阅读说明：本技术 非金属与金属粘接质量的干耦合板波检测方法及装置 (Dry coupling plate wave detection method and device for nonmetal and metal bonding quality ) 是由 高晓进 江柏红 高增华 张昊 于 2019-10-25 设计创作，主要内容包括：本发明涉及一种非金属与金属粘接质量的干耦合板波检测方法及装置,属于无损检测技术领域,解决非金属与金属粘接结构必须使用耦合剂和无法从复合材料一侧检测的问题；方法包括顺序连接计算机、数据采集卡、超声仪和干耦合超声探头组成干耦合板波检测装置；制作对比试块,采用干耦合板波检测装置对对比试块进行探测,调节超声仪的增益,使超声仪的检测灵敏度符合设定要求；采用调节好检测灵敏度的干耦合板波检测装置,对被检件进行扫查,探测并确定所述被检件的脱粘缺陷位置和边界。本发明不使用耦合剂,可从复合材料侧对复合材料与金属粘接结构粘接质量进行快速、高可靠性的检测,有效地保障复合材料与金属制品粘接质量和使用安全性。(The invention relates to a dry coupling plate wave detection method and a dry coupling plate wave detection device for the bonding quality of nonmetal and metal, belongs to the technical field of nondestructive detection, and solves the problems that a nonmetal and metal bonding structure must use a coupling agent and cannot be detected from one side of a composite material; the method comprises sequentially connecting a computer, a data acquisition card, an ultrasonic instrument and a dry coupling ultrasonic probe to form a dry coupling plate wave detection device; manufacturing a comparison test block, detecting the comparison test block by adopting a dry coupling plate wave detection device, and adjusting the gain of an ultrasonic instrument to enable the detection sensitivity of the ultrasonic instrument to meet the set requirement; and scanning the detected piece by adopting a dry coupling plate wave detection device with well-adjusted detection sensitivity, and detecting and determining the debonding defect position and the boundary of the detected piece. The invention does not use coupling agent, can carry out rapid and high-reliability detection on the bonding quality of the composite material and the metal bonding structure from the side of the composite material, and effectively ensures the bonding quality and the use safety of the composite material and the metal product.)

1. A dry coupling plate wave detection device for the bonding quality of nonmetal and metal materials comprises a computer, a data acquisition card, an ultrasonic instrument and an ultrasonic probe, and is characterized in that the ultrasonic probe is a dry coupling ultrasonic probe and comprises two probes, wherein one probe is a transmitting probe, and the other probe is a receiving probe; each probe comprises a probe wafer and a flexible attaching device; the probe wafer is arranged at the front end of the probe and used for transmitting or receiving ultrasonic plate wave signals; the flexible attaching device is arranged at the front end of the probe wafer, is matched with the acoustic impedance of the probe wafer, can be attached to the surface of the detected piece under set pressure, and is used for realizing the dry coupling of ultrasonic waves;

during detection, the transmitting probe and the receiving probe are positioned on the same side of a detected piece, the side surfaces of the transmitting probe and the receiving probe are attached side by side to form an ultrasonic probe pair, and under the action of applied pressure, the end parts of the transmitting probe and the receiving probe are perpendicular to and attached to the surface of the detected piece; and the included angles between the probe wafers of the transmitting probe and the receiving probe and the surface of the detected piece are the same.

2. A dry coupling plate wave detection method for the bonding quality of nonmetal and metal materials, which is characterized in that the detection method adopts the dry coupling plate wave detection device of claim 1 to detect, and comprises the following steps:

step S1, sequentially connecting a computer, a data acquisition card, an ultrasonic instrument and a dry coupling ultrasonic probe to form a dry coupling plate wave detection device;

step S2, manufacturing a comparison test block containing a manual debonding defect area;

step S3, detecting the manual debonding defect area and the non-defect area of the reference block by using the dry coupling plate wave detection device, and adjusting the gain of an ultrasonic instrument in the dry coupling plate wave detection device to enable the detection sensitivity of the ultrasonic instrument to meet the set sensitivity requirement;

s4, scanning and detecting the detected piece by adopting a dry coupling plate wave detection device with well-adjusted detection sensitivity, and determining the debonding defect position of the detected piece;

step S5, the probe is moved near the debonding defect position to determine the boundary of the defect.

3. The dry-coupled plate wave detection method according to claim 2, wherein the dry-coupled ultrasonic probe comprises two probes, one being a transmitting probe and the other being a receiving probe; each probe comprises a probe wafer and a flexible attaching device; the probe wafer is arranged at the front end of the probe and used for transmitting or receiving ultrasonic plate wave signals; the flexible attaching device is arranged at the front end of the probe wafer, is matched with the acoustic impedance of the probe wafer, can be attached to the surface of the detected piece under the action of applied pressure, and is used for realizing the dry coupling of ultrasonic waves.

4. The dry-coupled plate wave detection method according to claim 3, wherein during detection, the transmitting probe and the receiving probe are positioned at the same side of the detected piece, the side surfaces of the transmitting probe and the receiving probe are attached side by side to form an ultrasonic probe pair, and under the application of pressure, the end parts of the transmitting probe and the receiving probe are perpendicular to and attached to the surface of the detected piece; the included angles between the probe wafers of the transmitting probe and the receiving probe and the surface of the detected piece are the same, and the probe wafers of the transmitting probe and the probe wafers of the receiving probe are arranged in an inverted V shape.

5. The dry coupling plate wave detection method according to claim 4, wherein the diameter range of the probe wafer is phi 7.5 mm-phi 15mm, the frequency range is 0.5MHz-2MHz, and an included angle of 15-45 degrees is formed between the wafer and the surface direction of the detected piece.

6. The dry-coupled plate wave detection method according to claim 3, wherein the flexible attachment device is a water-filled rubber bladder; or the flexible high polymer material has reduced ultrasonic energy attenuation and is matched with the acoustic impedance of the probe wafer.

7. The dry-coupled plate wave detection method according to any one of claims 2 to 6, wherein the reference block is made of the same material, thickness, preparation process and bonding process as the piece to be detected;

the manufacture of the artificial debonding defect of the reference block comprises the following steps:

processing a plurality of through holes with the diameter within a set range on a metal material along the thickness direction;

and bonding the metal material and the composite material to form the artificial debonding defect at the through hole.

8. The dry-coupled plate wave detection method according to any one of claims 2 to 6, wherein the sensitivity is set to satisfy the following conditions simultaneously:

when a non-defect area is detected, the amplitude of an ultrasonic signal received by the ultrasonic instrument is not less than 80%;

when the artificial defect area is detected, namely the center position of the central connecting line of the two trunk coupling ultrasonic probes is detected to be superposed with the center position of the artificial defect area, the amplitude of an ultrasonic signal received by the ultrasonic instrument is not more than 20%.

9. The dry-coupled plate wave detection method according to claim 8, wherein the method for determining the defect position comprises:

placing the ultrasonic probe opposite to the surface of the composite material, and scanning by adopting a rectangular scanning path, wherein the scanning direction is consistent with the direction of a central connecting line of the two probes of the probe pair, and the scanning step is half of the diameter of the dry coupling ultrasonic probe;

during scanning, the data acquisition card acquires and sends analog voltage signals corresponding to the plate wave signal peak value received by the ultrasonic instrument to a computer;

when the acquired voltage signal is not greater than the threshold A, the computer gives an alarm, and the lower part of the center of the central connecting line of the two dry coupling ultrasonic probes is the debonding position.

10. The dry-coupled plate wave detection method of claim 8,

the method for determining the defect boundary comprises the following steps:

after the debonding defect position is scanned, moving the dry coupling ultrasonic probe pair near the debonding defect position to find a point with the lowest ultrasonic signal amplitude;

moving the ultrasonic probe pair to each direction of the periphery by taking the point as a center, wherein the moving direction of the ultrasonic probe pair is consistent with the direction of a connecting line of the centers of the two probes of the probe pair;

when the ultrasonic plate wave signal detector moves, the data acquisition card acquires and sends analog voltage signals corresponding to plate wave signal peak values received by the ultrasonic instrument to a computer;

when the acquired voltage signal is equal to the threshold value B, the computer prompts that the debonding edge is reached, namely the position below the center of the central connecting line of the two probes is the debonding edge position; marking the composite material;

and after marking the debonding edge positions in all directions, connecting adjacent edge points, wherein the displayed outline is the boundary of the debonding defect.

Technical Field

The invention relates to the technical field of nondestructive testing, in particular to a dry coupling plate wave testing method and device for nonmetal and metal bonding quality.

Background

The fiber reinforced resin matrix composite and metal sleeve bonding structure is a novel thermal protection structure. The thickness of the composite material in the structure is 1mm-10mm, and the thickness of the metal material is 3mm-15 mm. The external fiber reinforced resin matrix composite material can play a heat-proof role, protect internal parts from being damaged by high temperature, and the internal metal ensures the high strength of the structure. In the structure, when the bonding quality is not good, the mechanical property of the structure can be directly influenced, and even serious consequences such as falling of a composite material layer and the like can be caused, so that a serious accident is caused, and therefore, an effective nondestructive testing method is required to be adopted for testing the bonding quality.

At present, a method adopted by the bonding quality of metal and nonmetal is an ultrasonic multi-echo reflection method, but the method can only detect from the metal side, needs a liquid coupling agent and is only suitable for the condition that the thickness of the metal is less than 8 mm; if the metal material of the detected structure is in the structure, the ultrasonic probe cannot contact the metal material and the thickness of the metal material is thick, the metal material cannot be detected by using an ultrasonic multi-echo reflection method, and other traditional ultrasonic detection methods cannot detect the metal material; in addition, the use of liquid couplants for ultrasonic testing can cause contamination of the composite material.

Disclosure of Invention

In view of the above analysis, the present invention aims to provide a method and an apparatus for detecting the bonding quality of nonmetal and metal by dry coupling plate waves, which solves the problems that the bonding structure of composite material and metal cannot use coupling agent and cannot detect from the side of composite material.

The purpose of the invention is mainly realized by the following technical scheme:

the invention discloses a dry coupling plate wave detection device for the bonding quality of nonmetal and metal materials, which comprises a computer, a data acquisition card, an ultrasonic instrument and an ultrasonic probe, wherein the ultrasonic probe is a dry coupling ultrasonic probe and comprises two probes, one probe is a transmitting probe, and the other probe is a receiving probe; each probe comprises a probe wafer and a flexible attaching device; the probe wafer is arranged at the front end of the probe and used for transmitting or receiving ultrasonic plate wave signals; the flexible attaching device is arranged at the front end of the probe wafer, is matched with the acoustic impedance of the probe wafer, can be attached to the surface of the detected piece under set pressure, and is used for realizing the dry coupling of ultrasonic waves;

during detection, the transmitting probe and the receiving probe are positioned on the same side of a detected piece, the side surfaces of the transmitting probe and the receiving probe are attached side by side to form an ultrasonic probe pair, and under the action of applied pressure, the end parts of the transmitting probe and the receiving probe are perpendicular to and attached to the surface of the detected piece; and the included angles between the probe wafers of the transmitting probe and the receiving probe and the surface of the detected piece are the same.

The invention also discloses a dry coupling plate wave detection method for the bonding quality of nonmetal and metal materials, which adopts the dry coupling plate wave detection device for detection and comprises the following steps:

step S1, sequentially connecting a computer, a data acquisition card, an ultrasonic instrument and a dry coupling ultrasonic probe to form a dry coupling plate wave detection device;

step S2, manufacturing a comparison test block containing a manual debonding defect area;

step S3, detecting the manual debonding defect area and the non-defect area of the reference block by using the dry coupling plate wave detection device, and adjusting the gain of an ultrasonic instrument in the dry coupling plate wave detection device to enable the detection sensitivity of the ultrasonic instrument to meet the set sensitivity requirement;

s4, scanning and detecting the detected piece by adopting a dry coupling plate wave detection device with well-adjusted detection sensitivity, and determining the debonding defect position of the detected piece;

step S5, the probe is moved near the debonding defect position to determine the boundary of the defect.

Furthermore, the dry coupling ultrasonic probe comprises two probes, wherein one probe is a transmitting probe, and the other probe is a receiving probe; each probe comprises a probe wafer and a flexible attaching device; the probe wafer is arranged at the front end of the probe and used for transmitting or receiving ultrasonic plate wave signals; the flexible attaching device is arranged at the front end of the probe wafer, is matched with the acoustic impedance of the probe wafer, can be attached to the surface of the detected piece under the action of applied pressure, and is used for realizing the dry coupling of ultrasonic waves.

Furthermore, during detection, the transmitting probe and the receiving probe are positioned on the same side of the detected piece, the side surfaces of the transmitting probe and the receiving probe are attached and arranged side by side to form an ultrasonic probe pair, and under the action of applied pressure, the end parts of the transmitting probe and the receiving probe are perpendicular to and attached to the surface of the detected piece; the included angles between the probe wafers of the transmitting probe and the receiving probe and the surface of the detected piece are the same, and the probe wafers of the transmitting probe and the probe wafers of the receiving probe are arranged in an inverted V shape.

Furthermore, the diameter range of the probe wafer is phi 7.5 mm-phi 15mm, the frequency range is 0.5MHz-2MHz, and an included angle of 15-45 degrees is formed between the wafer and the surface direction of the detected piece.

Further, the flexible laminating device is a rubber bag filled with water; or the flexible high polymer material has reduced ultrasonic energy attenuation and is matched with the acoustic impedance of the probe wafer.

Furthermore, the manufacturing material, thickness, preparation process and bonding process of the reference block are the same as those of the tested piece;

the manufacture of the artificial debonding defect of the reference block comprises the following steps:

processing a plurality of through holes with the diameter within a set range on a metal material along the thickness direction;

and bonding the metal material and the composite material to form the artificial debonding defect at the through hole.

Further, the set sensitivity requirement is that the following conditions are simultaneously satisfied:

when a non-defect area is detected, the amplitude of an ultrasonic signal received by the ultrasonic instrument is not less than 80%;

when the artificial defect area is detected, namely the center position of the central connecting line of the two trunk coupling ultrasonic probes is detected to be superposed with the center position of the artificial defect area, the amplitude of an ultrasonic signal received by the ultrasonic instrument is not more than 20%.

Further, the method for determining the defect position comprises the following steps:

placing the ultrasonic probe opposite to the surface of the composite material, and scanning by adopting a rectangular scanning path, wherein the scanning direction is consistent with the direction of a central connecting line of the two probes of the probe pair, and the scanning step is half of the diameter of the dry coupling ultrasonic probe;

during scanning, the data acquisition card acquires and sends analog voltage signals corresponding to the plate wave signal peak value received by the ultrasonic instrument to a computer;

when the acquired voltage signal is not greater than the threshold A, the computer gives an alarm, and the lower part of the center of the central connecting line of the two dry coupling ultrasonic probes is the debonding position.

Further, the method for determining the defect boundary comprises the following steps:

after the debonding defect position is scanned, moving the dry coupling ultrasonic probe pair near the debonding defect position to find a point with the lowest ultrasonic signal amplitude;

moving the ultrasonic probe pair to each direction of the periphery by taking the point as a center, wherein the moving direction of the ultrasonic probe pair is consistent with the direction of a connecting line of the centers of the two probes of the probe pair;

when the ultrasonic plate wave signal detector moves, the data acquisition card acquires and sends analog voltage signals corresponding to plate wave signal peak values received by the ultrasonic instrument to a computer;

when the acquired voltage signal is equal to the threshold value B, the computer prompts that the debonding edge is reached, namely the position below the center of the central connecting line of the two probes is the debonding edge position; marking the composite material;

and after marking the debonding edge positions in all directions, connecting adjacent edge points, wherein the displayed outline is the boundary of the debonding defect.

The invention has the following beneficial effects:

1) the invention can detect the bonding quality of the bonding structure of the nonmetal and the metal with the metal thickness of more than 8mm, and can quickly and effectively ensure the bonding quality and the use safety of the composite material and the metal product.

2) The invention adopts dry coupling plate wave detection, does not need to use any coupling agent during scanning, can achieve the detection effect of stable coupling by only pressing the flexible laminating device at the front end of the probe to the surface of the detected piece, and avoids irreversible pollution to the interior of the composite material caused by the coupling agent used in conventional ultrasonic detection.

3) The invention adopts a probe pair consisting of a transmitting probe and a receiving probe to form a dry coupling probe, when the probe is used for probing, the two probe sides of the dry coupling ultrasonic probe are attached to form an ultrasonic probe pair side by side, the ultrasonic probe pair is arranged on the surface of a composite material, and the transmitting probe transmits plate waves to the horizontal direction; the receiving probe receives plate wave signals transmitted by the composite material and the metal, and the single-side detection of the detected piece is realized by positioning the ultrasonic transmitting probe and the receiving probe at the same side of the detected piece; the detection is only carried out from one side of the nonmetal, the detection is not carried out from one side of the metal, the influence of the thickness and the appearance of the metal material on the detection is avoided, the metal material can be arranged in and inside the detected piece, and the probe can not contact the components in and inside the detected piece for detection; the ultrasonic multi-echo reflection method can only detect from the metal side, the liquid couplant is needed, and the ultrasonic multi-echo reflection method is only suitable for the condition that the metal thickness is less than 8 mm.

4) The data acquisition card is adopted to acquire detection signals in real time, the acquired signals are automatically processed in real time in a computer, compared with a set threshold value and subjected to real-time alarming and prompting, the situations of misjudgment and missed detection caused by artificial observation of the signals on the screen of the ultrasonic instrument are reduced, and the detection reliability and the detection efficiency are improved.

Drawings

The drawings are only for purposes of illustrating particular embodiments and are not to be construed as limiting the invention, wherein like reference numerals are used to designate like parts throughout.

FIG. 1 is a flowchart illustrating a method for detecting a dry-coupled plate wave according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram of a dry-coupled ultrasound probe according to a first embodiment of the present invention;

FIG. 3 is a schematic diagram of a reference block in the first embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view illustrating defect quantification in a first embodiment of the present invention;

FIG. 5 is a schematic top view of defect quantification in a first embodiment of the present invention;

fig. 6 is a schematic view of a detection apparatus in a second embodiment of the invention.

The reference number in the attached figure 1-computer, 2-collecting card, 3-ultrasonic instrument signal peak value analog voltage output interface, 4-ultrasonic instrument, 5-transmitting end, 6-receiving end, 7-receiving probe, 8-transmitting probe, 9-probe wafer, 10-horizontal plane direction, 11-composite material, 12-aluminum alloy, 13-defect edge, 14-ultrasonic signal amplitude lowest point, 15-debonding defect boundary, 16-water-filled rubber bag.

Detailed Description

The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form a part hereof, and which together with the embodiments of the invention serve to explain the principles of the invention.