阅读说明：本技术 显示装置以及其制造方法 (Display device and method for manufacturing the same ) 是由 市川公也 家段胜好 佐野雅彦 广濑量平 米田裕 于 2020-02-19 设计创作，主要内容包括：本发明提供一种使用微型LED作为像素,制造成本低的显示装置以及其制造方法。显示装置(1)的制造方法,具备如下工序：准备基板(20)和发光元件(30)的工序,在所述基板设定了子像素(11)并按每个子像素(11)设置了第一布线(21),在所述发光元件的下表面设置了第一电极(35)并在相互交叉的至少两个侧面设置了第二电极(33)；在基板(20)上搭载发光元件(30),并将第一电极(35)与第一布线(21)电连接的工序；在基板(20)上形成覆盖发光元件(30)的树脂构件(23)的工序；通过除去树脂构件(23)的上部,使第二电极(33)的一部分从树脂构件(23)的上表面(23a)露出的工序；以及在树脂构件(23)上形成网格状的第二布线(24)以使一部分配置于发光元件(30)上,并将第二布线(24)与第二电极(33)电连接的工序。(The invention provides a display device using a micro LED as a pixel and having low manufacturing cost and a manufacturing method thereof. A method for manufacturing a display device (1) comprises the steps of: a step of preparing a substrate (20) on which sub-pixels (11) are set, a first wiring (21) for each sub-pixel (11) being provided, and a light-emitting element (30) on which a first electrode (35) is provided on the lower surface and second electrodes (33) are provided on at least two side surfaces that intersect each other; a step of mounting a light-emitting element (30) on a substrate (20) and electrically connecting a first electrode (35) to a first wiring (21); a step of forming a resin member (23) on the substrate (20) so as to cover the light-emitting element (30); a step of exposing a part of the second electrode (33) from the upper surface (23a) of the resin member (23) by removing the upper part of the resin member (23); and a step of forming a second wiring (24) in a grid pattern on the resin member (23) so that a part of the second wiring is disposed on the light-emitting element (30), and electrically connecting the second wiring (24) and the second electrode (33).)

1. A method of manufacturing a display device, wherein,

the method comprises the following steps:

preparing a substrate and a light emitting element, the substrate having sub-pixels, first wirings provided for the sub-pixels, first electrodes provided on a lower surface of the light emitting element, and second electrodes provided on at least two mutually intersecting side surfaces of the light emitting element;

mounting the light-emitting element on the substrate, and electrically connecting the first electrode to the first wiring;

forming a resin member on the substrate to cover the light emitting element;

removing an upper portion of the resin member to expose a portion of the second electrode from an upper surface of the resin member; and

and forming a second wiring in a grid shape on the resin member so that a part of the second wiring is disposed on the light emitting element, and electrically connecting the second wiring to the second electrode.

2. The method for manufacturing a display device according to claim 1,

the light emitting element includes a semiconductor member, and the second electrode is provided around the semiconductor member as viewed from above.

3. The method for manufacturing a display device according to claim 1,

the light emitting element includes a semiconductor member, and the second electrode is further provided on a part of an upper surface of the semiconductor member.

4. The method for manufacturing a display device according to any one of claims 1 to 3,

the shape of the light emitting element is rectangular when viewed from above.

5. The method for manufacturing a display device according to any one of claims 1 to 4,

the second wiring has:

a first straight portion extending in a first direction; and

and a second straight line portion extending in a second direction intersecting the first direction and connected to the first straight line portion.

6. The method for manufacturing a display device according to any one of claims 1 to 5,

at least one of the sub-pixels is provided with two or more of the light-emitting elements.

7. The method for manufacturing a display device according to claim 6,

the method for manufacturing a display device further includes:

and separating the defective one of the light emitting elements from the second wiring.

8. The method for manufacturing a display device according to any one of claims 1 to 7,

in the step of forming the resin member, the resin member covers the plurality of light emitting elements mounted on the plurality of sub-pixels,

in the exposing step, the resin member is divided for each of the sub-pixels.

9. A display device, wherein,

the display device includes:

a substrate on which sub-pixels are set;

a first wiring provided on the substrate for each of the sub-pixels;

a light-emitting element mounted on the substrate for each of the sub-pixels;

a resin member covering a lower portion of the light emitting element and the first wiring; and

a second mesh-shaped wiring provided on the resin member and partially disposed on the light emitting element,

the light-emitting element includes:

a semiconductor member;

a first electrode provided on a lower surface of the semiconductor member and electrically connected to the first wiring; and

a second electrode provided on at least two side surfaces of the semiconductor member that intersect with each other, and a part of which is exposed from an upper surface of the resin member,

the second wiring is electrically connected to a portion of the second electrode exposed on the resin member.

10. The display device according to claim 9,

the light-emitting element further has:

an insulating light reflecting layer provided between a side surface of the semiconductor member and the second electrode,

the second electrode is disposed around the semiconductor member as viewed from above,

the second electrode is electrically connected to a lower surface of the semiconductor member.

11. The display device according to claim 9 or 10,

at least two or more of the light-emitting elements are provided in at least one of the sub-pixels.

12. The display device according to claim 11,

the defective one of the light emitting elements is separated from the second wiring.

Technical Field

Background

As shown in patent document 1, in recent years, a display device using a micro LED (Light emitting diode) as a pixel has been proposed. Since such a display device includes pixels each including a self-luminous element, the resolution, the contrast, and the color reproducibility are higher than those of a display device using a liquid crystal panel. In addition, since the micro LED is mainly formed of an inorganic semiconductor material, it has a long life and is difficult to cause burning, compared to an Organic EL (Organic Electro-Luminescence) element using an Organic material.

However, in a display device using a micro LED, it is necessary to take out light from an upper surface of a light emitting element and connect a lower surface and an upper surface of the light emitting element to a wiring. Therefore, it is necessary to achieve both high conductivity and high light transmittance on the upper surface of the light emitting element. As a result, the following problems occur: in a manufacturing process of a display device using micro LEDs, the difficulty of a process of mounting light emitting elements on a substrate increases, and manufacturing cost increases.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2006-140247

Disclosure of Invention

In view of the above problems, it is an object of the present invention to provide a display device which uses micro LEDs as pixels and is low in manufacturing cost, and a method of manufacturing the display device.

A method for manufacturing a display device according to an embodiment of the present invention includes: preparing a substrate on which sub-pixels are provided, first wirings provided for the sub-pixels, and second electrodes provided on at least two side surfaces intersecting with each other, the first electrodes being provided on a lower surface of the light-emitting element; mounting the light-emitting element on the substrate, and electrically connecting the first electrode to the first wiring; forming a resin member on the substrate to cover the light emitting element; removing an upper portion of the resin member to expose a portion of the second electrode from an upper surface of the resin member; and forming a second wiring in a grid shape on the resin member so that a part of the second wiring is disposed on the light emitting element, and electrically connecting the second wiring to the second electrode.

A display device according to an embodiment of the present invention includes: a substrate on which sub-pixels are set; a first wiring provided on the substrate for each of the sub-pixels; a light-emitting element mounted on the substrate for each of the sub-pixels; a resin member covering a lower portion of the light emitting element and the first wiring; and a second mesh-shaped wiring provided on the resin member, a part of the second mesh-shaped wiring being disposed on the light emitting element. The light-emitting element includes: a semiconductor member; a first electrode provided on a lower surface of the semiconductor member and electrically connected to the first wiring; and a second electrode provided on at least two side surfaces of the semiconductor member that intersect with each other, and a part of which is exposed from an upper surface of the resin member. The second wiring is electrically connected to a portion of the second electrode exposed on the resin member.

According to one embodiment of the present invention, a display device which uses micro LEDs as pixels and is low in manufacturing cost and a manufacturing method thereof can be realized.

Drawings

Fig. 1 is a plan view showing a display device according to a first embodiment.

Fig. 2A is an end view based on the line a-a' shown in fig. 1.

Fig. 2B is an end view based on the line B-B' shown in fig. 1.

Fig. 3A is a plan view showing a light-emitting element of the display device of the first embodiment.

Fig. 3B is an end view showing a light-emitting element of the display device of the first embodiment.

Fig. 4A is a plan view showing a light-emitting element of the display device of the first embodiment.

Fig. 4B is an end view based on the line C-C' shown in fig. 4A.

Fig. 5A is a plan view showing a second electrode of a light-emitting element of the display device of the first embodiment.

Fig. 5B is a plan view showing the first electrode of the light emitting element of the display device of the first embodiment

Fig. 6A is an end view showing a method of manufacturing the display device of the first embodiment.

Fig. 6B is an end view showing the method of manufacturing the display device of the first embodiment.

Fig. 7A is an end view showing a method of manufacturing the display device of the first embodiment.

Fig. 7B is an end view showing a method of manufacturing the display device of the first embodiment.

Fig. 7C is an end view showing a method of manufacturing the display device of the first embodiment.

Fig. 8 is an end view showing a light emitting element of a display device according to a second embodiment.

Fig. 9 is an end view showing a light emitting element of a display device of a third embodiment.

Fig. 10 is a plan view showing a light-emitting element of a display device according to a fourth embodiment.

Fig. 11 is a plan view showing a light-emitting element of a display device of a fifth embodiment.

-description of symbols-

1: display device

10: pixel

11. 11B, 11G, 11R: sub-pixel

20: substrate

20 a: upper surface of

21: first wiring

22: electrode for electrochemical cell

23: resin member

23 a: upper surface of

23 b: side surface

24: second wiring

24 a: a first straight line part

24 b: second straight line part

24 c: wire breaking part

30. 30a, 30b, 30c, 30d, 30 x: light emitting element

31: semiconductor component

31 a: lower surface

31 b: side surface

31 c: upper surface of

31 n: a second semiconductor layer

31 t: luminescent layer

31 p: first semiconductor layer

32: light reflecting layer

32a, 32 b: opening part

33: second electrode

33 a: opening part

33 b: the first part

33 c: the second part

34: insulating layer

34 a: opening part

35: a first electrode

36: protective layer

37: first conductive layer

38: second conductive layer

39: metallic coating

100: supporting substrate

100 a: lower surface

101: adhesive sheet

102: a conductive paste layer.

Embodiments relate to a display device and a method of manufacturing the same.