阅读说明：本技术 一种研磨装置 (grinding device ) 是由 陶胜 冯鸣鸣 王春林 周行灿 吴伟力 于 2019-10-24 设计创作，主要内容包括：本发明提供一种研磨装置,包括机架、载台以及研磨轮,其中：载台包括支架及至少一个基台,支架具有悬臂、且可移动地安装于机架,基台可自转地安装于悬臂,基台沿其自转轴线方向的两端分别形成有用于固定玻璃基板的承载板；研磨轮可自转地安装于机架,研磨轮包括沿其自转轴线排列的第一研磨槽、第二研磨槽,第一研磨槽的槽宽和第二研磨槽的槽宽相同,第一研磨槽和第二研磨槽的净间距与基台沿其自转轴线的厚度相同；一个基台上可以固定两个玻璃基板,研磨轮的自转使得两个玻璃基板同时进行研磨；因此,上述研磨装置能够同时固定装载多个玻璃基板并通过一个研磨轮同时完成多个玻璃基板的研磨,提高研磨效率及总体产能,降低生产成本。(The invention provides grinding devices, which comprise a rack, a carrying platform and grinding wheels, wherein the carrying platform comprises a support and at least base platforms, the support is provided with a cantilever and is movably arranged on the rack, the base platforms are arranged on the cantilever in a rotating mode, bearing plates for fixing glass substrates are respectively formed at two ends of each base platform along the direction of the rotation axis of the base platform, the grinding wheels are arranged on the rack in a rotating mode and comprise grinding grooves and second grinding grooves which are arranged along the rotation axis of the grinding wheels, the groove width of the grinding groove is the same as the groove width of the second grinding groove, the net spacing between the grinding groove and the second grinding groove is the same as the thickness of the base platforms along the rotation axis of the base platforms, two glass substrates can be fixed on base platforms, and the two glass substrates can be simultaneously ground by the rotation of the grinding wheels, therefore, the grinding devices can simultaneously fix and load the plurality of glass substrates and simultaneously finish grinding of the plurality of glass substrates by grinding wheels, grinding efficiency and overall productivity are improved.)

1, kind of grinder, its characterized in that includes frame, microscope carrier and grinding miller, wherein:

the carrying platform comprises a support and at least base platforms, the support is provided with a cantilever and movably arranged on the frame, the base platforms are arranged on the cantilever in a rotating way, and bearing plates for fixing the glass substrate are respectively formed at two ends of the base platforms extending along the direction of the rotation axis of the base platforms;

the grinding wheel is rotatably mounted on the frame and comprises th grinding grooves and second grinding grooves which are arranged along the rotation axis of the grinding wheel, the groove width of the th grinding groove is the same as that of the second grinding groove, and the clear spacing between the th grinding groove and the second grinding groove is the same as the thickness of the base table along the rotation axis of the base table.

2. The polishing apparatus as claimed in claim 1, wherein the base has an th rotation axis, the base includes a th loading plate, a micro-motion platform, a connecting platform and a second loading plate sequentially arranged in a th rotation axis direction, the connecting platform is rotatably mounted to the cantilever around the th rotation axis, the micro-motion platform is movably mounted to the connecting platform around the th rotation axis, the th loading plate is fixedly mounted to the micro-motion platform, and the second loading plate is fixedly mounted to the connecting platform.

3. The grinding device as claimed in claim 2, wherein an th motor is fixed at the end of the cantilever, and the extended end of the th motor is parallel to the extending direction of the cantilever and is connected with the connecting table through a gear transmission mechanism so as to drive the connecting table to rotate around the th rotation axis.

4. The abrading apparatus of claim 2, further comprising an th imaging unit mounted to the frame, a second imaging unit, and a control unit, wherein:

the imaging unit is located on the side of the bearing plate facing the micro-motion platform and close to the edge of the bearing plate, and the imaging unit is in signal connection with the control unit and is used for collecting and transmitting image information of the th glass substrate;

the second imaging unit is located on the side, facing the connecting table, of the second bearing plate and is close to the edge of the second bearing plate, the second imaging unit and the imaging unit are arranged in a direction parallel to the self-rotation axis, and the second imaging unit is in signal connection with the control unit and is used for collecting and transmitting image information of the second glass substrate;

the control unit is connected with the micro-motion platform through signals and used for calculating compensation quantity of the th glass substrate relative to the second glass substrate according to the received th glass substrate image information and the second glass substrate image information and controlling the micro-motion platform to act according to the compensation quantity.

5. The abrading apparatus of claim 4, wherein the micro-motion stage comprises:

the th micro-motion platform is arranged on the connecting table and drives the th bearing plate to move along the th direction during action, and the th micro-motion platform is in signal connection with the control unit;

the second micro-motion platform is arranged on the th micro-motion platform and drives the bearing plate to move along a second direction during motion, and the second micro-motion platform is in signal connection with the control unit;

the third micro-motion platform is arranged on the second micro-motion platform and drives the bearing plate to rotate along the rotation axis during motion, and the third micro-motion platform is in signal connection with the control unit;

the th spin axis is perpendicular to the th direction and the second direction.

6. The polishing device as claimed in claim 5, wherein the th micro-motion platform is a th cylinder, the th cylinder is fixed on the connecting table and is connected with the control unit by signals, and the extension end of the th cylinder is parallel to the th direction and is fixedly connected with the second micro-motion platform.

7. The grinding device as claimed in claim 6, wherein the second fine motion platform is a second cylinder fixed to an extending end of the th cylinder and in signal communication with the control unit, and the extending end of the second cylinder is parallel to the second direction and in fixed communication with the third fine motion platform.

8. The grinding apparatus as claimed in claim 7, wherein the third micro-motion stage is a second motor fixed to an extending end of the second cylinder and in signal communication with the control unit, and the extending end of the second motor is parallel to the rotation axis and in fixed communication with the carrier plate.

9. The polishing apparatus as claimed in claim 2, wherein the bearing plate has a bearing surface facing away from the micro motion platform for bearing the glass substrate, the bearing plate has a vacuum chamber formed therein for connecting to a vacuum pump, and the bearing plate has a plurality of through holes opening at the bearing surface, the through holes are in communication with the vacuum chamber;

the surface of the second bearing plate, which deviates from the connecting table, forms a second bearing surface for bearing the second glass substrate, a second vacuum chamber connected with the vacuum pump is formed inside the second bearing plate, the second bearing plate is provided with a plurality of second through holes with openings on the second bearing surface, and the second through holes are communicated with the second vacuum chamber.

10. The grinding apparatus of claim 1, wherein the grinding wheel has a second rotation axis, the grinding wheel includes a plurality of grinding grooves arranged along the second rotation axis, the plurality of grinding grooves includes -th grinding groove and a second grinding groove, the plurality of grinding grooves have the same groove width, the clear distance between the -th grinding groove and the second grinding groove is N times the clear distance between two adjacent grinding grooves, N is greater than or equal to 1 and is an integer.

Technical Field

The invention relates to grinding devices, and belongs to the technical field of grinding.

Background

The polishing of the glass substrate is an important process for ensuring the product yield, and is widely applied to the manufacturing process of the display panel, for example, the polishing process before the strength strengthening process of the glass substrate can ensure that the surface flatness of the glass substrate is high, for example, the polishing process for processing the four peripheral parts of the formed glass can form chamfers on the periphery of the glass substrate.

At present, when the glass substrate is ground, the mode is adopted, a single grinding device is adopted to grind glass substrates, the mode adopts multiple circles of grinding such as coarse grinding, fine grinding and angle grinding for ensuring the grinding quality and needs to limit the grinding speed to be not too fast, but the yield bottleneck problems of overlong grinding beat, overlong grinding time and low grinding efficiency exist, and the mode II is adopted, a plurality of grinding devices are connected in parallel to grind a plurality of glass substrates, the grinding efficiency is not improved, the efficiency of the single grinding device is still low, the yield bottleneck problem of the single grinding device is not solved, the grinding efficiency is not high, the equipment cost is overhigh, and the like.

Disclosure of Invention

The invention provides grinding devices, which are used for solving the problem of low grinding efficiency, improving the grinding efficiency and the overall productivity and reducing the production cost.

The invention provides grinding devices, which comprise a frame, a carrying platform and a grinding wheel, wherein:

the carrying platform comprises a support and at least base platforms, the support is provided with a cantilever and movably arranged on the frame, the base platforms are arranged on the cantilever in a rotating way, and bearing plates for fixing the glass substrate are respectively formed at two ends of the base platforms extending along the direction of the rotation axis of the base platforms;

the grinding wheel is rotatably mounted on the frame and comprises a th grinding groove and a second grinding groove which are arranged along the rotation axis of the grinding wheel, the groove width of the th grinding groove is the same as that of the second grinding groove, and the clear distance between the th grinding groove and the second grinding groove is the same as the thickness of the base table along the rotation axis of the base table.

Optionally, the polishing apparatus as described above, wherein the base platform has an th rotation axis, the base platform comprises a th loading plate, a micro-motion platform, a connecting platform and a second loading plate sequentially arranged along the th rotation axis, the connecting platform is rotatably mounted on the cantilever around the th rotation axis, the micro-motion platform is movably mounted on the connecting platform around the th rotation axis, the th loading plate is fixedly mounted on the micro-motion platform, and the second loading plate is fixedly mounted on the connecting platform.

In the grinding device, optionally, an th motor is fixed at an end of the cantilever, and an extending end of the th motor is parallel to the extending direction of the cantilever and is connected with the connecting table through a gear transmission mechanism so as to drive the connecting table to rotate around the th rotation axis.

The polishing apparatus as described above, optionally, further comprising a th imaging unit mounted to the frame, a second imaging unit, and a control unit, wherein:

the imaging unit is located on the side of the bearing plate facing the micro-motion platform and close to the edge of the bearing plate, and the imaging unit is in signal connection with the control unit and is used for collecting and transmitting image information of the th glass substrate;

the second imaging unit is located on the side, facing the connecting table, of the second bearing plate and is close to the edge of the second bearing plate, the second imaging unit and the imaging unit are arranged in a direction parallel to the self-rotation axis, and the second imaging unit is in signal connection with the control unit and is used for collecting and transmitting image information of the second glass substrate;

the control unit is connected with the micro-motion platform through signals and used for calculating compensation quantity of the th glass substrate relative to the second glass substrate according to the received th glass substrate image information and the second glass substrate image information and controlling the micro-motion platform to act according to the compensation quantity.

The grinding apparatus as described above, optionally, the micro-motion stage comprises:

the th micro-motion platform is arranged on the connecting table and drives the th bearing plate to move along the th direction during action, and the th micro-motion platform is in signal connection with the control unit;

the second micro-motion platform is arranged on the th micro-motion platform and drives the bearing plate to move along a second direction during motion, and the second micro-motion platform is in signal connection with the control unit;

the third micro-motion platform is arranged on the second micro-motion platform and drives the bearing plate to rotate along the rotation axis during motion, and the third micro-motion platform is in signal connection with the control unit;

the th spin axis is perpendicular to the th direction and the second direction.

Optionally, in the polishing apparatus as described above, the th micro-motion platform is a th cylinder, the th cylinder is fixed to the connecting platform and is in signal connection with the control unit, and an extending end of the th cylinder is parallel to the th direction and is fixedly connected with the second micro-motion platform.

Optionally, the second fine-motion platform is a second cylinder, the second cylinder is fixed to an extending end of the th cylinder and is in signal connection with the control unit, and the extending end of the second cylinder is parallel to the second direction and is in fixed connection with the third fine-motion platform.

Optionally, the third micro-motion platform is a second motor, the second motor is fixed to an extending end of the second cylinder and is in signal connection with the control unit, and the extending end of the second motor is parallel to the th rotation axis and is fixedly connected with the th loading plate.

Optionally, a bearing surface for bearing the glass substrate is formed on a surface of the bearing plate facing away from the micro-motion platform, a vacuum chamber connected to a vacuum pump is formed inside the bearing plate, the bearing plate has a plurality of through holes opened on the bearing surface, and the through holes are communicated with the vacuum chamber;

the surface of the second bearing plate, which deviates from the connecting table, forms a second bearing surface for bearing the second glass substrate, a second vacuum chamber connected with the vacuum pump is formed inside the second bearing plate, the second bearing plate is provided with a plurality of second through holes with openings on the second bearing surface, and the second through holes are communicated with the second vacuum chamber.

The grinding device as described above, optionally, the grinding wheel has a second rotation axis, the grinding wheel includes a plurality of grinding grooves arranged along the second rotation axis, the plurality of grinding grooves includes -th grinding groove and a second grinding groove, the widths of the plurality of grinding grooves are the same, the groove center distance between the -th grinding groove and the second grinding groove is N times the net distance between two adjacent grinding grooves, N is greater than or equal to 1, and is an integer.

The grinding device provided by the invention has the advantages that the base table is rotatably arranged on the cantilever of the bracket, so that the bearing plates formed at the two ends of the base table along the direction of the rotation axis of the base table can be provided with and fix the glass substrates, base tables can be used for fixing two glass substrates, the grinding groove and the second grinding groove in the grinding wheel have the same groove width, the net spacing between the grinding groove and the second grinding groove is the same as the thickness of the base table along the rotation axis of the base table, when the glass substrate positioned on the bearing plate is inserted into the grinding groove, the glass substrate positioned on the substrate is simultaneously inserted into the second grinding groove, so that the two glass substrates are simultaneously ground by the rotation of the grinding wheel, the bracket moves relative to the frame to drive the base table to move, the grinding on the side of the glass substrate is finished, and after the grinding on the side is finished, the base table rotates to grind other sides, so that the grinding device can simultaneously fixedly load a plurality of the glass substrates and simultaneously finish the grinding of the plurality of the glass substrates by grinding wheels, the grinding efficiency and the overall grinding cost.

Drawings

The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate embodiments consistent with the present invention and together with the description , serve to explain the principles of the invention.

FIG. 1 is a schematic view of types of prior art polishing devices according to the present invention;

FIG. 2 is a schematic view of configurations of a polishing apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic view of the polishing apparatus of FIG. 2 at position C;

FIG. 4 is a top view of a module comprising a micropositioning stage and a connecting stage of the polishing apparatus of the present invention;

FIG. 5 is a schematic view of the polishing apparatus of FIG. 2 at position D;

fig. 6 is a schematic view of the polishing apparatus of fig. 2 at position E.

Description of reference numerals:

Detailed Description

To make the objects, technical solutions and advantages of the present invention clearer and more fully apparent, the technical solutions in the embodiments of the present invention will be described below in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are some, but not all, embodiments of the present invention.

As shown in fig. 1, fig. 1 shows a specific structure of a single polishing apparatus in the prior art, the single polishing apparatus includes a base 01 for placing a glass substrate 03 to be processed and a polishing wheel 02, the base 01 mainly includes a horizontal base 011, a vertical base 012 and a carrier 013, the horizontal base 011 is movable along an X-axis to adjust a position of the glass substrate 03 with respect to the polishing wheel 02, the vertical base 012 is disposed on the horizontal base 011 and can rotate along a C-axis to adjust an edge of the glass substrate to be processed to be opposite to the polishing wheel, the carrier 013 is fixed on an upper portion of the vertical base 012 and the carrier 013 is away from a surface of the vertical base 012 to place and fix the glass substrate 03, the polishing wheel 02 is movable up and down along a Z-axis and includes a plurality of polishing grooves 021 for polishing the glass substrate 03, since the single polishing apparatus has only carriers 01 and carriers can only place glass substrates 03 on the carrier 01, so that only glass substrates can be processed per polishing process, the single polishing apparatus has a low polishing efficiency and a beat, the polishing apparatus is designed to improve the polishing efficiency and the polishing efficiency of the single polishing apparatus, and the polishing apparatus is not designed to improve the polishing efficiency of the polishing apparatus, and to improve the polishing apparatus.

As shown in fig. 2, 3 and 4, fig. 2 shows a specific structure of a polishing device, and the invention provides polishing devices, wherein the polishing device comprises a frame (not shown), a platform 100 and a polishing wheel 200, for convenience of description, the platform 100 is placed on a horizontal working surface, and the direction on the horizontal surface is set as an X axis, and the second direction is set as a Y axis, wherein:

the stage 100 includes a support 111 and at least bases 120, the support 111 has a cantilever 112, the cantilever 112 and the support 111 may be a integral structure or a split structure, the cantilever 112 is fixed at a set position of the support 111, specifically, the cross section of the support 111 may be an L-shaped structure, the L-shaped structure has a pillar extending along the Z-axis, the cantilever 112 is fixedly disposed at a side of the pillar, and the cantilever 112 extends along the X-axis, the specific height of the cantilever 112 on the pillar is determined according to the actual condition of the grinding device, the support 111 is movably mounted on the frame, the movement includes moving along the X-axis and moving along the Y-axis, the relative position between the support 111 and the grinding wheel 200 is adjusted by the movement of the support 111, the movement of the support 111 may be driven by an air cylinder or a hydraulic cylinder, or by other driving structures, the number of the bases 120 may be , that the bases 120 are rotatably mounted on the cantilever 112, the base 120 is mounted on the cantilever 112 so that the support 111 can drive the base 120 to adjust the relative position between the base 120 and the glass carrier 120, and the glass carrier plate 120 can be rotated from the rotation axis AA 113, the vertical axis, the rotation axis of the second base 120, the glass carrier plate 120 is fixed at the rotation axis, the second base plate 120, the rotation axis, the second base plate 120 is set position of the glass carrier plate 120 can be set position of the glass carrier plate 120, the glass carrier plate 120 can be set upright axis, the second base platform 120, the glass carrier plate 120 can be set upright hinge axis, the glass carrier plate 120 can be used for grinding wheel 120, the glass carrier plate 120 can be fixed at the rotation axis.

For convenience of processing, movement of the bracket 111 is reduced, the grinding wheel 200 is disposed opposite to the carrier 100, when the grinding wheel 200 is disposed, the grinding wheel 200 is rotatably mounted on the frame, rotation of the grinding wheel 200 can be driven by a servo motor, or other driving structure can be used, the rotation axis of the grinding wheel 200 is set to be a second rotation axis BB parallel to the Z axis, the grinding wheel 200 includes a th grinding groove 211 and a second grinding groove 212 arranged along the second rotation axis BB, structures of the th grinding groove 211 and the second grinding groove 212 are the same, both used for grinding the glass substrate, a groove width of the th grinding groove 211 is the same as a groove width of the second grinding groove 212, and the groove width is set to be the same as a thickness of the glass substrate to be processed, so that the glass substrate can be inserted into the th grinding groove 211 and the second grinding groove 212, and a clear distance between the th grinding groove 211 and the second grinding groove 212 and a thickness of the base 120 along the rotation axis thereof is the same as a thickness of the glass substrate 3578, and a distance between the second grinding groove wall of the second grinding groove 211 and the second grinding groove 212 is equal to a distance 367, and a distance between the base 35 of the grinding groove 3526 of the second grinding groove 211 and the base of the base 211 is equal to 36320, so that the grinding groove 120, when the grinding groove 211 and the grinding groove 357, the grinding groove 120 is added from the grinding groove 310.

When the polishing apparatus polishes, first, a th glass substrate 310 is placed on a th carrier plate 121 and fixed on a th carrier plate 121, a second glass substrate 320 is fixed on a second carrier plate 122, then, a bracket 111 is moved to drive the base 120, a th glass substrate 310 and the second glass substrate 320 to move along an X axis, a th glass substrate 310 is positioned in a th polishing groove 211, and the second glass substrate 320 is positioned in a second polishing groove 212, and then, a polishing wheel 200 is rotated, an th polishing groove 211 polishes upper and lower edges of a th glass substrate 310, a second polishing groove 212 polishes upper and lower edges of a second glass substrate 320, and the bracket 111 drives the base 120, a th glass substrate 310 and the second glass substrate 320 to move along a Y axis, so as to polish sides of the th glass substrate 310 and the second glass substrate 320, then, the base 120 rotates to repeat polishing of other sides, until the entire th glass substrate 310 and the second glass substrate 320 are polished, and the polishing wheel 120 is capable of fixing and polishing efficiency of polishing the second glass substrate is improved, and the polishing efficiency of the multiple substrates is improved by and 36320 polishing efficiency of the polishing wheel.

It should be noted that the driving of the support 111, the base 120 and the grinding wheel 200 can be performed by using a conventional driving method, such as a servo motor, an air cylinder, a hydraulic cylinder, etc., and the movement of the support 111, the base 120 and the grinding wheel 200 can be controlled by using a conventional control module, such as a PLC, which is not described herein again.

referring to FIG. 3, FIG. 3 shows a concrete structure of the base platform 120, preferred embodiments, the base platform 120 includes a th carrier plate 121, a micro-motion platform 123, a connecting platform 124 and a second carrier plate 122, when specifically configured, the micro-motion platform 123 is located between the th carrier plate 121 and the connecting platform 124, and the micro-motion platform 123 is also located between the second carrier plate 122 and the connecting platform 124. As shown in FIG. 3, the micro-motion platform 123 is located between the th carrier plate 121 and the connecting platform 124, and the th carrier plate 121, the micro-motion platform 123, the connecting platform 124 and the second carrier plate 122 are sequentially arranged along the th rotation axis AA, the connecting platform 124 is rotatably mounted on the cantilever 112 around the th rotation axis AA, the second carrier plate 122 is fixedly mounted on the connecting platform 124, the th carrier plate 121 is fixedly mounted on the micro-motion platform 123 is mounted on the connecting platform 124, and the micro-motion platform 123 is movable on the connecting platform 124, and the connecting platform 123 is rotatably mounted on the th rotation axis.

In the grinding device, the rotation of the connecting table 124 around the rotation axis AA can drive the second bearing plate 122 and the micro-motion platform 123 mounted on the connecting table 124 to move, and the movement of the micro-motion platform 123 drives the th bearing plate 121 located thereon to move, so that the rotation of the connecting table 124 can drive the entire base table 120, the th glass substrate 310 located on the th bearing plate 121 and the th glass substrate 320 located on the second bearing plate 122 to rotate, when there is a position deviation between the th glass substrate 310 and the second glass substrate 320, the micro-motion platform 123 can drive the th bearing plate 121 and the th glass substrate 310 located thereon to rotate for a certain angle, so as to adjust the angle of the th glass substrate 310 relative to the second glass substrate 320, and similarly, the micro-motion platform 123 can drive the th glass substrate 121 and the th glass substrate 310 located on the bearing plate to move, so as to adjust the th glass substrate 310 relative to the second glass substrate 320, thereby aligning the th glass substrate 310 to the second glass substrate 310, and further ensure the alignment of the second glass substrate, and the grinding precision of the second substrate 121, and the grinding precision of the product is improved.

While there are various ways of connecting the connecting platform 124 to the suspension arm 112, with continued reference to fig. 3, fig. 3 shows the connecting way of the connecting platform 124 and the suspension arm 112, specifically, the -th motor 113 is fixed at the end of the suspension arm 112, the housing of the -th motor 113 is fixedly connected to the suspension arm 112, and the protruding end of the -th motor 113 protrudes, and the extending direction of the protruding end is parallel to the extending direction of the suspension arm 112, the protruding end of the -th motor 113 is connected to the connecting platform 124 through the gear transmission 400, the protruding end of the -th motor 113 rotates around its axis, which is parallel to the X-axis, and the gear transmission 400 converts the rotation of the connecting platform 124 around its -th rotation axis AA.

The structure of the th motor 113 driving the connecting platform 124 to rotate around the th rotation axis AA is not limited to the gear transmission 400, but may be other transmission mechanisms capable of meeting the direction change, such as a worm gear structure, in the specific arrangement, the gear transmission 400 includes a th bevel gear 410 sleeved on the extending end of the th motor 113, a second bevel gear 420 sleeved on the outer side of the connecting platform 124, and a th bevel gear 410 and the second bevel gear 420 are engaged to drive the connecting platform 124 to rotate around the th rotation axis AA under the rotation of the th motor 113.

In order to accurately determine the relative position error of the th glass substrate 310 and the second glass substrate 320, specifically, as shown in fig. 2, the polishing apparatus further includes a th imaging unit 510, a second imaging unit 520, and a control unit, wherein the th imaging unit 510, the second imaging unit 520, and the control unit (not shown) are mounted on the frame, and wherein:

the th imaging unit 510 is located at the side of the carrier plate 121 facing the micro-motion platform 123, the th imaging unit 510 is close to the edge of the th carrier plate 121, the th imaging unit 510 is connected with the control unit through signals, and the th imaging unit 510 can take a picture of the th glass substrate 310 fixed on the carrier plate 121 to collect and transmit image information of the th glass substrate 310;

the second imaging unit 520 is located at side of the second carrier plate 122 facing the connecting platform 124, and the second imaging unit 520 is close to the edge of the second carrier plate 122, the second imaging unit 520 and the imaging unit 510 are arranged along the direction parallel to the rotation axis AA, the second imaging unit 520 is connected with the control unit through signals, and the second imaging unit 520 can photograph the second glass substrate 320 fixed on the second carrier plate 122 to collect and transmit image information of the second glass substrate 320;

the control unit is in signal connection with the micro-motion platform 123 and is used for calculating the compensation amount of the th glass substrate 310 relative to the second glass substrate 320 according to the received th glass substrate 310 image information and the second glass substrate 320 image information, and controlling the micro-motion platform 123 to move or rotate according to the compensation amount after the compensation amount is calculated by the control unit.

In the polishing apparatus, the second glass substrate 320 is fixed on the second carrier plate 122, the th glass substrate 310 is fixed on the second carrier plate 122, the th imaging unit 510 acquires image information of the th glass substrate 310, the image information includes an edge position of the th glass substrate 310 and an alignment Mark (Mark) position, and transmits the image information to the control unit, the second imaging unit 520 acquires image information of the second glass substrate 320, the image information includes an edge position of the second glass substrate 320 and an alignment Mark (Mark) position, and transmits the image information to the control unit, and the control unit receives the image information of the th glass substrate 310 and the image information of the second glass substrate 320, analyzes the relative positions of the edge of the th glass substrate 310 and the edge of the second glass substrate 320, accurately determines a relative position error of the th glass substrate 310 and the second glass substrate 320, thereby obtaining a compensation amount of the th glass substrate 310 relative to the second glass substrate 320, and the control unit adjusts a fine motion amount according to adjust a fine motion amount, thereby improving a polishing yield of the second glass substrate 310, and further ensuring a polishing product quality of the polishing product .

In a specific configuration, since the thickness of the glass substrate is 0.3mm-1.3mm, the grinding precision can be ± 50 μm, and a CCD (Charge Coupled Device) as kinds of semiconductor devices can convert an optical image into an electrical signal, and the imaging range can reach 3mm, the th imaging unit 510 can be a CCD imaging Device or other imaging elements, the second imaging unit 520 can be a CCD (imaging Device or other imaging elements, the th imaging unit 510 and the second imaging unit 520 can be the same as or different from kinds of imaging elements.

The micro-motion platform 123 has various structural forms, and refer to fig. 4, fig. 4 shows a specific structure of the micro-motion platform 123, preferred embodiments, the micro-motion platform 123 includes a micro-motion platform 1231, a second micro-motion platform 1232 and a third micro-motion platform 1233, the micro-motion platform 1231 and the second micro-motion platform 1232 are used for driving the th bearing plate 121 to move, the third micro-motion platform 1233 is used for driving the th bearing plate 121 to rotate, the compensation amount includes an angle compensation amount that the th glass substrate 310 needs to rotate relative to the second glass substrate 320 and a compensation amount of an X axis and a compensation amount of a Y axis that the glass substrate 310 needs to move relative to the second glass substrate 320, when specifically set:

the th micro-motion platform 1231 is mounted on the connecting platform 124, and the th micro-motion platform 1231 drives the th loading plate 121 to move along the X-axis when acting, and the th micro-motion platform 1231 is connected with the control unit by signals and is used for moving according to the compensation quantity of the X-axis transmitted by the control unit;

the second micro-motion platform 1232 is installed on the th micro-motion platform 1231, and when the second micro-motion platform 1232 acts, the th bearing plate 121 is driven to move along the Y-axis, and the second micro-motion platform 1232 is connected with the control unit through signals and is used for moving according to the compensation quantity of the Y-axis transmitted by the control unit;

the third micro-motion platform 1233 is installed on the second micro-motion platform 1232, and when the third micro-motion platform 1233 acts, the bearing plate 121 is driven to rotate around the rotation axis AA, and the third micro-motion platform 1233 is connected with the control unit through a signal, and is used for rotating according to the angle compensation amount transmitted by the control unit.

In the polishing device, the control unit calculates the compensation amount of the th glass substrate 310 relative to the second glass substrate 320 according to the received image information of the th glass substrate 310 and the image information of the second glass substrate 320, the control unit transmits the compensation amount of the X-axis to the th micro-motion platform 1231, the th micro-motion platform 1231 moves along the X-axis according to the compensation amount of the X-axis to drive the second micro-motion platform 1232 to move, the second micro-motion platform 1232 moves along the X-axis to drive the third micro-motion platform 1233 to move along the X-axis to drive the th carrier plate 121 and the th glass substrate 310 to move along the X-axis, the control unit transmits the compensation amount of the Y-axis to the second micro-motion platform 1232, the th micro-motion platform 1231 moves along the Y-axis according to the compensation amount of the Y-axis to drive the third micro-motion platform 1233 to move along the X-axis to drive the th and th glass substrates 310 to move along the Y-axis, the AA substrate 310 to rotate around the axis 123 and the third glass substrate to adjust the motion platform 123 and the third glass substrate 310 through the motion axis AA axis 123 and the rotation axis 123 and the third glass substrate 6321.

The th micro-motion platform 1231 has various structures, as shown in fig. 4, specifically, the th micro-motion platform 1231 can be a th cylinder, the housing of the th cylinder is fixed to the connecting platform 124, and the th cylinder is in signal connection with the control unit, and after receiving the action signal of the control unit, the extending end of the th cylinder is parallel to the X axis, and the extending end of the th cylinder is fixedly connected with the second micro-motion platform 1232.

In the grinding device, the cylinder acts after receiving a signal sent by the control unit, the extension end of the cylinder extends by a distance equal to the compensation amount in the direction, the second micro-motion platform 1232 is driven to move by a distance equal to the compensation amount in the 0 direction in the direction, and the second micro-motion platform 1232 drives the third micro-motion platform 1233, the bearing plate 121 and the glass substrate 310 to move by a distance equal to the compensation amount in the direction, so that the th glass substrate 310 and the second glass substrate 320 do not deviate in the direction.

The second micro motion platform 1232 has various structures, as shown in fig. 4, and more specifically, the second micro motion platform 1232 may be a second cylinder, a housing of the second cylinder is fixed to an extending end of the th cylinder, and the second cylinder is in signal connection with the control unit, and upon receiving an action signal of the control unit, the second cylinder acts, and the extending end of the second cylinder is parallel to the Y axis, and the extending end of the second cylinder is fixedly connected with the third micro motion platform 1233.

In the polishing device, the second cylinder acts after receiving a signal sent by the control unit, the extension end of the second cylinder extends by the compensation amount in the second direction, and the third micro-motion platform 1233 is driven to move by the compensation amount in the second direction, and the third micro-motion platform 1233 drives the bearing plate 121 and the glass substrate 310 to move by the compensation amount in the second direction, so that the glass substrate 310 and the second glass substrate 320 do not deviate in the second direction.

The third micro-motion platform 1233 has various structures, as shown in fig. 4, more specifically, the third micro-motion platform 1233 may be a second motor, a housing of the second motor is fixed to an extending end of the second cylinder and is in signal connection with the control unit, and after receiving an action signal of the control unit, the third motor acts, the extending end of the second motor is parallel to the rotation axis AA, and the extending end of the second motor is fixedly connected with the bearing plate 121.

In the grinding device, the second motor acts after receiving a signal sent by the control unit, the extension end of the second motor extends out to rotate around the th rotation axis AA by an angle of an angle compensation amount, and the extension end of the second motor drives the bearing plate 121 to rotate around the th rotation axis AA by an angle of an angle compensation amount, so that the th glass substrate 310 and the second glass substrate 320 have no angle deviation.

kinds of preferred embodiments of the structure for fixing the glass substrate on the carrier plate, as shown in fig. 5 and fig. 6, fig. 5 shows a specific structure of a carrier plate 121, fig. 6 shows a specific structure of a second carrier plate 122, a 2 bearing surface 1211 for bearing a 1 glass substrate 310 is formed on the surface of the 0 carrier plate 121 facing away from the micro-motion platform 123, a 4 vacuum chamber 1212 connected with a vacuum pump is formed inside the 3 carrier plate 121, the 5 carrier plate 121 has a plurality of through holes 1213 opening on the 6 bearing surface 1211, the through holes 1213 are communicated with the vacuum chamber 1212, when the structure is specifically configured, the plurality of through holes 1213 are uniformly distributed to ensure that the glass substrate 310 is uniformly stressed, the glass substrate 310 is prevented from being damaged, the yield is improved, and the stability of the glass substrate 310 fixed on the carrier plate 121 is improved, the grinding precision is improved;

a second bearing surface 1221 for bearing the second glass substrate 320 is formed on the surface of the second bearing plate 122 away from the connecting table 124, a second vacuum chamber 1222 connected to the vacuum pump is formed inside the second bearing plate 122, the second bearing plate 122 has a plurality of second through holes 1223 opened on the second bearing surface 1221, and the second through holes 1223 are communicated with the second vacuum chamber 1222; when specifically setting up, a plurality of second through-holes 1223 evenly distributed to guarantee that second glass substrate 320 atress is even, avoid damaging second glass substrate 320, improve the product yield, and can improve the fixed stability of second glass substrate 320 on second loading board 122, avoid grinding the in-process and remove, improve the grinding precision.

In the polishing apparatus, a vacuum pump is used for vacuumizing the vacuum chamber 1212, the vacuum chamber 1212 is communicated with the through hole 1213 to form a negative pressure between the glass substrate 310 and the carrier plate 121, the glass substrate 310 is fixed on the carrier surface 1211, after polishing is finished, the polished glass substrate 310 can be removed by releasing the vacuum state, the vacuum pump is used for vacuumizing the second vacuum chamber 1222, the second vacuum chamber 1222 is communicated with the second through hole 1223 to form a negative pressure between the second glass substrate 320 and the second carrier plate 122, the second glass substrate 320 is fixed on the second carrier surface 1221, after polishing is finished, the vacuum state is released, the polished second glass substrate 320 can be removed, the glass substrate is fixed on the carrier plate in a through hole and vacuum chamber structure form or other structures which can meet requirements, and the specific structural form can be selected according to the actual conditions of the polishing apparatus and the glass substrate.

With continued reference to FIG. 2, FIG. 2 shows a specific structure of a grinding wheel 200, preferred embodiments, the grinding wheel 200 includes a plurality of grinding grooves 210 arranged along a second rotation axis BB, the plurality of grinding grooves 210 includes a th grinding groove 211 and a second grinding groove 212, the plurality of grinding grooves 210 have the same groove width, and each th grinding groove 210 has the same groove width as the thickness of the glass substrate to be processed, the net spacing between the th grinding groove 211 and the second grinding groove 212 is N times the net spacing between two adjacent grinding grooves 210, N is greater than or equal to 1 and is an integer.

In the grinding device, the grinding wheel 200 comprises a body 220 and partitions 230 formed on the body 220, grinding grooves 210 are formed between the adjacent partitions 230, -th grinding grooves 211 in the plurality of grinding grooves 210 can be positioned at the end, the second grinding grooves 212 can also be positioned at the end, the -th grinding grooves 211 and the second grinding grooves 212 are arranged and limited, the net spacing between the -th grinding grooves 211 and the second grinding grooves 212 is N times of the net spacing between the two adjacent grinding grooves 210, the aspect can be matched with the plurality of glass substrates to grind the plurality of glass substrates simultaneously, in addition, the aspect can replace other grinding grooves 210 when the grinding grooves 210 are worn, so that the grinding precision and the service life of the grinding wheel 200 are improved, in specific arrangement, the net spacing between the -th grinding grooves 211 and the second grinding grooves 212 is 1 time, 2 times, 3 times and 4 times of the net spacing between the two adjacent grinding grooves 210, and the number of the grinding grooves 210 in the grinding wheel 200 can be 10, 11, 12, 13, 14, 15, and the actual grinding grooves 210 and the grinding groove thickness can be selected according to actual conditions.

In the grinding device provided by the invention, the base table 120 is rotatably arranged on the cantilever 112 of the bracket 111, so that the bearing plates formed at the two ends of the base table 120 along the rotation axis direction can be provided with and fix the glass substrates, base tables 120 can be fixed with two glass substrates, the grinding groove 211 and the second grinding groove 212 in the grinding wheel 200 have the same groove width, the grinding groove 211 and the second grinding groove 212 have the same net spacing with the thickness of the base table 120 along the rotation axis, so that when the glass substrate positioned on the bearing plate is inserted into the grinding groove 211, the other glass substrate positioned on the other substrate is simultaneously inserted into the second grinding groove 212, and the rotation of the grinding wheel 200 enables the two glass substrates to be simultaneously ground, the bracket 111 moves relative to the frame to drive the base table 120 to move, the grinding of the side of the glass substrate is completed, the base table 120 rotates to grind the other sides after the grinding of the side is completed, therefore, the grinding device can simultaneously fixedly load a plurality of glass substrates and simultaneously complete the grinding wheels 200 through grinding wheels, thereby improving the overall grinding efficiency and reducing the production cost.

In addition, in the present invention, unless otherwise expressly stated or limited, the terms "connected," "stacked," and the like shall be construed , for example, as being fixedly connected, detachably connected, or in a body, directly connected, indirectly connected through an intermediate medium, communicating between two elements, or interacting between two elements.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.