 421) has a gate terminal coupled to a first selection signal (S1), and the second switching element (transistor 422) has a gate terminal coupled to a second selection signal (S2). The drain terminal of transistors 421 and 422 is coupled to V_SENSE. Capacitors 425 and 426 each have a corresponding capacitance value, C in FIG. 4_bAnd C_c. The specific capacitance value will vary based on the specific implementation, but in this example C_bAnd C_cContaining the same values as each other. The read transistors 423 and 424 include a sense circuit at C_bAnd C_cPerforming a subtraction between the stored voltages and at V_OUTPresenting a resultant voltage. In particular, a gate terminal of transistor 423 is coupled to a first READ control signal (READ A), and a gate terminal of transistor 424 is coupled to a second READ control signal (READ B). A source terminal of transistor 421 is coupled to a first terminal of capacitor 425 and a drain terminal of transistor 424. A source terminal of transistor 424 is coupled to capacitor 426 and to a source terminal of transistor 422. A source terminal of the transistor 423 and a second pole terminal of the capacitor 426 are coupled to a low potential, such as ground or 0V. V_OUTPresent the result from the compensation circuit 420, V_OUTTo the drain terminal of transistor 423.

In operation, current control circuit 210 is configured to apply a step current 401 to circuit 200. The step current corresponds to I_LIMITIs a first constant value of I_{LIMIT_1}Is followed by I_LIMITOf a second constant value, i.e. I_{LIMIT_2}. In this example, I_{LIMIT_1}Is greater than I_{LIMIT_2}But other configurations are possible. Example Current Limit is I_{LIMIT_1}11 microamperes (μ A) of (1)_{LIMIT_2}2 μ A. Current control circuit 210 selects thisThese current limits produce a mirrored current through current mirror 212, which draws current through at least MRAM elements 231 and selector 238 and associated row and column lines in circuit 200.

Fig. 5 shows a timing diagram 500 detailing the control signaling of the compensation circuit 420. In graph 500, selector 238 changes to the 'on' state by exceeding a threshold condition (such as a threshold voltage or a threshold current). A voltage may be established across the optional MRAM cell 230 that results in a threshold voltage (V) above the selector 238_t) As seen in curve 501 of graph 500. Specifically, in this example, the voltage is established as V_BITLINEAnd V_WORDLINEThe difference between them or 2.3V. V_BITLINECorresponding to the voltage applied to column line 252 by column driver 242. V_WORDLINECorresponding to the voltages applied to the row lines 251 by the row driver 241. Once the selector 238 is placed in the 'on' state, current may pass through the selector 238. As long as the current remains above the hysteresis current value, the selector 238 will remain in the 'on' state or low resistance state. If the current drops below the hysteresis current value, the selector will change to the 'off' state and will stop delivering a measurable current due to the high resistance state.

A first current limit, i.e., 11 μ A I, is applied to the current through the optional MRAM cell 230_{LIMIT_1}. This first current limit can be seen in curve 503 of graph 500. The first select signal (S1) and the second select signal (S2) remain at a high voltage that controls the associated transistor (421, 422) in an enabled state, allowing the corresponding capacitor (425, 426) to track V at various current limits_SENSEThe voltage presented above. Specifically, as seen in curve 502, when I is applied_{LIMIT_1}At this time, the first selection signal (S1) is driven to a high voltage (enabled state), the high voltage controlling transistor 421 will V_SENSEThe voltage present at is passed to node 432 and capacitor 425. Capacitor 425 is stored at I_{LIMIT_1}The V of_SENSEA value, then disabled by driving the gate terminal to a low voltage (non-enabled state)S1, to connect the capacitor 425 and V_SENSEAnd (4) isolating. A second current limit, i.e., I of 2 μ A, is applied to the current through the optional MRAM cell 230_{LIMIT_2}. This second current limit can be seen in curve 503 of graph 500. From I_{LIMIT_1}To I_{LIMIT_2}May be a ramp having a speed selected to ensure the desired operational timing of the compensation circuit 420 while keeping the electromagnetic interference and oscillations below a target level. As seen in plot 504, when I is applied_{LIMIT_2}At this time, the second select signal (S2) is driven to a high voltage (enabled state), which controls the transistor 422 to switch V_SENSEThe voltage present at is passed to node 431 and capacitor 426. Capacitor 426 is stored in I_{LIMIT_2}The V of_SENSEValue, S2 is then disabled by driving the gate terminal to a low voltage (non-enabled state) to connect capacitor 426 with V_SENSEAnd (4) isolating.

Once both capacitors 425 and 426 have used a particular V for a particular current limit_SENSEThe sample is charged and a subtraction can be performed between the voltages stored in capacitors 425 and 426. First, the READ A signal is brought to a low voltage to disable transistor 423 (curve 505), while the READ B signal is brought to a high value to enable transistor 424 (curve 506). This configuration of the READ A and READ B signals allows the voltages stored in capacitors 425 and 426 to be subtracted from each other by transistor 424 and taken at V_OUTThe resulting voltage is present. May then be at V_OUTThe output or result from the compensation circuit 420 is sensed as shown (sensed) according to the approximate timing in the graph 500. V_OUTThis result at (f) corresponds to the calculation of the discrete differential of equation 203 and is then used to determine the magnetization state of MRAM cell 231.

Graph 510 in fig. 5 shows the simulation results using this process described above for compensation circuit 420 and graph 500. The particular selector used as selector 238 in the simulation of graph 510 is the threshold voltage (V) at an ambient temperature of 85 deg.C_t) An Ovonic Threshold Switch (OTS) of 1.7V. Also shows C_bAnd C_cFor the associated curve in graph 510, an example value of 10 nanometersMicrofarads (fF) and 30 fF. Further, a curve of each binary value stored in the associated MRAM element is shown, as indicated by the parallel and anti-parallel magnetization states of the corresponding MTJ element.

In graph 510, curves 511 and 512 show V as selector 238_OFFSETV without using the process described above with respect to fig. 4 and graph 500_SENSEA sensing window. As can be seen, V is shown_SENSEWith V_OFFSETThe variation is large. Curve 513 + 516 shows the voltage V of the compensation circuit 420 using capacitive subtraction_OUT. For curve 511-_OUTWith V_OFFSETThe variation of the variation is much smaller and the margin V can be obtained compared to the margin +/- < 1.2V in the absence of the capacitive subtraction circuit as shown by curves 511 and 512_OFFSET>+/-0.2V. For selector 238, even better results would be obtained using a selector with a lower drain than the particular selector used in the simulation.

The circuitry, configurations, and operations presented in fig. 4 and 5 may be further simplified in another example implementation. Fig. 6 presents this example implementation 600. The implementation 600 includes a compensation circuit 620 that employs a single capacitor 622 and a single switching element (transistor 621). In FIG. 6, for I_LIMITTo determine V_SENSEThe sample of (1). Using capacitor 622 minus V_SENSETo obtain the results. The result corresponds to a discrete differential type of equation 203 and is then used to determine the magnetization state of MRAM cell 231. As with the circuits and techniques of FIGS. 3 and 4, the results determined by the circuit of FIG. 6 also reduce or eliminate V in equation 203_OFFSET(and associated selector device to device variations). In fig. 6, no direct measurement of the current through the capacitive element is performed as in fig. 3. Instead, V is subtracted in capacitor 622_SENSETo produce V, to produce_OUTThis reduces or eliminates V_OFFSETThe influence of (c).

In FIG. 6, the output circuit 220 includes compensation circuitryAnd a way 620. Present in V_SENSECoupled to a first terminal of capacitor 622. The compensation circuit 620 includes a single transistor-based switching element (621) that selectively couples or decouples the second terminal of the capacitor 622 to or from a low potential, such as ground or 0V. The transistor 621 has a gate terminal coupled to a first selection signal (S1). A drain terminal of the transistor 621 is coupled to the second terminal of the capacitor 622 and V_OUTAnd a source terminal of the transistor 621 is coupled to a low potential. Capacitor 622 has a corresponding capacitance value, C in FIG. 6_d. The specific capacitance values will vary based on the implementation. V_OUTPresent the result from the compensation circuit 620, this V_OUTTo the drain terminal of transistor 621. Separate readout circuits, such as transistors 423 and 424, are not required in compensation circuit 620. In contrast, the transistor 621 and the capacitor 622 include a readout circuit, and include a compensation circuit.

In operation, current control circuit 210 is configured to apply a step current 601 to circuit 200. The step current corresponds to I_LIMITIs a first constant value of I_{LIMIT_1}Is followed by I_LIMITOf a second constant value, i.e. I_{LIMIT_2}. In this example, I_{LIMIT_1}Is greater than I_{LIMIT_2}But other configurations are possible. Example Current Limit is I_{LIMIT_1}11 microamperes (. mu.A) and I_{LIMIT_2}2 μ A. Current control circuit 210 selects these current limits to produce a mirrored current through current mirror 212, which draws current through at least MRAM elements 231 and selector 238 and the associated row and column lines in circuit 200.

Fig. 7 shows a timing diagram 700 detailing the control signaling of the compensation circuit 620. In graph 700, selector 238 changes to the 'on' state by exceeding a threshold condition (such as a threshold voltage or a threshold current). A voltage may be established across the optional MRAM cell 230 that results in a threshold voltage (V) above the selector 238_t) As seen in curve 701 of graph 700. Specifically, in this example, the voltage is established as V_BITLINEAnd V_WORDLINEDifference therebetweenValue or 2.3V. V_BITLINECorresponding to the voltage applied to column line 252 by column driver 242. V_WORDLINECorresponding to the voltages applied to the row lines 251 by the row driver 241. Once the selector 238 is placed in the 'on' state, current may pass through the selector 238. As long as the current remains above the hysteresis current value, the selector 238 will remain in the 'on' state or low resistance state. If the current drops below the hysteresis current value, the selector will change to the 'off' state and will stop delivering a measurable current due to the high resistance state.

A first current limit, i.e., 11 μ A I, is applied to the current through the optional MRAM cell 230_{LIMIT_1}. This first current limit can be seen in curve 703 of graph 700. The first select signal (S1) remains at a high voltage during the first current limit, which controls the associated transistor 621 in an enabled state, allowing the corresponding capacitor 622 to track V at the first current limit_SENSEThe voltage presented above. Specifically, as seen in curve 702, when I is applied_{LIMIT_1}When the first selection signal (S1) is driven to a high voltage (enabled state), the high voltage control transistor 621 is coupled to a low potential. Capacitor 622 can be charged to I_{LIMIT_1}Period V_SENSEThe voltage presented above. Applying a second current limit (I) to the current control circuit 210_{LIMIT_2}) Previously, the first select signal (S1) was driven low as seen in curve 703, placing the transistor 621 in a non-enabled state and floating the second terminal of the capacitor 622 relative to the low potential. However, the first terminal of capacitor 622 is still coupled to V_SENSE. Once the current control circuit 210 applies the second current limit (I)_{LIMIT_2}) From the first current limit (I)_{LIMIT_1}) Period V_SENSEContinuously subtracting V from the initial sample value of_SENSEAt the voltage present. At the current from I_{LIMIT_1}Is converted into_{LIMIT_2}Then, V_OUTThe voltage at the second terminal of the capacitor 622 corresponds to the result of the compensation circuit 620. May then be at V_OUTSense the output from the compensation circuit 620The result is taken or obtained as shown (sensed) according to the approximate timing in graph 700. V_OUTThis result at (f) corresponds to the calculation of the discrete differential of equation 203 and is then used to determine the magnetization state of MRAM cell 231.

Graph 710 in fig. 7 shows the simulation results using this process described above for compensation circuit 620 and graph 700. The particular selector used as selector 238 in the simulation of graph 510 is the threshold voltage (V) at an ambient temperature of 85 deg.C_t) An Ovonic Threshold Switch (OTS) of 1.7V. C in diagram 710_dThe example capacitance value of (c) is set to 10fF, but other values may be used. Further, graph 710 shows a comparison between compensation circuit 420 employing two capacitors and compensation circuit 620 employing one capacitor. The single capacitor based circuit of compensation circuit 620 gives an even more independent of V than the two capacitor circuit of compensation circuit 420_OFFSETThe result of (1). Advantageously, compensation circuit 620 has a less complex configuration, a smaller part count, exhibits a V pair, as compared to compensation circuit 420_SENSEAnd V_OUTAnd may produce faster results.

In graph 710, curves 711 and 713 show V as selector 238_OFFSETFunction of, V when using compensation circuit 420_SENSEA sensing window. Curves 712 and 714 show V as selector 238_OFFSETFunction of, V when using compensation circuit 620_SENSEA sensing window. As can be seen, curves 711 and 713 exhibit a larger following V than curves 712 and 714_OFFSETVariable V_SENSEAnd (4) changing. For curves 712 and 714, the voltage V_OUTFollowing V_OFFSETThe variation is much smaller and the single capacitor circuit using the compensation circuit 620 can obtain the margin V < 0.2V compared to the margin +/- < 0.2V in the case of the dual capacitor subtraction circuit using the compensation circuit 420 shown in curves 711 and 713_OFFSET>+/-0.1V. For selector 238, even better results would be obtained using a selector with a lower drain than the particular selector used in the simulation.

FIG. 8 is now presented to illustrate the operation of the various circuits and systems discussed hereinDo this. The operations of fig. 8 are discussed in the context of the elements of fig. 2, but different elements may alternatively be employed. In fig. 8, compensation is performed for the voltage read from the optional MRAM cell 230. This compensation reduces the effect of selector 238 on the voltage generated by the current through the optional MRAM cell 230. Specifically, selector 238 has a particular V when enabled_OFFSETThe properties, which may vary from device to device and based on the current through selector 238. Therefore, it may be difficult to read the voltage of the MRAM element 231 composed of the MTJ 232.

Although not required, some examples may perform an erase operation or a write operation prior to a read operation. In particular, MRAM element 321 may optionally be erased to an initial state, and then a desired data value may be written or programmed into MRAM element 321. In another example, a read operation may be performed prior to an erase or write operation to determine the current state of the MRAM element 321, such as discussed in operations 803-805. If MRAM element 321 is in the desired state, then the erase or write operation may be omitted. In other examples, MRAM element 321 can be written or programmed without erasing to an initial state or checking a previously programmed state via a read operation.

When an erase operation is required, then optional operation 801 may be performed. In operation 801, data is first erased from the optional MRAM cell 230. This can be achieved by: drives a voltage across the selectable MRAM cell 230 that exceeds a threshold voltage (Vth) required to switch the selector 238 to an enabled or conductive state_t). Once in the conductive state, the selector 238 may pass a current that is used to erase the series-connected MTJ232 within the optional MRAM cell 230. This erase operation places the magnetization state of MTJ232 in a desired initial state, which may represent a binary '1' or '0' as well as other values. This state corresponds to the parallel (P) or anti-parallel (AP) state of MTJ232, where a relatively large current may pass through MTJ232 in a preferred direction or polarity to force MTJ232 into an initial state (e.g., P or AP) depending on the current polarity. Because of the fact thatThe selector 238 includes a bi-directional or bi-polar selector element so the selector 238 can pass current of either polarity for the MTJ 232.

When employed in an MRAM cell array, such as that shown in fig. 1, then a particular column line and row line may be selected for reaching the target MRAM cell for erasure. In a cross-point memory array, such as that shown in FIG. 1, each memory cell is typically individually selectable at each junction of a column line and a row line. Various column select circuits and row select circuits may be employed to control the select operation.

When a write operation is required, then optional operation 802 may be performed. Optional MRAM cell 230 may have a data value written or programmed into MRAM element 321. In optional operation 802, data is written by: drives a voltage across the selectable MRAM cell 230 that exceeds a threshold voltage (Vth) required to switch the selector 238 to an enabled or conductive state_t). Once in the conductive state, the selector 238 may pass a current for programming the series-connected MTJ232 within the optional MRAM cell 230. The write operation places the magnetization state of MTJ232 in a desired state to represent a data value, which may include a binary '1' or '0' among other values. These data values or data states correspond to the parallel (P) or anti-parallel (AP) state of the MTJ232, where a current can be passed through the MTJ232 in a preferred direction or polarity to force the MTJ232 into a desired state (e.g., P or AP) depending on the current polarity. Because the selector 238 includes a bi-directional or bi-polar selector element, the selector 238 can pass current of either polarity for the MTJ 232.

Turning now to a discussion of the enhanced read operation, optional MRAM cell 230 may have a data value read from MRAM element 321. In operation 803, data is read from the optional MRAM cell 230 by: drives a voltage across the selectable MRAM cell 230 that exceeds a threshold voltage (Vth) required to switch the selector 238 to an enabled or conductive state_t). Once in the conductive state, the selector 238 may pass a current for reading the series-connected MT within the optional MRAM cell 230The current magnetization state of J232. The read operation generates a voltage on MTJ232 that depends on the previously programmed magnetization state, which represents a data value that may include a binary '1' or '0' among other values. These data values or data states correspond to the parallel (P) or anti-parallel (AP) state of MTJ232, wherein a current can be passed through MTJ232 in a preferred direction or polarity to generate a voltage across MTJ232 that reflects the current magnetization state. Because the selector 238 includes a bi-directional or bi-polar selector element, the selector 238 can pass current of either polarity for the MTJ 232.

However, in the implementation of FIG. 2, the current is read for I_LIMITThe indicated polarity is passed from the column driver 242 through the column line 252, through the series connection of the selector 238 and the MRAM elements 231, through the row line 251, and the row driver 241. In operation, a voltage may be employed to change the selector 238 to a conductive state, but then the current control circuit 210 in conjunction with the current mirror 212 is used to limit the magnitude of the current passed by the selector 238 and the MRAM elements 231. Limiting the current in various ways to be at V_SENSEIn a first example, shown in fig. 3, a ramp current limit 301 is employed, which is at V_SENSEA ramp voltage is generated. The compensation circuit 320 may be used to receive V_SENSEAnd compensates for V of selector 238_OFFSETAn attribute. This compensation advantageously reduces V_OFFSETThe effect on the voltage produced across MTJ232 by the applied read current and the effect on the device-to-device variability of selector 238 is reduced.

In a second example, as shown in FIG. 4, a step current limit 401 at V is used_SENSETwo successive voltages are generated. The compensation circuit 420 may be used to receive V_SENSETemporarily storing V_SENSEEach value of (a). By subtracting V stored from the second current limit_SENSETo reduce the stored V from the first current limit_SENSEThe first value of (c). The compensation circuit 420 may therefore use the subtracted result to compensate for V of the selector 238_OFFSETProperties. Similar to the compensation of fig. 3, the compensation performed in fig. 4 advantageously reduces V_OFFSETThe effect on the voltage produced across MTJ232 by the applied read current and the effect on the device-to-device variability of selector 238 is reduced. However, the compensation circuit 420 implements the compensation with a lower circuit complexity than the compensation circuit 320.

In a third example, as shown in FIG. 6, a step current limit 601 is used, which is at V_SENSETwo successive voltages are generated. The compensation circuit 620 may be used to receive V_SENSETemporarily storing the first current limit period V_SENSEAnd from the first value of V within a single capacitor_SENSEMinus the second current limit period V_SENSEA second value of (2). The compensation circuit 620 may compensate the V of the selector 238 with the subtracted result_OFFSETAn attribute. Similar to the compensation of fig. 4, the compensation performed in fig. 6 advantageously reduces V_OFFSETThe effect on the voltage produced across MTJ232 by the applied read current and the effect on the device-to-device variability of selector 238 is reduced. However, the compensation circuit 620 implements this compensation with a lower circuit complexity than even the compensation circuit 420.

As described above, based on the sensed voltages resulting from the various current limits, the output circuit 220 determines (804) an output voltage (V)_OUT). Various compensation circuits may be included to compensate for V_OFFSETThe effect on the voltage generated across MTJ 232. However, the result of the compensation circuit described above typically includes V_SENSEDerivative or differential form of, minus or eliminating V_OFFSETThe influence of (c). This may be represented by a derivative or differential form of equation 203 of fig. 2.

Output circuit 220 then determines (805) the value of the data in MRAM element 231 in optional MRAM cell 230 based on the output voltage from the compensation circuit. In some examples, output circuit 220 calculates the pairs V_OUTTo determine the magnetization state of the MTJ232 in the MRAM element 231. In further examples, output circuit 220 may directly interpret V_OUTTo determine the magnetism of the MTJ232 in the MRAM element 231And (4) state conversion. For example, if the magnetization state of MTJ232 in MRAM element 231 has two possible values (e.g., '1' and '0' corresponding to parallel and anti-parallel states in one example), then once from V_OUTBy reducing or removing V_OFFSETThe output circuit 220 can determine the voltage difference between the two states. Thus, V_OUTWill each correspond to a particular magnetization state of the MTJ232 in the MRAM element 231 and thus to a different data value. The data values may then be associated with different logic levels, voltage levels, or other representations as indicated for one or more external systems. In further examples, buffer 160 may be used to store data values prior to transmission to one or more external systems.

The description and drawings are included to depict specific embodiments that teach those skilled in the art how to make and use the best mode. For the purpose of teaching inventive principles, some conventional aspects have been simplified or omitted. Those skilled in the art will appreciate variations from these embodiments that fall within the scope of the disclosure. Those skilled in the art will also appreciate that the above-described features may be combined in various ways to form multiple embodiments. Accordingly, the present disclosure is not limited by the specific embodiments described above, but only by the claims and their equivalents.