阅读说明：本技术 有机绝缘体、粘贴金属的层叠板及布线基板 (Organic insulator, metal-clad laminate, and wiring board ) 是由 长泽忠 芦浦智士 主税智惠 于 2018-06-26 设计创作，主要内容包括：有机绝缘体以有机树脂相为主成分,该有机树脂相中包含耐候稳定剂,有机树脂相包括内部区域和形成在该内部区域的至少一个表面的表面区域,表面区域的耐候稳定剂的含有比例比内部区域的耐候稳定剂的含有比例高。粘贴金属的层叠板具备上述的有机绝缘体、和层叠在该有机绝缘体的至少一个面的金属箔。布线基板具备通过上述的有机绝缘体而构成的多个绝缘层、和配置在该绝缘层间的金属箔。(The metal-clad laminate comprises the above-described organic insulator and a metal foil laminated on at least surfaces of the organic insulator, and the wiring board comprises a plurality of insulating layers formed by the above-described organic insulator and a metal foil disposed between the insulating layers.)

1, kinds of organic insulators,

an organic resin phase is used as a main component,

the organic resin phase contains a weather-resistant stabilizer,

the organic resin phase includes an inner region and surface regions of at least surfaces formed in the inner region,

the content ratio of the weather-resistant stabilizer in the surface region is higher than the content ratio of the weather-resistant stabilizer in the inner region.

2. The organic insulator according to claim 1,

the organic insulator has a plate-like shape,

the surface region is present on the main surface having the largest area among the surfaces of the organic insulator.

3. The organic insulator according to claim 2,

the surface region is present on two opposite main faces of the inner region.

4. The organic insulator according to any of claims 1 to 3, wherein,

the organic resin phase also comprises inorganic particles,

the content ratio of the inorganic particles in the surface region is lower than the content ratio of the inorganic particles in the inner region.

5. The organic insulator of any of claims 1 to 4, wherein,

the organic resin phase also includes a flame retardant,

when the content ratio of the weather-resistant stabilizer contained in the inner region is set to SI, the content ratio of the weather-resistant stabilizer contained in the surface region is set to SO, the content ratio of the flame retardant contained in the inner region is set to FI, and the content ratio of the flame retardant contained in the surface region is set to FO, SO/SI > FO/FI is satisfied.

6. The organic insulator according to any of claims 1 to 5, wherein,

the surface region has a layer shape.

7. The organic insulator of any of claims 1 to 6, wherein,

the organic resin phase has a laminated structure in which a plurality of unit layers are laminated.

8. The organic insulator according to claim 7,

the proportion of the weather resistant stabilizer and the inorganic particles contained in at least the th part is lower in the interface where the unit layers overlap with each other than the interface of the unit layers.

9. The organic insulator of any of claims 1 to 8, wherein,

the organic resin phase includes a thermosetting resin.

10. The organic insulator according to claim 9,

the organic resin phase includes a thermoplastic resin.

11. The organic insulator of claim 10,

the main component of the thermoplastic resin is a cyclic olefin copolymer.

12. The organic insulator of any of claims 9 to 11, wherein,

the thermosetting resin contains a cyclic olefin copolymer as a main component and contains a peroxide having a benzene ring.

13. The organic insulator of any of claims 9 to 12, wherein,

the thermosetting resin is a cured product of a resin compound including a cyclic olefin copolymer having a crosslinkable functional group in a molecule, a monomer having at least two ethylenically unsaturated groups in a molecule, and a peroxide having a benzene ring in a molecule.

14. The organic insulator of claim 13,

the monomer having an ethylenically unsaturated group includes at least 1 selected from the group consisting of tricyclodecane dimethanol diacrylate, tricyclodecane dimethanol dimethacrylate, and triallyl isocyanate.

15. The organic insulator according to claim 13 or 14,

the cyclic olefin copolymer is contained in a proportion of 1 part by mass or more and 8 parts by mass or less based on 100 parts by mass of the monomer having an ethylenically unsaturated group.

16. The organic insulator of any of claims 13 to 15, wherein,

1, 2-bis (2, 3, 4, 5, 6-pentabromophenyl) ethane is also included as a flame retardant.

17, A metal-clad laminate comprising:

the organic insulator as claimed in any of claims 1 to 16, and

and a metal foil laminated on at least surfaces of the organic insulator.

18, kinds of wiring boards, comprising:

a plurality of insulating layers formed by the organic insulator described in any of claims 1 to 16, and

and a metal foil disposed between the insulating layers.

Technical Field

The present disclosure relates to an organic insulator, a metal-clad laminate, and a wiring substrate.

Background

In recent years, the LSI is being developed to have higher speed, higher integration, larger capacity of memory, and the like, and along with this, the various electronic components are being rapidly developed to have smaller size, lighter weight, thinner weight, and the like. Conventionally, for example, a cyclic olefin copolymer described in patent document 1 has been used as an insulating material for a wiring board or the like used in the field of the electronic component as described above. The insulating material as described above is used for a copper-clad substrate and a high-frequency wiring substrate, for example, in which a copper foil is bonded to a surface thereof.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open publication No. 2010-100843

Disclosure of Invention

The organic insulator of the present disclosure includes an organic resin phase as a main component, the organic resin phase containing a weather-resistant stabilizer, the organic resin phase including an inner region and surface regions of at least surfaces formed in the inner region, and a content ratio of the weather-resistant stabilizer in the surface regions being higher than a content ratio of the weather-resistant stabilizer in the inner region.

The metal-clad laminate of the present disclosure includes the organic insulator and a metal foil laminated on at least surfaces of the organic insulator.

The disclosed wiring substrate is provided with: a plurality of insulating layers formed of the organic insulator; and a metal foil disposed between the insulating layers.

Drawings

Fig. 1 is a perspective view schematically showing an embodiment of the organic insulator according to the present disclosure.

Fig. 2 is a sectional view taken along line ii-ii of fig. 1.

Fig. 3 is a perspective view schematically showing another embodiment of the organic insulator according to the present disclosure.

Fig. 4 is a sectional view taken along line iv-iv of fig. 3.

Fig. 5 is a cross-sectional view schematically showing an embodiment in which the organic insulator further includes inorganic particles.

Fig. 6 is a cross-sectional view schematically showing another embodiment in which an inorganic particle is further included in the organic insulator.

Fig. 7 is a cross-sectional view schematically illustrating another embodiment of the organic insulator.

Fig. 8 is a cross-sectional view schematically showing an embodiment of the metal-clad laminate according to the present disclosure.

Fig. 9 is a cross-sectional view schematically showing an embodiment of the wiring board according to the present disclosure.

Fig. 10 is a cross-sectional view taken along line X-X of fig. 9.

Detailed Description

When a metal-clad laminate having a metal foil on the surface of an organic insulator is applied to a wiring board for high frequency signals, stability with aging of dielectric characteristics and heat resistance are generally required.

Fig. 1 is a perspective view schematically showing an embodiment of the organic insulator according to the present disclosure.

Fig. 2 is a sectional view taken along line ii-ii of fig. 1. The organic insulator 1 shown in fig. 1 contains an organic resin phase 3 as a main component and a weather-resistant stabilizer 5.

In the organic insulator 1, as shown in fig. 2, the surface region 11 contains the weather resistant stabilizer 5 more than the inner region 9. In other words, in the organic insulator 1, the content ratio of the weather-resistant stabilizer 5 is higher in the surface region 11 than in the inner region 9. Since the surface region 11 of the organic insulator 1 contains a large amount of the weather resistant stabilizer 5, the organic insulator 1 can suppress oxidation of the organic resin phase 3, which is a main component of the organic insulator 1, when left at a temperature higher than room temperature (25 ℃) for a long period of time, for example. This can suppress an increase in the dielectric dissipation factor (Df) of the organic insulator 1. Furthermore, the organic insulator 1 can be inhibited from lowering in glass transition point (Tg) due to the inclusion of the weather-resistant stabilizer 5. In this case, the weather resistant stabilizer 5 is preferably uniformly dispersed in the surface region 11 and the inner region 9 of the organic insulator 1.

Here, the organic resin phase 3 is a main component, and the content of the organic resin phase 3 in the organic insulator 1 is 60 mass% or more. The surface region 11 of the organic insulator 1 refers to a range including the surface 1a of the organic insulator 1 and up to a depth of 20 μm from the surface 1 a. The inner region 9 is a portion deeper than 20 μm from the surface 1 a. The content ratio of the weather resistant stabilizer 5 in the surface region 11 is higher than that in the inner region 9, and means a case where the content ratio of the weather resistant stabilizer 5 in the surface region 11 is 2 or more when the content ratio of the weather resistant stabilizer 5 contained in the inner region 9 is 1.

The distribution of the weather-resistant stabilizer 5 contained in the organic insulator 1 is determined by, first, grinding the surface 1a of the organic insulator 1 to be extremely thin, then, observing the new surface of the exposed organic insulator 1 by a scanning electron microscope to substantially distinguish regions of different color tones, then, determining a region of a large area ratio among the distinguished regions as the organic resin phase 3, and further, on the other hand, , determining a region of a small area ratio as the region containing the weather-resistant stabilizer 5.

The method for manufacturing the weather-resistant stabilizer of the present invention is characterized by further comprising steps of polishing the organic insulator 1, processing the polished organic insulator so that new surfaces are sequentially exposed, carrying out X-ray spectroscopic analysis (XPS) on the sequentially exposed new surfaces, identifying specific elements detected in a large amount from regions having a low area ratio, examining the distribution of the specific elements detected from regions other than the organic resin phase 3, which are not identified at this time, comparing the content of the weather-resistant stabilizer 5 in the surface region 11 with the content of the elements indicated by the X-ray spectroscopic analysis (XPS) device between the inner region 9 and the surface region 11 of the organic insulator 1, obtaining the average value of the count values of the elements indicated by the X-ray spectroscopic analysis (XPS) device in the above-mentioned range of the surface region 11, obtaining , obtaining the content of the weather-resistant stabilizer 5 in the inner region 9 based on the average value of the count values of the X-ray spectroscopic analysis (XPS) performed at 3 to 5 in the central part in the thickness direction of the organic insulator 1, obtaining the average value of the weather-resistant stabilizer 5, obtaining the content of the weather-resistant stabilizer 5, preferably obtaining the average value of the weather-stable index of the weather-stable infrared spectroscopic analysis (XPS) by using an infrared spectroscopic analysis, obtaining the high infrared spectroscopic analysis (XPS) and obtaining the average value of the infrared spectroscopic analysis of weather-5).

Fig. 3 is a perspective view schematically showing another embodiment of the organic insulator according to the present disclosure. Fig. 4 is a sectional view taken along line iv-iv of fig. 3. The reference numerals of the parts and members constituting the organic insulator 21 shown in fig. 3 and 4 are as follows, 23: organic resin phase, 25: weather resistant stabilizer, 29: inner region, 31: a surface area. In the organic insulator 21 shown in fig. 3 and 4, the organic insulator 21 has a plate shape. The organic insulator 27 also comprises an organic resin phase 23 and a weather stabilizer 25. In the case of the organic insulator 21, the weather resistant stabilizer 25 is contained in a higher proportion in the surface region 31 than in the inner region 29 of the organic insulator 21. In the organic insulator 21, the region having a higher content of the weather resistant stabilizer 25 than the inner region 29 is preferably the main surface 21a side of the organic insulator 21. The difference in the content ratio of the weather resistant stabilizer 25 between the surface region 31 and the inner region 29 of the organic insulator 21 is the same as in the case of the organic insulator 1 shown in fig. 1 and 2.

The surface region 31 of the organic insulator 21 also varies depending on the thickness of the organic insulator 21, and the depth from the main surface is preferably 0.05 to 0.3 when the thickness of the organic insulator 21 is 1, and is more preferably a range in which the thickness ratio of the inner region 29 of the organic insulator 21 when the thickness of the organic insulator 21 is 1 is 0.4 to 0.9.

The content ratio of the weather-resistant stabilizer 25 contained in the surface region 31 of the organic insulator 21 is preferably 2 or more, assuming that the content ratio of the weather-resistant stabilizer 25 contained in the inner region 29 is 1. In the case of the organic insulator 21, the weather resistant stabilizer 25 is also contained in a large amount in the surface region 31 of the organic composite 21, and therefore, when the organic insulator 21 is left at a temperature higher than room temperature (25 ℃) for a long period of time, for example, oxidation of the organic resin phase 25 can be suppressed, as in the case of the organic insulator 1. This can suppress a decrease in dielectric characteristics. In addition, the glass transition point (Tg) of the organic insulator 21 can be suppressed from decreasing. In this case, it is also preferable that the weather resistant stabilizer 25 be uniformly dispersed in the surface region 31 and the internal region 29 of the organic insulator 21.

In the organic insulator 21, a portion (surface region 31) having a high content of the weather resistant stabilizer 25 is preferably present on the side of the two opposing main surfaces 21 a. In this case, the side surface 21b of the organic insulator 21 may have a structure in which a portion having a high content of the weather resistant stabilizer 25 sandwiches a portion having a low content of the weather resistant stabilizer 25 in the thickness direction of the organic insulator 21. In the case where the organic insulator 21 is thin plate-shaped or film-shaped, even if the portion of the inner region 29 is exposed to the side surface 21b of the organic insulator 21, the area thereof is narrower than the main surface 21a, and therefore, even if a portion having a high content of the weather resistant stabilizer 25 is provided only on the main surface 21a side having a large area, oxidation of the organic resin phase 23 is suppressed.

If the organic insulators 1, 21 include the weather-resistant stabilizers 5, 25 in a large amount, the oxidation resistance of the organic insulators 5, 25 can be improved, however, if the content of the weather-resistant stabilizers 5, 25 becomes too large, there is a possibility that the glass transition point (Tg) of the organic insulators 1, 21 may decrease, in such a case, it is preferable that a portion having a high content of the weather-resistant stabilizers 5, 25 has a layer shape in the organic insulators 1, 21, and if a portion having a high content of the weather-resistant stabilizers 5, 25 has a layer shape in the surface regions 11, 31 of the organic insulators 1, 21, a region having a high concentration of the weather-resistant stabilizers 5, 25 can be provided in a range of a thin thickness in the surface regions 11, 31 of the organic insulators 1, 21, as a result, the oxidation resistance can be improved by the step, in such a case, since the weather-resistant stabilizers 5, 25 are concentrated in the surface regions 11, 31, the volume ratio of the internal regions 9, 29 occupying most of the organic insulators 1, 21 can be increased, and if the volume ratio of the weather-stabilizer 5, 25 is low, the organic insulator is preferably, the organic insulator is set to a uniform thickness, and if the organic insulator surface-1, 3, the heat-stabilizing stabilizer has a uniform thickness, and the organic insulator-1-0-1-3-1-3-1-3-1-3-1-3-1-3-1-one.

Examples of the weather-resistant stabilizer 5 include: phosphite-based heat stabilizers such as tris (2, 4-di-tert-butylphenyl) phosphite, bis [2, 4-bis (1, 1-dimethylethyl) -6-methylphenyl ] ethyl phosphite, tetrakis (2, 4-di-tert-butylphenyl) [1, 1-diphenyl ] -4, 4' -diyl diphosphonite, and bis (2, 4-di-tert-butylphenyl) pentaerythritol diphosphite; lactone heat-resistant stabilizers such as reaction products of 3-hydroxy-5, 7-di-tert-butyl-furan-2-one and o-xylene; hindered phenol-based polymers such as 3, 3 ', 3 ", 5, 5 ', 5" -hexa-t-butyl-a, a ', a "- (methylene-2, 4, 6-triyl) tri-p-cresol, 1, 3, 5-trimethyl-2, 4, 6-tris (3, 5-di-t-butyl-4-hydroxyphenyl) benzyl benzene, pentaerythritol tetrakis [3- (3, 5-di-t-butyl-4-hydroxyphenyl) propionate ], octadecyl-3- (3, 5-di-t-butyl-4-hydroxyphenyl) propionate, and thiodiethylene bis [3- (3, 5-di-t-butyl-4-hydroxyphenyl) propionate ]; a sulfur-based polymer; amine-based polymers, and the like. The weather-resistant stabilizer 5 may be used alone or in combination of two or more. Among them, phosphite-based heat stabilizers, hindered amine-based polymers and hindered phenol-based polymers are excellent. When the hindered amine-based polymer is identified, nitrogen (N) is preferably used as the element to be detected.

When the content of the organic resin phase 3, 23 from the inner region 9, 29 and the surface region 11, 31 is set to 100 parts by mass, the weather-resistant stabilizer 5, 25 is preferably 0.01 parts by mass or more and 10 parts by mass or less, and by including the weather-resistant stabilizer 5, 25 in the above-described ratio, the oxidation resistance and heat resistance (Tg) of the organic insulator 1, 21 can be improved and the increase in the dielectric loss factor can be suppressed, in this case, the content of the weather-resistant stabilizer 5, 25 is determined by using a specific gravity (for example, the specific gravity of the organic resin phase 23 and the weather-resistant stabilizer 5, 25 is 1.05) which is equivalent to the area ratio of the weather-resistant stabilizer 5, 25 reflected in the cross-sectional photograph obtained by a scanning electron microscope.

Fig. 5 is a cross-sectional view schematically showing an embodiment in which the organic insulator further includes inorganic particles. The organic insulator 41 shown in fig. 5 characterizes the case where the organic insulator 1 shown in fig. 2 further includes inorganic particles. Here, the reference numerals of the respective portions and members constituting the organic insulator 41 shown in fig. 5 are as follows, 43: organic resin phase, 45: weather resistant stabilizer, 49: inner region, 51: surface area, 53: inorganic particles.

As shown in fig. 5, the organic insulator 41 preferably further contains inorganic particles 53 in addition to the weather resistant stabilizer 45. In this case, the organic insulator 41 contains a plurality of inorganic particles 53. The inorganic particles 53 preferably have a lower content of the surface region 51 than the internal region 49 of the organic insulator 41. In the case where the surface region 51 of the organic insulator 41 contains the weather resistant stabilizer 45 in a larger proportion than the inner region 49, if the content of the inorganic particles 53 is lower than that of the inner region 49, the occupancy of the organic resin phase 43 exposed on the surface 41a of the organic insulator 41 can be increased. If the occupancy of the organic resin phase 43 in the surface 41a of the organic insulator 41 is increased, for example, the adhesion strength between the metal foils attached to the surface 41a of the organic insulator 41 as the conductor layer can be increased.

Fig. 6 is a cross-sectional view schematically showing another embodiment in which an inorganic particle is further included in the organic insulator. The organic insulator shown in fig. 6 characterizes a case where the organic insulator 21 shown in fig. 4 further includes inorganic particles. Here, the reference numerals of the respective portions and members constituting the organic insulator 61 shown in fig. 6 are as follows, 63: organic resin phase, 65: weather resistant stabilizer, 69: inner region, 71: surface area, 73: inorganic particles.

The organic insulator 61 shown in fig. 6 also contains inorganic particles 73 in addition to the weather resistant stabilizer 65. The organic insulator 61 shown in fig. 6 also contains a plurality of inorganic particles 73. In the organic insulator 61, the content ratio of the inorganic particles 73 in the surface region 71 is preferably lower than that in the inner region 69. In this case, too, the adhesive strength between the metal foils attached to the surface 61a of the organic insulator 61 as the conductor layer can be increased.

In the organic insulator 61 shown in fig. 6, the surface regions 71 having a low content of the inorganic particles 73 are preferably formed on the two opposing main surfaces 61 a. In the case described above, the metal foil can be formed on both main surfaces 61 of the organic insulator 61 with high adhesion strength. In the case of these organic insulators 41 and 61, the inorganic particles 73 are preferably uniformly dispersed in the surface regions 51 and 71 and the inner regions 49 and 69 of the organic insulators 41 and 61, respectively.

The content ratio of the inorganic particles 53, 73 in the surface regions 51, 71 is lower than that in the inner regions 49, 69, and means that when the content ratio of the inorganic particles 53, 73 contained in the inner regions 49, 69 is 1, the content ratio of the inorganic particles 53, 73 in the surface regions 51, 71 is 0.4 or more and 0.7 or less.

The content ratio of the inorganic particles 53 and 73 contained in the organic insulators 41 and 61 is evaluated as follows. Here, for convenience, the description is made using reference numerals assigned to the organic insulator 61. The same is true for the evaluation of the content ratio of the inorganic particles 53 contained in the organic insulator 41.

Specifically, the surface 61a of the organic insulator 61 is first polished to be extremely thin, and then the polished surface is observed by a scanning electron microscope to substantially distinguish regions of different color tones, then, a region having a large area ratio among the distinguished regions is determined as the organic resin phase 63, and a region other than the region identified as the weather resistant stabilizer 65 is determined as the portion of the inorganic particles 73, next, steps are further performed to polish the organic insulator 61 to process the organic insulator so that new surfaces are sequentially exposed, next, elemental analysis by a scanning electron microscope equipped with an energy dispersion type X-ray analyzer is performed on the new surfaces sequentially exposed, and a distribution of specific elements which are detected in a large amount from the regions other than the regions of the organic resin phase 63 and the weather resistant stabilizer 65 is examined, and the specific elements which are not determined at this time to be included in the regions of the organic resin phase 63 and the weather resistant stabilizer 65 and are detected from the regions other than the regions of the organic resin phase 63 and the weather resistant stabilizer 65.

In the case where the outline of the inorganic particles 73 can be confirmed, the content ratio of the inorganic particles 73 can be determined from the area ratio of the inorganic particles 73 reflected on a cross-sectional photograph taken with a scanning electron microscope, in this case, the area ratio of the inorganic particles 73 in the surface region 71 of the organic insulator 61 is an average value of the area ratios determined in a range of 3 μm or more and 6 μm or less from the surface 61a of the organic insulator 61. in addition, , the area ratio of the inorganic particles 73 in the inner region 69 of the organic insulator 61 is determined by performing the same analysis as described above at 3 to 5 points in the central portion in the thickness direction of the organic insulator 61. then, the ratio of the area ratio of the inorganic particles 73 in the surface region 71 of the organic insulator 61 and the area ratio of the inorganic particles 73 in the inner region 69 are compared and then determined.

When the content of the organic resin phase 63 is set to 100 parts by mass from the inner region 69 and the surface region 71 , the inorganic particles 73 are preferably 5 parts by mass or more and 40 parts by mass or less, the rigidity and mechanical strength of the organic insulator 61 can be improved by including the inorganic particles 73 in the above-described ratio, and the increase in the dielectric dissipation factor of the organic insulator 61 can be suppressed by the inorganic particles 73, in this case, the above-described area ratio is considered to be equivalent to the volume ratio as the content of the inorganic particles 73, and the specific gravity (for example, silica (quartz): 2.5) is used.

As the inorganic particles 73, metal oxides shown below are preferable. For example, at least 1 selected from the group consisting of silica, talc (telc), mica (mica), clay, titanium oxide, barium titanate, glass beads, glass hollow spheres, and the like can be cited. In addition to the metal oxide, a carbonate of calcium carbonate or the like may be used. Examples of the silica include pulverized silica and fused silica, and they may be used alone or in a mixture of two or more kinds. Specifically, isobutylene silane (metharyl silane) treated fused silica: SFP-130MC (manufactured by electro-chemical industry Co., Ltd.), FUSELEXE-2, Adma FineSO-C5, PLV-3 (both manufactured by Loxon Co., Ltd.), and the like. The particle diameter of the inorganic particles 73 is preferably 0.03 μm or more and 2 μm or less. The number of the inorganic particles 73 is counted, and when the frequency of occurrence is expressed in units of particle diameters of 1 μm, the frequency of occurrence of particles having particle diameters of 1 μm or less is preferably expressed as the maximum.

Further, the organic insulator 61 preferably contains a flame retardant. In this case, the difference in the content ratio between the surface region 71 and the inner region 69 is preferably smaller than that between the flame retardant, the weather resistant stabilizer 65, and the inorganic particles 73. As the content ratio of the flame retardant in the organic insulator 61, when the content ratio of the flame retardant contained in the inner region 69 of the organic insulator 61 is 1, it is preferable that the content ratio of the flame retardant contained in the surface region 71 is 0.9 or more and 1.1 or less. In other words, the flame retardant is preferably contained in the organic insulator 61 in a state where the difference in the ratio between the inner region 69 and the surface region 71 is small. If the flame retardant is in such a substantially uniformly dispersed state, the range of the portion of the organic insulator 61 where combustibility is locally improved can be narrowed. Therefore, the flame spread in the organic insulator 61 is suppressed, and the flame retardancy as a whole can be improved.

The flame retardant is preferably analyzed by a scanning electron microscope equipped with an energy dispersive X-ray analyzer. When the flame retardant has a color tone different from that of the organic resin phase 63, the weather-resistant stabilizer 65 and the inorganic particles 73, the number of flame retardants present in a predetermined area is counted from the observation and the photograph of the cross section, and the difference between the surface region 71 and the inner region 69 is evaluated. In the case where it is difficult to identify the flame retardant from the difference in color tone, a method of analyzing each of specific elements (for example, bromine (Br)) contained in the flame retardant but not contained in the organic resin phase 63, the weather resistant stabilizer 65, and the inorganic particles 73 may be used.

The flame retardants include, for example, melamine phosphate, melamine polyphosphate, melem polyphosphate, melamine pyrophosphate, ammonium polyphosphate, red phosphorus, aromatic phosphate, phosphonate ester, phosphinate ester, phosphine oxide, phosphazene, melamine cyanurate, bromine-based flame retardants (for example, ethylenebispentabromobenzene, ethylenebistetrabromophthalimide, 1, 2-bis (2, 3, 4, 5, 6-pentabromophenyl) ethane, etc.) and the like, and these flame retardants may be used alone or in combination of two or more, and when the content of the organic resin phase 63 is set to 100 parts by mass, the flame retardants are contained in a proportion of 15 parts by mass or more and 45 parts by mass or less, and preferably, the flame retardants are contained in such a proportion that the influence on the dielectric loss factor, the adhesion property and the moisture resistance can be reduced, and the flame retardancy can be improved by , the heat resistance can be improved, and when the particle diameter of the flame retardants is set to 1.05 μm or more and 5 μm or less, the number of the flame retardants is counted, and when the particle diameter is set to 1 μm, the particle diameter is set, the frequency of occurrence is preferably, the particle diameter is set to 1 μm or less, and the proportion of the flame retardants is set to 2, the ratio of the highest, and the proportion of the flame retardants is set to 2 to 5, and the proportion of the weight of the flame retardants is set to 2 to 5, 2 to.

FIG. 7 is a cross-sectional view schematically showing another embodiment of the organic insulator, and the portions and members constituting the organic insulator 81 shown in FIG. 7 are denoted by 83: an organic resin phase, 85: a weather resistant stabilizer, 89: an inner region, 91: a surface region, 93: inorganic particles, and 95a, 95b, 95c, 95d, 95 e: unit layers.

In the organic insulator 81 shown in fig. 7, the organic resin phase 83 has a layer structure, in other words, in the organic insulator 81, the organic resin phase 83 has a laminated structure formed by a plurality of unit layers 95a, 95b, 95c, 95d, and 95e (hereinafter, sometimes, reference numeral 95.) in this case, in the vicinity of the interface 97 where the unit layers 95 are in contact, the content ratio of at least sides of the weather-resistant stabilizer 85 and the inorganic particles 93 is preferably lower than the central portion in the thickness direction, and in the vicinity of the interface 97 where the unit layers 95 constituting the organic resin phase 83 are in contact, if the content ratio of at least sides of the weather-resistant stabilizer 85 and the inorganic particles 93 is low, the content ratio of the organic resin in the interface 97 is increased, as a result, the insulation between the unit layers 95 can be improved, and thus, a thin-layered organic insulator 81 can be obtained.

For example, in the case of the organic insulator shown in fig. 7, it is preferable that the content ratio of the weather resistant stabilizer 85 contained in the inner region 89 is SI, the content ratio of the weather resistant stabilizer 85 contained in the surface region 91 is SO, the content ratio of the flame retardant contained in the inner region 89 is FI, and the content ratio of the flame retardant contained in the surface region 91 is FO, SO/SI > FO/FI. In the organic insulator, when the relationship between the content ratios of the weather resistant stabilizer 85 and the flame retardant between the inner region 89 and the surface region 91 is set as described above, the adhesiveness between the surface of the organic insulator and the metal foil can be improved. Further, the oxidation resistance is improved as a whole, and combustion can be made difficult.

As the material of the organic resin phase 3, 23, 43, 63, 83 (hereinafter, represented by reference numeral 3), a resin compound containing a cyclic olefin copolymer as a main component and a peroxide is excellent. The peroxide preferably has a benzene ring. As the organic insulator, a thermosetting organic compound is excellent. The organic compound as described above is preferably a cyclic olefin copolymer as a main component. When a material containing a cyclic olefin copolymer having thermosetting properties as a main component is applied to the organic resin phase 3, the temperature dependence is reduced, and an organic insulator having a low specific permittivity and a low dielectric dissipation factor in a high-frequency region can be obtained. The dielectric characteristics are, for example, a specific dielectric constant at 125 ℃ at 30GHz of 2.7 or less and a dielectric dissipation factor of 0.0025 or less.

The cyclic olefin copolymer is a polyolefin copolymer having a cyclic structure. Specifically, the cyclic olefin copolymer is a copolymer of a cyclic olefin and another monomer copolymerizable with the cyclic olefin. The ratio of the cyclic olefin to the other monomer is not particularly limited, and may include, for example, 10 to 80 mass% of the cyclic olefin and 20 to 90 mass% of the other monomer. Examples of the cyclic olefin include a norbornene monomer, a cyclic diene monomer, and a vinyl alicyclic hydrocarbon monomer. Specific examples of the cyclic olefin include norbornene, vinylnorbornene, phenylnorbornene, dicyclopentadiene, tetracyclododecene, cyclopropene, cyclobutene, cyclopentene, cyclohexene, cyclohexadiene, cyclooctadiene, and the like. These cyclic olefins may be used alone or in combination of two or more.

The cyclic olefin copolymer having thermosetting properties preferably has a crosslinkable functional group in the molecule. Examples of the crosslinkable functional group include a group capable of undergoing a crosslinking reaction by a radical derived from a peroxide having a benzene ring. Examples thereof include vinyl, allyl, acryloyl, and methacryloyl groups. As the cyclic olefin copolymer, for example, LCOC-4 manufactured by Mitsui chemical Co., Ltd. can be used as a preferable material. In this case, as the crosslinkable functional group, at least 1 kind selected from the group consisting of vinyl group, allyl group, acryloyl group and methacryloyl group can be cited.

The reason for this is presumed to be that a peroxide having at least two benzene rings in the molecule can be used from the viewpoint of reactivity as described above, and that a peroxide having benzene rings in the molecule can be used, and that, for example, t-butyl peroxybenzoate, α' -di- (t-butylperoxy) diisopropylbenzene, t-butylcumyl peroxide, diisopropylbenzene and the like can be cited as peroxides having benzene rings in the molecule, and these compounds are sold as "PERCUTUTE-VS", "RBPERCUTY-P", "RBPERCUYL-C", and "Japanese oil" (manufactured by Japanese oil Co., Ltd.) and the like.

When the total amount of the cyclic olefin copolymer and the peroxide in the resin compound is 100% by mass, the peroxide having a benzene ring is preferably contained in an amount of 1% by mass or more and 3% by mass or less, and when the peroxide having a benzene ring in the molecule is contained in such an amount, the crosslinking reaction of the cyclic olefin copolymer effectively proceeds, and the dielectric loss factor can be further reduced by .

The resin compound may further contain a monomer having at least two ethylenically unsaturated groups in the molecule. The above-mentioned monomer functions as a crosslinking agent between the cyclic olefin copolymers. Since the monomer is present in the resin compound in a state of a small molecular weight, it is easily incorporated between the cyclic olefin copolymers. Further, since the organic molecule has two or more ethylenically unsaturated groups, it has a property of easily reacting with a plurality of adjacent crosslinkable sites of the cyclic olefin copolymer. This can increase the glass transition point (Tg).

Examples of the monomer include tricyclodecane dimethanol diacrylate, tricyclodecane dimethanol dimethacrylate, and triallyl isocyanate. Among these, tricyclodecane dimethanol diacrylate is preferable. When tricyclodecane dimethanol diacrylate is contained in the resin compound, the glass transition point (Tg) becomes 150 ℃ or higher, and the increase rate of the dielectric loss tangent after the resin compound is left at a high temperature can be reduced. In this case, the content ratio of the monomer is preferably 1 part by mass or more and 8 parts by mass or less based on 100 parts by mass of the cyclic olefin copolymer.

When the monomer as described above is present in the resin compound, the monomer is present between the cyclic olefin copolymers, and two or more ethylenically unsaturated groups are present, whereby a cured product in which the cyclic olefin copolymers are strongly crosslinked can be formed. Specifically, a cured product (organic insulator) having a glass transition point (Tg) of 143 ℃ or higher after curing can be obtained. Further, regarding the electrical characteristics, the dielectric constant at a frequency of 30GHz is 2.7 or less at room temperature (25 ℃) and the dielectric loss tangent under the same conditions is 0.002 or less. Further, a cured product (organic insulator) having a small dielectric loss tangent can be obtained even when the cured product is left to stand at a temperature higher than room temperature (25 ℃) for a long period of time (e.g., at least 1000 hours) than room temperature (125 ℃).

When the organic resin phase 3 is formed of a cyclic olefin copolymer, it is preferable to use a thermosetting cyclic olefin copolymer (thermosetting COC) as a main component in terms of heat resistance. However, if the organic insulator 1 contains a thermosetting cyclic olefin copolymer in a predetermined ratio or more as a main component, it may be a composite with a thermoplastic cyclic olefin copolymer (thermoplastic COC).

When the organic resin phase 3 is a composite of a thermosetting cyclic olefin copolymer and a thermoplastic cyclic olefin copolymer, the composite preferably exists in two places, namely, a temperature region where the peak value of the dissipation factor obtained by dynamic viscoelasticity measurement is 120 to 150 ℃ and a temperature region where the peak value of the dissipation factor is 80 to 100 ℃.

In the case where the organic resin phase 3 is a composite of a thermosetting cyclic olefin copolymer and a thermoplastic cyclic olefin copolymer, the specific dielectric constant and the dielectric dissipation factor of the organic insulator 1 can be further reduced by steps as compared with the case where the cyclic olefin copolymer is a thermosetting cyclic olefin copolymer, in this case, it is preferable that the specific dielectric constant at 30GHz is 2.69 or less and the dielectric dissipation factor is 0.0019 or less with respect to the dielectric characteristics of the organic insulator 1, the content of the thermosetting cyclic olefin copolymer contained in the organic resin phase 3 is 60 mass% or more and 80 mass% or less, and the content of the thermoplastic cyclic olefin copolymer contained in the organic resin phase 3 is 20 mass% or more and 40 mass% or less, in addition, is preferable.

The organic insulator 1 may contain additives such as a stress relaxation agent, an oxidation inhibitor, a heat stabilizer, an antistatic agent, a plasticizer, a pigment, a dye, and a colorant as needed, as long as the effects of the organic insulator 1 are not inhibited. Specific examples of the additive include R-42 (made by Sakai chemical Co., Ltd.), IRGANOX1010 (made by BASF) and the like.

The stress relaxation agent is not particularly limited, and examples thereof include silicone resin particles, and examples thereof include KMP-597 (manufactured by shin-Etsu chemical Co., Ltd.), X-52-875 (manufactured by shin-Etsu chemical Co., Ltd.), KMP-590 (manufactured by shin-Etsu chemical Co., Ltd.), X-52-1621 (manufactured by shin-Etsu chemical Co., Ltd.), and the like, as silicone resin particles, these stress relaxation agents may be used alone or in combination of two or more, and as the stress relaxation agent, a material having an average particle diameter of 10 μm or less may be used.

The method of mixing the components in producing the organic insulator 1 is not particularly limited. Examples of the mixing method include a solution mixing method in which all the components are uniformly dissolved or dispersed in a solvent, and a melt fusion method in which the components are heated by an extruder or the like. As a preferred solvent used in the solution mixing method, xylene can be mentioned, for example. In this case, the mass ratio of the solid phase (resin) to the solvent is not particularly limited, and is, for example, 60: 40-20: 80. in addition to xylene, an aromatic solvent such as toluene, benzene, or ethylbenzene, a hydrocarbon solvent such as n-hexane, cyclohexane, or methylcyclohexane, a ketone solvent such as acetone, or another solvent such as tetrahydrofuran or chloroform may be used, or xylene and the above-mentioned other solvent may be used together.

Fig. 8 is a cross-sectional view schematically showing an embodiment of a metal-clad laminate, fig. 8 shows an example in which an organic insulator having the same structure as the organic insulator 21 shown in fig. 4 is applied as the organic insulator 101, and fig. 8 shows a metal-clad laminate 100 having a metal foil 103 on a surface 101a of the organic insulator 101, and thus the metal-clad laminate 100 has dielectric properties and oxidation resistance exhibited by the organic insulator 21, and the metal-clad laminate 100 of the present embodiment is not limited thereto, and can be similarly applied to the organic insulator 1, the organic insulator 41, the organic insulator 61, and the organic insulator 81, and in the case of these organic insulators, the metal-clad laminate 100 has properties such as dielectric properties, oxidation resistance, adhesion to metal foil, flame retardancy, and insulation properties, which the organic insulator 1, the organic insulator 41, the organic insulator 61, and the organic insulator 81 have, respectively.

The metal foil 103 is not particularly limited, and examples thereof include electrolytic copper foil, copper foil such as rolled copper foil, aluminum foil, and composite foil obtained by laminating these metal foils, among these metal foils 103, copper foil is preferable, and the thickness of the metal foil 103 is not particularly limited, and is preferably about 5 to 105 μm, and in this case, the surface roughness Ra of the metal foil 103 is preferably 0.5 μm or less, particularly preferably 0.2 μm or less, and the minimum surface roughness (Ra) is preferably 0.05 μm or more for the sake of securing the adhesion between the metal foil 103 and the organic insulator 101.

The metal-clad laminate 100 is obtained by laminating a desired number of organic insulators 101 and metal foils 103 on each other and then performing heat and pressure molding. If the dielectric dissipation factor of the metal-clad laminate 100 is 0.004 or less, for example, sufficient electrical characteristics such as specific permittivity can be exhibited, and thus the metal-clad laminate can be used for a wiring board for high frequency signals, for example.

Fig. 9 is a cross-sectional view schematically showing an embodiment of a wiring substrate, fig. 10 is an X-X cross-sectional view of fig. 9, the wiring substrate 110 includes a plurality of insulating layers 111 and a metal foil (conductor layer) 113 disposed between the insulating layers 111, and the insulating layers 111 are preferably formed by the organic insulator 21, for example, the wiring substrate 110 is not limited to the organic insulator 21 as the insulating layers 111, and is also applicable to the organic insulator 1, the organic insulator 41, the organic insulator 61, and the organic insulator 81 described above, and in the case of the wiring substrate 110, the organic insulator 1, the organic insulator 21, the organic insulator 41, the organic insulator 61, and the organic insulator 81 described above have characteristics such as dielectric properties, oxidation resistance, adhesion to a metal foil, flame retardancy, and insulation properties.

The wiring substrate 110 can be applied to a wiring substrate 110 having a cavity structure in the same manner as a multilayer wiring substrate in which the insulating layer 111 and the metal foil 113 are alternately multilayered. The wiring board 110 can be obtained, for example, by stacking an inner layer board having a circuit and a through hole formed in the metal-clad laminate 100 described above on a prepreg, laminating a metal foil 113 on the surface of the prepreg, and then heating (curing) and pressure-molding the laminate. Further, a circuit and a via hole may be formed in the metal foil 113 on the surface to form a multilayer printed wiring board.

The wiring substrate 110 can be obtained, for example, by performing the following steps: a step of preparing a resin compound to be the organic insulator 21; forming a sheet from the resin compound to form a semi-cured insulating sheet; a step of covering the surface of the insulating sheet with a metal foil 103 to be a conductor layer; and a step of heating and pressurizing the insulating sheet covered with the metal foil 103 under predetermined conditions (temperature, pressure, and atmosphere). The wiring substrate 110 thus obtained is preferably a high-frequency wiring substrate 110 having excellent long-term reliability because the insulating phase 111 is formed by the above-described organic insulators 1, 21, 41, 61, and 81, for example.

The resin compound including the cyclic olefin copolymer having a crosslinkable functional group in the molecule, the monomer having at least 2 ethylenically unsaturated groups in the molecule, and the peroxide having a benzene ring in the molecule may be combined with a reinforcing material and processed into a sheet-like molded body.

Examples of the reinforcing material include woven and unwoven fabrics of fibers such as glass and polyimide, and paper. The glass material includes D glass, S glass, quartz glass, and the like, in addition to general E glass.

The method for producing the sheet-like molded article is not particularly limited. For example, the inorganic particles may be dispersed in the above resin compound and molded into a sheet, or the resin compound may be coated with or impregnated with a reinforcing material and then dried and molded into a sheet. The inorganic particles may be dispersed in the resin compound coated or impregnated with the reinforcing material. As the sheet-like molded body, for example, a prepreg or the like can be cited as an example of the resin compound in addition to the composite body including the inorganic particles.

Preferably, the inorganic particles and the reinforcing material contained in the sheet-like formed body are contained in a total amount of about 20 to 80 parts by mass. When the inorganic particles and the reinforcing material are in the above-mentioned proportions, the dimensional stability and strength of the sheet-like molded article after curing can be more easily exhibited. If necessary, a coupling agent such as a silane coupling agent or a titanate coupling agent may be added to the sheet-like molded article.

Whether or not the resin of the sheet-like molded body is the above-mentioned resin compound can be confirmed by analyzing the resin by infrared spectroscopy (IR) and Gas Chromatography (GC) to confirm the composition, and further by analyzing the resin by nuclear magnetic resonance spectroscopy (NMR) and gas chromatography mass spectrometry (GC-MS). The resin in the sheet-like molded body is in an uncured or semi-cured state.

The method for producing the sheet-like molded article is not particularly limited, and examples thereof include a method in which the above-mentioned resin compound is uniformly dissolved or dispersed in xylene or another solvent as necessary, and then the reinforcing material is applied or impregnated and then dried. The resin compound may be melted and impregnated into the reinforcing material. The coating method and the dipping method are not particularly limited, and examples thereof include a method of coating a solution or dispersion of a resin compound using a sprayer, a brush, a bar coater, or the like; a method of immersing (dipping) the base material in a solution or dispersion of the resin compound, and the like. The coating or dipping can be repeated as many times as necessary. Alternatively, it is also possible to repeatedly perform coating or dipping using a plurality of solutions or dispersions having different resin concentrations. Alternatively, a method of molding a resin compound including inorganic particles into a sheet shape and semi-curing or curing the molded product may be mentioned.

The sheet-like molded article is processed into a laminated sheet by, for example, thermoforming. The laminate sheet is obtained by, for example, stacking a plurality of sheet-like molded bodies in accordance with a desired thickness, laminating sheets such as metal foils, and performing heat (curing) and pressure molding to remove the sheets such as metal foils. Further, a laminate having a larger thickness can be obtained by combining the obtained laminate with another sheet-like molded body (for example, a prepreg). The lamination and curing can be performed simultaneously by a hot press, but they may be performed separately. That is, a semi-cured laminate may be obtained by first performing lamination molding, and then completely cured by treating with a heat treatment machine. The heating and pressing may be carried out, for example, at 80 to 300 ℃ under a pressure of 0.1 to 50MPa for about 1 minute to 10 hours, or at 150 to 250 ℃ under a pressure of 0.5 to 10MPa for about 10 minutes to 5 hours.

A metal-clad laminate or wiring board can also be produced by the same method as described above using the sheet-like molded article obtained in this manner.