阅读说明：本技术 一种新型fpc扁线制程生产工艺及usb外设 (Novel FPC flat wire manufacturing process production technology and USB peripheral ) 是由 霍然 于 2020-04-28 设计创作，主要内容包括：本发明提供了一种新型FPC扁线制程生产工艺及USB外设,包括如下步骤：将FPC焊接于PCB的焊盘上；将焊接后的焊点及焊盘进行点胶处理。USB外设的线材制程生产工艺采用上述一种新型FPC扁线制程生产工艺。本发明提供的一种新型FPC扁线制程生产工艺及USB外设,将FPC与PCB进行焊接后点胶,使得信号质量可以得到保证,经过测试线材摇摆测试结果较好,相对于现有扁线,摇摆耐受性提高两倍以上。且本工艺不会带来额外的宽度和厚度。由此工艺制备的USB外设更加易收纳、且信号更好,线材摇摆耐受性强。(The invention provides a novel FPC flat wire manufacturing process production process and a USB peripheral, which comprises the following steps: welding the FPC on a welding disc of the PCB; and dispensing the welded welding points and the welding pads. The manufacturing process of the wire of the USB peripheral adopts the novel manufacturing process of the FPC flat wire. According to the novel FPC flat wire manufacturing process production process and the USB peripheral, the FPC and the PCB are welded and then subjected to glue dispensing, so that the signal quality can be guaranteed, the test result of the test wire rod swinging is better, and the swinging tolerance is improved by more than two times compared with the existing flat wire. And the process does not bring extra width and thickness. The USB peripheral prepared by the process is easier to store, has better signals and has strong wire swinging tolerance.)

1. A novel FPC flat wire manufacturing process production technology is characterized in that: the method comprises the following steps:

welding the FPC on a welding disc of the PCB;

and dispensing the welded welding points and the welding pads.

2. The novel FPC flat wire manufacturing process production process according to claim 1, characterized in that: the welding mode adopted by the FPC and the PCB is Hot-bar welding technology.

3. The novel FPC flat wire manufacturing process production process according to claim 2, characterized in that: the glue used in the glue dispensing treatment is AB glue or UV glue.

4. A USB peripheral, comprising: the manufacturing process of the wire of the USB peripheral adopts the manufacturing process of the novel FPC flat wire according to any one of claims 1 to 3.

5. The USB peripheral of claim 1, wherein the USB peripheral is configured as a USB adapter.

Technical Field

The invention relates to the technical field of wire manufacturing processes, in particular to a novel FPC flat wire manufacturing process production process and a USB peripheral.

Background

The conventional wire manufacturing process adopts a common round wire design. The round wire design has the advantages of mature scheme, low price and high reliability, but has the problems of poor portability and poor diameter compressibility of the wire. In order to solve the thickness problem of the existing round wire, the skilled person adopts the FPC flat wire design. The flat wire is thinner than the existing round wire. And is easier to store than a round wire. However, there is a problem in that the bending reliability is poor. Further, in order to solve the above technical problems, those skilled in the art adopt a solution based on the connector + FPC design. This has the advantage of increasing the wobble reliability of the flat wire, but has the problem that the signal quality is poor, and especially the high frequency part information may be affected.

In addition, the thickness and width of the connector itself may also result in a limited product appearance.

Disclosure of Invention

In view of the above-mentioned drawbacks and problems of the prior art, an object of the present invention is to provide a novel FPC flat wire manufacturing process and a USB peripheral device.

In order to achieve the purpose, the invention provides the following technical scheme: a novel FPC flat wire manufacturing process production process comprises the following steps:

welding the FPC on a welding disc of the PCB;

and dispensing the welded welding points and the welding pads.

The welding mode adopted by the FPC and the PCB is a Hot-bar welding process.

Wherein, the glue used in the glue dispensing treatment is AB glue or UV glue.

A USB peripheral device is provided, and the manufacturing process of the wire of the USB peripheral device adopts the novel manufacturing process of the FPC flat wire.

Wherein, the USB is externally provided with a USB adapter.

According to the novel FPC flat wire manufacturing process production process and the USB peripheral, the FPC and the PCB are welded and then subjected to glue dispensing, so that the signal quality can be guaranteed, the test result of the test wire rod swinging is better, and the swinging tolerance is improved by more than two times compared with the existing flat wire. And the process does not bring extra width and thickness. The USB peripheral prepared by the process is easier to store, has better signals and has strong wire swinging tolerance.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic diagram of the structural connection of an embodiment of the present invention.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

According to the illustration in fig. 1, as an example,

hot-bar soldering is a common name for heating and tin melting soldering, and is a process of heating two parts which are previously coated with solder resist and plated with tin to a temperature which is enough for the solder to melt. After cooling and solidification, the two parts form a permanent electrical-mechanical connection by the solidified solder. The AB glue is a bi-component adhesive, and two liquids are mixed to be hardened and are called separately, one liquid is the original glue, the other liquid is a hardening agent, and the two liquids can be hardened after being mixed, and the AB glue is one of normal-temperature hardening glue. UV glue requires UV ultraviolet light to cure, typically using UV led lamps to harden. The PCB is called printed circuit board, also called printed circuit board, is an important electronic device, is a support body of the electronic component, and is a carrier for electrical connection of the electronic component. The FPC is a flexible printed circuit board with high reliability and excellent performance, which is made of polyimide or polyester film as a base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. A novel FPC flat wire manufacturing process production process comprises the following steps:

welding the FPC 3 on a welding disc of the PCB 2; the welding mode adopted can be a Hot-bar welding process. Has the advantage of low cost and can ensure the signal quality relative to the connector.

And dispensing the welded welding points and the welding pads. The dispensing position can be the position shown by the welding spot welding pad 1 in fig. 1, and the glue used for dispensing treatment is AB glue or UV glue, and can be selected according to actual requirements. Thereby make it firm thereby the distribution of power when making the test of swaing even and conduct whole PCB, and then promote the tolerance of swaing by a wide margin.

The invention also discloses a USB peripheral, wherein the wire of the USB peripheral is firstly used as a flat wire, and the manufacturing process production process of the wire adopts the novel manufacturing process production process of the FPC flat wire.

The USB peripheral can be a USB adapter, and the USB interface of the USB adapter can also be manufactured by the novel FPC flat wire manufacturing process

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.