阅读说明：本技术 用于减小晃荡噪声的结构、用于制造这种结构的装置和方法 (Structure for reducing sloshing noise, device and method for manufacturing such a structure ) 是由 V·陶伊特 于 2018-04-16 设计创作，主要内容包括：本发明涉及一种用于减小晃荡噪声的结构,所述结构用于放置在车辆的液体容器中,具有随机布置的互连线,其中,多根线至少部分地以一体的方式与所述结构的至少一根或多根其另外的线结合,其中,所述结构具有至少一个侧面,在所述至少一个侧面的区域中随机布置的互连线至少部分地设有平盖。(The invention relates to a structure for reducing sloshing noise, which is intended to be placed in a liquid container of a vehicle, having randomly arranged interconnecting lines, wherein a plurality of lines is at least partially integrated with at least one or more further lines of the structure in an integrated manner, wherein the structure has at least one side face, in the region of which the randomly arranged interconnecting lines are at least partially provided with a flat cover.)

1. A structure for reducing sloshing noise, the structure being configured to be disposed in a liquid container of a motor vehicle,

-having randomly arranged interconnect lines,

-wherein the plurality of wires are at least partially connected in a material-bonding manner with at least one or more further wires of the structure,

it is characterized in that the preparation method is characterized in that,

the structure has at least one side face, in the region of which a flat cover of randomly arranged interconnection lines is at least partially provided.

2. The structure of claim 1, wherein the first and second electrodes are arranged in a single plane,

it is characterized in that the preparation method is characterized in that,

the flat cover is formed by the fact that the wires assigned to the at least one side are at least partially welded to each other and/or welded together, thereby forming the flat cover.

3. The structure of any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-said at least one side of said structure is substantially completely spanned by said flat cover, or

-said at least one side of said structure is covered over the whole area by said flat cover.

4. The structure of any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-providing at least one web having a parting plane along which the structure is assembled,

-wherein the web is part of the flat cover,

and/or

-the web abuts the flat cover.

5. The structure of any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-providing at least two flat lids arranged on two sides of the structure facing away from each other.

6. The structure of any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-the structure has a higher linear density in a volume portion adjoining the longitudinal side and/or end side and/or cover side than in an inner volume portion adjoining the volume portion of higher linear density.

7. An apparatus for use in the manufacture of a structure,

an extrusion device with randomly arranged interconnecting wires, wherein a plurality of wires are connected at least partially in a material-bonded manner with at least one or more further wires, and

-having at least one post-treatment device destined for making at least a partial flat cover on at least one side of said structure.

8. The apparatus of claim 7, wherein the first and second electrodes are disposed on opposite sides of the substrate,

it is characterized in that the preparation method is characterized in that,

-the post-treatment device has heating means destined to fuse and/or weld the wires of the structure, so as to form the at least partially flat cover,

-wherein the heating device has in particular a heating mirror.

9. The apparatus according to any one of claims 7 and 8,

it is characterized in that the preparation method is characterized in that,

-a heating mirror, in particular for compressing the randomly arranged interconnect lines during heat input, is movable along and opposite to the extrusion direction of the randomly arranged interconnect lines.

10. The apparatus of any one of claims 7 to 9,

it is characterized in that the preparation method is characterized in that,

the post-treatment device has a cooling device designated for cooling the already welded and/or soldered wires, thereby forming the at least partially flat cover, wherein the cooling device has in particular one cooling mirror.

11. The device according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-the cooling mirror is movable along the extrusion direction and opposite to the extrusion direction of the randomly arranged interconnect lines.

12. The device according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-the post-treatment device has at least one anti-adhesive layer provided for bearing on the randomly arranged interconnection lines and destined for supplying heat by the heating means and/or for discharging heat by the cooling means.

13. The device according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

the release layer is provided on a plate which is movable relative to the heating means and/or cooling means, in particular transversely to the extrusion direction of the randomly arranged interconnect lines.

14. The device according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-the post-treatment device has at least one separating means for assembling the structure.

15. The device according to any one of the preceding claims,

it is characterized in that the preparation method is characterized in that,

-providing a device for guiding and directing the extruded randomly arranged interconnect lines,

-having a deflection device for deflecting the extruded randomly arranged interconnect lines one, two or more times, wherein the deflection device is particularly designated for substantially at least partially deflecting the extruded randomly arranged interconnect lines in a meandering manner,

and/or

-having a buffer device, which is designated for diverting the extruded randomly arranged interconnect lines transversely to the extrusion direction in order to free additional extrusion paths.

16. A method for producing a structure, comprising the following method steps:

-extruding and interconnecting wires, thereby forming randomly arranged interconnecting wires, wherein the plurality of wires are at least partly connected in a material-bonded manner with at least one or more further wires;

-manufacturing at least a partially flat cover on at least one side of said structure.

17. The method of claim 16, wherein the first and second light sources are selected from the group consisting of,

it is characterized in that the preparation method is characterized in that,

-manufacturing at least a partial flat cover on at least one side of the structure by welding and/or soldering the wires of the structure, thereby forming the at least partial flat cover.

18. The method of claim 16 or claim 17,

it is characterized in that the preparation method is characterized in that,

-welding the threads of the structure by placing the threads so as to bear on heating means, so as to form the at least partially flat cover.

19. The method according to claim 17 or 18,

it is characterized in that the preparation method is characterized in that,

-cooling by cooling means after fusing and/or welding the wire.

20. The method according to claim 18 or 19,

it is characterized in that the preparation method is characterized in that,

-the heating means and/or the cooling means and/or the heat transfer plates are moved in the direction of the randomly arranged interconnection lines so that they bear on and compress the randomly arranged interconnection lines.

21. The method of any one of claims 16 to 20,

it is characterized in that the preparation method is characterized in that,

-the randomly arranged interconnect lines are deflected at least once, in particular at least twice, in particular in a meandering manner, wherein the flat cover is manufactured in particular by actuating a heating mirror in the direction of a bend formed by the deflection of the randomly arranged interconnect lines,

and/or

-continuously extruding the randomly arranged interconnection lines, wherein the lines are intermittently fused, re-fused and/or welded, wherein the continuously extruded randomly arranged interconnection lines are guided into a buffer memory transversely to the extrusion direction.

Technical Field

The invention relates to a structure for reducing sloshing noise, which is provided to be arranged in a liquid container of a motor vehicle, with a random arrangement of interconnected wires, wherein a plurality of wires are connected at least partially in a material-bonded manner with at least one or more further wires of the structure. Furthermore, the invention relates to a device and a method for producing such a structure.

Background

An advantage of a structure for reducing sloshing noise of the type mentioned at the outset is that, owing to the randomly arranged interconnecting lines, the damping properties of the structure are independent of the direction, in particular in comparison with a cross-laid structure, woven fabric or warp/weft knitted fabric, the thread structure of which in each case follows a predetermined sequence.

In the case of the initially mentioned structures with randomly arranged interconnection lines, they are subjected to an increasing heat input, so that there is a risk that the material-bonded connections between the individual lines are released, so that the structure tears or is at least partially destroyed. Such a heat input to the structure can occur, for example, when manufacturing a liquid container for a motor vehicle.

Thus, the structure for reducing sloshing noise may be engaged with the wall of the liquid container at the first temperature, for example during a blow molding process. That is, the structure is connected to the wall of the liquid container while the wall still has residual temperature from the previous extrusion and is in a plasticized state.

Here, the structure is exposed to a hot blast, wherein the blast reflected by the wall is further heated due to the contact of the blast with the wall still plasticized up to now. The blast reflected by the wall can thus in particular lead to partial disruption of the structure, since the blast reflected by the wall can flow through the structure arranged in the region of the wall and can locally disrupt the structure. Thereby, the damping properties of the structure are reduced and may cause malfunction of valves, lever arm sensors and other active and passive functional units arranged in the inner space of the liquid container.

Disclosure of Invention

Starting from the prior art described above, the invention is based on the following technical objects: a structure for reducing sloshing noise, a device and a method for producing the structure are specified which do not have the above-mentioned disadvantages, or at least do so to a lesser extent, wherein a more heat-resistant structure for blow molding processes can be specified.

The above technical objects are in each case achieved by a structure according to claim 1, an apparatus according to claim 7, and a method according to claim 16. Further design embodiments of the invention emerge from the dependent claims and the following description.

According to a first aspect, the invention relates to a structure for reducing sloshing noise, the structure being provided to be arranged in a liquid container of a motor vehicle, having randomly arranged interconnecting lines, wherein a plurality of lines are connected at least partially in a material-bonded manner with at least one or more further lines of the structure. The structure has at least one side face, in the region of which a flat cover of randomly arranged interconnection lines is at least partially provided.

The flat cover may serve to partially protect the structure against the ingress of blow air during the joining process, in particular to withstand reflected blow air. For example, the flat cover can be arranged such that during the blow molding process described at the outset, reflected blow air strikes the flat cover when the structure is engaged, thus at least partially preventing flow through the structure. In other words, at least the entry of blow air, in particular reflected blow air, into the structure can be minimized.

By "randomly arranged" herein is meant that the lines of the structure are arranged with respect to each other in a sequence that does not follow any predetermined order, but that the characteristics of, for example, a woven, knitted or warp/weft fabric follow a predetermined sequence. More precisely, the wires of the structure form chaotic wire tangles or are intertwined with each other in a random spatial arrangement into clusters. In other words, the lines are interconnected in a random spatial network structure.

The plurality of wires may be at least partially interconnected in a material-bonded manner with at least one or more additional wires of the structure, thereby forming a substantially unitary structure. By "substantially unitary" it is presently meant that the random arrangement does not include any loose removable threads. The wires of the structure are thus fixedly integrated into the random structure in a form-and/or material-bonded manner, so that the function of the valve or lever arm sensor, which can be arranged in the liquid container, is not impeded by a single wire released from the structure.

According to a further embodiment, each thread of the structure can be connected in a material-bonded manner to at least one or more further threads of the structure. In this case, the threads form a monolithic structure, so that no one thread can be released from the random structure in a non-destructive manner.

The randomly arranged plurality of interconnected wires may essentially consist of a large number of individual plastic material wires, which may be made of PE (polyethylene) or PP (polypropylene). The strand of plastics material may be constructed in multiple layers, wherein, for example, the core strand may be coated with one or more further plastics materials. Alternatively or additionally, the wire may be configured to be hollow and thus tubular, thereby achieving a high stiffness of the structure and at the same time reducing weight and material input.

More than 90%, preferably more than 95%, further preferably more than 98% of the threads of the structure can be connected in a material-bonded manner with one or more other threads of the structure.

The number of connection points can be determined in a non-destructive manner by imaging methods, for example, by Raster Electron Microscopy (REM), or by Computed Tomography (CT). In addition, damaged material bond attachment points on each wire may be verified by releasing the wire from the structure.

It may be provided that the structure does not have any suction effect on the liquid stored in the container, in particular no suction effect or substantially no capillary effect on the fuel stored in the fuel tank.

It can be provided that each thread of the structure is connected in a material-bonding manner to at least one or more further threads of the structure. In this case, the threads form a unitary structure such that no one thread can be released from the structure in a non-destructive manner.

A plurality of randomly arranged connection points, in particular local welding points of intersecting lines, may be provided within the structure.

The structures may have wires of different wire thicknesses or diameters, wherein the wires in the first region of the structure may in particular have a larger diameter than the wires in the second region. This can be achieved by providing grooves of different diameters in the mould used to form the wire matrix. In this way, the structure may have regions of different stiffness. For example, the wire provided for linking the structure to the wall of the liquid container may have a larger diameter than the wire in the region facing away from the wall in the finished state. Thus, the sandwich material type structure may have structural layers of different stiffness and/or density.

Alternatively or additionally, the structure may have wires of different materials, wherein the wires in the first region are in particular made of a first material and the wires in the second region are made of a second material. This may be achieved by feeding different materials into the mould for shaping the wire of the structure. For example, the area provided for linking the structure to the wall of the liquid container may comprise a line made of a first material and the area facing away from the wall in the finished state comprises a line made of a second material. Thus, a structure in the form of a sandwich material may have structural layers of different materials.

The structure may be made of one or more plastic materials in a single layer or in multiple layers. The structure may essentially consist of a plurality of individual plastic material threads, which may be made of PE (polyethylene) or PP (polypropylene). The strand of plastics material may be constructed in multiple layers, wherein, for example, the core strand may be coated with one or more further plastics materials. Alternatively or additionally, the wire may be configured to be hollow and thus tubular, thereby enabling a high stiffness of the structure and simultaneously a low weight and a low material input.

It may be provided that the flat cover is at least partly or completely provided by fastening cover elements, which are provided separately from the randomly arranged interconnection lines. For example, a material that is more heat-resistant than the material of the wires can be used for this purpose, for example, in order to at least partially protect the randomly arranged interconnection wires from the ingress of air blows.

According to a further embodiment of the construction, it is provided that the flat lid is formed by at least partially welding the lines assigned to the at least one side to one another and/or to one another. Thus, the flat lid may be at least partially established by welding and/or fusing lines, thereby forming a flat lid. Thus, the flat cover can be manufactured at least partially in a cost-effective manner without any additional material input. In addition, a separate cover element may be provided as already described above.

According to another design embodiment, the flat lid may consist entirely of the material of the thread, so that the flat lid is completely built up by welding and/or welding the thread, thereby forming the flat lid. Thus, the flat cover can be manufactured in a cost-effective manner without any additional material input.

It can be provided that at least one side of the structure is substantially completely spanned by the flat cover. When reference is made so far to a flat cover which substantially completely spans at least one side, said flat cover may thus have some or more gaps or passage openings, that is to say some or more gaps or free peripheries. In this case, the entry of air blows, which impact the structure in the region of the side during joining, can be largely, but not completely, prevented.

Alternatively, it can be provided that at least one side of the structure is covered over the entire area by a flat cover and is free of any gaps. In this case, the cover is formed as a completely closed protective hood which prevents the ingress of air blasts which impact the structure in the region of the side faces during joining.

Provision may be made for at least one web to be provided with a separating surface along which the structure is assembled, wherein the web is part of the flat cover and/or wherein the web adjoins the flat cover.

By means of the webs, the structure can be assembled without cutting individual threads of the structure, which cut threads may be released from the structure in the fully assembled state of the structure and may be able to interfere with the function of the liquid container.

The webs and/or the separating surfaces can be made of a solid material and/or be designed such that they are closed over the entire area. For example, the web may be manufactured by welding or re-welding and/or welding the lines of the structure, respectively. It is thereby possible to avoid the creation of free thread stubs in the area of the separation locations along the structure to be cut, which would hamper the easy handling of the structure.

The web may be formed to protrude and at least partially protrude beyond the sides of the structure. Thus, it is possible to ensure that the structure is assembled at a certain pitch from randomly arranged interconnect lines and to avoid cutting to individual lines adjoining the web.

For example, the structure may possess a substantially cuboid volume. In other words, the envelope of the randomly arranged interconnect lines comprising the flat caps may possess a volume of substantially a cuboid. The webs may extend to protrude beyond the end faces and/or side faces and/or cover faces bounding such a cuboid volume.

According to a further embodiment of the arrangement, it can be provided that at least two flat covers are provided, which are arranged on two sides of the arrangement facing away from each other. Thus, the random structure of the interconnect line may be at least partially shielded on at least two sides. It can be provided that the structure has exactly two flat covers. It may be provided that the structure has three or more flat lids.

In the case of a structure having a substantially cuboid volume, the cover can be arranged, for example, in the region of two end sides of the cuboid volume facing away from one another. Alternatively or additionally, one or more covers may be arranged in the region of the longitudinal sides and/or cover faces of the cuboid volume.

It can be provided that the structure has a local compression of the lines. Thereby, the blast flow through the structure in this area during assembly of the structure may be reduced, or the blast into the structure may be reduced.

It can be provided that the linear density of the structure in a volume section adjoining the longitudinal side and/or the end side and/or the cover side is higher than the linear density in an interior volume section adjoining this volume section of higher linear density. Thereby, the blast flow through the structure in this area during assembly of the structure may be reduced, or the blast into the structure may be reduced.

A higher linear density volume portion may be arranged, for example, between the cover and the inner volume portion, thereby at least partially shielding the inner volume portion.

The structure may be substantially rectangular parallelepiped or possess or fill the volume of a substantially cuboid, respectively. The flat cover can be arranged, for example, in the region of the end face or in the region of the two end faces facing away from one another. The volume portion of higher line density may be provided in the region of the longitudinal side or the cover side adjoining the end side.

For example, two volume portions of higher linear density may have a mutual spacing and contain an inner volume portion of lower linear density. Incorporating one or more flat covers in the region of these or further sides, blow-through into the structure can be minimized.

It can be provided that more than 50% of one side of the randomly arranged interconnect lines is covered by the flat lid. This may be, for example, a side of a substantially cuboid structure, wherein the randomly arranged interconnect lines define a volume of the substantially cuboid, or the envelope of the randomly arranged interconnect lines are respectively substantially cuboid.

It can be provided that more than 70%, in particular more than 90%, of one side of the randomly arranged interconnect lines is covered by a flat cover in order to shield the randomly arranged interconnect lines from e.g. hot blast air.

According to a second aspect, the invention relates to an apparatus for producing a structure, having an extrusion apparatus for producing randomly arranged interconnecting lines, wherein a plurality of lines are connected at least partially in a material-bonded manner with at least one or more further lines, and having at least one post-treatment device which is designated for producing at least partially flat covers on at least one side of the structure.

The extrusion device may be designated for continuously extruding randomly arranged interconnect lines.

The extrusion device may be designed for extruding randomly arranged interconnect lines, for example as a mat product, which is substantially rectangular in cross-section when viewed transversely to the extrusion direction.

The extrusion device may be designed to first melt the plastic material granules, thereby forming a homogeneous plastic material compound that can be extruded. The plastics material compound can be extruded by an extruder, for example through a die, which may each have a grid or matrix of mutually spaced openings. The opening may be circular, for example. The plastic material compound passing through the die may be divided into a number of mutually spaced, continuously extruded individual threads, which may extend substantially parallel to each other, in particular in the case of a vertical extrusion direction. The matrix of wires formed in this way can be shaped so as to form randomly arranged interconnection wires, wherein, for example, the individual wires are deflected transversely to the extrusion direction and are respectively glued or soldered to adjacent wires. Here, it is sufficient to deflect, for example, individual threads of an extruded thread matrix which have been extruded continuously as parallel individual threads, to start winding or mixing the thread matrix separately over the entire matrix cross section. As soon as the still plasticized plastic material threads contact one another in the region of their outer lateral surfaces, a bonded material connection between the respective threads is formed in the contact region. After the wire interconnection, the resulting random arrangement may be cooled in a water bath or the like, thereby fixing the random network structure with local material bonding of the wire connections according to its shape.

The post-processing device may be designated for fastening a cover element provided separately from the randomly arranged interconnect lines to at least one side of the randomly arranged interconnect lines.

It can be provided that the post-treatment device has a heating device which is designated for fusing and/or welding the wires of the structure, so that an at least partially flat cover is formed, wherein the heating device has in particular a heating mirror. Thus, a cost-effective manufacturing method of the cover may be provided, wherein the wires are pressed onto the heated mirror or onto a plate supported on the heated mirror and are respectively welded or re-welded to form a flat cover, and/or welded to form a flat cover.

The heating mirror, in particular for compressing the randomly arranged interconnect lines during heat input, can be moved along and opposite to the extrusion direction of the randomly arranged interconnect lines. The heating mirror can be moved in particular parallel to the extrusion direction of the randomly arranged interconnect lines. Thus, in operation of the device, the heated mirror may be actuated in the direction of the randomly arranged interconnect lines extruded by the extrusion device.

The heating mirrors may be actuated in the direction of the randomly arranged interconnect lines, thereby simultaneously compressing and heating the randomly arranged interconnect lines by the heating mirrors.

The aftertreatment device may have a cooling device which is designed to cool the already welded and/or soldered lines, so that an at least partially flat cover is formed, wherein the cooling device has in particular a cooling mirror. The flat lids can be fixed by cooling means according to their shape, wherein the re-melted and/or welded wire material solidifies due to the outflow of heat. Furthermore, due to the cooling, a non-destructive release or lifting of the structure from the post-treatment device, respectively, can be achieved. Cooling can be achieved in that the flat cover is pressed onto the cooling mirror or onto a plate supported on the cooling mirror.

The heating device may be designated for heating the wire to a temperature above the melting temperature of the wire.

The cooling means may be designated for cooling the wire, which has been welded or re-welded and/or welded, respectively, to form the flat cover, to a temperature below the melting temperature of the wire.

The heating means and the cooling means may be integrated on separate plates. Therefore, a combination of a heating mirror and a cooling mirror may be provided, thereby generating a temperature change.

The cooling mirror is movable along and opposite to the extrusion direction of the randomly arranged interconnect lines. In particular, the cooling mirror can be moved parallel to the extrusion direction of the randomly arranged interconnect lines. Thus, in operation of the device, the cooling mirror may be actuated in the direction of the randomly arranged interconnect lines extruded by the extrusion device.

In order to avoid any adhesion of the wires on the post-treatment device, the post-treatment device may have at least one anti-adhesive layer which is provided for bearing on the randomly arranged interconnection wires and which is designated for supplying heat by means of a heating device and/or for discharging heat by means of a cooling device.

An anti-adhesive layer and/or an anti-adhesive coating may be provided on the heated mirror.

An anti-adhesive layer and/or an anti-adhesive coating may be provided on the cooling mirror.

It may be provided that the anti-adhesive device is provided separately from the heating device and/or the cooling device.

According to a further embodiment of the invention, it is provided that the release layer is provided on a plate which is movable relative to the heating device and/or the cooling device, in particular transversely to the extrusion direction of the randomly arranged interconnection lines.

The plate provided with the anti-adhesive layer is arranged so that it bears on randomly arranged interconnection lines, thereby enabling indirect heat input to the heating means and/or heat output to the cooling means.

The plate provided with the release layer on one side can be supported on the heating device and on the side facing away from the side can be supported on randomly arranged interconnection lines.

For heating, provision may be made for the heating device to be brought into contact first with the plate provided with the release layer. The heating device can then be removed and the cooling device can be brought into contact with the plate provided with the anti-adhesive layer.

Alternatively or additionally, the plate provided with the release layer on one side can be supported on a cooling device and on the side facing away from the side can be supported on randomly arranged interconnection lines.

The aftertreatment device has at least one separation device for assembling the structure. Thus, the structures can be assembled in particular to the dimensions envisaged for the final assembly, for example by means of separating means for stamping or cutting.

A further design embodiment of the apparatus is characterized in that a device for guiding and directing the extruded randomly arranged interconnect lines is provided, which device has a deflection device for deflecting the extruded randomly arranged interconnect lines once, twice or more, wherein the deflection device is particularly designated for deflecting the extruded randomly arranged interconnect lines substantially at least partially in a meandering manner.

One or more heating means may be assigned to the deflection arrangement in order to simultaneously re-fuse and/or solder randomly arranged interconnect lines at two or more locations, thereby forming a flat lid.

As an alternative or in addition to the deflection device, the device for guiding and directing may have a buffer device which is designated for deflecting the extruded randomly arranged interconnect lines transversely to the extrusion direction, thereby releasing additional extrusion paths. Thus, while the randomly arranged interconnect lines continue to be continuously extruded into the buffer memory, intermittent soldering and/or re-soldering may be performed, whereby backlashes of the randomly arranged interconnect lines in the region of the heating device may be avoided.

At least two or more aftertreatment devices may be provided. The number of heating devices may be adapted to the envisaged extrusion rate and welding time, so that a continuous extrusion at a constant rate may be achieved.

According to a third aspect, the invention relates to a method for manufacturing a structure, comprising the following method steps:

-extruding and interconnecting wires, thereby forming randomly arranged interconnecting wires, wherein the plurality of wires are at least partly connected in a material-bonded manner with at least one or more further wires;

-manufacturing at least a partial flat cover on at least one side of the structure.

In extrusion, the plastic material granules may first be welded, thereby forming a homogeneous plastic material compound that can be extruded. The plastic material compound can be extruded by an extruder, for example, through a die, which can each have a grid or matrix of a plurality of openings spaced apart from one another. The opening may be circular, for example.

By passing through the matrix, the plastic material compound can be separated into a plurality of mutually spaced, continuously extruded individual threads, which can run substantially parallel to one another, in particular in the case of a vertical extrusion direction.

The matrix of interconnected wires may be shaped to form randomly arranged interconnecting wires, such that, for example, individual wires are deflected transversely to the extrusion direction and are respectively bonded or welded to adjacent wires.

It is sufficient to deflect individual threads of a thread matrix, which have been continuously extruded as parallel individual threads, for example, to start winding or mixing the thread matrix separately over the entire matrix cross section. As soon as the still plasticized plastic material threads contact one another in the region of their outer lateral surfaces, a bonded material connection between the respective threads is formed in the contact region. After interconnection of the wires, the resulting random structure may be cooled in a water bath or the like, thereby fixing the random network structure with local material bonding of the wire connections according to its shape.

After the structure emerges from the water bath, the structure may be dried, in particular air-dried.

According to a further embodiment of the method, it is provided that the at least partially flat cover is produced on at least one side of the structure by welding and/or soldering the threads of the structure, thereby forming an at least partially flat cover.

According to a further embodiment of the method, the welding of the threads of the structure to form at least a partial flat cover is performed by laying the threads for bearing on a heating device.

According to a further embodiment of the method, it is provided that the welding and/or soldering line is subsequently cooled by a cooling device.

The adhesion of the wire to the heating means may be higher than the mutual cohesion of the wires. By cooling in combination with the anti-adhesive layer, a non-destructive lifting from the heating device and/or the plate provided with the anti-adhesive layer can be achieved. The plate with the release coating may be used as a heat transfer element during the heating phase and/or the cooling phase.

According to a further embodiment of the method, it is provided that the heating device and/or the cooling device and/or the heat transfer plate is moved in the direction of the randomly arranged interconnection lines, so that it bears on the randomly arranged interconnection lines and compresses the randomly arranged interconnection lines.

In order not to cause the wires to continue to adhere when lifting the heat transfer plates after the melting and compression process when critical thermoplastic materials are used, a corresponding temperature change management of the heat transfer plates is required. Materials having a cohesion which is less than the adhesion of said materials with respect to the heat transfer plate are referred to herein as critical materials. The temperature change is applied to the contact surfaces of the heat transfer plates supported on the wire and managed so as to bring the temperature above the melting temperature of the material upon melting and compression and to reach a surface temperature below the melting temperature of the material just before the contact surfaces are raised from the melt.

According to a further embodiment of the method, it is provided that the randomly arranged interconnect lines are deflected at least once, in particular at least twice, in particular in a meandering manner, wherein the flat cover is produced, in particular by actuating the heating mirror in the direction of the bend formed by the deflection of the randomly arranged interconnect lines.

According to a further embodiment of the method, provision is made for randomly arranged interconnection lines to be extruded continuously, wherein the lines are welded, re-welded and/or welded intermittently, wherein the continuously extruded randomly arranged interconnection lines are guided into a buffer memory transversely to the extrusion direction. Thereby backlog can be prevented.

The randomly arranged interconnect lines may be at least partially dried, in particular air dried, before being supplied to the buffer memory.

The buffer memory can be depleted after the re-welding and/or soldering, and the material can be transported out of the buffer memory and provided to the next post-processing step. In the next intermittent post-processing step, the buffer memory is replenished.

After the curing, the structure in the region of the web may be partially or completely separated.

Drawings

The invention will be described in more detail below by means of the appended drawings showing exemplary embodiments. In the drawings, there are shown by way of example in each case:

FIGS. 1A, 1B illustrate a structure according to the present invention;

FIG. 2 illustrates an apparatus and method for fabricating a structure; and

fig. 3 illustrates an apparatus and method for fabricating a structure.

Detailed Description

Fig. 1 shows a structure 2 for reducing sloshing noise. The structure 2 is arranged to be arranged in a liquid container of a motor vehicle. The structure 2 has randomly arranged interconnection lines 4, which are locally soldered to one another in the region of its envelope surface. One such partial weld 5 is shown in the enlarged portion of fig. 1A.

The plurality of threads 4 is at least partially connected in a material-bonded manner with at least one or more further threads 4 of the structure 2.

The structure 2 has at least one side 6, in the region of which at least partial flat caps 8 of randomly arranged interconnection lines 4 are provided.

The flat lid 8 has been formed in that the threads 4 assigned to at least one side 6 have been at least partially welded to each other and/or welded together, so that the flat lid 8 is formed. The flat cover 8 is now made of the material of the thread 4. The wire 4 is currently made of thermoplastic material.

Fig. 1B depicts a situation in which at least one side 6 of the structure 2 is covered over the entire area by a flat cover 8. Thus, in the case of fig. 1B, the flat cover 8 of the side face 6 has no gap. According to an alternative embodiment, it can be provided that the flat lid has a gap in the region in which the wires are not welded and/or fused or re-fused to one another in each case, so that a continuous surface is formed.

A web 12 having a parting plane 14 is provided, along which parting plane 14 the structure 2 is assembled.

The web 12 is part of the flat lid 8 and adjoins the flat lid 8. The web 12 is now formed so that the web 12 is integral with the flat lid 8 by welding or re-welding the wires 4 of the structure 2, respectively. The web 12 consists of a solid material and the parting plane 14 is closed over the entire area.

The structure 2 according to fig. 1B now has a second flat cover 16. According to fig. 1B, a second flat cover 16 is arranged on a side 18 of the structure 2 facing away from the side 6 and is likewise formed by respectively welding or re-welding and/or welding the line 4.

The linear density of the structure 2 according to fig. 1B is in each case higher in the volume sections 24, 26 adjoining the longitudinal sides 20 and 22 than in the interior volume sections 28 adjoining the volume sections 24, 26 of higher linear density.

The structure 2 is at present substantially cuboid or respectively has a cuboid volume.

Figure 2 shows an extrusion device 32 for manufacturing randomly arranged interconnect lines 4. In the manufacture of randomly arranged interconnect lines 4, a plurality of lines 4 are connected at least partly in a material-bonded manner with at least one or more further lines 4.

A post-treatment device 34 is provided, said post-treatment device 34 being destined for manufacturing at least part of the flat covers 8, 16 of the sides 6, 18 of the structure 2 to be manufactured.

The aftertreatment device 34 has a heating device 36. The heating means 36 are destined to weld and/or weld the wires 4 of the structure 2, thus forming at least part of the flat lids 8, 16. The heating device 36 has a heating mirror 38. The heating mirror 38 is movable along an extrusion direction 40 of randomly arranged interconnect lines 4, opposite to said extrusion direction 40 and transverse to the extrusion direction 40.

The post-treatment device 34 has a cooling device 42, said cooling device 42 being designated for cooling the already welded and/or soldered line 4, thereby forming at least part of the flat covers 8, 16, wherein the cooling device 42 has a cooling mirror 44.

The cooling mirror 44 is movable along the extrusion direction 40 of the randomly arranged interconnect lines 4, opposite to the extrusion direction 40 and transverse to the extrusion direction 40.

The aftertreatment device 34 has a release layer 46 disposed on a plate 48. The anti-adhesion layer 46 of the plate 48 is arranged to bear on the randomly arranged interconnect lines 4. Heat input is made from the heating device 36 to the randomly arranged interconnect lines through the plate 48. The heat output by means of the cooling device 42 is likewise effected via the plate 48.

Further heating means 39, further cooling means 41 and further heat transfer plates 43 may be provided.

The heating means and the cooling means may be brought into contact with the plate 48 on the side thereof facing away from the wire structure 4, so that a temperature change is achieved. The heated mirror can thus be removed from the position on the plate 48 shown in fig. 2, wherein the cooled mirror 44 is then supported on the plate 48. In each case, the plate 48 serves as a heat transfer element for inputting heat to the wire 4 and outputting heat from the flat covers 8, 16.

An apparatus 52 for guiding and directing the extruded randomly arranged interconnect lines 4 is provided. The device 52 for guiding and directing has a deflection device 54, which deflection device 54 is designated for deflecting the extruded randomly arranged interconnect lines 4 in a substantially meandering manner.

Furthermore, the device 52 for guiding and directing has a buffer device 56, which buffer device 56 is designed to divert the extruded randomly arranged interconnect lines 4 transversely to the extrusion direction 40, thereby releasing an additional extrusion path 58.

A method for producing the structure 2 will be described below, which method has the following method steps:

extruding and interconnecting wires 4, thereby forming randomly arranged interconnecting wires 4, wherein the plurality of wires 4 are at least partly connected in a material-bonded manner with at least one or more further wires;

-manufacturing at least a partially flat cover on at least one side of said structure.

In order to provide a random arrangement of interconnecting wires 4, a plastic material is first melted in an extruder 60 and guided through a die 62, thereby providing a wire matrix 64, the wires 4 of which wire matrix 64 extend in a mutually parallel manner and with a mutual spacing.

The line matrix 64 is guided on rollers 66, wherein the mutual distance of the rollers 66 is smaller than the width of the line matrix. The outer wires 68 of the wire matrix are thereby offset inwardly in the direction of the inner wires 70 of the wire matrix 64, said outer wires 68 being welded in the region of their circumferential lateral surface. The arrangement of the random interconnection lines which are locally welded to one another and which are formed in this way can then be cooled and set, in particular in a water bath 72.

The arrangement of the random interconnection lines 4 may be set based on at least partial cooling. In particular, the randomly arranged interconnect lines 4 may be formed, in particular integrally. This means that each wire 4 of the randomly arranged interconnection wires 4 is locally soldered to at least one further wire 4 in the region of its mantle surface or in any case cannot be released from the structure in a non-destructive manner.

The arrangement of random interconnection lines 4 continuously extruded in this way is then fed to a post-process.

The flat lids 8, 16 are manufactured by welding and soldering the line 4 by means of a post-processing device 34. In the intermittent welding process, the bundle of randomly arranged interconnection lines 4, which continues to be continuously extruded, is extruded at a constant rate in a continuous manner, wherein the material is guided transversely to the extrusion direction 40 into the buffer device 56, so that backlogs in front of the post-processing device 34 are avoided.

After the intermittent welding in the area of the after-treatment device 34, the buffer store is depleted again and the material guided in the loop 58 of the buffer store 56 is fed to the after-treatment device 34.

As follows from the figures, the arrangement of random interconnection lines 4, which are continuously extruded in the region of the post-treatment device 34, is stacked in a meandering manner, so that a plurality of flat lids 8, 16 can be welded simultaneously.

Welding takes place in the region of the outer curve 74, wherein the respective separating device 50 is arranged on a fold 76 which is bent away from the outer curve. The separating element 50 or the separating device 50 can be actuated after welding or re-melting the lines 4 to form the flat lids 8, 16, respectively, so that only a narrow web 12 made of solid material remains.

The structure 2 may then be separated from the web by a separation device. Alternatively or additionally, the separation of the structure 2 from the continuous material may be carried out by manual cutting or by a separate cutting device downstream.