Integral full-sealed prefabricated electric circuit board and manufacturing method

文档序号:1365082 发布日期:2020-08-11 浏览:13次 中文

阅读说明:本技术 一种整体全密封预制式电气线路板及制作方法 (Integral full-sealed prefabricated electric circuit board and manufacturing method ) 是由 施宁 施宇翔 张娜 于 2020-04-24 设计创作,主要内容包括:本发明公开了一种整体全密封预制式电气线路板及制作方法,所述电气线路板包括:基板、导线、导线连接件和绝缘封装材料,所述基板正面用于固定电气器件,与正面相对的背面固定并支撑所述导线,所述导线用于连接电气器件,所述导线连接件固定设于所述基板上,用于连接所述导线和外部线束,所述绝缘封装材料覆盖于所述基板背面;所述制作方法用于制作上述电气线路板。本发明的电气线路板可以提高电气控制设备的质量、降低人工成本,还使得电气控制设备的绝缘防护、防火、防尘、防水、防爆、性能得到大幅提升,而且美观大方。(The invention discloses an integral full-sealed prefabricated electric circuit board and a manufacturing method thereof, wherein the electric circuit board comprises: the front surface of the substrate is used for fixing an electric device, the back surface opposite to the front surface of the substrate is used for fixing and supporting the wire, the wire is used for connecting the electric device, the wire connecting piece is fixedly arranged on the substrate and used for connecting the wire and an external wiring harness, and the insulating packaging material covers the back surface of the substrate; the manufacturing method is used for manufacturing the electric circuit board. The electric circuit board can improve the quality of the electric control equipment, reduce the labor cost, greatly improve the insulation protection, fire prevention, dust prevention, water prevention, explosion prevention and performance of the electric control equipment, and is attractive and elegant.)

1. The utility model provides an electric circuit board of whole totally enclosed prefabricated formula which characterized in that includes: the substrate is used for fixing an electric device, the back face opposite to the front face is fixed and supported by the wire, the wire is used for connecting the electric device, the wire connecting piece is fixedly arranged on the substrate and used for connecting the wire and an external wiring harness, and the insulating packaging material covers the back face of the substrate.

2. The integrally fully encapsulated prefabricated electrical circuit board of claim 1, further comprising a frame disposed on and surrounding the back side of said substrate.

3. The integrally fully-sealed prefabricated electrical circuit board of claim 2, wherein the substrate is made of a metal plate, and an insulating support is disposed on the substrate for fixing and supporting the wires in an isolated manner.

4. The integrally fully encapsulated prefabricated electrical circuit board of claim 2, wherein said substrate is made of an insulating plate, and said leads are attached to the back surface of said substrate.

5. The integrally fully-encapsulated prefabricated electrical circuit board of claim 1, wherein the substrate is made of an insulating board, the substrate is provided with a groove on the back surface thereof, the groove is used for fixedly embedding the conductive wire, and the insulating encapsulating material is used for filling the groove.

6. The electrical circuit board of any one of claims 1 to 5, wherein a bottom plate is disposed on a side of the back surface of the substrate, and the bottom plate is fixedly covered under the insulating packaging material.

7. The integrally fully-sealed prefabricated electrical circuit board of claim 1, wherein the substrate is made of an insulating board, the wires are attached to the back surface of the substrate, and the insulating packaging material is poured on the back surface of the substrate to cover the wires.

8. The integrally fully encapsulated prefabricated electrical circuit board of claim 7, wherein said insulating encapsulation material is cast by casting said substrate and said conductors.

9. A manufacturing method of an integral fully-sealed prefabricated electric circuit board is characterized by comprising the following steps:

(1) pre-burying a wire connecting piece and a nut for fixing an electric device on a substrate, and connecting the wire connecting piece by adopting a hot melting or riveting mode;

(2) fixing a lead on the back surface or inside the substrate; when the substrate is an insulating plate, the wire is attached to the back surface of the substrate or arranged in the substrate through a slot; when the substrate is a metal plate, an insulating support is arranged on the substrate and used for isolating, fixing and supporting the lead;

(3) and filling an insulating packaging material on the back surface of the substrate so that the substrate, the wires, the wire connecting pieces and the insulating packaging material are integrated.

10. The method according to claim 9, wherein in the step (3), the insulating encapsulating material is directly filled on the back surface of the substrate, or the substrate and the wires are poured through a pouring mold.

Technical Field

The invention belongs to the field of manufacturing (strong current) of electrical control equipment, and particularly relates to an integrally fully-sealed prefabricated electrical circuit board and a manufacturing method thereof.

Background

The electrical control equipment mainly refers to the electrical control cabinet and the power distribution cabinet which are commonly known. A complete electronic control device mainly comprises four main parts: a metal casing (or other material such as engineering plastic) for protection and easy installation; an electrical device mounting plate made of metal (also made of other materials such as engineering plastics and epoxy insulating plates) for fixing various electrical devices; a set of electrical devices (such as circuit breakers, relays, etc.) determined by design, which function to perform various electrical control functions; one wire (several wires) is determined by design to connect the wires between the various electrical devices. The specific implementation steps are as follows: firstly, fixing each electric device on a mounting plate according to a certain rule. The mounting plate is then secured within the housing. And then manufacturing connecting wires between the devices one by one according to a designed electrical schematic diagram. Finally, the connecting wires between the devices are installed to form a complete electric control device.

In the manufacturing process of the specific electric control equipment, the specific shapes and sizes of the shell and the mounting plate can cause that the wiring board is difficult to realize standardized production due to different designs, different equipment manufacturers and different electric device brand selections. Therefore, the wiring boards are still produced in a scattered production manner or even in a manual production manner. The existing production mode and process of the electric control equipment have the following defects: the production efficiency is low, the labor cost is high, the safety insulation property is poor, the waterproof, dustproof and anticorrosive properties are poor, the operation reliability is poor, the quality is difficult to guarantee, the consistency of the product is also poor, and the appearance is not easy to achieve. Sometimes, in order to conceal disordered wires, protective plates, wiring ducts and other objects have to be added for concealing, so that the volume weight and the cost of equipment are increased, and a fire hazard is left.

Disclosure of Invention

In order to solve the problems, the invention provides an integral fully-sealed prefabricated electric circuit board and a manufacturing method thereof, which not only improve the quality of the electric circuit board, but also are beneficial to improving the quality of electric control equipment and reducing the labor cost, and also greatly improve the insulation protection, fire prevention, dust prevention, water prevention and explosion prevention performance of the electric control equipment, and are attractive and elegant.

In order to achieve the purpose, the invention adopts the technical scheme that:

an integrally hermetically sealed prefabricated electrical circuit board comprising: the substrate is used for fixing an electric device, the back face opposite to the front face is fixed and supported by the wire, the wire is used for connecting the electric device, the wire connecting piece is fixedly arranged on the substrate and used for connecting the wire and an external wiring harness, and the insulating packaging material covers the back face of the substrate.

Preferably, the display device further comprises a frame, wherein the frame is arranged on the back surface of the substrate and surrounds the periphery of the back surface of the substrate.

The frame of the optimized scheme is used for increasing the thickness of the substrate which can be used actually, providing space for laying the wires on the back of the substrate, and meanwhile, the insulating packaging material can be prevented from overflowing during pouring.

More preferably, the substrate is made of a metal plate, and the substrate is provided with an insulating support for fixing and supporting the wires in an isolated manner.

More preferably, the substrate is made of an insulating plate, and the wires are attached to the back surface of the substrate.

Preferably, the substrate is made of an insulating plate, a groove is formed in the back of the substrate, the groove is used for fixedly embedding the wire, and the insulating packaging material is used for filling the groove.

Preferably, a bottom plate is arranged on one side of the back face of the substrate, and the bottom plate is fixedly covered below the insulating packaging material.

The bottom plate of the optimized scheme is filled between the substrate and the bottom plate, so that the product is safer and more attractive.

Preferably, the substrate is made of an insulating plate, the wires are attached to the back surface of the substrate, and the insulating packaging material is poured on the back surface of the substrate to cover the wires.

More preferably, the insulating encapsulation material pours the substrate and the wires through a pouring mold.

The optimization effect that this optimization scheme brought is, will fix the base plate of wire and wire connecting piece and put into the casting mould, pour insulating packaging material into casting mould one shot forming again for the electric circuit board is complete seamless.

A method for manufacturing an integral fully-sealed prefabricated electric circuit board comprises the following steps:

(1) pre-burying a wire connecting piece and a nut for fixing an electric device on a substrate, and connecting the wire connecting piece by adopting a hot melting or riveting mode;

(2) fixing a lead on the back surface or inside the substrate; when the substrate is an insulating plate, the wire is attached to the back surface of the substrate or arranged in the substrate through a slot; when the substrate is a metal plate, an insulating support is arranged on the substrate and used for isolating, fixing and supporting the lead;

(3) and filling an insulating packaging material on the back surface of the substrate so that the substrate, the wires, the wire connecting pieces and the insulating packaging material are integrated.

Preferably, in the step (3), the insulating encapsulation material may directly cover and fill the back surface of the substrate, or the substrate and the wires may be cast by a casting mold.

Compared with the prior art, the invention has the beneficial effects that:

1. the integrally fully-sealed prefabricated electric circuit board provided by the invention greatly improves the electric reliability of the electric control equipment. The manufacturing method adopts a hot-melt welding method, so that the contact resistance of the lead connecting point is greatly reduced, and the circuit heating is reduced; the structure that the whole bus distributes electric energy is adopted, the screw compression joint segmented bus structure is eliminated, even if the screw is loosened, the point that the loosening is affected is only, the whole bus is not affected, and the electrical faults (such as short circuit, open circuit, heating and electric sparks) caused by poor contact can be greatly reduced.

2. The whole fully-sealed prefabricated electric circuit board provided by the invention has the advantages that the anti-vibration performance of the electric control equipment is greatly improved, all the wires except the wire harness are tightly wrapped by the insulating packaging material and are very firm, and in addition, the wires and the wire connecting piece, and the wire connecting piece and the wire harness are all connected by adopting the hot melting welding, so that the wires are unlikely to displace or loosen even if the electric control equipment works in a vibration state, and the anti-vibration performance is improved.

3. The integrally fully-sealed prefabricated electric circuit board provided by the invention has the advantages that the fireproof performance of the electric control equipment is greatly improved, most of connecting wires are tightly wrapped by the insulating packaging material, so that the wires are isolated from air, the insulating packaging material is fireproof, and the wires are generally made of bare copper. Thus, even if the bare copper generates heat, the periphery of the bare copper does not have combustible substances or oxygen required by combustion, so that the internal lead of the circuit board cannot be combusted, and open fire is not generated. The closely wrapped wire can not generate displacement, cause the short circuit to cause and generate heat either, what the pencil of being connected with the wire connecting piece adopted is the silica gel line, is that the fire prevention wire can not burn, makes the fire behavior of electric circuit board obtain improving based on above-mentioned reason. As long as the device does not adopt a combustible insulating material to manufacture the shell, the fire resistance of the whole electric control equipment is guaranteed.

There are two reasons for fire caused by the electric control device, one is short circuit caused by aging and insulation damage of the internal connection wire, which causes fire. Secondly, the electric wire is overheated due to long-term overcurrent or poor contact at the joint, and fire is caused. The electrical wiring board of the present invention solves these problems well.

4. The integrally fully-sealed prefabricated electric circuit board provided by the invention has the advantages that the dustproof, waterproof, moistureproof, anticorrosive and insulating safety performances of the electric control equipment are greatly improved, and the fully-sealed structure of the electric circuit board is benefited.

5. The integrally fully-sealed prefabricated electric circuit board provided by the invention has the following advantages that the electric circuit board can realize mechanized mass production, and the production efficiency and the product quality are greatly improved. The novel multifunctional electric heating cooker is simple in structure, easy to popularize, good in product consistency, attractive, tidy and tidy. The subsequent electrical devices are convenient to install and wire, have low technical level requirements on installation personnel and are convenient to maintain and replace. The electrical circuit board is suitable for electrical control equipment of various electrical systems, including power supply and distribution equipment and control equipment. In particular, the voltage is below 1000V, and the current is below 800A.

Drawings

Fig. 1 is a schematic structural diagram of an integrated fully-sealed prefabricated electrical circuit board according to the first embodiment.

Fig. 2 is an electrical schematic diagram according to the first embodiment.

Fig. 3 is a layout diagram of devices on the front surface of the substrate according to the first embodiment.

Fig. 4 is a layout diagram of the front side insulating support, the wire connecting member and the embedded nut according to the first embodiment.

Fig. 5 is a schematic diagram of the wiring harness connection on the front surface of the substrate according to the first embodiment.

Fig. 6 is a schematic diagram of a wiring layout on the reverse side of the substrate according to the first embodiment.

FIG. 7 is a plan view of the base plate according to the first embodiment.

Fig. 8 is a schematic structural view of an integral fully-sealed prefabricated electrical circuit board according to the second embodiment.

Fig. 9 is a schematic structural view of an integral fully-sealed prefabricated electrical circuit board according to the third embodiment.

Wherein, 1, a substrate; 2. a wire; 3. a wire connecting member; 4. an insulating packaging material; 5. a frame; 6. an insulating support; 7. a base plate; 8. a trench; 9. an electric circuit board fixing hole; 10. a nut; 11. a primary loop wire connector; 12. a secondary loop wire connection; 13. a primary loop wire; 14. and a secondary loop wire.

Detailed Description

For a better understanding of the present invention, the contents of the present invention will be further explained below with reference to the drawings and examples, but the present invention is not limited to the following examples.

In the description of the present invention, it is to be understood that the orientations or positional relationships indicated by the "front side", "back side", "frame", "bottom plate", "inside", "outside", "above", "below", etc. are all based on the orientations or positional relationships shown in the drawings, and the objects are only for convenience of description and simplification of description, and do not indicate or imply that the components referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the present invention.

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