阅读说明：本技术 发光装置及其制造方法、背光模组、显示面板和显示装置 (Light-emitting device and manufacturing method thereof, backlight module, display panel and display device ) 是由 王丽花 孙晓平 马从华 东强 于 2020-06-02 设计创作，主要内容包括：本发明实施例公开了一种发光装置及其制造方法、背光模组、显示面板和显示装置,该制造方法包括：提供衬底基板；在衬底基板的一侧形成线路层；提供至少一个开关元件和至少一个发光元件；将开关元件和发光元件与线路层电连接；其中,线路层包括第一电源信号线、第二电源信号线以及脉宽调制信号线；开关元件包括控制端、第一端以及第二端；控制端与脉宽调制信号线电连接,第一端与第一电源信号线电连接,第二端与第二电源信号线电连接；发光元件电连接于第一端与第一电源信号线之间,或者发光元件电连接于第二端与第二电源信号线之间。如此,本发明实施例的技术方案提供了一种新的发光装置的制造方法,且方法步骤简单,制造成本较低。(The embodiment of the invention discloses a light-emitting device and a manufacturing method thereof, a backlight module, a display panel and a display device, wherein the manufacturing method comprises the following steps: providing a substrate base plate; forming a circuit layer on one side of a substrate base plate; providing at least one switching element and at least one light emitting element; electrically connecting the switching element and the light emitting element to the wiring layer; the circuit layer comprises a first power supply signal line, a second power supply signal line and a pulse width modulation signal line; the switch element comprises a control end, a first end and a second end; the control end is electrically connected with the pulse width modulation signal wire, the first end is electrically connected with the first power supply signal wire, and the second end is electrically connected with the second power supply signal wire; the light emitting element is electrically connected between the first end and the first power supply signal line, or the light emitting element is electrically connected between the second end and the second power supply signal line. Therefore, the technical scheme of the embodiment of the invention provides a novel manufacturing method of the light-emitting device, and the method has simple steps and lower manufacturing cost.)

1. A method of manufacturing a light emitting device, comprising:

providing a substrate base plate;

forming a circuit layer on one side of the substrate base plate;

providing at least one switching element and at least one light emitting element;

electrically connecting the switching element and the light emitting element to the wiring layer;

wherein the line layer includes a first power supply signal line, a second power supply signal line, and a pulse width modulation signal line; the switching element comprises a control end, a first end and a second end; the control end is electrically connected with the pulse width modulation signal wire, the first end is electrically connected with the first power supply signal wire, and the second end is electrically connected with the second power supply signal wire;

the light emitting element is electrically connected between the first end and the first power supply signal line, or the light emitting element is electrically connected between the second end and the second power supply signal line.

2. The method of manufacturing a light-emitting device according to claim 1, wherein the wiring layer includes a bonding layer remote from the base substrate; electrically connecting the switching element and the light emitting element with the wiring layer includes:

binding and electrically connecting the switching element to the binding layer, and binding and electrically connecting the light emitting element to the binding layer.

3. The method of manufacturing a light-emitting device according to claim 2, wherein electrically connecting the switching element and the light-emitting element to the wiring layer comprises:

the switching element and the light-emitting element are electrically connected to the wiring layer by means of transfer.

4. The method of manufacturing a light-emitting device according to claim 2, wherein the wiring layer further includes at least one metal layer formed between the bonding layer and the base substrate;

the first power supply signal line, the second power supply signal line, and the pulse width modulation signal line are formed in any one of the metal layers.

5. The method for manufacturing a light-emitting device according to claim 4, wherein the wiring layer further includes a protective layer;

the protective layer is formed between the binding layer and the metal layer closest to the binding layer;

or multiplexing the metal layer closest to the binding layer as a protective layer;

or multiplexing the binding layer as a protective layer.

6. The method of manufacturing a light-emitting device according to claim 2, wherein the wiring layer further comprises a solder mask layer;

the welding-assistant layer is formed on one side of the binding layer, which is far away from the substrate base plate.

7. The method for manufacturing a light-emitting device according to claim 1, wherein the electrically connecting the switching element and the light-emitting element to the wiring layer comprises:

forming a connecting via hole in the substrate base plate; the first power signal line has a first hollow area, the second power signal line has a second hollow area, and a vertical projection of the first hollow area on the substrate base plate, a vertical projection of the second hollow area on the substrate base plate and the connecting via hole are overlapped;

and one of the switch element and the light-emitting element is electrically connected to one side of the circuit layer, which is far away from the circuit substrate, and the other one of the switch element and the light-emitting element is electrically connected to one side of the circuit layer, which is far away from the circuit layer, through the connecting via hole.

8. The method for manufacturing a light-emitting device according to claim 7, further comprising, after forming a wiring layer on one side of the base substrate, before electrically connecting the switching element and the light-emitting element to the wiring layer:

forming a connecting layer on one side of the substrate base plate, which is far away from the circuit layer, and in the connecting through hole;

the light emitting element or the switching element is electrically connected to the wiring layer through a connection line in the connection layer.

9. The method of manufacturing a light-emitting device according to claim 7, wherein forming a connecting via in the substrate base plate includes:

and forming the connecting through hole in the substrate base plate in a laser drilling mode.

10. The method for manufacturing a light-emitting device according to claim 1, wherein the wiring layer further includes a resistor electrically connected in series with the light-emitting element between the first power supply signal line and the second power supply signal line;

the resistor and at least one of the first power signal line, the second power signal line and the pulse width modulation signal line are made of the same material and formed in the same process.

11. The method for manufacturing a light-emitting device according to claim 1, further comprising:

providing a resistor;

electrically connecting the resistor to the circuit layer;

wherein the resistor and the light emitting element are electrically connected in series between the first power supply signal line and the second power supply signal line.

12. A light-emitting device formed by applying the method for manufacturing a light-emitting device according to any one of claims 1 to 11, the light-emitting device comprising:

a substrate base plate;

the circuit layer is formed on one side of the substrate base plate; the circuit layer comprises a first power supply signal line, a second power supply signal line and a pulse width modulation signal line;

at least one switching element and at least one light emitting element, both electrically connected to the wiring layer;

the switching element comprises a control end, a first end and a second end; the control end is electrically connected with the pulse width modulation signal wire, the first end is electrically connected with the first power supply signal wire, and the second end is electrically connected with the second power supply signal wire;

the light emitting element is electrically connected between the first end and the first power supply signal line, or the light emitting element is electrically connected between the second end and the second power supply signal line.

13. The light-emitting device according to claim 12, wherein one of the first power supply signal line and the second power supply signal line is configured to transmit a first potential, and the other is configured to transmit a second potential;

the first potential is equal to or greater than a threshold voltage of the light emitting element, and the second potential is equal to zero potential.

14. The light-emitting device according to claim 12, wherein the wiring layer includes a binding layer remote from the substrate base plate, and both the switching element and the light-emitting element are electrically connected to the binding layer.

15. The light-emitting device according to claim 14, wherein the wiring layer further comprises at least one metal layer, the metal layer being located between the substrate base plate and the bonding layer;

the first power supply signal line, the second power supply signal line and the pulse width modulation signal line are located in any one of the metal layers.

16. The light-emitting device according to claim 15, wherein the wiring layer further comprises a protective layer;

the protective layer is located between the binding layer and the metal layer closest to the binding layer, or

The protective layer multiplexes the metal layer closest to the binding layer; or

The protection layer multiplexes the binding layer.

17. The light-emitting device according to claim 12, wherein the substrate base plate comprises a connection via;

one of the switch element and the light-emitting element is arranged on one side of the circuit layer, which is far away from the substrate base plate, and the other one of the switch element and the light-emitting element is arranged on one side of the substrate base plate, which is far away from the circuit layer, and is electrically connected with the circuit layer through the connecting through hole.

18. The light-emitting device according to claim 12, further comprising a resistor formed in the wiring layer or electrically connected to the wiring layer; and

the resistor is electrically connected in series with the light emitting element between the first power supply signal line and the second power supply signal line.

19. The light-emitting device according to claim 18, further comprising a driver circuit which is provided at one side edge of the light-emitting device, wherein the first power signal line, the second power signal line, and the pulse width modulation signal line are electrically connected to the driver circuit;

the resistor comprises a first resistor and a second resistor, the first resistor is arranged on one side of the second resistor close to the driving circuit, the resistance value of the first resistor is R, the resistance value of the second resistor is R0, the voltage drop on the first power signal wire between the first resistor and the second resistor is DeltaV, the potential received by the second resistor is V, and the difference value between the current flowing through the first resistor and the current flowing through the second resistor is C, then:

wherein C is a constant.

20. The apparatus of claim 18, wherein each of the light emitting elements electrically connected to each of the switching elements is connected in series with at least one of the resistors.

21. The light emitting device of claim 12, wherein the substrate comprises a glass substrate, a printed circuit board substrate, or a flexible circuit board substrate.

22. The light-emitting device according to claim 12, wherein the first power signal line is routed in a grid, and/or

The second power signal wire is arranged in a grid shape;

the vertical projection of the grid-shaped routing on the substrate base plate surrounds the switch element and the light-emitting element electrically connected with the switch element.

23. The light-emitting device according to claim 22, wherein the base substrate includes a light-emitting region and a non-light-emitting region surrounding the light-emitting region;

the light emitting element and the switching element are disposed in the light emitting region, and the first power supply signal line, the second power supply signal line, and the pulse width modulation signal line each extend into the non-light emitting region from the light emitting region;

the LED lamp also comprises at least two first connecting terminals which are arranged in the non-luminous zone and are positioned on different sides of the luminous zone;

the first power signal wires extending to the same side are electrically connected with the same first connecting terminal, and the first connecting terminals are electrically connected end to end in sequence;

the LED lamp comprises a non-luminous zone, at least two second connecting terminals and a plurality of LED light sources, wherein the at least two second connecting terminals are arranged in the non-luminous zone and are positioned on different sides of the luminous zone;

the second power signal line extending to the same side is electrically connected with the same second connecting terminal, and the second connecting terminals are electrically connected end to end in sequence.

24. The light-emitting device according to claim 12, wherein directions of extension of the first power supply signal line, the second power supply signal line, and the pulse width modulation signal line are the same.

25. A backlight module comprising the light-emitting device according to any one of claims 12-24.

26. A display device comprising the backlight module of claim 25, and further comprising a display panel;

the display panel is arranged on the light-emitting side of the backlight module.

27. A display panel comprising the light-emitting device according to any one of claims 12 to 24, and further comprising:

and an opposing substrate disposed opposite to the light emitting device.

28. A display device characterized by comprising the display panel according to claim 27.