阅读说明：本技术 显示面板及其制造方法 (Display panel and method for manufacturing the same ) 是由 刘仲展 于 2020-05-08 设计创作，主要内容包括：一种显示面板及其制造方法,显示面板包括元件阵列基板、多个第一发光元件、光刻胶层以及至少一修补水平式发光二极管。这些第一发光元件设置于元件阵列基板上,并电性连接元件阵列基板。光刻胶层设置于元件阵列基板上,并具有上表面以及多个开口。这些开口从上表面延伸至元件阵列基板。这些第一发光元件分别位于这些开口内。光刻胶层的厚度大于各个第一发光元件的高度。修补水平式发光二极管粘着于上表面,并从这些开口至少一者电性连接元件阵列基板。(A display panel and a manufacturing method thereof are provided, the display panel comprises an element array substrate, a plurality of first light-emitting elements, a photoresist layer and at least one horizontal type repairing light-emitting diode. The first light-emitting elements are arranged on the element array substrate and electrically connected with the element array substrate. The photoresist layer is arranged on the element array substrate and is provided with an upper surface and a plurality of openings. These openings extend from the upper surface to the element array substrate. The first light-emitting elements are respectively positioned in the openings. The thickness of the photoresist layer is greater than the height of each first light emitting element. The horizontal light emitting diode is adhered to the upper surface and electrically connected with the element array substrate from at least one of the openings.)

1. A display panel, comprising:

an element array substrate;

a plurality of first light emitting elements arranged on the element array substrate and electrically connected with the element array substrate;

a photoresist layer disposed on the element array substrate and having an upper surface and a plurality of openings, wherein the openings extend from the upper surface to the element array substrate, and the first light-emitting elements are respectively disposed in the openings, wherein the thickness of the photoresist layer is greater than the height of each of the first light-emitting elements; and

at least one horizontal repair LED disposed on the upper surface and electrically connected to the element array substrate through at least one of the openings.

2. The display panel of claim 1, further comprising a plurality of repair lines, wherein the repair horizontal light emitting diode comprises two electrodes, and the device array substrate comprises a plurality of first pads and a plurality of second pads, wherein the first light emitting devices are electrically connected to the first pads and the second pads, and a portion of the first pads and a portion of the second pads are disposed in the openings, each of the repair lines extends from the top surface into one of the openings, and each of the repair lines is electrically connected to one of the electrodes of the repair horizontal light emitting diode and one of the first pads or one of the second pads disposed in the opening.

3. The display panel of claim 2, wherein the repair lines are transparent conductive lines or metal lines.

4. The display panel of claim 1, further comprising at least one second light emitting element disposed on the element array substrate, wherein the photoresist layer covers the at least one second light emitting element.

5. The display panel of claim 4, wherein the first light emitting elements are normal light emitting elements and the at least one second light emitting element is a defective light emitting element.

6. The display panel of claim 4, wherein the number of the at least one repairing horizontal LED is plural, the number of the at least one second LED is plural, the repairing horizontal LEDs are adhered to the upper surface and electrically connected to the device array substrate through the openings, and the photoresist layer covers the second LEDs.

7. The display panel of claim 6, wherein the colors of the light emitted by the horizontal repair LEDs are different from each other.

8. The display panel of claim 6, wherein at least one of the repaired horizontal LEDs overlaps one of the second light emitting devices.

9. The display panel of claim 6, wherein at least one of the repaired horizontal LEDs is not overlapped with the second light emitting element.

10. The display panel of claim 1, further comprising a plurality of wavelength converting materials, wherein each wavelength converting material is disposed in one of the openings and covers the first light emitting element.

11. The display panel of claim 10, further comprising a plurality of transparent filling materials, wherein the transparent filling materials are respectively disposed in the other openings where the wavelength conversion materials are not disposed and respectively cover the other first light emitting elements.

12. The display panel of claim 10, wherein each of the first light emitting elements is configured to emit an initial light, and two of the wavelength converting materials are configured to convert the initial light into a first monochromatic light and a second monochromatic light, respectively, wherein the first monochromatic light and the second monochromatic light are different in color from each other.

13. The display panel of claim 12, wherein the color of the light emitted by one of the repaired horizontal light emitting diodes is the same as one of the initial light, the first monochromatic light and the second monochromatic light.

14. A method of manufacturing a display panel, comprising:

providing an element array substrate and a plurality of light-emitting elements, wherein the light-emitting elements are arranged on the element array substrate;

forming a photoresist material layer on the element array substrate, wherein the photoresist material layer covers the light-emitting elements and is provided with an adhesion surface, and the light-emitting elements are positioned between the adhesion surface and the element array substrate;

making a plurality of normal light-emitting elements in the light-emitting elements emit light so that the light emitted by the normal light-emitting elements irradiates the photoresist material layer;

after the normal light emitting elements emit light, removing part of the photoresist material layer irradiated by the light emitted by the normal light emitting elements by developing the photoresist material layer so as to form a photoresist layer with a plurality of openings, wherein the openings extend from the adhesion surface to the element array substrate, and the normal light emitting elements are positioned in the openings;

adhering at least one horizontal repair LED to the adhesion surface; and

electrically connecting the at least one repaired horizontal light emitting diode and the element array substrate.

15. The method according to claim 14, wherein the step of electrically connecting the at least one repaired horizontal light emitting diode to the device array substrate comprises:

forming a plurality of repair lines on the photoresist layer, wherein the repair horizontal light emitting diode comprises two electrodes, the element array substrate comprises a plurality of first connecting pads and a plurality of second connecting pads, the normal light emitting elements are electrically connected with the first connecting pads and the second connecting pads, each repair line extends from the adhesion surface to one of the openings, and each repair line is electrically connected with one of the electrodes of the repair horizontal light emitting diode and one of the first connecting pads or one of the second connecting pads in the opening.

16. The method according to claim 15, wherein the repair lines are formed by photolithography, dispensing or jet printing.

17. The method of manufacturing a display panel according to claim 15, further comprising:

and baking the photoresist layer after the at least one repaired horizontal light emitting diode is adhered to the adhesion surface.

18. The method according to claim 14, wherein in the step of adhering at least one of the repairing horizontal light emitting diodes to the adhesive surface, an obtaining member places a plurality of the repairing horizontal light emitting diodes on the adhesive surface of the photoresist layer at a time, wherein a portion of the repairing horizontal light emitting diodes correspond to the openings without contacting the adhesive surface, and at least one of the repairing horizontal light emitting diodes is adhered to the adhesive surface.

19. The method of manufacturing a display panel according to claim 14, further comprising:

after electrically connecting the at least one repaired horizontal light emitting diode and the element array substrate, a plurality of wavelength conversion materials are arranged in part of the openings.

20. The method of manufacturing a display panel according to claim 19, further comprising:

after electrically connecting the at least one repaired horizontal light emitting diode and the element array substrate, a plurality of transparent filling materials are arranged in the other openings without the wavelength conversion materials.

Technical Field

The present invention relates to a display panel and a method for manufacturing the same, and more particularly, to a display panel manufactured by using a photoresist material layer having viscosity and a method for manufacturing the same.

Background

The current Solid-State Lighting (SSL) technology has developed a Micro Light Emitting Diode (μ LED) with a micron size, and the length or width of the Micro Light Emitting Diode can be below 30 microns (μm). For example, the bottom surface of the micro-leds may be 10 microns by 10 microns square. Due to the tiny size of micro-leds, micro-leds are suitable for fabrication into pixel displays (pixel displays).

Generally, the number of pixels of the pixel type display is far more than ten thousand, even more than million, so that a display panel using micro light emitting diodes also needs to be provided with ten thousand micro light emitting diodes. At present, the epitaxy (epitaxiy) and transfer (transferring) of the micro light-emitting diode can reach good yield (yield). However, even though the yield of 90% can be achieved by epitaxy and transfer, the pixel type display still has a lot of defective micro leds to be repaired.

For example, some Full High Definition (FHD) large-size pixel type displays require more than a million micro leds. If the yield of the epitaxy and transfer processes can reach 99%, the large-sized pixel type display still needs to be repaired by more than ten thousand faulty micro light emitting diodes, and the conventional repair method is to replace the faulty micro light emitting diodes one by one with normal micro light emitting diodes, so that the pixel type display needs to spend a considerable time for repairing a large number of faulty micro light emitting diodes, and the production capacity is not easy to be further improved.

Disclosure of Invention

The invention provides a manufacturing method of a display panel, which utilizes a viscous photoresist material layer to manufacture the display panel.

The invention also provides a display panel manufactured by the manufacturing method.

The display panel provided by the invention comprises an element array substrate, a plurality of first light-emitting elements, a photoresist layer and at least one horizontal repairing light-emitting diode. The first light-emitting elements are arranged on the element array substrate and electrically connected with the element array substrate. The photoresist layer is disposed on the element array substrate and has an upper surface and a plurality of openings, wherein the openings extend from the upper surface to the element array substrate, the first light-emitting elements are respectively disposed in the openings, and the thickness of the photoresist layer is greater than the height of each of the first light-emitting elements. The horizontal light emitting diode is adhered to the upper surface and electrically connected with the element array substrate from at least one of the openings.

In at least one embodiment of the present invention, the display panel further includes a plurality of repair lines. The repair horizontal type light emitting diode comprises two electrodes, the element array substrate comprises a plurality of first connecting pads and a plurality of second connecting pads, wherein the first light emitting elements are electrically connected with the first connecting pads and the second connecting pads, and part of the first connecting pads and part of the second connecting pads are positioned in the openings. Each repair line extends from the upper surface to one of the openings, and each repair line is electrically connected with one of the electrodes for repairing the horizontal light emitting diode and one of the first connecting pads or one of the second connecting pads located in the opening.

In at least one embodiment of the present invention, the repair lines are transparent conductive lines or metal lines.

In at least one embodiment of the present invention, the display panel further includes at least one second light emitting device disposed on the device array substrate, wherein the photoresist layer covers the at least one second light emitting device.

In at least one embodiment of the present invention, the first light emitting device is a normal light emitting device, and the second light emitting device is a failure light emitting device.

In at least one embodiment of the present invention, the number of the repairing horizontal light emitting diodes is plural, and the number of the second light emitting elements is plural. The horizontal repair light-emitting diodes are adhered to the upper surface and electrically connected with the element array substrate from the openings, and the second light-emitting elements are covered by the photoresist layer.

In at least one embodiment of the present invention, the colors of the light emitted by the two repaired horizontal light emitting diodes are different from each other.

In at least one embodiment of the present invention, at least one of the repaired horizontal light emitting diodes overlaps with one of the second light emitting devices.

In at least one embodiment of the present invention, at least one of the repaired horizontal light emitting diodes does not overlap with the second light emitting device.

In at least one embodiment of the present invention, the display panel further includes a plurality of wavelength conversion materials, wherein each wavelength conversion material is disposed in one of the openings and covers the first light emitting element.

In at least one embodiment of the present invention, the display panel further includes a plurality of transparent filling materials, wherein the transparent filling materials are respectively disposed in the other openings where the wavelength conversion materials are not disposed, and respectively cover the other first light emitting elements.

In at least one embodiment of the present invention, each of the first light emitting elements is configured to emit an initial light, and two of the wavelength conversion materials are respectively configured to convert the initial light into a first monochromatic light and a second monochromatic light, wherein the first monochromatic light and the second monochromatic light have different colors.

In at least one embodiment of the present invention, a color of light emitted by one of the repairing horizontal light emitting diodes is the same as a color of one of the initial light, the first monochromatic light and the second monochromatic light.

In the method for manufacturing a display panel provided by the present invention, first, an element array substrate and a plurality of light emitting elements are provided, wherein the light emitting elements are disposed on the element array substrate. Then, a photoresist material layer is formed on the element array substrate, wherein the photoresist material layer covers the light-emitting elements and is provided with an adhesion surface, the light-emitting elements are positioned between the adhesion surface and the element array substrate, and then a plurality of normal light-emitting elements in the light-emitting elements emit light so that the photoresist material layer is irradiated by the light emitted by the normal light-emitting elements. After the normal light emitting elements emit light, the photoresist material layer is developed to remove part of the photoresist material layer irradiated by the light, so that the photoresist material layer forms a photoresist layer with a plurality of openings, wherein the openings extend from the adhesion surface to the element array substrate, and the normal light emitting elements are positioned in the openings. And then, adhering at least one horizontal repair LED on the adhesion surface. And then, electrically connecting the at least one repaired horizontal light emitting diode with the element array substrate.

In at least one embodiment of the present invention, the step of electrically connecting the at least one repaired horizontal light emitting diode and the device array substrate includes the following steps. And forming a plurality of repair lines on the photoresist layer, wherein the horizontal light emitting diode comprises two electrodes, and the element array substrate comprises a plurality of first connecting pads and a plurality of second connecting pads. The normal light emitting elements are electrically connected with the first connecting pads and the second connecting pads. Each repair line extends into one of the openings from the adhesion surface, and is electrically connected with one of the electrodes of the horizontal light emitting diode and one of the first connecting pads or one of the second connecting pads in the opening.

In at least one embodiment of the present invention, the method for forming the repair lines includes photolithography (photolithography), dispensing, or jet printing.

In at least one embodiment of the present invention, the method for manufacturing a display panel further includes baking the photoresist layer after the at least one repaired horizontal light emitting diode is adhered to the adhesion surface.

In at least one embodiment of the present invention, in the step of adhering the at least one repaired horizontal light emitting diode to the adhesion surface, the obtaining component places the plurality of repaired horizontal light emitting diodes on the adhesion surface of the photoresist layer at one time, wherein a portion of the repaired horizontal light emitting diodes correspond to the openings without contacting the adhesion surface, and the at least one repaired horizontal light emitting diode is adhered to the adhesion surface.

In at least one embodiment of the present invention, the method for manufacturing the display panel further includes disposing a plurality of wavelength conversion materials in a portion of the openings after electrically connecting the at least one repaired horizontal light emitting diode and the device array substrate.

In at least one embodiment of the present invention, the method for manufacturing the display panel further includes disposing a plurality of transparent filling materials in the openings where the wavelength conversion materials are not disposed after electrically connecting the at least one repaired horizontal light emitting diode and the element array substrate.

Based on the above, the invention uses the photoresist material layer to detect and screen the plurality of light emitting elements arranged on the element array substrate at one time, and uses the viscosity of the photoresist layer to arrange and repair the horizontal light emitting diode. When the normal light emitting elements emit light, the photoresist layer is exposed and developed to form a photoresist layer with openings, wherein the normal light emitting elements are respectively located in the openings. The light emitting element with defect or failure of normal light emitting is covered by the photoresist layer, and the horizontal light emitting diode can be arranged at the position with defect or failure of light emitting element by using the adhesive surface of the photoresist layer. Compared with the conventional method for repairing and replacing the fault light-emitting element one by one, the method effectively shortens the time for detecting and repairing, thereby improving the productivity of the display panel.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1A is a schematic top view of a display panel according to at least one embodiment of the invention.

FIG. 1B is a schematic cross-sectional view taken along line 1B-1B in FIG. 1A.

FIG. 1C is a schematic cross-sectional view taken along line 1C-1C in FIG. 1A.

FIG. 1D is a schematic cross-sectional view taken along line 1D-1D in FIG. 1A.

Fig. 2 is a schematic flow chart of a manufacturing method of the display panel in fig. 1A.

Fig. 3A to 3H are schematic cross-sectional flow diagrams illustrating the manufacturing method of fig. 2.

Description of reference numerals:

30: catch piece

100: display panel

110: element array substrate

111: first pad

112: second pad

113: element array layer

114: substrate

121: first light emitting element

122: second light emitting element

121 h: height

123a, 123 c: solder block

130: photoresist layer

130i, 130: layer of photoresist material

130 t: thickness of

131: upper surface of

131 i: adhesive surface

132: opening of the container

138: exposure portion

140: repairing horizontal light emitting diode

141a, 141 c: electrode for electrochemical cell

150 b: transparent filling material

150r, 150 g: wavelength conversion material

161. 162: repair line

B12: initial light

G12: second monochromatic light

R12: the first monochromatic light

PR1, PG1, PB 1: sub-pixel region

S201 to S208: step (ii) of

Detailed Description

In the following text, dimensions (e.g., length, width, thickness, and depth) of elements (e.g., layers, films, substrates, regions, etc.) in the drawings are exaggerated in unequal scale for clarity of presentation of technical features of the present disclosure. Accordingly, the description and illustrations of the embodiments below are not limited to the sizes and shapes of elements shown in the drawings, but are intended to cover deviations in sizes, shapes and both that result from actual manufacturing processes and/or tolerances. For example, the flat surfaces shown in the figures may have rough and/or non-linear features, while the acute angles shown in the figures may be rounded. Therefore, the elements shown in the drawings of the present disclosure are for illustration purposes only and are not intended to accurately depict the actual shape of the elements nor be used to limit the claims of the present disclosure.

Furthermore, the terms "about", "approximately" or "substantially" as used in this disclosure encompass not only explicitly recited values and ranges of values, but also permissible deviations as would be understood by those skilled in the art, wherein such deviations are determined by errors in measurement, e.g., due to limitations of both the measurement system or process conditions. Further, "about" may mean within one or more standard deviations of the above-described values, e.g., within ± 30%, 20%, 10%, or 5%. The terms "about," "approximately," or "substantially," as used herein, may be selected with an acceptable range of deviation or standard deviation based on optical, etching, mechanical, or other properties, and not all properties may be used with one standard deviation alone.

Fig. 1A is a schematic top view of a display panel according to at least one embodiment of the invention. Referring to FIG. 1A, the display panel 100 can be applied to various pixel type displays with different sizes, and is suitable for being made into large-size or small-size displays. In other words, the display panel 100 is suitable for being manufactured into a large-sized full-high-definition television or computer screen, and is also suitable for being manufactured into a small-sized screen dedicated for mobile devices such as mobile phones, tablet computers or notebook computers. The display panel 100 includes a plurality of first light emitting elements 121 and a photoresist layer 130, wherein the photoresist layer 130 has a plurality of openings 132, and the first light emitting elements 121 are respectively located in the openings 132. Taking fig. 1A as an example, the first light emitting elements 121 may be disposed in the openings 132 one to one.

Each of the first light emitting elements 121 may be a solid state light emitting element, which is, for example, a light emitting diode. The first light emitting elements 121 are all normal light emitting elements, so that the first light emitting elements 121 can emit light after being powered on. In terms of size, the first light emitting device 121 can be a micro light emitting diode with a width and a length less than or equal to 30 micrometers, or a light emitting diode with a width and a length greater than 30 micrometers. In terms of structure, the first light emitting element 121 may be a flip chip LED (flip chip LED), a horizontal LED (lateral LED), or a vertical LED (vertical LED).

The display panel 100 further includes at least one repair horizontal light emitting diode 140 disposed on the photoresist layer 130. In the embodiment, the display panel 100 includes a plurality of repairing horizontal leds 140 (fig. 1A shows two repairing horizontal leds 140), but in other embodiments, the display panel 100 may include only one repairing horizontal led 140, especially a small-sized display panel 100 with a small number of light emitting elements. Therefore, it is emphasized that fig. 1A is only for illustration and is not used to limit the number of the repair horizontal leds 140 included in the display panel 100.

FIGS. 1B to 1D are schematic cross-sectional views of the cross-section of FIG. 1A taken along the line 1B-1B, the line 1C-1C and the line 1D-1D, respectively. Referring to fig. 1A to fig. 1C, the display panel 100 further includes a device array substrate 110, wherein the photoresist layer 130, the first light emitting devices 121, and the repair horizontal light emitting diodes 140 are disposed on the device array substrate 110. The device array substrate 110 has a plurality of sub-pixel regions PR1, PG1 and PB1, and the first light emitting devices 121 and the repair horizontal light emitting diodes 140 are respectively disposed in the sub-pixel regions PR1, PG1 and PB 1. In addition, the sub-pixel regions PR1, PG1 and PB1 may be arranged in an array, and the first light emitting elements 121 and the repair horizontal light emitting diodes 140 may also be arranged in an array, wherein only one opening 132 may be formed in one of the sub-pixel regions PR1, PG1 or PB1, as shown in fig. 1A and 1B.

The first light emitting devices 121 are electrically connected to the device array substrate 110. In detail, the device array substrate 110 includes a plurality of first pads 111 and a plurality of second pads 112, wherein the first pads 111 and the second pads 112 may be made of a transparent conductive material or a metal, and the transparent conductive material may be a transparent Oxide, such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO). The first light emitting elements 121 are electrically connected to the first pads 111 and the second pads 112, and the first pads 111 and the second pads 112 are not electrically connected before all the light emitting elements (such as the first light emitting elements 121) are not disposed on the device array substrate 110.

The display panel 100 may further include a plurality of solder bumps 123a and 123c, wherein the solder bumps 123a and 123c not only respectively connect two electrodes, i.e., a cathode and an anode (not shown) of the first light emitting element 121, but also respectively connect the first pads 111 and the second pads 112. Thus, the anode of each of the first light emitting elements 121 can be electrically connected to the second pads 112 through the solder bumps 123a, and the cathode can be electrically connected to the first pads 111 through the solder bumps 123 c. It should be noted that the first light emitting device 121 in fig. 1A and 1B is a flip-chip light emitting diode as an example, but the first light emitting device 121 is not limited to be a flip-chip light emitting diode. When the first light emitting element 121 is a horizontal light emitting diode or a vertical light emitting diode, the first light emitting element 121 can be electrically connected to the first pad 111 and the second pad 112 by a circuit formed by photolithography, dispensing or spray printing, and is fixed to the element array substrate 110 by a glue material. Therefore, the first light emitting element 121 is not limited to electrically connecting the element array substrate 110 only with the solder bumps 123a and 123 c.

The element array substrate 110 further includes a substrate 114 and an element array layer 113, wherein the element array layer 113 is disposed on the substrate 114. The substrate 114 may be a glass plate or a plastic substrate. In addition, in other embodiments, the element array substrate 110 may also be a printed circuit board. The element array layer 113 has a plurality of control elements (not shown). The control element is electrically connected to the second pads 112, and may be a transistor, such as a thin film transistor formed by a plurality of patterned thin films, wherein the structure of the thin film transistor may be the same as or similar to that of a thin film transistor in a conventional display.

When the control device is a transistor (e.g., a thin film transistor), the drain of the control device is electrically connected to the second pad 112. When the external power source provides power to the device array substrate 110, the control device can control the voltage output to the second pads 112 to control the brightness of the first light emitting devices 121. The first pads 111 can provide a common voltage (common voltage) to generate a voltage difference between the first pads 111 and the second pads 112, so as to generate an electrical energy input to the first light emitting device 121.

The photoresist layer 130 also has an upper surface 131, wherein the openings 132 extend from the upper surface 131 to the element array substrate 110. Accordingly, the openings 132 are formed through the photoresist layer 130. As shown in fig. 1A and 1B, the photoresist layer 130 covers the first pads 111 and the second pads 112, but since the openings 132 extend from the upper surface 131 to the device array substrate 110, and a portion of the first pads 111 and a portion of the second pads 112 are located in the openings 132, the portions of the first pads 111 and the second pads 112 close to the first light emitting devices 121 are not covered by the photoresist layer 130, as shown in fig. 1B.

The thickness 130t of the photoresist layer 130 is greater than the height 121h of each first light emitting element 121, wherein the height 121h is equal to the distance between the top surface of the first light emitting element 121 and the element array substrate 110, and therefore the height 121h includes the thickness of the first light emitting element 121 and a portion of the thickness of both the solder bumps 123a and 123 c. Since the thickness 130t of the photoresist layer 130 is greater than the height 121h of the first light emitting elements 121, each of the first light emitting elements 121 does not protrude from the upper surface 131 of the photoresist layer 130.

Each of the first light-emitting elements 121 can emit the original light B12, and the original light B12 of the first light-emitting elements 121 has substantially the same spectrum (spectrum), wherein the term "substantially the same spectrum" as used herein means that the original light B12 spectrum of the first light-emitting elements 121 has the same or very similar peak wavelength and Full width at half maximum (FWHM). Since the first light emitting elements 121 can be light emitting diodes, the initial lights B12 of the first light emitting elements 121 all have narrower full widths at half maximum and peak wavelengths that are not different from each other. When the primary light B12 is visible light, the first light-emitting elements 121 can emit primary light B12 of the same color, which can be monochromatic light, such as blue light, when viewed by the naked eye. In addition, in the present embodiment, the original light B12 may be visible light (e.g., blue light), but in other embodiments, the original light B12 may also be invisible light, such as ultraviolet light.

The display panel 100 may further include a plurality of wavelength converting materials 150r and 150g, wherein each wavelength converting material 150r or 150g is disposed within one of the openings 132. Taking fig. 1B as an example, the wavelength conversion materials 150r and 150g may be disposed in the plurality of openings 132 one-to-one, that is, one wavelength conversion material 150r is disposed in one opening 132, and the wavelength conversion material 150g is disposed in the other opening 132. Each wavelength converting material 150r or 150g may fill the opening 132 and cover the first light emitting element 121. In addition, in the embodiment shown in fig. 1B, the wavelength converting materials 150r and 150g are disposed in some of the openings 132, but not all of the openings 132, so that the wavelength converting materials 150r and 150g are not disposed in some of the openings 132. For example, the wavelength conversion materials 150r and 150g are not disposed in the opening 132 in the pixel region PB 1.

Two of the wavelength conversion materials are used for converting the initial light B12 into the first monochromatic light R12 and the second monochromatic light G12, respectively. Specifically, the wavelength converting material 150R can convert the initial light B12 into first monochromatic light R12, and the wavelength converting material 150G can convert the initial light B12 into second monochromatic light G12, wherein the colors of the first monochromatic light R12 and the second monochromatic light G12 are different from each other. For example, the first monochromic light R12 may be red light, and the second monochromic light G12 may be green light. In addition, the wavelength converting materials 150r and 150g may be phosphor or quantum dot materials, wherein the quantum dot materials include, for example, perovskite materials.

The display panel 100 may further include a plurality of transparent filling materials 150b, which are, for example, transparent optical glues. The transparent filling materials 150b are respectively disposed in the other openings 132 where the wavelength conversion materials 150r and 150g are not disposed, and can fill the openings 132. The transparent filling materials 150b cover the first light emitting elements 121 not covered by the wavelength conversion materials 150r and 150 g. Therefore, the wavelength conversion materials 150r and 150g respectively cover some of the first light emitting elements 121, and the transparent filling materials 150b respectively cover other first light emitting elements 121. The initial light B12 can penetrate the transparent filling material 150B, and the transparent filling material 150B does not substantially change the wavelength of the initial light B12. For example, when the initial light B12 is blue, the initial light B12 is still blue after penetrating through the transparent filling material 150B.

Since the wavelength conversion material 150R can convert the initial light B12 into the first monochromatic light R12, the wavelength conversion material 150G can convert the initial light B12 into the second monochromatic light G12, and the transparent filling material 150B does not substantially change the wavelength of the initial light B12, the display panel 100 can emit the initial light B12, the first monochromatic light R12 and the second monochromatic light G12. The control elements of the element array layer 113 can control the light emitting brightness of the first light emitting elements 121 to adjust the light intensities of the initial light B12, the first monochromatic light R12 and the second monochromatic light G12 emitted by the display panel 100, so as to generate gray scales of multiple colors.

In detail, the wavelength conversion materials 150r and 150g and the transparent filling material 150b are respectively located in the pixel regions PR1, PG1 and PB1, wherein the wavelength conversion material 150r is located in the pixel region PR1, the wavelength conversion material 150g is located in the pixel region PG1, and the transparent filling material 150b is located in the pixel region PB 1. When the first monochromatic light R12 is red light, the second monochromatic light G12 is green light, and the primary light B12 is blue light, the pixel region PR1 can be used as a red pixel of the display panel 100, the pixel region PG1 can be used as a green pixel of the display panel 100, and the pixel region PB1 can be used as a blue pixel of the display panel 100. The control elements of the element array layer 113 can control the light emitting brightness of the first light emitting elements 121 to adjust the gray scales of the red pixels, the green pixels and the blue pixels, so that the display panel 100 can present an image.

In particular, the above embodiment is exemplified by the initial light B12 being blue light. When the primary light B12 emitted by the first light emitting elements 121 is ultraviolet light, all the transparent filling material 150B in the display panel 100 may be replaced by other kinds of wavelength conversion materials to convert the ultraviolet light into blue light. Therefore, the display panel 100 in other embodiments may not include the transparent filling material 150b, and the wavelength conversion materials (including the wavelength conversion materials 150r and 150g) are respectively disposed in all the openings 132.

Referring to fig. 1A and 1C, the repairing horizontal leds 140 are all adhered to the upper surface 131 and are not located in the openings 132. As shown in fig. 1C, the repairing horizontal led 140 is separated from the element array substrate 110 by the photoresist layer 130, so that the height of the repairing horizontal led 140 relative to the element array substrate 110 is significantly higher than the height 121h (shown in fig. 1B) of the first light-emitting element 121 relative to the element array substrate 110. Each of the repair horizontal leds 140 includes two electrodes 141a and 141c, wherein the electrode 141a is an anode and the electrode 141c is a cathode. The electrodes 141a and 141c are located on the same side of the horizontal repair led 140. Taking fig. 1B as an example, the electrodes 141a and 141c are both located on the upper side of the repair horizontal led 140.

Each of the repair horizontal type leds 140 is electrically connected to the device array substrate 110 through at least one of the openings 132. Specifically, the display panel 100 may further include a plurality of repair lines 161 and 162. Each of the repair lines 161 or 162 extends from the upper surface 131 into one of the openings 132, and each of the repair lines (i.e., the repair line 161 or 162) is electrically connected to one of the electrodes (the electrode 141a or 141c) of the repair horizontal type led 140 and one of the first pads 111 or one of the second pads 112 located in the opening 132. Taking fig. 1C as an example, the repair line 161 is electrically connected to the electrode 141a of the horizontal light emitting diode 140 and electrically connected to the second pad 112 through one opening 132. The repair line 162 is electrically connected to the electrode 141c of the horizontal light emitting diode 140 and is electrically connected to the first pad 111 through the other opening 132.

Therefore, the repair horizontal light emitting diode 140 can be electrically connected to the device array substrate 110 through at least one of the openings 132, so that the control device of the device array layer 113 can also control the light emitting brightness of the repair horizontal light emitting diode 140. It should be noted that, in the embodiment shown in fig. 1C, one repairing horizontal led 140 is electrically connected to the device array substrate 110 through two openings 132, but in other embodiments, one repairing horizontal led 140 may be electrically connected to the device array substrate 110 through only one opening 132. Therefore, the electrical connection between the repair horizontal led 140 and the device array substrate 110 shown in fig. 1C is only for illustration and is not intended to limit the invention. In addition, the repair lines 161 and 162 may be transparent conductive lines or metal lines, wherein the transparent conductive lines may be made of transparent oxide, such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO).

The display panel 100 further includes at least one second light emitting element 122 disposed on the element array substrate 110. Although the present embodiment only shows one second light emitting element 122, in other embodiments, the number of the second light emitting elements 122 included in the display panel 100 may be multiple, so the number of the second light emitting elements 122 illustrated in fig. 1A and 1C does not limit the number of the second light emitting elements 122 included in the display panel 100. The first light emitting element 121 is substantially the same as the second light emitting element 122, and is disposed on the element array substrate 110 by using solder bumps 123a and 123 c. The first light emitting element 121 is a normal light emitting element that can emit the initial light B12, and the second light emitting element 122 is a failed light emitting element that cannot emit light. In other words, the second light emitting element 122 is the failed first light emitting element 121. At least one of the repair horizontal light emitting diodes 140 overlaps one of the second light emitting elements 122. That is, the horizontal repair led 140 is obviously located right above the second light emitting element 122, as shown in fig. 1C.

Referring to fig. 1B and fig. 1C, in the display panel 100 of fig. 1C, the second light emitting device 122 is the first light emitting device 121 that fails to emit light, but the repair horizontal light emitting diode 140 above the second light emitting device 122 can emit the first monochromatic light R12. Thus, the horizontal repair led 140 can replace the second light emitting device 122 to provide the first monochromatic light R12, as the wavelength conversion material 150g and the first light emitting device 121 in fig. 1B. When the first monochromatic light R12 is red, the pixel region PR1 where the repaired horizontal light emitting diode 140 is located can still be used as a red pixel of the display panel 100, and the control device of the device array layer 113 can control the light emitting brightness of the repaired horizontal light emitting diode 140 to adjust the gray scale of the red pixel, so that the display panel 100 can normally display an image and eliminate the defect caused by the second light emitting device 122.

Referring to fig. 1A and 1D, in the display panel 100, at least one of the repaired horizontal light emitting diodes 140 does not overlap with the second light emitting element 122 (see fig. 1C). That is, the second light emitting element 122 and the first light emitting element 121 are not located directly below the repair horizontal type light emitting diode 140 in fig. 1D. Although the first light emitting element 121 and the second light emitting element 122 are not disposed in the pixel area PB1 where the repair horizontal light emitting diode 140 is located in fig. 1D, the repair horizontal light emitting diode 140 in fig. 1D may also emit the initial light B12, so that the pixel area PB1 where the repair horizontal light emitting diode 140 is located may still be used as the blue pixel of the display panel 100, and the control element of the element array layer 113 may also control the luminance of the repair horizontal light emitting diode 140 in fig. 1D to adjust the gray scale of the blue pixel, so that the display panel 100 can normally display an image.

In the embodiments shown in fig. 1C and 1D, the horizontal repair led 140 is disposed in the pixel regions PR1 and PB1 as an example. However, in other embodiments, no first light emitting element 121 or the failed second light emitting element 122 may be disposed in the other pixel region PG1, and the horizontal repair led 140 may be disposed in the defective pixel region PG1 without the first light emitting element 121, that is, in the defective pixel region PG1, and may emit light (e.g., green light) corresponding to the pixel region PG 1. Therefore, the repair led 140 can be disposed in the defective pixel regions PR1, PG1 and PB1 to restore the pixel functions of the pixel regions PR1, PG1 and PB 1. In other words, when one of the pixel regions PR1, PG1 and PB1 is defective due to missing devices and is not provided with the first light emitting element 121 (normal light emitting element) or the second light emitting element 122 (failed light emitting element), the repair horizontal light emitting diode 140 can be adhered on the photoresist layer 130 and can emit light corresponding to the pixel regions PR1, PG1 and PB1 to recover the pixel functions of the pixel regions PR1, PG1 and PB1, so that the display panel 100 can normally display images, and the defect caused by the absence of the first light emitting element 121 or the second light emitting element 122 can be eliminated.

Fig. 2 is a schematic flow chart of a manufacturing method of the display panel in fig. 1A, and fig. 3A to 3G are schematic flow cross-sectional views drawn according to the manufacturing method described in fig. 2. Referring to fig. 2 and fig. 3A, in the method for manufacturing the display panel 100, first, step S201 is performed to provide the device array substrate 110 and a plurality of light emitting devices. The light emitting elements include normal and failed light emitting elements, and in the following description and the accompanying drawings, the first light emitting element 121 represents a normal light emitting element, and the second light emitting element 122 represents a failed light emitting element. The light emitting elements (including the first light emitting element 121 and the second light emitting element 122) are disposed on the element array substrate 110, and in the embodiment, the light emitting elements can be soldered to the element array substrate 110, that is, the first light emitting element 121 and the second light emitting element 122 can be connected to the element array substrate 110 by solder bumps 123a and 123 c. Alternatively, in other embodiments, the first light emitting element 121 and the second light emitting element 122 may be electrically connected to the device array substrate 110 by using a circuit formed by photolithography, dispensing or jet printing, and fixed to the device array substrate 110 by using a glue material.

The first light emitting element 121 and the second light emitting element 122 can be disposed on the element array substrate 110 by using an extractor. In detail, the retriever may be made of Polydimethylsiloxane (PDMS) or other materials, and may be a PDMS stamp having viscosity. Therefore, the extractor can adhere a plurality of light emitting elements (including the first light emitting element 121 and the second light emitting element 122) and can transfer the light emitting elements to the element array substrate 110. When the pickup device sticks to the light emitting elements, some light emitting elements may not be stuck to the pickup device and may be omitted, so that the first light emitting element 121 or the second light emitting element 122 is not disposed in some pixel regions (for example, at least one of the pixel regions PR1, PG1, and PB 1).

Although fig. 3A shows three pixel regions PR1 in which the first light emitting element 121 and the second light emitting element 122 are disposed, in other embodiments, the first light emitting element 121 or the second light emitting element 122 is not disposed in at least one of the pixel regions PR1, PG1, and PB1 due to missing light emitting elements, as shown in fig. 1D. Therefore, fig. 3A is only for illustration and does not limit any of the pixel regions PR1, PG1, and PB1 to have the first light emitting element 121 or the second light emitting element 122 disposed therein.

Next, step S202 may be performed to energize the light emitting elements (i.e., the first light emitting element 121 and the second light emitting element 122) through the element array substrate 110, so that the light emitting elements emit light. Since the second light emitting element 122 is a defective light emitting element, even if the external power supply supplies power to the second light emitting element 122, the second light emitting element 122 does not emit light, and only the normal first light emitting element 121 emits light. During the execution of step S202, the light emission conditions of the light emitting elements can be observed. When most of the light emitting elements are the second light emitting elements 122, for example, more than half of the light emitting elements do not emit light, the element array substrate 110 and the light emitting elements may be discarded or reworked (reworked) without performing subsequent processes.

Referring to fig. 2 and 3B, next, step S203 is performed to form a photoresist material layer 130i covering the light emitting devices (the first light emitting device 121 and the second light emitting device 122) on the device array substrate 110. The photoresist material layer 130i may be formed on the element array substrate 110 by spin coating (spin coating), wherein the photoresist material layer 130i covers all of the first light emitting elements 121 and all of the second light emitting elements 122. The photoresist material layer 130i has viscosity, so the photoresist material layer 130i has an adhesion surface 131 i. As shown in fig. 3B, the adhesion surface 131i is also the upper surface of the photoresist material layer 130i, and the first light emitting elements 121 and the second light emitting elements 122 are located between the adhesion surface 131i and the device array substrate 110.

Referring to fig. 2 and 3C, after forming the photoresist material layer 130i, step S204 is performed, wherein step S204 may be substantially the same as step S202, except that step S202 is performed before forming the photoresist material layer 130i, and step S204 is performed after forming the photoresist material layer 130 i. When step S204 is executed, the light emitting elements are powered through the element array substrate 110, so that a plurality of normal light emitting elements (i.e., the first light emitting elements 121) in the light emitting elements emit light, and the photoresist material layer 130i is irradiated by the light emitted by the normal light emitting elements. That is, the first light emitting elements 121 are all allowed to emit the initial light B12 to the photoresist material layer 130i, so that the photoresist material layer 130i is irradiated by the initial light B12.

The photoresist material layer 130i may be exposed to the initiation light B12 such that a portion of the photoresist material layer 130i around the first light emitting element 121 is converted into an exposed portion 138. In the present embodiment, the photoresist material layer 130I may be a GH type (GH-Line), a GHI type (GHI-Line), or a type I (I-Line) photoresist, wherein the GH type and GHI type photoresists are adapted to be sensitive to blue light, and the type I photoresist is adapted to be sensitive to ultraviolet light. When the initial light B12 is blue light, the photoresist material layer 130i may be a GH type or GHI type photoresist. When the initial light B12 is ultraviolet light, the photoresist material layer 130I may be type I photoresist.

The second light emitting element 122 is a defective light emitting element. Even though the external power source provides power to the second light emitting element 122, the second light emitting element 122 still does not emit light. Therefore, in step S204, the portion of the photoresist material layer 130i around the second light emitting element 122 is not exposed to light and remains as it is. That is, the exposed portion 138 is not formed around the second light emitting element 122. In addition, in the embodiment shown in fig. 2, the manufacturing method of the display panel 100 may include the step S202, but in other embodiments, the manufacturing method of the display panel 100 may omit the step S202. Therefore, the manufacturing method shown in fig. 2 is not limited to include the step S202.

Referring to fig. 2 and 3D, after the normal light emitting devices (the first light emitting devices 121) emit light, step S205 is performed to develop the photoresist material layer 130i to remove the portion of the photoresist material layer 130i irradiated by the initial light B12. Specifically, the photoresist material layer 130i is a positive photoresist, and therefore the plurality of exposed portions 138 formed in step S204 are removed by the developer to form a plurality of openings 132, so that the photoresist material layer 130i forms the photoresist layer 130 having the openings 132, wherein the adhesion surface 131i of the photoresist material layer 130i is equal to the upper surface 131 of the photoresist layer 130. Since the second light emitting element 122 does not emit light in step S204, the exposed portion 138 is not formed around the second light emitting element 122. Therefore, after step S205, a portion of the photoresist material layer 130i around the second light emitting element 122 still remains, and the opening 132 is not formed above the second light emitting element 122. In addition, in fig. 3D, an opening 132 is formed in the pixel region PR 1.

Referring to fig. 2, fig. 3E and fig. 3F, next, step S206 is performed to adhere the repaired horizontal light emitting diode 140 to the photoresist layer 130. In detail, after step S205 and before step S206, the photoresist layer 130 still has the original viscosity of the photoresist material layer 130i, so the upper surface 131 at this time has viscosity and is a sticky surface, and thus the repairing horizontal light emitting diode 140 can be stuck to the upper surface 131 (also a sticky surface). In step S206, the obtaining unit 30 may first obtain a plurality of repaired horizontal leds 140 (as shown in fig. 3E), and move the repaired horizontal leds 140 over the photoresist layer 130. Thereafter, the obtaining member 30 is lowered and moved toward the photoresist layer 130 to place the repairing horizontal leds 140 on the adhesive upper surface 131 at a time, so that a plurality of repairing horizontal leds 140 can be adhered on the photoresist layer 130 (as shown in fig. 3F).

The obtaining member 30 may be made of Polydimethylsiloxane (PDMS) or other materials, and may be a PDMS stamp with viscosity, so that the repair led 140 can be adhered to the obtaining member 30. In addition, the obtaining member 30 can also be used to transfer the light emitting elements (including the first light emitting element 121 and the second light emitting element 122) to the element array substrate 110. In other words, the obtaining member 30 can not only dispose the plurality of repair horizontal light emitting diodes 140 on the photoresist layer 130, but also dispose the plurality of first light emitting elements 121 and the plurality of second light emitting elements 122 on the element array substrate 110.

Since the opening 132 is not formed over the second light emitting element 122, the upper surface 131 of the photoresist layer 130 still exists right above the second light emitting element 122. On the contrary, the photoresist material layer 130i around the first light emitting element 121 is removed, so that the opening 132 is formed above the first light emitting element 121, and the upper surface 131 does not exist right above the first light emitting element 121. Therefore, in the process of disposing the repair horizontal leds 140 on the upper surface 131 of the obtaining member 30, some of the repair horizontal leds 140 correspond to the openings 132 without contacting the upper surface 131, and at least one of the repair horizontal leds 140 contacts the upper surface 131 and adheres to the contact upper surface 131, as shown in fig. 3F. Thus, the repairing horizontal led 140 is disposed on the upper surface 131 of the photoresist layer 130 and is not disposed in the opening 132.

Therefore, by using the adhesive photoresist layer 130 and the openings 132, the obtaining device 30 can automatically dispose the plurality of repair horizontal light emitting diodes 140 directly above the second light emitting element 122, or disposed in a pixel region (e.g., the pixel region PR1, PG1, or PB1) without any first light emitting element 121 and second light emitting element 122, which is not disposed directly above the first light emitting element 121. In other words, in step S206, the obtaining member 30 can directly perform a bulk transfer to automatically and correctly dispose a large number of repaired horizontal leds 140 on the upper surface 131 of the photoresist layer 130. Compared with the conventional method of repairing one by one, the embodiment can effectively shorten the repairing time, thereby improving the productivity of the display panel 100.

Referring to fig. 2 and fig. 3G, step S207 is performed to electrically connect the repair horizontal light emitting diode 140 and the device array substrate 110. In this embodiment, the method for electrically connecting the repair horizontal light emitting diode 140 and the device array substrate 110 may be to form a plurality of repair lines 161 and 162 on the photoresist layer 130 (fig. 3G only shows one repair line 161 and one repair line 162), wherein each repair line 161 or 162 extends from the upper surface 131 (adhesion surface) into one of the openings 132, and electrically connects the repair horizontal light emitting diode 140 and the device array substrate 110. The method for forming the repair lines 161 and 162 may include photolithography, dispensing, or jet printing. Specifically, the repair lines 161 and 162 can be transparent conductive lines or metal lines, wherein the transparent conductive lines are made of, for example, indium tin oxide or indium zinc oxide. When the repair lines 161 and 162 are transparent conductive lines, the repair lines 161 and 162 can be formed by photolithography.

By using the repair lines 161 and 162, the horizontal light emitting diode 140 can be repaired to be electrically connected to the device array substrate 110, so that the control device of the device array layer 113 can control the brightness of the repaired horizontal light emitting diode 140, and the defect caused by the absence of the first light emitting device 121 or the installation of the second light emitting device 122 can be eliminated. Taking fig. 3G as an example, the repairing horizontal led 140 is disposed in the pixel region PR1 and can emit a second monochromatic light R12 (see fig. 1C). Therefore, even if the first light emitting device 121 is not disposed or the failed second light emitting device 122 is disposed in the pixel region PR1, the pixel region PR1 can still use the repair horizontal light emitting diode 140 to provide the second monochromatic light R12, so as to recover the pixel function of the pixel region PR 1. Therefore, when one of the pixel regions PR1, PG1 and PB1 is defective due to a defect and the first light emitting element 121 (normal light emitting element) or the second light emitting element 122 (failed light emitting element) is not disposed, the repair horizontal light emitting diode 140 can emit light corresponding to the pixel regions PR1, PG1 and PB1 to recover the pixel functions of the pixel regions PR1, PG1 and PB1, so that the display panel 100 can normally display images.

Referring to fig. 2 and 3H, after step S207, step S208 may be performed to dispose a plurality of wavelength conversion materials 150r and 150g and a plurality of transparent filling materials 150b (fig. 3H only shows the wavelength conversion material 150r as an example) in the openings 132. To this end, the display panel 100 is substantially completed. The wavelength conversion materials 150r and 150g may be phosphor or quantum dot materials, and the transparent filling material 150b may be transparent optical glue, wherein the method for forming the wavelength conversion materials 150r and 150g and the transparent filling material 150b may be dispensing or spraying. After the repairing horizontal led 140 is adhered to the adhesive upper surface 131, the photoresist layer 130 may be baked. Some types of photoresist layers 130 lose their adhesion after baking, i.e., the adhesion of the baked top surface 131 disappears. However, the bonding force (bonding force) between the repair horizontal led 140 and the photoresist layer 130 does not disappear due to baking, so that the repair horizontal led 140 is still adhered to the photoresist layer 130 after baking.

In summary, the invention utilizes the photoresist material layer to detect and screen a plurality of light emitting devices disposed on the device array substrate at a time, and utilizes the viscosity of the photoresist material layer to repair the horizontal light emitting diode. When the normal light emitting elements emit light, the photoresist layer is exposed and developed to form a photoresist layer with openings, wherein the normal light emitting elements are respectively located in the openings. The failure light-emitting component which can not emit light is covered by the photoresist layer, and the repaired horizontal light-emitting diode can be arranged above the failure light-emitting component or in the pixel area of the missing component by utilizing the viscosity of the photoresist layer. The horizontal light emitting diode can emit light corresponding to the pixel region to eliminate the defect caused by the lack of a normal light emitting element or the setting of a fault light emitting element, so that the display panel can normally display images.

Secondly, by utilizing the viscosity and the openings of the developed photoresist layer, the obtaining member can directly perform bulk transfer to adhere a plurality of repairing horizontal light emitting diodes on the photoresist layer, i.e. selectively and massively dispose the repairing horizontal light emitting diodes at one time, and automatically dispose the repairing horizontal light emitting diodes in the defective pixel region, such as directly above the defective light emitting element, or in the pixel region without any light emitting element. Compared with the conventional one-by-one repairing method, the manufacturing method disclosed by at least one embodiment of the invention can effectively shorten the time for detecting and repairing the light-emitting elements, so as to improve the productivity of the display panel.

Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, and various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention.