阅读说明：本技术 端子、基板用连接器、带连接器的基板及端子的制造方法 (Terminal, connector for substrate, substrate with connector, and method for manufacturing terminal ) 是由 中西雄一 松田英一 坂井启人 于 2019-08-29 设计创作，主要内容包括：本发明涉及端子、基板用连接器、带连接器的基板及端子的制造方法,能够维持焊料的浸润性并且能够实现成本降低。端子具备与电路基板连接的基板连接部,所述端子具备基材和镀层,所述基材具备被所述镀层覆盖的被镀覆面和露出的露出面,在所述基板连接部,所述镀层具备第1倾斜面,第1倾斜面覆盖将所述被镀覆面及所述露出面连接的斜面。(The invention relates to a terminal, a connector for a substrate, a substrate with a connector and a method for manufacturing the terminal, which can maintain the wettability of solder and can reduce the cost. The terminal includes a substrate connection portion connected to a circuit substrate, the terminal includes a base material including a plated surface covered with the plating layer and an exposed surface, and a plating layer including a1 st inclined surface covering an inclined surface connecting the plated surface and the exposed surface at the substrate connection portion.)

1. A terminal having a substrate connection portion connected to a circuit substrate,

the terminal is provided with a base material and a plating layer,

the base material has a plated surface covered with the plating layer and an exposed surface,

in the substrate connecting portion, the plating layer includes a1 st inclined surface, and the 1 st inclined surface covers an inclined surface connecting the plated surface and the exposed surface.

2. A terminal according to claim 1,

the substrate connecting portion includes a rising surface rising at an angle from the exposed surface,

the rising surface exposes the base material,

the plating layer includes a2 nd inclined surface, and the 2 nd inclined surface covers an inclined surface connecting the plated surface and the rising surface.

3. A terminal according to claim 1 or 2,

the plating layer contains Sn.

4. A terminal according to any one of claims 1 or 2,

the terminal is provided with a bent portion.

5. A terminal according to any one of claims 1 or 2,

the thickness of the base material is 0.05mm to 0.80 mm.

6. A connector for a substrate includes:

the terminal of any one of claims 1 to 5; and

a connector housing that holds the terminal.

7. A substrate with a connector includes:

the connector for a substrate according to claim 6;

a circuit board on which the substrate connector is mounted; and

a solder connecting the circuit board and the board connection portion,

the exposed surface is disposed opposite to the circuit board.

8. The substrate with connector according to claim 7,

the exposed surface is embedded in the solder.

9. A method of manufacturing a terminal according to any one of claims 1 to 5, comprising:

a plating step of performing a plating treatment to form plated layers on both surfaces of a plate material made of the base material to obtain a plated plate;

a punching step of punching the plating plate to obtain a terminal blank sheet having the plated surface and an exposed surface; and

and a rolling step of rolling the plating layer to form the first inclined surface by applying a rolling process to the terminal blank sheet.

10. The method of manufacturing a terminal according to claim 9,

the plating treatment is electrolytic plating.

Technical Field

The technology disclosed in the present specification relates to a terminal, a connector for a substrate, a substrate with a connector, and a method for manufacturing a terminal.

Background

A substrate connector to be mounted on a circuit board by soldering comprises a connector housing and a terminal held by the connector housing, and the tip end of the terminal is fixed to the circuit board by solder.

As a method for manufacturing a terminal provided in a connector for a substrate, a method of punching a plate material into a shape of a terminal and then plating the punched plate material (hereinafter, referred to as "post-plating method") is known. Since the terminal manufactured by the post-plating method has a plated layer on the entire surface, wettability of solder can be ensured. However, the post-plating method, in which the terminals punched out of the plate material are plated one by one, increases the manufacturing cost as compared with the pre-plating method, in which the terminals are punched out after plating the plate material.

In order to solve this problem, a method of manufacturing a terminal is proposed as follows: the plate surface of the plate material before the blanking is plated in advance, and when the plate material after the plating treatment is blanked, a part of the plated layer is dragged in the blanking direction and forcibly spread to the blanked and cut side surface portion, and plating is also performed on the blanked and cut side surface portion (see patent document 1 below).

Disclosure of Invention

Problems to be solved by the invention

In a conventional method for manufacturing a terminal using a pre-plating method, a workpiece plated by the pre-plating method is further bent to obtain a terminal having a portion connected to a substrate. However, when this bending is performed, there is a problem that the manufacturing cost of the terminal becomes higher than when this bending is not performed.

Accordingly, an object of the present invention is to provide a terminal, a connector for a substrate, a substrate with a connector, and a method for manufacturing a terminal, which can maintain wettability of solder and can reduce manufacturing cost of the terminal.

Means for solving the problems

According to the present invention, there is provided a terminal comprising a substrate connecting portion connected to a circuit substrate, the terminal comprising a base material and a plating layer, the base material comprising a plated surface covered with the plating layer and an exposed surface, the plating layer comprising a1 st inclined surface at the substrate connecting portion, the 1 st inclined surface covering an inclined surface connecting the plated surface and the exposed surface.

Further, according to the present invention, there is provided a connector for a substrate, comprising: a terminal having the above structure; and a connector housing that holds the terminal.

Further, according to the present invention, there is provided a substrate with a connector, including: a connector for a substrate having the above structure; a circuit board on which the substrate connector is mounted; and solder for connecting the circuit board and the board connecting portion, wherein the exposed surface is arranged to face the circuit board.

Further, according to the present invention, there is provided a method for manufacturing a terminal having the above-described configuration, including: a plating step of performing a plating treatment to form plated layers on both surfaces of a plate material made of the base material to obtain a plated plate; a punching step of punching the plating plate to obtain a terminal blank sheet having the plated surface and an exposed surface; and a rolling step of rolling the plating layer to form the first inclined surface by applying a rolling process to the terminal blank sheet.

The terminal of the present invention may further have the following configuration.

(1) The substrate connecting portion may include a rising surface rising at an angle from the exposed surface, the rising surface exposing the base material, and the plating layer may include a2 nd inclined surface covering an inclined surface connecting the plated surface and the rising surface.

(2) The plating layer may contain Sn.

(3) The terminal may include a bent portion.

(4) The thickness of the base material may be 0.05mm to 0.80 mm.

In the connector-equipped board, the exposed surface may be embedded in the solder.

In the above method for manufacturing a terminal, the plating treatment may be electrolytic plating.

Effects of the invention

According to the present invention, it is possible to provide a terminal, a connector for a substrate, a substrate with a connector, and a method for manufacturing a terminal, which can maintain wettability of solder and reduce cost.

Drawings

Fig. 1 is a perspective view of a substrate with a connector according to the present embodiment.

Fig. 2 is a rear view of the substrate connector according to the present embodiment.

Fig. 3 is a bottom view of the substrate connector of the present embodiment.

Fig. 4 is a side view of the terminal of the present embodiment.

Fig. 5 is a plan view of the terminal of the present embodiment.

Fig. 6 is a partially enlarged side view showing a substrate connection portion of the terminal of the present embodiment.

Fig. 7 is an enlarged view within circle R1 of fig. 2.

Fig. 8 is an enlarged view within circle R2 of fig. 3.

Fig. 9 is a cross-sectional view showing a structure in which the substrate connection portion of the terminal of the present embodiment is soldered to the circuit substrate, cut at a position shown by line a-a in fig. 6.

Fig. 10 is a cross-sectional view of the terminal of the present embodiment cut at a position indicated by line B-B in fig. 6.

Fig. 11 is a cross-sectional view of the terminal of the present embodiment cut at a position indicated by line C-C in fig. 6.

Fig. 12 is a cross-sectional view of the structure in which the substrate connection portion of the terminal of the present embodiment is soldered to the circuit substrate, cut at a position indicated by the line D-D in fig. 7.

Fig. 13 is a perspective view of the metal plate material of the present embodiment.

Fig. 14 is a perspective view of the plated plate of the present embodiment.

Fig. 15 is a plan view schematically showing a case where terminal green sheets are obtained in a punching step in the terminal manufacturing method of the present embodiment.

Fig. 16 is a cross-sectional view of the substrate connection blank sheet portion cut at a position indicated by line E-E in fig. 15.

Detailed Description

< embodiment >

Embodiments of the present invention will be described below with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

The terminal of the present embodiment includes a substrate connection portion connected to a circuit substrate, the terminal includes a base material including a plated surface covered with the plating layer and an exposed surface, and a plating layer, the plating layer includes a1 st inclined surface at the substrate connection portion, and the 1 st inclined surface covers an inclined surface connecting the plated surface and the exposed surface.

The present inventors have studied a method for manufacturing a terminal by a plating-first method in order to achieve sufficient solder wettability and reduction in manufacturing cost of the terminal. As a result, they found that: when the terminal is manufactured by designing the direction of the punching step, forming the inclined surface of the base material in the rolling step, and sandwiching the exposed surface between the inclined surfaces, sufficient solder wettability can be exhibited even by the pre-plating method.

The present inventors have discussed the difference between the characteristic point of the terminal realized by the terminal manufacturing method and the conventionally known terminal. As a result, the present inventors found that: in the terminal of the present embodiment, the shape of the plated surface and the exposed surface is controlled to be different from that of the conventional terminal, so that the wettability of the solder can be maintained and the cost can be reduced.

(substrate with connector 1)

As shown in fig. 1, the substrate with connector 1 of the present embodiment includes, for example: a substrate connector 20; a circuit board 10 to which the board connector 20 is mounted; and solder for connecting the circuit board and the board connecting portion.

The substrate with connector 1 of the present embodiment can be used for an automobile, for example. The terminal of the present embodiment is manufactured, for example, by a method that does not include a bending step of forming the substrate connection portion 31 of the terminal 30. This can improve the dimensional accuracy. Therefore, the terminal 30 of the present embodiment can exhibit appropriate dimensional accuracy even when a small-sized terminal having a small thickness of a base material is used as compared with a conventional terminal for an automobile use, for example.

(Circuit Board 10)

The circuit board 10 is not limited to a specific one, and a known circuit board can be selected according to the application of the substrate with a connector. Specific examples of the circuit board 10 include a printed wiring board.

As the printed wiring board, for example, a printed wiring board in which a conductive path is formed on one surface or both surfaces of an insulating plate made of an insulating material and electronic components are mounted can be used.

(connector for substrate 20)

As shown in fig. 1, the board connector 20 includes, for example, a terminal 30 and a connector housing 21 holding the terminal 30. In the substrate connector 20, the terminals 30 are connected to, for example, conductive paths on the circuit substrate 10.

The connector housing 21 is a connecting member to which connector members such as a mating connector housing, the terminal 30, and the circuit board 10 are connected.

The material of the connector housing 21 is, for example, resin.

As shown in fig. 1, the connector housing 21 includes, for example, a housing main body 22 and a fixing wall portion 25 disposed so as to sandwich the housing main body 22.

The housing main body 22 includes, for example, a terminal holding wall 23 that holds the terminal 30 and a housing portion that can receive a mating connector therein. As shown in fig. 2, for example, the terminal holding wall 23 has a plurality of terminal press-in holes 24 into which the terminals 30 are press-fitted.

The fixing wall portion 25 is a portion for fixing the connector housing to the circuit board 10, for example.

For example, as shown in fig. 3, the fixing wall portions 25 each have a fixing-part press-fitting hole 26, and a fixing part 27 for fixing the connector housing 21 to the circuit board 10 is press-fitted into the fixing-part press-fitting hole 26.

(terminal 30)

The terminal of the present embodiment is electrically connected to a counterpart member, for example.

The terminal 30 of the present embodiment is a component for electrically connecting the circuit board 10 and a counterpart.

For example, as shown in fig. 4, the terminal 30 of the present embodiment includes: a substrate connection portion 31 connected to the circuit substrate 10; a terminal connection portion 33 connected to a terminal of a counterpart member; and an intermediate portion 32 that connects the substrate connection portion 31 and the terminal connection portion 33.

Specific examples of the method of connecting the substrate connection portion 31 and the circuit board 10 include soldering.

The terminal connecting portion 33 may be a male terminal or a female terminal, for example. In addition, the terminal 30 of the present embodiment may be bent, for example, to form the terminal connecting portion 33.

The terminal of the present embodiment preferably includes, for example, one or more bent portions, and preferably includes two or more bent portions. Even when such a bent portion is provided, the terminal 30 of the present embodiment is preferable in terms of being able to achieve appropriate dimensional accuracy.

In the terminal 30, the bent portion is preferably disposed in the intermediate portion 32, for example. This is preferable in terms of improving the degree of freedom in designing the components of the substrate connector 20. As an example, fig. 4 shows a terminal 30 in which two bent portions (the 1 st bent portion 34 and the 2 nd bent portion 35) are arranged in an intermediate portion.

The terminal 30 includes, for example, a base 41 and plating layers 44A and 44B.

The surface of the base material 41 includes, for example, a plated surface covered with a plating layer and an exposed surface exposed.

The substrate 41 includes, for example, a slope surface connecting the plated surface and the exposed surface in the substrate connection portion 31 connecting the terminal 30 and the circuit board 10. The plating layer includes, for example, the 1 st inclined surface covering the inclined surface of the substrate 41. The inclined surface and the 1 st inclined surface are unique shapes formed by the method of manufacturing the terminal 30 of the present embodiment. By providing the terminal 30 of the present embodiment with this unique shape, appropriate plating wettability can be exhibited. Therefore, it is preferable in terms of being able to firmly fix the circuit board 10 and the terminal 30.

As the substrate 41, for example, a metal containing copper (Cu) can be used without limitation. The plating layers 44A and 44B are not limited to a specific one, and may be made of a metal such as tin (Sn), nickel (Ni), zinc (Zn), or chromium (Cr).

The detailed mechanism is not clear, but when the terminal 30 is manufactured by the post-plating method described later, it is presumed that it is important that the base material 41 follows the plating layers 44A and 44B in the rolling step. From the viewpoint of follow-up, for example, a plating layer containing tin (Sn) is preferably used as the plating layers 44A and 44B. From the viewpoint of follow-up properties, it is more preferable to use the tin (Sn) -containing plating layers 44A and 44B in combination with the copper (Cu) -containing base material 41.

The thickness of the substrate 41 is, for example, preferably 0.05mm or more, more preferably 0.07mm or more, and further preferably 0.08mm or more. This can suppress deformation of the base material 41 when the plating layer 52 is rolled, and can improve the dimensional accuracy of the terminal 30.

The thickness of the substrate 41 is preferably, for example, 0.80mm or less, more preferably 0.70mm or less, and further preferably 0.64mm or less. Thus, the plating layer 52 can be easily rolled with a small pressure when it is rolled, and the terminal 30 can be more appropriately covered with the plating layers 44A and 44B. Therefore, it is preferable from the viewpoint of ensuring sufficient plating wettability.

The arrangement of the terminals 30 in the connector-equipped board 1 according to the present embodiment is not limited.

The terminal 30 is preferably disposed so that the exposed surface faces the circuit board 10, for example. Thus, by sufficiently improving the plating wettability, the terminal 30 and the circuit board 10 can be firmly connected, and the manufacturing cost of the terminal 30 can be reduced.

In the connector-equipped board 1 of the present embodiment, the exposed surface is preferably embedded in solder, for example. Thus, by sufficiently improving the plating wettability, the terminal 30 and the circuit board 10 can be firmly connected, and the manufacturing cost of the terminal 30 can be reduced.

One mode of the terminal of the present embodiment will be described in more detail below with reference to the drawings.

As shown in fig. 13, 14 and 15, the terminal 30 is manufactured by punching a plated plate 53 plated on both sides of a metal plate 51, and includes a plate-shaped base material 41 and plated layers 44A and 44B as shown in fig. 9. As shown in fig. 6, 9, 10, and 11, the substrate 41 has a pair of plate surfaces 42A and 42B and an end surface 43 connecting the plate surfaces 42A and 42B.

As shown in fig. 6, in the board connection portion 31, a surface (lower surface in fig. 6) of the end surface 43 which faces the circuit board 10 when the board connector 20 is mounted on the circuit board 10 is a board facing end surface 43A, a surface (left surface in fig. 6) rising at an angle from one end of the board facing end surface 43A is a1 st rising end surface 43B, and a surface (right surface in fig. 6) rising at an angle from the other end of the board facing end surface 43A is a2 nd rising end surface 43C.

The pair of plate surfaces 42A, 42B are covered with the plating layers 44A, 44B over the entire surfaces thereof. The end surface 43 is formed by punching, and is an exposed surface of the base 41 exposed from the plating layers 44A and 44B.

In the one board surface 42A, a region adjacent to the board facing end surface 43A becomes the facing inclined surface 42A1 as shown in fig. 9, a region adjacent to the 1 st rising end surface 43B becomes the 1 st rising inclined surface 42A2 as shown in fig. 10, and a region adjacent to the 2 nd rising end surface 43C becomes the 2 nd rising inclined surface 42A3 as shown in fig. 11. The remaining region of the plate surface 42A excluding the opposing inclined surface 42A1, the 1 st rising inclined surface 42A2, and the 2 nd rising inclined surface 42A3 is a non-inclined surface 42A4 as shown in fig. 9, 10, and 11. The opposing inclined surface 42a1, the 1 st rising inclined surface 42a2, and the 2 nd rising inclined surface 42A3 are surfaces connecting the substrate opposing end surface 43A, the 1 st rising end surface 43B, and the 2 nd rising end surface 43C with the non-inclined surface 42a4, respectively.

The other plate surface 42B similarly has the opposite inclined surface 42B1, the 1 st rising inclined surface 42B2, the 2 nd rising inclined surface 42B3, and the non-inclined surface 42B 4.

As shown in fig. 9, 10, and 11, the two non-inclined surfaces 42a4 and 42B4 are parallel to each other, and the opposing inclined surfaces 42a1 and 42B1, the 1 st rising inclined surfaces 42a2 and 42B2, and the 2 nd rising inclined surfaces 42A3 and 42B3 are inclined with respect to the non-inclined surfaces 42a4 and 42B 4.

More specifically, as shown in fig. 9, the two opposing inclined surfaces 42a1, 42B1 are inclined so as to approach the substrate opposing end surface 43A, and the portion of the base material 41 adjacent to the substrate opposing end surface 43A (the portion sandwiched between the two opposing inclined surfaces 42a1, 42B 1) becomes thinner toward the substrate opposing end surface 43A. Similarly, as shown in fig. 10, the two 1 st rising slopes 42a2, 42B2 are inclined so as to approach the 1 st rising end face 43B, and the portion of the base material 41 adjacent to the 1 st rising end face 43B (the portion sandwiched between the two 1 st rising slopes 42a2, 42B 2) becomes thinner at the tip end as it approaches the 1 st rising end face 43B. Similarly, as shown in fig. 11, the two 2 nd rising slopes 42A3, 42B3 are inclined so as to approach each other as they approach the 2 nd rising end face 43C, and the portion of the base material 41 adjacent to the 2 nd rising end face 43C (the portion sandwiched between the two 2 nd rising slopes 42A3, 42B 3) becomes thinner as it approaches the 2 nd rising end face 43C.

As shown in fig. 9, a portion of the one plating layer 44A covering the opposing inclined surface 42a1 is an opposing inclined portion 44A1, and the surface of the opposing inclined portion 44A1 is an opposing inclined surface 45a 1. As shown in fig. 10, the portion covering the 1 st rising slope 42a2 is the 1 st rising slope 44a2, and the surface of the 1 st rising slope 44a2 is the 1 st rising slope 45a 2. As shown in fig. 11, the portion covering the 2 nd rising slope 42A3 is the 2 nd rising slope 44A3, and the surface of the 2 nd rising slope 44A3 is the 2 nd rising slope 45 A3. The opposing inclined surface 45a1, the 1 st rising inclined surface 45a2, and the 2 nd rising inclined surface 45A3 are inclined along the opposing inclined surface 42a1, the 1 st rising inclined surface 42a2, and the 2 nd rising inclined surface 42A3, respectively.

The other plating 44B also has the opposing inclined portion 44B1, the 1 st rising inclined portion 44B2, the 2 nd rising inclined portion 44B3, and the opposing inclined surface 45B1, the 1 st rising inclined surface 45B2, and the 2 nd rising inclined surface 45B3 of the same configuration.

(method of manufacturing terminal 30)

The method for manufacturing the terminal 30 of the present embodiment will be described below.

The method for manufacturing a terminal according to the present embodiment includes: a plating step of performing a plating treatment to form plating layers on both surfaces of a plate material made of a base material to obtain a plated plate; a punching step of performing punching processing on the plated plate to obtain a terminal blank sheet having a plated surface and an exposed surface; and a rolling step of rolling the terminal green sheet to roll the plating layer to form a first inclined surface.

Details of each step will be described below with reference to fig. 13 to 15.

< plating Process >

The plating step is a step of performing a plating treatment to form plated layers 52 on both surfaces of a base material plate 51 to obtain a plated sheet 53 (fig. 13 to 14).

As the plating treatment, a treatment method such as electrolytic plating or electroless plating can be specifically employed. As the plating treatment, one or a combination of two or more of the above specific examples can be used. As the plating treatment, electrolytic plating is preferably employed. In a conventional terminal manufacturing method, for example, when a plating step is performed after a punching step, the punched terminal is hung in an electrolyte solution and plated. In this case, the plating layer becomes thicker in the direction of gravity. In the method of manufacturing a terminal according to the present embodiment, a plate material plated in advance is punched out. Therefore, even if electrolytic plating which is inexpensive and suitable for mass production is employed, it is convenient in terms of being able to control the plating thickness of the terminal to be uniform.

The thickness of the plating layer 52 formed by the plating treatment is, for example, preferably 0.5 μm or more, and preferably 0.7 μm or more, more preferably 0.9 μm or more, and still more preferably 1.0 μm or more. This is preferable from the viewpoint that the generation of cracks in the plating layer 52 can be suppressed even when the plating layer 52 is rolled in the rolling step.

The thickness of the plating layer 52 formed by the plating treatment is, for example, preferably 3.5 μm or less, more preferably 3.3 μm or less, still more preferably 3.1 μm or less, and still more preferably 3.0 μm or less. This is preferable in terms of reducing the cost of plating treatment and ensuring sufficient plating wettability.

< punching step >

The punching step is a step of punching the plated plate 53 to obtain a terminal blank sheet 30P having a plated surface and an exposed surface (fig. 15).

The method of blanking is not limited. As a method of punching, a method of pressing a plated sheet using a press die is specifically exemplified.

The shape of the terminal blank sheet 30P is not limited. As the shape of the terminal green sheet 30P, for example, in the case of manufacturing the terminal 30 of fig. 4, it is preferable to punch out the terminal green sheet 30P as shown in fig. 15. As shown in fig. 15, the terminal blank sheet 30P is provided with two bent portions 34 and 35 and a substrate connecting blank sheet portion 31P serving as a substrate connecting portion 31 so that the terminal 30 can be formed without bending. That is, the terminal green sheet is preferably punched so as to include the bent portion of the terminal. According to this method, it is not necessary to perform bending for forming the bending shape necessary for the substrate connecting portion 31 and the intermediate portion 32 after punching, and it is not necessary to consider the influence of springback. This is preferable in that the dimensional accuracy of the terminal 30 can be improved.

Fig. 16 shows an E-E cross section of the cross section of fig. 15. As shown in fig. 16, the terminal green sheet 30P includes, for example, a green sheet substrate 41P serving as the substrate 41 and a plating layer 44P.

The blank sheet substrate 41P has two plate surfaces 42P covered with the plating layer 44P and a fracture surface 43P formed by punching and connecting the two plate surfaces 42P. The fracture surface 43P is an exposed surface that exposes the blank sheet base 41P without being covered with the plating layer 44P.

< Rolling Process >

In the rolling step, the terminal green sheet is subjected to rolling processing to roll the plating layer, thereby forming the first inclined surface. The method of rolling is not limited, and specific examples thereof include a method of pressing the terminal green sheet with a die.

Thereby, the base material of the terminal green sheet is pressed to form the inclined surface of the terminal. The plating layer of the terminal green sheet is pressed to form the 1 st inclined surface of the terminal.

The substrate joint blank sheet portion 31P is pressed by the rolling process. Thus, the opposing inclined surfaces 42a1, 42B1, the opposing inclined portions 44a1, 44B1, the 1 st rising inclined surfaces 42a2, 42B2, the 2 nd rising inclined surfaces 42A3, 42B3, the 1 st rising inclined portions 44a2, 44B2, and the 2 nd rising inclined portions 44A3, 44B3 are formed.

(average value of plating thickness)

The average value of the plating thicknesses of the opposing inclined portion 44B1, the 1 st rising inclined portion 44B2, and the 2 nd rising inclined portion 44B3 is, for example, preferably 0.5 μm or more, preferably 0.7 μm or more, more preferably 0.9 μm or more, and still more preferably 1.0 μm or more. Preferably 3.5 μm or less, more preferably 3.3 μm or less, still more preferably 3.1 μm or less, and yet more preferably 3.0 μm or less. This provides a terminal having excellent plating uniformity and excellent long-term reliability.

(Standard deviation of coating thickness)

The standard deviation of the plating thickness of the opposing inclined portion 44B1, the 1 st rising inclined portion 44B2, and the 2 nd rising inclined portion 44B3 is, for example, preferably 0.40 μm or less, more preferably 0.35 μm or less, still more preferably 0.30 μm or less, and still more preferably 0.25 μm or less. This provides a terminal having excellent plating uniformity and excellent long-term reliability.

The terminal may be subjected to a bending process after the rolling process, for example. Specific examples of the bending process include a bending process for forming the terminal connecting portion 33, a bending process for forming a bent portion, and the like.

In the method of manufacturing a terminal according to the present embodiment, for example, the punching step is preferably performed so as not to perform a bending process for forming a bent portion. Thus, the influence of the rebound does not have to be considered. This is preferable in that the dimensional accuracy of the terminal 30 can be improved.

(method of manufacturing connector for substrate 20)

A method for manufacturing the substrate connector 20 of the present embodiment will be described.

The board connector 20 of the present embodiment is manufactured by, for example, press-fitting the terminal connection portions 33 into the corresponding terminal press-fitting holes 24 to assemble the plurality of terminals 30 to the connector housing 21.

(method of manufacturing substrate with connector)

The connector-equipped board is manufactured by mounting the board connector 20 to the circuit board 10 by reflow soldering or the like.

The details are described below.

First, solder H is applied in advance to each portion to be soldered on one surface of the circuit board 10. Next, the board connector 20 is placed at a predetermined position on the circuit board 10. At this time, each terminal 30 is disposed on the circuit board 10 in a posture perpendicular to the circuit board 10, the board connection portion 31 is carried on the solder H, and the board facing end surface 43A is disposed so as to face the circuit board 10. Further, the fixing components 27 are also mounted on the solder H.

Next, the circuit board 10 on which the substrate connector 20 is mounted is moved into a reflow furnace, not shown, and the solder H is melted. Thereafter, when the solder H is cooled and solidified, the substrate connection portions 31 of the terminals 30 are adhered to the corresponding conductive paths to be electrically connected, and the fixing parts 27 are adhered to the circuit substrate 10. Thereby, the board connector 20 is fixed to the circuit board 10.

During reflow, the solder H is melted by the heat of the reflow furnace, and as shown in fig. 9, spreads wet on the substrate opposing end surface 43A and the opposing inclined surfaces 42a1, 42B1, and the substrate opposing end surface 43A is buried in the solder H. Here, as shown in fig. 9, in the substrate connection portion 31, the substrate facing end surface 43A facing the circuit substrate 10 and serving as a connection surface to be connected to the circuit substrate 10 is not plated and is an exposed surface where the base material 41 is exposed, and therefore wettability of the solder H may be inferior to that of the plated surface. However, as described above, since the area of the substrate facing end surface 43A is relatively small by rolling, sufficient wettability can be exhibited. Since the opposing inclined surfaces 42a1, 42B1 adjacent to the substrate opposing end surface 43A are inclined toward the circuit substrate 10, the opposing inclined surfaces 42a1, 42B1 also function as connection surfaces connected to the circuit substrate 10. These opposing slopes 42a1, 42B1 are covered with the plating layers 44A, 44B, and the wettability of the solder H is improved, so that the solder H smoothly wets, and a good fillet is formed. This improves the connection reliability of the terminal 30 to the circuit board 10.

The solder H also spreads on the 1 st rising end surface 43B and the 1 st rising slopes 42a2, 42B 2. The 1 st rising end surface 43B is also an exposed surface where the base material 41 is exposed without being plated as in the case of the substrate facing end surface 43A, and therefore wettability of the solder H may be inferior to that of the plated surface. However, since the area of the 1 st rising end surface 43B is relatively reduced by rolling as described above, sufficient wettability can be exhibited. Further, since the 1 st rising inclined surfaces 42a2, 42B2 adjacent to the 1 st rising end surface 43B are covered with the plating layers 44A, 44B, the wettability of the solder H becomes good, and therefore the solder H smoothly wets, and a good fillet can be formed (see fig. 12). If a load is applied to the terminal 30, stress concentration occurs around the 1 st rising end surface 43B, and the solder H may crack. The terminal 30 of the present embodiment is preferably used from the viewpoint that the solder is appropriately wetted around the 1 st rising end surface 43B, and therefore the circuit board 10 and the terminal 30 can be strongly connected to each other.

The same applies to the 2 nd rising end surface 43C and the 2 nd rising inclined surfaces 42a3, 42B 3.

The present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within a range that can achieve the object of the present invention are included in the present invention.