阅读说明：本技术 柔性集成显示屏模组及其制备方法、显示装置 (Flexible integrated display screen module, preparation method thereof and display device ) 是由 赵瑾荣 于 2019-08-12 设计创作，主要内容包括：本发明披露一种柔性集成显示屏模组及其制备方法,所述柔性集成显示屏模组包括：一柔性集成显示基板；所述柔性集成显示基板包括一集成区域,在所述集成区域的一侧设有一显示区和围绕所述显示区的非显示区,所述集成区域划分成多个区域,每个所述区域定义出对应的功能区域；所述功能区域包括：一显示线路功能区、多个直接内嵌式触控线路功能区,所述多个直接内嵌式触控线路功能区设置在所述显示线路功能区的两侧；所述显示线路功能区用于配置显示线路和薄膜覆晶封装体线路；所述直接内嵌式触控线路功能区用于配置直接内嵌式触控线路。(The invention discloses a flexible integrated display screen module and a preparation method thereof, wherein the flexible integrated display screen module comprises: a flexible integrated display substrate; the flexible integrated display substrate comprises an integrated area, wherein a display area and a non-display area surrounding the display area are arranged on one side of the integrated area, the integrated area is divided into a plurality of areas, and each area defines a corresponding functional area; the functional area includes: the display circuit comprises a display circuit functional area and a plurality of direct embedded touch circuit functional areas, wherein the direct embedded touch circuit functional areas are arranged on two sides of the display circuit functional area; the display circuit functional area is used for configuring a display circuit and a thin film flip chip packaging body circuit; the direct embedded touch circuit function area is used for configuring a direct embedded touch circuit.)

1. The utility model provides a flexible integrated display screen module which characterized in that includes: a flexible integrated display substrate; the flexible integrated display substrate comprises an integrated area, wherein a display area and a non-display area surrounding the display area are arranged on one side of the integrated area, the integrated area is divided into a plurality of areas, and each area defines a corresponding functional area; the functional area includes: the touch control circuit comprises a display circuit functional area and a plurality of direct embedded touch control circuit functional areas, wherein the direct embedded touch control circuit functional areas are arranged on two sides of the display circuit functional area; the display circuit functional area is used for configuring a display circuit and a thin film flip chip packaging body circuit; the direct embedded touch circuit function area is used for configuring a direct embedded touch circuit.

2. The flexible integrated display screen module of claim 1, wherein: the flexible integrated display screen module further comprises a touch display driving integrated circuit chip, the touch display driving integrated circuit chip is pressed on the integrated area of the flexible integrated display substrate, and the touch display driving integrated circuit chip is used for generating driving signals for display and touch circuits on the display area and the non-display area and providing driving signals for touch display panels corresponding to the display area and the non-display area.

3. The flexible integrated display screen module according to claim 1, further comprising a touch display driver ic chip disposed on an external driver system pcb or an external flexible pcb of the flexible integrated display substrate, the touch display driver ic chip being configured to generate driving signals for display and touch circuits on the display area and the non-display area and provide driving signals to the touch display panel corresponding to the display area and the non-display area.

4. The flexible integrated display screen module of claim 3, wherein the external drive system printed circuit board is connected to the flexible integrated display substrate by a connector.

5. A preparation method of a flexible integrated display screen module is characterized by comprising the following steps:

providing a flexible integrated display substrate;

defining an integrated area on the flexible integrated display substrate, dividing the integrated area into a plurality of areas, and defining a corresponding functional area in each area;

dividing a display area and a non-display area on the flexible integrated display substrate and on one side of the integrated area;

forming a functional circuit film layer in the corresponding functional area in a physical vapor deposition mode;

coating, exposing and developing a photoresist on the functional circuit film layer to pattern the photoresist;

patterning the functional circuit film layer below the light resistor in an etching mode, wherein the functional circuit film layer corresponds to the patterned light resistor; and stripping the patterned photoresist.

6. The method for manufacturing a flexible integrated display screen module according to claim 5, further comprising, after the step of stripping the patterned photoresist:

defining a binding area in the integration area;

cleaning the binding region;

attaching an anisotropic conductive film layer to the binding region;

arranging a touch display driving integrated circuit chip on the anisotropic conductive film layer in a pre-pressing manner; and

and carrying out local voltage on the touch display driving integrated circuit chip.

7. The method for manufacturing a flexible integrated display screen module according to claim 5, further comprising, after the step of stripping the patterned photoresist:

defining a binding area on an external drive system printed circuit board of the flexible integrated display substrate;

cleaning the binding region;

attaching an anisotropic conductive film layer to the binding region;

arranging a touch display driving integrated circuit chip on the anisotropic conductive film layer in a pre-pressing manner; and

and carrying out local voltage on the touch display driving integrated circuit chip.

8. The method for manufacturing a flexible integrated display module according to claim 7, further comprising forming a connector for connecting the flexible integrated display substrate and the external driving system printed circuit board by a surface mounting technique in the step of defining the bonding area.

9. A display device, comprising the flexible integrated display screen module according to claims 1 to 4.

Technical Field

The invention relates to the technical field of flexible display panels, in particular to a flexible integrated display screen module, a manufacturing method of the flexible integrated display screen module and a display device.

Background

Flexible OLED (Organic Light-Emitting Diode) refers to a flexible Organic Light-Emitting Diode. Flexible OLEDs are manufactured on, and operate on, flexible substrates. Compared to conventional glass displays, flexible OLEDs are more flexible, lighter, and thinner.

At present, the OLED light-emitting device is mainly applied to products such as smart phones, household appliances, televisions, smart watches, VR devices, and the like, wherein the application ratio of the OLED light-emitting device in the smart phones is the highest, and reaches 70.6%. The key advantage of the OLED light emitting device is that it is flexible, thereby realizing "flexible" display, and increasing the application scenes and imagination space of the conventional display screen.

The OLED light emitting device is more suitable for manufacturing a flexible screen due to differences in structure, material properties, and light emitting principle between the OLED light emitting device and a TFT-LCD (thin film transistor liquid crystal display) device. Currently, flexible screens are also widely referred to as curved screens because they present a fixed curve, not truly "flexible", and the display screen is supported by glass, which has its insurmountable resistance to bending.

"flexible" screens are currently being developed in both the "Bendable" and "Foldable" directions, but the ultimate goal is to achieve the "Rollable" screen state.

Currently, as shown in fig. 1, a flexible Display module 100 includes four major components, namely a Panel (Panel)110, a film on-chip package (COF)120, a Display flexible printed circuit board (Display FPC)130, and a direct in-cell touch flexible printed circuit (DOT-TP-FPC) 140, wherein the Panel is mainly used for displaying images, an Active area 101 shown in fig. 1 is an area of the Panel for displaying images, and is a core component of the Display module, and the Panel further includes a non-Display area 102. The COF (chip on fpc)120 is used to provide signals for driving the panel 110 to display images, the COF IC121 in fig. 1 is used to generate circuit driving signals on the panel 110, and the lines for conducting signals are densely distributed on the thin film flip chip package 120 between the IC121 and the panel 110. The DOT-TP-FPC140 functions mainly to supply driving signals to TPs integrated on the panel 110. The Display FPC130 is a flexible printed circuit board for connecting the thin film flip chip package 120 and the external driving system of the DOT-TP-FPC140, and mainly provides control driving signals for the IC121 on the thin film flip chip package and the IC141 on the DOT-TP-FPC.

The existing flexible folding display screen module has the following defects: first, most of COF, Display FPC and DOT-TP-FPC in the current flexible folding Display module are produced by external cooperation manufacturers, and the quality and cost are not easy to control. Secondly, the structure of the existing flexible folding display module is complex, the number of parts is large, for example, a bonding process is needed for connecting and bonding the flexible printed circuit board and the panel or between the flexible printed circuit board and the flexible printed circuit board, 4-5 process steps are needed totally, the bonding process is prone to pressing and offsetting between the flexible printed circuit board and the panel, and bad phenomena such as foreign matters (particles) and pressing contact are generated, the process flow is long, the overall yield is prone to being reduced, and the cost is prone to being increased. And thirdly, all the parts are bonded together by bonding technology, and hard parts such as IC exist on the flexible printed circuit board, so that when the flexible display module is used for manufacturing a folding product or a curling product, the IC, the flexible printed circuit board and a connecting channel of the panel are easily damaged.

Disclosure of Invention

The invention aims to provide a flexible integrated Display screen module, a preparation method thereof and a Display device, and provides a new design scheme aiming at the defects of the existing flexible Display panel, wherein four parts of a panel (panel) of a flexible Display screen, a film flip chip packaging body (COF), a Display flexible printed circuit board (Display FPC) and a direct embedded touch flexible printed circuit board (DOT-TP-FPC) are integrated on a flexible Display substrate, and a Display area for displaying images, a COF circuit function area, a DOT-TP-FPC circuit function area and a Display FPC circuit function area are defined in different areas on the flexible Display substrate, so that the integration level of the foldable flexible Display screen is improved, the structural complexity is reduced, the process flow is reduced, the yield is improved, and the overall cost is reduced.

According to an aspect of the present invention, there is provided a flexible integrated display screen module, comprising: a flexible integrated display substrate; the flexible integrated display substrate comprises an integrated area, wherein a display area and a non-display area surrounding the display area are arranged on one side of the integrated area, the integrated area is divided into a plurality of areas, and each area defines a corresponding functional area; the functional area includes: the display circuit comprises a display circuit functional area and a plurality of direct embedded touch circuit functional areas, wherein the direct embedded touch circuit functional areas are arranged on two sides of the display circuit functional area; the display circuit functional area is used for configuring a display circuit and a thin film flip chip packaging body circuit; the direct embedded touch circuit function area is used for configuring a direct embedded touch circuit.

In an embodiment of the invention, the flexible integrated display screen module further includes a touch display driving integrated circuit chip, the touch display driving integrated circuit chip is pressed on the integrated area of the flexible integrated display substrate, and the touch display driving integrated circuit chip is configured to generate driving signals for display and touch circuits in the display area and the non-display area, and provide the driving signals for the touch display panel corresponding to the display area and the non-display area.

In an embodiment of the invention, the flexible integrated display screen module further includes a touch display driving integrated circuit chip, the touch display driving integrated circuit chip is disposed on an external driving system printed circuit board or an external flexible printed circuit board of the flexible integrated display substrate, and the touch display driving integrated circuit chip is configured to generate driving signals for display and touch circuits in the display area and the non-display area, and provide the driving signals for the touch display panel corresponding to the display area and the non-display area.

In an embodiment of the invention, the external driving system printed circuit board is connected to the flexible integrated display substrate through a connector.

According to another aspect of the present invention, a method for manufacturing a flexible integrated display module is provided, which includes the following steps: providing a flexible integrated display substrate; defining an integrated area on the flexible integrated display substrate, dividing the integrated area into a plurality of areas, and defining a corresponding functional area in each area; dividing a display area and a non-display area on the flexible integrated display substrate and on one side of the integrated area; forming a functional circuit film layer in the corresponding functional area in a physical vapor deposition mode; coating, exposing and developing a photoresist on the functional circuit film layer to pattern the photoresist; patterning the functional circuit film layer below the light resistor in an etching mode, wherein the functional circuit film layer corresponds to the patterned light resistor; and stripping the patterned photoresist.

In an embodiment of the invention, after the step of stripping the patterned photoresist, the method further includes: defining a binding area in the integration area; cleaning the binding region; attaching an anisotropic conductive film layer to the binding region; arranging a touch display driving integrated circuit chip on the anisotropic conductive film layer in a pre-pressing manner; and carrying out local voltage on the touch display driving integrated circuit chip.

In an embodiment of the invention, after the step of stripping the patterned photoresist, the method further includes: defining a binding area on an external drive system printed circuit board of the flexible integrated display substrate; cleaning the binding region; attaching an anisotropic conductive film layer to the binding region; arranging a touch display driving integrated circuit chip on the anisotropic conductive film layer in a pre-pressing manner; and carrying out local voltage on the touch display driving integrated circuit chip.

In an embodiment of the invention, in the step of defining the binding region, a connector for connecting the flexible integrated display substrate and the external driving system printed circuit board is further formed by a surface mounting technology.

According to another aspect of the invention, a display device is provided, which comprises the flexible integrated display screen module.

The invention has the advantages that the flexible integrated Display screen module is a new design scheme provided aiming at the defects of the existing flexible Display panel, four parts of the panel of the flexible Display screen module, a thin film flip chip packaging body, a Display flexible printed circuit board and a direct embedded touch flexible printed circuit board are integrated on a flexible Display substrate, and a Display area, a COF circuit function area, a DOT-TP-FPC circuit function area and a Display FPC circuit function area for displaying images are defined in different areas on the flexible Display substrate, so that the integration level of the foldable flexible Display screen module is improved, the structural complexity is reduced, the process flow is reduced, the yield is improved, and the overall cost is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of a structure of a folding flexible display device of the prior art.

Fig. 2 is a schematic structural diagram of a flexible integrated display module according to an embodiment of the invention.

Fig. 2A and 2B are schematic diagrams of the display circuit functional area and the direct in-cell touch circuit functional area shown in fig. 2, respectively.

Fig. 3 is a schematic structural diagram of a flexible integrated display module according to another embodiment of the invention.

Fig. 4 is a flowchart illustrating steps of a method for manufacturing a flexible integrated display module according to an embodiment of the present invention.

Fig. 5 and 6 are flowcharts of steps subsequent to step S470 shown in fig. 4, respectively.

Fig. 7 is a schematic structural diagram of a display device according to an embodiment of the invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.