阅读说明：本技术 一种导电胶及其制备方法 (Conductive adhesive and preparation method thereof ) 是由 凌发林 于 2019-12-05 设计创作，主要内容包括：本发明的一种导电胶的制备方法是按照比例称取原料特高己烯基含量生胶、生胶、硅油、含氢硅油、脱模剂、蓝色素和导电炭黑,然后充分混合均匀后投入搅拌机中进行搅拌,升温后恒温处理得到导电胶粗品,将导电胶粗品通过检验、抽真空出料、晾胶、包辊和滤胶即得所述的导电胶,导电胶中不含有金、银、镍等重金属,极大降低了生产成本,并且没有环境污染,该导电胶具有优良的导电功能,表面电阻值为50～1000Ω,且具有优良的耐高低温性能,可在-50～200℃下使用,在臭氧、辐射线环境中不易被氧化、讲解,化学稳定性好,具有优良的憎水、防潮、抗震及生理惰性等,本发明的导电胶还具有良好的耐高温、耐低温和导电性,能够满足潮湿,沙石,水下等复杂应用环境的要求。(The preparation method of the conductive adhesive comprises the steps of weighing raw rubber, silicon oil, hydrogen-containing silicon oil, a release agent, a blue pigment and conductive carbon black with ultrahigh hexenyl content according to a proportion, fully and uniformly mixing the raw rubber, putting the raw rubber, the silicon oil, the hydrogen-containing silicon oil, the release agent, the blue pigment and the conductive carbon black into a stirrer for stirring, heating and carrying out constant temperature treatment to obtain a crude conductive adhesive product, and carrying out inspection, vacuum pumping and discharging, adhesive airing, roll wrapping and adhesive filtering on the crude conductive adhesive product to obtain the conductive adhesive, wherein the conductive adhesive does not contain heavy metals such as gold, silver, nickel and the like, so that the production cost is greatly reduced, in addition, the environmental pollution is avoided, the conductive adhesive has an excellent conductive function, a surface resistance value of 50-1000 omega, and excellent high and low temperature resistance, can be used at the temperature of-50-200 ℃, is not easy to oxidize and explain in ozone and environment, has, the conductive adhesive also has good high temperature resistance, low temperature resistance and conductivity, and can meet the requirements of complex application environments such as moisture, sand, underwater and the like.)

1. A conductive adhesive is characterized in that: the preparation raw materials of the conductive adhesive comprise: raw rubber with ultra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black.

2. The conductive adhesive according to claim 1, wherein: the conductive adhesive comprises the following components in parts by weight:

3. a conductive paste according to any one of claims 1 or 2, wherein: the relative molecular weight of the raw rubber with the ultra-high hexenyl content is (50-60) x 10 ⁴The vinyl content of the raw rubber with the ultra-high hexenyl content is 4-5 wt%.

4. A conductive paste according to any one of claims 1 or 2, wherein: the raw rubber is selected from one or more of smoked sheet rubber, standard rubber, styrene butadiene rubber, cis-butadiene rubber, butyl rubber, chloroprene rubber or butadiene-acrylonitrile rubber.

5. A conductive paste according to any one of claims 1 or 2, wherein: the viscosity of the silicone oil is 300-500 cP.

6. A conductive paste according to any one of claims 1 or 2, wherein: the hydrogen content of the hydrogen-containing silicone oil is 1-1.5 wt%.

7. A conductive paste according to any one of claims 1 or 2, wherein: the release agent is selected from any one or more of siloxane compound, silicone grease, silicone resin, silicone rubber, polytetrafluoroethylene and fluororesin.

8. A conductive paste according to any one of claims 1 or 2, wherein: the particle size of the conductive carbon black is 30-200 nm, and the purity of the conductive carbon black is 90-99.9 wt%.

9. A preparation method of conductive adhesive is characterized by comprising the following steps: the preparation method of the conductive adhesive comprises the following steps:

s1, weighing raw rubber with extra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black according to the proportion, and then fully and uniformly mixing to obtain a conductive rubber premix;

s2, putting the conductive adhesive pre-mixture prepared in the step S1 into a stirrer for stirring, heating to 140-180 ℃ for 3-4 hours, and then carrying out constant-temperature treatment for 20-40 min to obtain a crude conductive adhesive product;

s3, the conductive adhesive is obtained by checking, vacuumizing and discharging, drying, wrapping rollers and filtering the crude conductive adhesive prepared in the step S2.

Technical Field

The invention relates to the field of glue and preparation thereof, in particular to conductive glue and a preparation method thereof.

Background

The conductive adhesive is an adhesive which has certain conductivity after being cured or dried. It can connect multiple conductive materials together to form an electrical path between the connected materials. In the electronics industry, conductive adhesives have become an indispensable new material. The variety of the conductive adhesive is various, and the conductive adhesive can be divided into a general conductive adhesive and a special conductive adhesive from the application angle. The general conductive adhesive only has certain requirements on the conductivity and the adhesive bonding strength of the conductive adhesive, and the special conductive adhesive has certain special requirements on the conductivity and the adhesive bonding strength. Such as high temperature resistance, ultra-low temperature resistance, instant curing, anisotropy, transparency and the like.

The conductive adhesive has the functions of conducting, radiating and bonding, and overcomes the defects of infirm joint, part deformation, reduced application performance and the like of a welding method. With the miniaturization and weight reduction of electric and electronic devices, conductive adhesives have become an indispensable material in the electronic industry. Conductive adhesives are widely used in electrical components and parts such as large scale integrated circuits, detectors, body sensors, photosensors, cameras, and instrument waveguides. Low cost printed wiring boards can be manufactured using this technique. Conductive paste has thus made a great contribution to the development of microelectronic packages.

Most of conductive adhesives in the current market realize conductivity by adding gold, silver, copper, aluminum, zinc, iron, nickel powder and the like, but the addition of a large amount of heavy metals not only greatly increases the production cost, but also influences the personal health and pollutes the environment.

Disclosure of Invention

In order to solve the problems, the invention provides a conductive adhesive and a preparation method thereof, wherein the contents of the conductive adhesive are as follows:

the invention aims to provide a conductive adhesive, which is technically characterized in that: the preparation raw materials of the conductive adhesive comprise: raw rubber with ultra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black.

In some embodiments of the present invention, the conductive adhesive comprises the following components in parts by weight:

in some embodiments of the invention, the extra-high hexenyl content raw gum has a relative molecular weight of (50-60) × 10 ⁴The vinyl content of the raw rubber with the ultra-high hexenyl content is 4-5 wt%.

In some embodiments of the present invention, the raw rubber is selected from any one or more of smoked sheet rubber, standard rubber, styrene-butadiene rubber, cis-butyl rubber, chloroprene rubber or nitrile-butadiene rubber.

In some embodiments of the invention, the viscosity of the silicone oil is 300 to 500 cP.

In some embodiments of the present invention, the hydrogen content of the hydrogen-containing silicone oil is 1 to 1.5 wt%.

In some embodiments of the present invention, the release agent is selected from any one or more of siloxane compound, silicone grease, silicone resin, silicone rubber, polytetrafluoroethylene, and fluorine resin.

In some embodiments of the present invention, the particle size of the conductive carbon black is 30 to 200nm, and the purity of the conductive carbon black is 90 to 99.9 wt%.

Another object of the present invention is to provide a method for preparing a conductive adhesive, which comprises the following steps: the preparation method of the conductive adhesive comprises the following steps:

s1, weighing raw rubber with extra-high hexenyl content, raw rubber, silicone oil, hydrogen-containing silicone oil, a release agent, blue pigment and conductive carbon black according to the proportion, and then fully and uniformly mixing to obtain a conductive rubber premix;

s2, putting the conductive adhesive pre-mixture prepared in the step S1 into a stirrer for stirring, heating to 140-180 ℃ for 3-4 hours, and then carrying out constant-temperature treatment for 20-40 min to obtain a crude conductive adhesive product;

s3, the conductive adhesive is obtained by checking, vacuumizing and discharging, drying, wrapping rollers and filtering the crude conductive adhesive prepared in the step S2.

Compared with the prior art, the invention has the beneficial effects that:

the conductive adhesive disclosed by the invention does not contain heavy metals such as gold, silver, nickel and the like, so that the production cost is greatly reduced, no environmental pollution is caused, the conductive adhesive has an excellent conductive function, the surface resistance value is 50-1000 omega, the conductive adhesive has excellent high and low temperature resistance, the conductive adhesive can be used at the temperature of-50-200 ℃, the conductive adhesive is not easily oxidized or explained in ozone and radiation environments, the chemical stability is good, and the conductive adhesive has excellent hydrophobicity, moisture resistance, shock resistance, physiological inertia and the like.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below so that those skilled in the art can better understand the advantages and features of the present invention, and thus the scope of the present invention will be more clearly defined. The embodiments described herein are only a few embodiments of the present invention, rather than all embodiments, and all other embodiments that can be derived by one of ordinary skill in the art without inventive faculty based on the embodiments described herein are intended to fall within the scope of the present invention.