阅读说明：本技术 一种双色led灯珠封装结构 (double-color LED lamp bead packaging structure ) 是由 管志平 丁俞岚 于 2019-11-26 设计创作，主要内容包括：本发明公开了一种双色LED灯珠封装结构,框架的顶部对称开设有安装槽,安装槽的底部安装有绝缘层,绝缘层的底部安装有散热板,散热板的上表面放置有连接板,连接板的中部嵌入安装有导热块,连接板顶端的中部连接有晶片,框架两端位于散热口上方的位置处对称开设有凹槽,凹槽的一端固定连接有挤压弹簧,挤压弹簧的一端固定连接有固定块,凹槽的底端开设有卡槽,固定块一端的中部连接有卡块,本发明利用卡块固定连接板,进而将晶片位置固定,且通过固定块和挤压弹簧的配合使用,使得连接板更易更换,即可更换单个晶片,有效的避免了损坏一个就要同时更换所有结构,提高资源的利用率。(The invention discloses a double-color LED lamp bead packaging structure, wherein mounting grooves are symmetrically formed in the top of a frame, an insulating layer is mounted at the bottom of each mounting groove, a heat radiating plate is mounted at the bottom of each insulating layer, a connecting plate is placed on the upper surface of each heat radiating plate, a heat conducting block is embedded in the middle of each connecting plate, a wafer is connected to the middle of the top end of each connecting plate, grooves are symmetrically formed in positions, above heat radiating openings, of two ends of the frame, an extrusion spring is fixedly connected to ends of each groove, a fixing block is fixedly connected to ends of each extrusion spring, a clamping groove is formed in the bottom end of each groove, and a clamping block is connected to the middle of ends of each fixing block.)

The utility model provides a double-color LED lamp bead packaging structure, including frame (1), characterized in that the top of frame (1) is seted up mounting groove (2) symmetrically, insulating layer (3) is installed to the bottom of mounting groove (2), heating panel (4) are installed to the bottom of insulating layer (3), connecting plate (5) have been placed to the upper surface of heating panel (4), heat conduction piece (6) are installed to the middle part embedding of connecting plate (5), the middle part of connecting plate (5) top is connected with wafer (7), the surface parcel of wafer (7) has euphotic layer (8), the both sides of wafer (7) are connected with lead wire (9), the position that the inside both sides wall of mounting groove (2) is located above connecting plate (5) has all seted up connector (17), thermovent (10) have been seted up symmetrically at the both ends of frame (1);

the heat dissipation device is characterized in that grooves (11) are symmetrically formed in positions, located above a heat dissipation port (10), of two ends of the frame (1), ends of the grooves (11) are fixedly connected with extrusion springs (15), ends of the extrusion springs (15) are fixedly connected with fixing blocks (16), clamping grooves (13) are formed in the bottom ends of the grooves (11), clamping blocks (14) are connected to the middle portions of ends of the fixing blocks (16), and pulling blocks (12) are connected to the middle portions of ends of the fixing blocks (16).

2. The kinds of double-color LED lamp bead packaging structure of claim 1, wherein the frame (1) has wire holes (19) at four corners at the bottom, the bottom of the wire holes (19) is connected with a protection block (20), and wires (18) are placed inside the wire holes (19).

3. The kinds of bi-color LED lamp bead packaging structure of claim 1, wherein the two chips (7) emit light of different colors, and the chips (7) are bi-electrode chips.

4. The kinds of double-color LED lamp bead packaging structure of claim 1, wherein the insulating layer (3) and the connecting plate (5) are made of plastic, and the heat dissipation plate (4) and the heat conduction block (6) are made of metal.

5. The kinds of bi-color LED lamp bead packaging structure of claim 1, wherein the end of the latch (14) penetrates through the slot (13), and the bottom end of the latch (14) is closely attached to the upper surface of the connection plate (5).

6. The kinds of bi-color LED lamp bead packaging structure of claim 2, wherein a end of the wire (18) is connected with the lead (9) through the connector (17), and another end of the wire (18) is electrically connected with an output end of an external power supply.

Technical Field

The invention relates to the technical field of LEDs, in particular to an double-color LED lamp bead packaging structure.

Background

In recent years, science and technology progress, users demand smaller size, complex structure and diversified light colors for LED lamps, original LED lamps only comprise bowls and cannot meet the requirement of users for multiple light colors, meanwhile, as the LED lamps are smaller and smaller, the power is continuously increased, and the heat dissipation effect is poor, the Chinese patent discloses double-color double-cup packaged LED lamp beads, the application number is 201821557384.7, the patent sets two independent bowls on a bottom plate, each bowl is provided with wafers, wafers with different colors are adopted to meet the requirement of users for multiple light colors, the wafers are arranged on pins, the pins can rapidly conduct heat generated by the wafers, the heat dissipation efficiency is effectively improved, meanwhile, the area of the pins fixed with the wafers is larger than that of the pins without the wafers, the area of a pad connected with the pins fixed with the wafers is larger than that of wafers, is further improved, the heat dissipation effect of the LED lamp beads is improved, and the service life of the LED lamp beads is prolonged;

however, the double-color LED lamp bead has the following defects that the wafer is welded on the bottom plate, if the double-color LED lamp bead is damaged, a single wafer cannot be replaced, the whole structure needs to be replaced again, manpower and resources are wasted, the wafer is not easy to operate during welding, the wafer and the lead wire are easy to damage, heat generated by the wafer is conducted by the pins, the heat dissipation effect is poor, and the service life of the LED lamp bead is further shortened.

Disclosure of Invention

The invention provides double-color LED lamp bead packaging structures, which can effectively solve the problems that the double-color LED lamp beads provided in the background technology weld wafers on a bottom plate, if the double-color LED lamp beads are damaged, a single wafer cannot be replaced, the whole structure needs to be replaced again, manpower and resources are wasted, the wafers are not easy to weld, the wafers and lead wires are easy to damage, heat generated by the wafers is conducted by pins alone, the heat dissipation effect is poor, and the service life of the LED lamp beads is further shortened.

kinds of double-colored LED lamp bead packaging structures, including the frame, the top of the said frame has mounting grooves symmetrically, the bottom of the said mounting groove installs the insulating layer, the bottom of the said insulating layer installs the cooling plate, the upper surface of the said cooling plate places the joint bar, the middle part of the said joint bar is embedded and installed the heat conduction block, the middle part of the top of the said joint bar connects with the crystal plate, the outer surface parcel of the said crystal plate has photic zone, both sides of the said crystal plate connect with the lead wire, the position above the joint bar of both sides wall of the said mounting groove interior has interface ports, both ends of the said frame have heat sinks symmetrically;

the heat radiator is characterized in that grooves are symmetrically formed in positions, located above the heat radiating port, of two ends of the frame, ends of the grooves are fixedly connected with extrusion springs, ends of the extrusion springs are fixedly connected with fixing blocks, clamping grooves are formed in the bottom ends of the grooves, clamping blocks are connected to the middle of ends of the fixing blocks, and pull blocks are connected to the middle of ends of the fixing blocks.

Preferably, wire holes are formed in four corner positions of the bottom of the frame, the bottom end of each wire hole is connected with a protection block, and wires are placed inside the wire holes.

Preferably, the two wafers emit light of different colors, and the wafers are two-electrode wafers.

Preferably, the insulating layer and the connecting plate are made of plastics, and the heat dissipation plate and the heat conduction block are made of metals.

Preferably, the end of the latch penetrates through the slot, and the bottom end of the latch is tightly attached to the upper surface of the connecting plate.

Preferably, an end of the lead is connected to the lead through the connector, and another end of the lead is electrically connected to the output end of the external power source.

Compared with the prior art, the invention has the beneficial effects that: the invention has scientific and reasonable structure and safe and convenient use:

1. be provided with draw-in groove, fixture block, extrusion spring, fixed block and connecting plate, utilize fixture block fixed connection board, and then with wafer rigidity, and use through the cooperation of fixed block and extrusion spring for the connecting plate is changeed, and single wafer damages and to be changed, and effectual damage have been avoided just will change all structures simultaneously, improve the utilization ratio of resource.

2. Be provided with insulating layer, heating panel, heat conduction piece, wafer and thermovent, utilize the heat conduction piece with the heat direction heating panel that the wafer produced, through increase heat radiating area for the radiating effect is better, utilizes the thermovent simultaneously, promotes heating panel and external ventilation, and then strengthens the radiating effect, the effectual life who prolongs the wafer.

3. Be provided with lead wire, connector, wire guide and protection piece, the wire passes connector and pin connection, and the wire guide plays the guard action to the wire, and the protection piece can prevent that the fracture from appearing in the wire interface that stretches out the wire guide simultaneously, the effectual life who improves the wire, and make the wire distribute and scatter, change the wire and be connected with external power source.

Drawings

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification , illustrate embodiment of the invention and do not constitute a limitation on the invention.

In the drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the frame of the present invention;

fig. 3 is a schematic structural diagram of the fixture block of the present invention.

Reference numbers in the figures: 1. a frame; 2. mounting grooves; 3. an insulating layer; 4. a heat dissipation plate; 5. a connecting plate; 6. a heat conducting block; 7. a wafer; 8. a light transmitting layer; 9. a lead wire; 10. a heat dissipation port; 11. a groove; 12. pulling the block; 13. a card slot; 14. a clamping block; 15. a compression spring; 16. a fixed block; 17. a connecting port; 18. a wire; 19. a wire guide hole; 20. and (5) protecting the block.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.