阅读说明：本技术 一种静电保护结构及静电保护电路 (Electrostatic protection structure and electrostatic protection circuit ) 是由 单毅 董业民 陈晓杰 于 2019-08-21 设计创作，主要内容包括：本申请实施例公开的一种静电保护结构及静电保护电路,包括衬底、电阻、二极管组件和第一阱区；二极管组件和第一阱区均设置于所述衬底上；第一阱区为低压阱区；第一阱区包括第一掺杂区、第一绝缘区、第二掺杂区、第二绝缘区和第三掺杂区；第一绝缘区用于隔离第一掺杂区与第二掺杂区,第二绝缘区用于隔离第二掺杂区与第三掺杂区；第一绝缘区与第二绝缘区跨接引出高压栅极端；第一掺杂区与第三掺杂区跨接引出源极端,源极端接地；第二掺杂区引出漏极端；电阻的第一端与栅极端连接,电阻的第二端接地。基于本申请实施例,通过在栅极端串接电阻,与漏极端-栅极端间寄生的耦合电容形成电容耦合效应,提高静电保护结构的导通均匀性。(The embodiment of the application discloses an electrostatic protection structure and an electrostatic protection circuit, which comprise a substrate, a resistor, a diode component and a first well region; the diode component and the first well region are arranged on the substrate; the first well region is a low-voltage well region; the first well region comprises a first doped region, a first insulating region, a second doped region, a second insulating region and a third doped region; the first insulating region is used for isolating the first doping region from the second doping region, and the second insulating region is used for isolating the second doping region from the third doping region; the first insulating region and the second insulating region are bridged to lead out a high-voltage grid terminal; the first doped region and the third doped region are connected in a bridging mode to lead out a source terminal, and the source terminal is grounded; the second doped region leads out a drain end; the first end of the resistor is connected with the grid end, and the second end of the resistor is grounded. Based on the embodiment of the application, the capacitance coupling effect is formed by connecting the resistance in series with the grid terminal and the parasitic coupling capacitance between the drain terminal and the grid terminal, so that the conduction uniformity of the electrostatic protection structure is improved.)

1. An electrostatic protection structure, comprising: the diode component comprises a substrate, a resistor, a diode component and a first well region;

the diode component and the first well region are arranged on the substrate;

the first well region is a low-voltage well region;

the first well region comprises a first doped region, a first insulating region, a second doped region, a second insulating region and a third doped region; the first insulating region is used for isolating the first doped region from the second doped region, and the second insulating region is used for isolating the second doped region from the third doped region;

the first insulating region and the second insulating region are connected in a bridging mode to lead out a high-voltage grid terminal;

the first doped region and the third doped region are connected in a bridging mode to lead out a source terminal, and the source terminal is grounded;

the second doped region leads out a drain end;

the first end of the resistor is connected with the grid end, and the second end of the resistor is grounded.

2. The structure of claim 1, wherein the first well region is provided with a first recess, a second recess, and a third recess;

the first doped region is arranged in the first groove, the second doped region is arranged in the second groove, and the third doped region is arranged in the third groove.

3. The structure of claim 1, wherein the first doped region, the second doped region, and the third doped region are all N + doped regions;

the first well region is a low-voltage P well region.

4. The structure of claim 1, wherein the substrate is a P-type substrate.

5. The structure of claim 1, wherein the diode assembly comprises at least one diode; the at least one diode is disposed laterally on the substrate.

6. The structure of claim 1, wherein each of the diodes comprises a second well region, a fourth doped region, a shallow trench isolation region, and a fifth doped region;

the fourth doped region, the shallow trench isolation region and the fifth doped region are sequentially and transversely arranged on the second well region.

7. The structure of claim 6 wherein the second well region is an N-well.

8. The structure of claim 6,

the fourth doped region is a P + doped region;

the fifth doped region is an N + doped region;

the shallow trench isolation region is used for isolating the fourth doped region and the fifth doped region.

9. The structure of claim 6, wherein a shallow trench isolation region is disposed between the first doped region and the fifth doped region;

the shallow trench isolation region is used for isolating the first doped region and the fifth doped region.

10. An electrostatic protection circuit comprising the electrostatic protection structure according to any one of claims 1 to 9.

Technical Field

The present invention relates to the field of integrated circuit design, and in particular, to an electrostatic protection structure and an electrostatic protection circuit.

Background

The antistatic leakage capacity is an important performance index for measuring the reliability of integrated circuit products and is an important consideration factor of the electrostatic protection design of the integrated circuit. With the rapid development of bulk silicon technology, the process size of integrated circuits is smaller and smaller, and the electrostatic discharge risk required to be faced per unit size is higher and higher.

Disclosure of Invention

The present invention provides an electrostatic protection structure and an electrostatic protection circuit to solve the above problems.

An embodiment of the present application provides an electrostatic protection structure, including: the diode component comprises a substrate, a resistor, a diode component and a first well region;

the diode component and the first well region are arranged on the substrate;

the first well region is a low-voltage well region;

the first well region comprises a first doped region, a first insulating region, a second doped region, a second insulating region and a third doped region; the first insulating region is used for isolating the first doping region from the second doping region, and the second insulating region is used for isolating the second doping region from the third doping region;

the first insulating region and the second insulating region are bridged to lead out a high-voltage grid terminal;

the first doped region and the third doped region are connected in a bridging mode to lead out a source terminal, and the source terminal is grounded;

the second doped region leads out a drain end;

the first end of the resistor is connected with the grid end, and the second end of the resistor is grounded.

Furthermore, the first well region is provided with a first groove, a second groove and a third groove; the first doped region is arranged in the first groove, the second doped region is arranged in the second groove, and the third doped region is arranged in the third groove.

Furthermore, the first doped region, the second doped region and the third doped region are all N + doped regions; the first well region is a low-voltage P well region.

Further, the substrate is a P-type substrate.

Further, the diode assembly includes at least one diode; at least one diode is disposed laterally on the substrate.

Furthermore, each diode comprises a second well region, a fourth doped region, a shallow trench isolation region and a fifth doped region; the fourth doped region, the shallow slot isolation region and the fifth doped region are sequentially and transversely arranged on the second well region.

Further, the second well region is an N-well.

Furthermore, the fourth doped region is a P + doped region; the fifth doped region is an N + doped region; the shallow trench isolation region is used for isolating the fourth doped region from the fifth doped region.

Furthermore, a shallow groove isolation region is arranged between the first doping region and the fifth doping region; the shallow trench isolation region is used for isolating the first doped region from the fifth doped region.

Correspondingly, the embodiment of the application also provides an electrostatic protection circuit which comprises the electrostatic protection structure.

The embodiment of the application has the following beneficial effects:

the electrostatic protection structure comprises a substrate, a resistor, a diode component and a first well region, wherein the diode component and the first well region are both arranged on the substrate, and the first well region is a low-voltage well region; the first well region comprises a first doped region, a first insulating region, a second doped region, a second insulating region and a third doped region; the first insulating region is used for isolating the first doping region from the second doping region, and the second insulating region is used for isolating the second doping region from the third doping region; the first insulating region and the second insulating region are bridged to lead out a high-voltage grid terminal; the first doped region and the third doped region are connected in a bridging mode to lead out a source terminal, and the source terminal is grounded; the second doped region leads out a drain end; the first end of the resistor is connected with the grid end, and the second end of the resistor is grounded. Based on the embodiment of the application, the capacitance coupling effect is formed by connecting the resistance in series with the grid terminal and the parasitic coupling capacitance between the drain terminal and the grid terminal, so that the conduction uniformity of the electrostatic protection structure is improved.

Drawings

In order to more clearly illustrate the technical solutions and advantages of the embodiments of the present application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of an electrostatic protection circuit according to the prior art;

fig. 2 is a schematic diagram illustrating an internal structure of an electrostatic protection structure according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of an electrostatic protection circuit according to an embodiment of the present disclosure.

Detailed Description

To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application will be described in further detail with reference to the accompanying drawings. It should be apparent that the described embodiment is only one embodiment of the embodiments of the application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that "embodiment" as referred to herein refers to a particular feature, structure, or characteristic that may be included in at least one implementation of an embodiment of the present application. In the description of the embodiments of the present application, the terms "first", "second", "third", "fourth" and "fifth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", "fourth" and "fifth" may explicitly or implicitly include one or more such features. Also, the terms "first," "second," "third," "fourth," and "fifth" are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order, it being understood that such usage data may be interchanged under appropriate circumstances. Furthermore, the terms "comprises," "comprising," and "includes" and any variations thereof, are intended to cover a non-exclusive inclusion, such that a list of elements, modules, or units is not necessarily limited to the particular elements, modules, or units shown, but may include elements, modules, or units not expressly listed or inherent to structure herein.

Referring to fig. 2, fig. 2 is a schematic diagram of an internal structure of an electrostatic protection structure according to an embodiment of the present application, where the schematic diagram includes: the semiconductor device comprises a substrate 1, a resistor 2, a diode component 4 and a first well region 3; the diode component 4 and the first well region 3 are both disposed on the substrate 1, wherein the first well region 3 is a low-voltage well region, the first well region 3 includes a first doped region 31, a first insulating region 32, a second doped region 33, a second insulating region 34 and a third doped region 35, the first insulating region 32 is used for isolating the first doped region 31 from the second doped region 33, the second insulating region 34 is used for isolating the second doped region 33 from the third doped region 35, the first insulating region 32 and the second insulating region 34 cross-connect to lead out the high-voltage gate terminal 36, the first doped region 31 and the third doped region 35 cross-connect to lead out the source terminal 37, the source terminal 37 is grounded, the second doped region 33 leads out 38, the first terminal 21 of the resistor 2 is connected to the gate terminal 36, and the second terminal 22 of the resistor 2 is grounded.

By adopting the electrostatic protection structure provided by the embodiment of the application, the parasitic coupling capacitance between the gate terminal 36 and the drain terminal 38-gate terminal 36 is formed by connecting the resistor 2 in series, so that the conduction uniformity of the electrostatic protection structure is improved.

In the embodiment of the present application, the first well region 3 is provided with a first groove, a second groove and a third groove; the first doped region 31 is disposed in the first groove, the second doped region 33 is disposed in the second groove, and the third doped region 35 is disposed in the third groove.

In the embodiment of the present application, the diode assembly 4 includes at least one diode; at least one diode is disposed laterally on the substrate. Each diode includes a second well region 41, a fourth doped region 42, a shallow trench isolation region 43, and a fifth doped region 44; the fourth doped region 42, the shallow trench isolation region 43 and the fifth doped region 44 are sequentially and laterally disposed on the second well region 41.

Next, an alternative embodiment of an esd protection circuit is introduced based on the above esd protection structure, please refer to fig. 2, which shows an internal structural diagram of an esd protection structure provided in an embodiment of the present application, and fig. 3 is a structural diagram of an esd protection circuit based on the esd protection structure in fig. 2. Fig. 2 includes: the semiconductor device comprises a substrate 1, a resistor 2, a diode component 4 and a first well region 3, wherein the diode component 4 and the first well region 3 are all arranged on the substrate 1, the substrate 1 is a P-type substrate, the first well region 3 is a low-voltage P-well region, the first well region 3 comprises a first doped region 31, a first insulating region 32, a second doped region 33, a second insulating region 34 and a third doped region 35, the first doped region 31, the second doped region 33 and the third doped region 35 are all N + doped regions, the first insulating region 32 is used for isolating the first doped region 31 from the second doped region 33, the second insulating region 34 is used for isolating the second doped region 33 from the third doped region 35, the first insulating region 32 and the second insulating region 34 are connected to lead out a high-voltage gate terminal 36, the first doped region 31 and the third doped region 35 are connected to lead out a source terminal 37, the gate terminal 37 is grounded, the second doped region 33 is led out a drain terminal 38, and the first terminal 21 of the resistor 2 is connected to the gate terminal 36, the second terminal 22 of the resistor 2 is connected to ground, and the resistance of the resistor 2 is greater than or equal to 0 ohm. The diode assembly 4 includes two diodes transversely disposed on the substrate 1, each diode includes a second well region 41, a fourth doped region 42, a shallow trench isolation region 43, and a fifth doped region 44, the two diodes are isolated by using the shallow trench isolation region 43 and a third well region 45, and the third well region 45 may be a high-voltage P-well or a low-voltage P-well. The fourth doped region 42, the shallow trench isolation region 43 and the fifth doped region 44 are sequentially and laterally disposed on the second well region 41. The second well region 41 is an N-well. The fourth doped region 42 is a P + doped region; the fifth doped region 44 is an N + doped region; the shallow trench isolation region 43 is used to isolate the fourth doped region 42 and the fifth doped region 44. A shallow groove isolation region 43 is arranged between the first doping region and the fifth doping region; the shallow trench isolation region 43 is used to isolate the first doped region 31 and the fifth doped region 44.

By adopting the electrostatic protection circuit provided by the embodiment of the application, the high-voltage well region is replaced by the low-voltage first well region 3 in the high-voltage circuit, so that the conduction voltage of the electrostatic protection structure can be reduced, the high-voltage grid terminal is replaced by the low-voltage grid terminal, the high-voltage resistance of the grid terminal 36 can be improved, the electric leakage and breakdown of the electrostatic protection circuit can be reduced, meanwhile, the grid terminal 36 of the electrostatic protection structure is connected with the resistor 2 in series, and the parasitic coupling capacitance between the grid terminal 38 and the grid terminal 36 forms a capacitive coupling effect, so that the conduction uniformity of the electrostatic protection structure is improved.

In the embodiments of the present application, unless explicitly stated or limited otherwise, the term "connected" should be understood broadly, and may be, for example, directly connected or connected through an intermediate medium, or connected inside two modules or in an interaction relationship between the two modules, and may be a wired connection or a wireless connection. The specific meanings of the above terms summarized in the examples of the present application can be understood by those of ordinary skill in the art as specific cases.

It should be noted that: the foregoing descriptions of the embodiments of the present application are provided for illustration only and not for the purpose of limiting the invention as defined by the appended claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing may also be implemented.

All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment is described with emphasis on differences from other embodiments. In particular, as for the embodiment of the apparatus, since it is substantially similar to the method embodiment, the description is relatively simple, and for the relevant points, reference may be made to the partial description of the method embodiment.

Those skilled in the art will appreciate that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing associated hardware, and the program may be stored in a computer readable medium.

The foregoing is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the embodiment of the present application, and these modifications and decorations are also considered to be the protection scope of the embodiment of the present application.