阅读说明：本技术 一种感光阻焊树脂及其制备方法 (Photosensitive solder resist resin and preparation method thereof ) 是由 何金国 颜明霞 于 2019-11-11 设计创作，主要内容包括：本发明公开了一种感光阻焊树脂及其制备方法,所述的感光阻焊树脂包含下述重量份的原料：多元胺5～20份,多元酸酐5～20份,环氧树脂10～30份,不饱和一元酸4～10份,酸酐10～15份,溶剂35～45份,催化剂0.05～0.25份,阻聚剂0.01～1.0份；所述溶剂包含二乙二醇乙醚醋酸酯和γ-丁内酯中的至少一种；所述催化剂为三苯基膦、4-二甲氨基吡啶、2,4,6—三(二甲胺基甲基)苯酚中的至少一种；所述阻聚剂为对羟基苯甲醚、对苯二酚、2,6-二叔丁基对甲酚中的至少一种；本发明的感光阻焊树脂的工艺简单,配方合理,并且具有优良的耐弯折性,解像精度、抗化金能力,能满足生产使用需要。(The invention discloses a photosensitive solder resist resin and a preparation method thereof, wherein the photosensitive solder resist resin comprises the following raw materials in parts by weight: 5-20 parts of polyamine, 5-20 parts of polybasic acid anhydride, 10-30 parts of epoxy resin, 4-10 parts of unsaturated monobasic acid, 10-15 parts of acid anhydride, 35-45 parts of solvent, 0.05-0.25 part of catalyst and 0.01-1.0 part of polymerization inhibitor; the solvent comprises at least one of diethylene glycol ethyl ether acetate and gamma-butyrolactone; the catalyst is at least one of triphenylphosphine, 4-dimethylaminopyridine and 2,4, 6-tris (dimethylaminomethyl) phenol; the polymerization inhibitor is at least one of p-hydroxyanisole, hydroquinone and 2, 6-di-tert-butyl-p-cresol; the photosensitive solder resist resin has the advantages of simple process, reasonable formula, excellent bending resistance, resolution precision and gold resistance, and can meet the production and use requirements.)

1. A photosensitive solder resist resin is characterized in that: the resin comprises the following raw materials in parts by weight: 5-20 parts of polyamine, 5-20 parts of polybasic acid anhydride, 10-30 parts of epoxy resin, 4-10 parts of unsaturated monobasic acid, 10-15 parts of acid anhydride, 35-45 parts of solvent, 0.05-0.25 part of catalyst and 0.01-1.0 part of polymerization inhibitor; the solvent comprises at least one of diethylene glycol ethyl ether acetate and gamma-butyrolactone; the catalyst is at least one of triphenylphosphine, 4-dimethylaminopyridine and 2,4, 6-tris (dimethylaminomethyl) phenol; the polymerization inhibitor is at least one of p-hydroxyanisole, hydroquinone and 2, 6-di-tert-butyl-p-cresol.

2. The photosensitive solder resist resin according to claim 1, characterized in that: the polyamine refers to two or more amine compounds, and includes at least one of diamines such as isophorone diamine, p-phenylene diamine, 4' -diaminodiphenylmethane (MDA), and 1, 6-hexamethylene diamine.

3. The photosensitive solder resist resin according to claim 1, characterized in that: the polybasic acid anhydride is at least one of trimellitic anhydride and pyromellitic dianhydride.

4. The photosensitive solder resist resin according to claim 1, characterized in that: the epoxy resin is at least one of o-cresol epoxy resin, phenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, polyhydric alcohol glycidyl ether and polybasic acid glycidyl ester.

5. The photosensitive solder resist resin according to claim 1, characterized in that: the unsaturated monoacid is acrylic acid or methacrylic acid.

6. The photosensitive solder resist resin according to claim 1, characterized in that: the anhydride is at least one of phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, maleic anhydride and itaconic anhydride.

7. A method for producing a photosensitive solder resist resin according to any one of claims 1 to 6, characterized in that: the preparation method comprises the following steps:

(1) adding the solvent and polybasic acid anhydride into a stirring reaction kettle, starting stirring, heating to 60-80 ℃, and keeping constant temperature;

(2) adding the polyisocyanate or the polyamine into a reaction kettle, and keeping the temperature at 60-80 ℃ for half an hour;

(3) gradually heating the reaction solution to 180 ℃, preserving the temperature for 3 hours, dehydrating in the reaction process, and dehydrating by adopting a water separator;

(4) cooling the reaction liquid to 120 ℃ and 130 ℃, adding epoxy resin, unsaturated monoacid, catalyst and polymerization inhibitor, and preserving the temperature for 8 hours in the air environment;

(5) after adding anhydride, preserving the heat for 2 hours at the temperature of 100-110 ℃ to obtain the polyimide photosensitive solder resist resin;

and (4) to (5) are carried out in an air environment.

Technical Field

The invention belongs to the technical field of resin materials, and particularly relates to a photosensitive solder resist resin and a preparation method thereof.

Background

Flexible circuit boards, also known as "flexible boards," are printed circuits made from flexible, insulating substrates. Flexible circuits provide excellent electrical performance, meet design requirements for smaller and higher density packaging, and also help reduce assembly processes and enhance reliability. The flexible circuit board is the only solution to meet the miniaturization and movement requirements of electronic products. The flexible printed circuit board can be freely bent, wound and folded, can bear millions of dynamic bending without damaging the lead, can be randomly arranged according to the space layout requirement, and can be freely moved and stretched in a three-dimensional space, so that the integration of component assembly and lead connection is realized; the flexible circuit board can greatly reduce the volume and the weight of the electronic product, and is suitable for the development of the electronic product towards high density, miniaturization and high reliability. Therefore, the FPC is widely applied to the fields or products of aerospace, military, mobile communication, laptop computers, computer peripherals, PDAs, digital cameras and the like. The FPC also has the advantages of good heat dissipation and weldability, easy connection, low comprehensive cost and the like.

In order to miniaturize and thin the FPC, development of a photosensitive coating layer has been intensively carried out in order to perform microfabrication by photolithography. Among them, the use of polyimide-containing photosensitive solder resist ink can satisfy these properties well from the viewpoints of the bending resistance, heat resistance and electrical insulation of FPC.

Disclosure of Invention

The invention aims to solve the technical problem of providing a photosensitive solder resist resin and a preparation method thereof aiming at the defects in the prior art, wherein the photosensitive solder resist resin comprises the following raw materials in parts by weight: 5-20 parts of polyamine, 5-20 parts of polybasic acid anhydride, 10-30 parts of epoxy resin, 4-10 parts of unsaturated monobasic acid, 10-15 parts of acid anhydride, 35-45 parts of solvent, 0.05-0.25 part of catalyst and 0.01-1.0 part of polymerization inhibitor; the solvent comprises at least one of diethylene glycol ethyl ether acetate and gamma-butyrolactone; the catalyst is at least one of triphenylphosphine, 4-dimethylaminopyridine and 2,4, 6-tris (dimethylaminomethyl) phenol; the polymerization inhibitor is at least one of p-hydroxyanisole, hydroquinone and 2, 6-di-tert-butyl-p-cresol; the photosensitive solder resist resin has the advantages of simple process, reasonable formula, excellent bending resistance, resolution precision and gold resistance, and can meet the production and use requirements.

In order to achieve the invention aims of providing the bending resistance, the resolution precision and the gold resistance of the FPC liquid photosensitive solder resist ink, the invention adopts the following technical scheme:

a photosensitive solder resist resin comprises the following raw materials in parts by weight: 5-20 parts of polyamine, 5-20 parts of polybasic acid anhydride, 10-30 parts of epoxy resin, 4-10 parts of unsaturated monobasic acid, 10-15 parts of acid anhydride, 35-45 parts of solvent, 0.05-0.25 part of catalyst and 0.01-1.0 part of polymerization inhibitor; the solvent comprises at least one of diethylene glycol ethyl ether acetate and gamma-butyrolactone; the catalyst is at least one of triphenylphosphine, 4-dimethylaminopyridine and 2,4, 6-tris (dimethylaminomethyl) phenol; the polymerization inhibitor is at least one of p-hydroxyanisole, hydroquinone and 2, 6-di-tert-butyl-p-cresol;

preferably, the polyamine refers to two or more amine compounds, and includes at least one of diamines such as isophorone diamine, p-phenylene diamine, 4' -diaminodiphenylmethane (MDA), and 1, 6-hexamethylene diamine;

preferably, the polybasic acid anhydride is at least one of trimellitic anhydride and pyromellitic dianhydride; or the polybasic acid anhydride is one or more mixed acid anhydrides containing trimellitic anhydride, such as trimellitic anhydride, pyromellitic dianhydride and the like, the polybasic acid anhydride and the polyamine are used for carrying out imidization reaction at the temperature of 150-200 ℃ for 2-8 hours, and the carboxylic acid end capping is kept according to the proportion:

wherein: r1 and R2-are organic continuous segments;

preferably, the epoxy resin is at least one of o-cresol epoxy resin, phenol epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, polyhydric alcohol glycidyl ether and polybasic acid glycidyl ester; preferentially using bisphenol A type epoxy resin, bisphenol F type epoxy resin, dihydric alcohol glycidyl ether, dibasic acid glycidyl ester and the like with a diepoxy structure to carry out epoxy ring-opening reaction with the reaction product, wherein the reaction temperature is 100-130 ℃, and the epoxy end capping is kept;

preferably, the unsaturated monoacid is acrylic acid or methacrylic acid; the epoxy end capping product is subjected to ring-opening reaction as unsaturated monoacid under the conditions of air atmosphere, temperature of 100-130 ℃ and time of 6-8 hours, and the required catalyst is triphenylphosphine, 4-dimethylaminopyridine, 2,4, 6-tris (dimethylaminomethyl) phenol and the like; the polymerization inhibitor is p-hydroxyanisole, hydroquinone, 2, 6-di-tert-butyl-p-cresol and the like;

preferably, the acid anhydride is at least one of phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, maleic anhydride and itaconic anhydride; wherein anhydrides without active double bonds such as phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride and the like provide acid values for the resin structure; maleic anhydride, itaconic anhydride and other anhydrides containing active double bonds provide acid value and unsaturated bonds for the resin, the reaction temperature is 100-110 ℃, the reaction time is 2 hours, and the addition amount is to keep the acid value of the resin at 50-150 mgKOH/g; the double bond equivalent is 0.5-5 mmol/g.

The invention also provides a preparation method of the polyimide liquid photosensitive solder resist resin, which is characterized by comprising the following steps:

(1) adding the solvent and polybasic acid anhydride into a stirring reaction kettle, starting stirring, heating to 60-80 ℃, and keeping constant temperature;

(2) adding the polyisocyanate or the polyamine into a reaction kettle, and keeping the temperature at 60-80 ℃ for half an hour;

(3) gradually heating the reaction solution to 180 ℃, preserving the temperature for 3 hours, dehydrating in the reaction process, and dehydrating by adopting a water separator;

(4) cooling the reaction liquid to 120 ℃ and 130 ℃, adding epoxy resin, unsaturated monoacid, catalyst and polymerization inhibitor, and preserving the temperature for 8 hours in the air environment;

(5) after adding anhydride, preserving the heat for 2 hours at the temperature of 100-110 ℃ to obtain the polyimide photosensitive solder resist resin;

and (4) to (5) are carried out in an air environment.

Detailed Description

To facilitate understanding of the present invention, examples are given below which may further supplement and explain the present invention, but the present invention is not limited to these examples.