阅读说明：本技术 一种塑封贴片二极管的测试设备及测试方法 (Test equipment and test method for plastic package surface mount diode ) 是由 刘永兴 刘永东 于 2021-07-26 设计创作，主要内容包括：本发明涉及二极管测试领域,具体是涉及一种塑封贴片二极管的测试设备,测试设备包括用于码放二极管的检具,以及用于与二极管的两个电极电连接的探针；检具包括,用于定位一个二极管的定位单元；以及,用于定位若干定位单元的定位模板,定位模板是水平设置的平板形状,定位单元与定位模板可拆卸连接,若干定位单元在定位模板上呈矩形阵列排布。本测试设备使用自动化技术取代了现有技术中人工码放二极管的工艺,提高了检验效率,并且本申请使用可根据需要组装的定位单元和定位模板取代了现有技术中固定不变的检具,降低了检验成本。本发明还涉及一种塑封贴片二极管的测试方法。(The invention relates to the field of diode testing, in particular to testing equipment for a plastic packaged surface mount diode, which comprises a testing tool for stacking the diode and probes for electrically connecting two electrodes of the diode; the checking fixture comprises a positioning unit for positioning a diode; and the positioning template is used for positioning the plurality of positioning units, the positioning template is in a flat plate shape horizontally arranged, the positioning units are detachably connected with the positioning template, and the plurality of positioning units are arranged on the positioning template in a rectangular array. This test equipment uses the automation technology to replace the technology of artifical pile up diode among the prior art, has improved inspection efficiency to this application has replaced the constant utensil of examining among the prior art with the positioning element that can assemble as required and location template, has reduced the inspection cost. The invention also relates to a test method of the plastic packaged surface mount diode.)

1. A test device for a plastic package surface mount diode comprises a detection tool for stacking a diode (1) and a probe (4) electrically connected with two electrodes of the diode (1); it is characterized in that the checking fixture comprises,

a positioning unit (2) for positioning a diode (1); and the number of the first and second groups,

the positioning template (3) is used for positioning the positioning units (2), the positioning template (3) is in a flat plate shape horizontally arranged, the positioning units (2) are detachably connected with the positioning template (3), and the positioning units (2) are arranged on the positioning template (3) in a rectangular array.

2. The test equipment for the plastic packaged chip diode according to claim 1, wherein the positioning template (3) comprises,

the positioning plate (3a) is horizontally arranged, the positioning plate (3a) is in a flat plate shape, one side face of the positioning plate (3a) is provided with a plurality of inserting grooves (3a1) which horizontally extend towards the other side face of the positioning plate (3a), the inserting grooves (3a1) do not penetrate through the positioning plate (3a), the inserting grooves (3a1) are arranged on the positioning plate (3a) side by side, the inserting grooves (3a1) are in a C-shaped shape with upward openings, and the positioning unit (2) is in sliding fit with the inserting grooves (3a 1); and the number of the first and second groups,

the sealing plate (3b) is vertically arranged, the sealing plate (3b) is arranged on the side face of the positioning plate (3a) and covers the opening of the slot (3a1), and the sealing plate (3b) is detachably connected with the positioning plate (3 a).

3. The test equipment for the plastic package patch diode according to claim 2, wherein the positioning unit (2) comprises,

the diode positioning structure comprises an insulating block (2a) used for placing a diode (1), wherein a positioning cavity is arranged at the top of the insulating block (2a), the positioning cavity is provided with an inclined bottom wall (2a1), the shape of the bottom wall (2a1) is matched with that of the bottom surface of the diode (1), and a first side wall (2a2) is formed at the intersection part of the peripheral wall of the positioning cavity and the lowest edge of the bottom wall (2a 1); and the number of the first and second groups,

and the conducting block (2b) partially replaces the bottom wall of the first side wall (2a2) and the insulating block (2a), and the positioning plate (3a) is provided with an avoiding opening (3a3) which penetrates through the positioning plate (3a) and exposes the conducting block (2 b).

4. The testing equipment for the plastic packaged chip diode as claimed in claim 3, wherein the positioning cavity is further provided with a first concave part (2a4) arranged at the intersection of the bottom wall (2a1) and the conductive block (2 b).

5. The test equipment for plastic packaged chip diodes according to any one of claims 1 to 4, wherein the test equipment further comprises,

a first feeding unit (5) for outputting the positioning unit (2); and the number of the first and second groups,

a step-by-step feeder (6) for receiving the positioning unit (2) output from the first feeding unit (5) and for transferring the positioning unit (2) step-by-step, the output end of the step-by-step feeder (6) facing one slot (3a 1); and the number of the first and second groups,

a second feeding unit (7) for outputting the diode (1); and the number of the first and second groups,

the distributor (8) is used for receiving the diodes (1) output by the second feeding unit (7) and outputting one diode (1) at the top of each positioning unit (2) on the stepping type material shifter (6); and the number of the first and second groups,

a translation table (9) for translating the positioning plate (3a) so that different slots (3a1) are aligned with the output of the step-by-step mover (6).

6. The test equipment for plastic packaged chip diodes according to claim 5, wherein the step-by-step material shifter (6) comprises,

a first material moving track (6a) for the positioning unit (2) to slide; and the number of the first and second groups,

a second material moving track (6b) which is perpendicular to the first material moving track (6a) and is obliquely arranged, wherein the lower end of the second material moving track (6b) is positioned right above one side of the middle end of the first material moving track (6a), and the bottom wall of the second material moving track (6b) is parallel to the bottom wall (2a1) of the positioning unit (2) positioned on the first material moving track (6a) and is higher than the bottom wall (2a 1); and the number of the first and second groups,

and the power module is used for driving the positioning unit (2) to move in a stepping mode in the first material moving track (6 a).

7. The test equipment for plastic packaged chip diodes according to claim 6, wherein the distributor (8) comprises,

the lifting rod (8a) is arranged beside the higher end of the second material moving track (6b) in a lifting manner, the top surface of the lifting rod (8a) is parallel to the bottom wall of the second material moving track (6b), and the output end of the second feeding unit (7) is arranged on one side, away from the second material moving track (6b), of the lifting rod (8 a); and the number of the first and second groups,

the lifting device (8b) is used for driving the lifting rod (8a) to lift; and the number of the first and second groups,

and a material blocker (8c) for blocking the diode (1) from moving from the output end of the second feeding unit (7) to the material lifting rod (8 a).

8. The test equipment for plastic packaged chip diodes according to claim 5, wherein the translation workbench (9) comprises,

a placement table (9a) which is flat and horizontally disposed; and the number of the first and second groups,

the clamping block (9b) is arranged on the object placing table (9a) in a sliding mode, and a groove matched with the positioning plate (3a) in shape is formed when the object placing table (9a) is close to the clamping block (9 b); and the number of the first and second groups,

a first linear driver (9c) for driving the clamping block (9b) to approach or depart from the object placing table (9 a); and the number of the first and second groups,

and the second linear driver (9d) is used for driving the object placing table (9a) to move horizontally vertical to the output end of the stepping type material moving device (6).

9. A test method of a plastic package patch diode is characterized by comprising the following steps,

s4, splicing the positioning units (2) and the positioning template (3) into a detection tool, so that each positioning unit (2) is positioned with a diode (1);

s5, placing the positioning template (3) on a detection table;

s6, electrically connecting the two probes (4) with two electrodes of the diode (1) respectively, and detecting the resistance of the diode (1);

s7, the electrodes of the two probes (4) are exchanged, and the resistance of the diode (1) is detected again.

10. The method for testing the plastic packaged chip diode according to claim 9, further comprising the steps of,

s1, the first feeding unit (5) continuously outputs a plurality of positioning units (2) to the input end of the stepping type material shifter (6), and the positioning units (2) move in a stepping mode under the driving of the stepping type material shifter (6);

s2, intermittently outputting the diodes (1) to the middle end of the stepping type material shifter (6) through the distributor (8) by the second material loading unit (7), and enabling a positioning cavity at the top of each positioning unit (2) to fall into one diode (1);

s3, the stepping type material shifter (6) drives the positioning unit (2) positioned with the diode (1) to enter each slot (3a1) on the positioning plate (3a) clamped by the translation workbench (9) in sequence.

Technical Field

The invention relates to the field of diode testing, in particular to testing equipment and a testing method for a plastic package surface mount diode.

Background

At present, the diodes are tested manually one by one, or the diodes are placed into a testing tool manually one by one and then are tested in batches, so that the testing process is long in time consumption and high in labor intensity. For example, patent application No. CN200910029291.6 discloses a detection apparatus for a chip diode, which stacks a large number of diodes through a detection tool, so that a large number of diodes can be detected at one time, and the detection time is greatly reduced.

Disclosure of Invention

In order to solve the technical problems, the technical scheme adopted by the invention is as follows:

a test device for a plastic package surface mount diode comprises a detection tool for stacking diodes and probes for electrically connecting two electrodes of the diodes; the checking fixture comprises a positioning unit for positioning a diode; and the positioning template is used for positioning the plurality of positioning units, the positioning template is in a flat plate shape horizontally arranged, the positioning units are detachably connected with the positioning template, and the plurality of positioning units are arranged on the positioning template in a rectangular array.

Preferably, the positioning template comprises a positioning plate which is horizontally arranged, the positioning plate is in a flat plate shape, one side surface of the positioning plate is provided with a plurality of slots which horizontally extend towards the other side surface of the positioning plate, the slots do not penetrate through the positioning plate, the slots are arranged on the positioning plate side by side, the slots are in a C-shaped shape with an upward opening, and the positioning unit is in sliding fit with the slots; and the sealing plate is vertically arranged, is arranged on the side surface of the positioning plate and covers the opening of the slot, and is detachably connected with the positioning plate.

Preferably, the positioning unit comprises an insulating block for placing the diode, a positioning cavity is arranged at the top of the insulating block, the positioning cavity is provided with an inclined bottom wall, the shape of the bottom wall is matched with that of the bottom surface of the diode, and a first side wall is formed at the intersection of the peripheral wall of the positioning cavity and the lowest edge of the bottom wall; and the conducting block partially replaces the first side wall and the bottom wall of the insulating block, and an avoiding opening which penetrates through the positioning plate and exposes the conducting block is arranged on the positioning plate.

Preferably, the positioning cavity further has a first recess portion provided at an intersection of the bottom wall and the conductive block.

As another aspect of the present application, the testing apparatus further includes a first feeding unit for outputting the positioning unit; the stepping type material shifter is used for receiving the positioning unit output by the first material loading unit and transmitting the positioning unit in a stepping manner, and the output end of the stepping type material shifter faces to one slot; and a second feeding unit for outputting a diode; the distributor is used for receiving the diodes output by the second feeding unit and outputting one diode at the top of each positioning unit on the stepping type material moving device; and the translation workbench is used for translating the positioning plate so that different slots are aligned with the output end of the stepping type material shifter.

Preferably, the stepping material moving device comprises a first material moving track for the positioning unit to slide; the lower end of the second material moving track is positioned right above one side of the middle end of the first material moving track, and the bottom wall of the second material moving track is parallel to and higher than the bottom wall of the positioning unit positioned on the first material moving track; and the power module is used for driving the positioning unit to move in a stepping mode in the first material moving track.

Preferably, the distributor comprises a material lifting rod, the material lifting rod is arranged beside the higher end of the second material moving rail in a lifting manner, the top surface of the material lifting rod is parallel to the bottom wall of the second material moving rail, and the output end of the second feeding unit is arranged on one side, away from the second material moving rail, of the material lifting rod; the lifting device is used for driving the material lifting rod to lift; and the material blocker is used for blocking the diode from moving from the output end of the second feeding unit to the material lifting rod.

Preferably, the translation work table comprises a placing table which is in a flat plate shape and is horizontally arranged; the clamping block is arranged on the object placing table in a sliding mode, and a groove matched with the positioning plate in shape is formed when the object placing table and the clamping block are close to each other; the first linear driver is used for driving the clamping block to approach or depart from the object placing table; and the second linear driver is used for driving the object placing table to move horizontally vertical to the output end of the stepping type material moving device.

The application also provides a test method of the plastic package surface mounted diode, which comprises the following steps of splicing the positioning units and the positioning template into a detection tool, so that each positioning unit is positioned with a diode; placing the positioning template on a detection table; the two probes are respectively and electrically connected with two electrodes of the diode and used for detecting the resistance of the diode; the electrodes of the two probes are exchanged and the resistance of the diode is again detected.

Preferably, the method further comprises the following steps that the first feeding unit continuously outputs a plurality of positioning units to the input end of the stepping type material shifter, and the positioning units move in a stepping mode under the driving of the stepping type material shifter; the second feeding unit intermittently outputs diodes to the middle end of the stepping type material shifter through the material distributor, so that one diode falls into a positioning cavity at the top of each positioning unit; the stepping material moving device drives the positioning units positioned with the diodes to sequentially enter each slot on the positioning plate clamped by the translation workbench.

Compared with the prior art, the application has the beneficial effects that:

this application uses the technology of automation to replace artifical putting things in good order diode among the prior art, has improved inspection efficiency to this application uses the locating element and the locating template that can assemble as required to replace the fixed unchangeable utensil of examining among the prior art, has reduced the inspection cost.

Drawings

FIG. 1 is a top view of a fixture embodying the present invention;

FIG. 2 is an exploded perspective view of a fixture embodying the present invention;

FIG. 3 is a top view of a partial structure of a fixture embodying the present invention;

FIG. 4 is a cross-sectional view at section A-A of FIG. 3;

FIG. 5 is a perspective view of a positioning unit embodying the present invention;

FIG. 6 is an exploded perspective view of a positioning unit embodying the present invention;

FIG. 7 is a first perspective view of a fixture embodying the present invention and an apparatus for automatically assembling the fixture;

FIG. 8 is a partial enlarged view of FIG. 7 at B;

FIG. 9 is a second perspective view of a gauge embodying the present invention and apparatus for automatically assembling the gauge;

FIG. 10 is a top view of a fixture and step transfer and dispenser embodying the present invention;

FIG. 11 is a cross-sectional view at section C-C of FIG. 10;

FIG. 12 is a top view of a step transfer and dispenser embodying the present invention;

FIG. 13 is a cross-sectional view at section D-D of FIG. 12;

FIG. 14 is a cross-sectional view at section E-E of FIG. 12;

FIG. 15 is a cross-sectional view at section F-F of FIG. 12;

FIG. 16 is a flow chart of a method of implementing the present invention;

the reference numbers in the figures are:

1-a diode;

2-a positioning unit; 2 a-an insulating block; 2a 1-bottom wall; 2a 2-first side wall; 2a 3-second side wall; 2a4 — first recess; 2a 5-boss; 2a 6-second recess; 2 b-a conductive block; 2b 1-riser; 2b 2-cross plate;

3, positioning a template; 3 a-a positioning plate; 3a 1-slot; 3a 2-iron nuggets; 3a 3-avoidance orifice; 3a 4-avoiding slot; 3 b-sealing plate; 3b 1-magnetic attraction block; 3b 2-positioning bar;

4-a probe;

5-a first feeding unit;

6-step type material moving device; 6 a-a first material moving track; 6a 1-splicing rails; 6a 2-feed track; 6a 3-discharge rail; 6 b-a second material moving track; 6 c-a first pusher; 6 d-a second pusher; 6 e-a first sensor; 6 f-a second sensor;

7-a second feeding unit;

8-a distributor; 8 a-a lifter bar; 8 b-a lifting device; 8 c-a stopper; 8 d-a third sensor;

9-a translation work table; 9 a-a placement table; 9 b-a clamping block; 9 c-a first linear driver; 9 d-second linear actuator.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.

In the prior art, the check tool for stacking the diodes 1 is integrally formed, when the specification of the diode 1 to be detected is changed, the check tool needs to be changed into a check tool with other shapes so as to adapt to the diode 1 with a new specification, and a longer processing period is needed for customizing and processing a new check tool, and the cost is high, so as to solve the above technical problems, as shown in fig. 1, 3 and 4, the following preferred technical solutions are provided:

a test device for a plastic package surface mount diode comprises a detection tool for stacking a diode 1 and a probe 4 for electrically connecting two electrodes of the diode 1; the checking fixture comprises a fixture body,

a positioning unit 2 for positioning one diode 1; and the number of the first and second groups,

the positioning template 3 is used for positioning the positioning units 2, the positioning template 3 is in a flat plate shape horizontally arranged, the positioning units 2 are detachably connected with the positioning template 3, and the positioning units 2 are arranged on the positioning template 3 in a rectangular array.

Specifically, the method comprises the following steps:

the checking fixture is composed of a plurality of positioning units 2 and a positioning template 3, each positioning unit 2 can position one diode 1, so that the plurality of diodes 1 are positioned by one positioning template 3, and further the probe 4 can detect each diode 1.

Further, in order to solve the technical problem of how to detachably connect the positioning unit 2 with the positioning template 3, as shown in fig. 2, the following preferred technical solutions are provided:

the positioning template 3 is composed of a positioning plate,

the positioning plate 3a is horizontally arranged, the positioning plate 3a is in a flat plate shape, one side surface of the positioning plate 3a is provided with a slot 3a1 horizontally extending towards the other side surface of the positioning plate 3a, the slot 3a1 does not penetrate through the positioning plate 3a, a plurality of slots 3a1 are arranged on the positioning plate 3a side by side, the slots 3a1 are in a C-shaped shape with an upward opening, and the positioning unit 2 is in sliding fit with the slots 3a 1; and the number of the first and second groups,

the sealing plate 3b is vertically arranged, the sealing plate 3b is arranged on the side surface of the positioning plate 3a and covers the opening of the slot 3a1, and the sealing plate 3b is detachably connected with the positioning plate 3 a.

Specifically, the method comprises the following steps:

all be provided with an iron plate 3a2 between two adjacent slots 3a1, be provided with on the board of sealing 3b with the magnetism piece 3b1 of every iron plate 3a2 one-to-one, the effect of magnetism through magnetism piece 3b1 and iron plate 3a2 makes the board of sealing 3b and locating plate 3a detachable connection, the staff slides locating element 2 inside a plurality of slots 3a1 and fill up all slots 3a1, reuse the board of sealing 3b closing cap slot 3a 1's opening part, can fix locating element 2 inside slot 3a1 and make it unable removal.

Further, in order to solve the technical problem of how to maintain the diode 1 in its own posture and position when the diode is positioned and two electrodes thereof are electrically connected to two probes 4, as shown in fig. 3 to 6, the following preferred technical solutions are provided:

the positioning unit 2 is comprised of a positioning unit,

an insulating block 2a used for placing the diode 1, wherein the top of the insulating block 2a is provided with a positioning cavity, the positioning cavity is provided with an inclined bottom wall 2a1, the shape of the bottom wall 2a1 is matched with that of the bottom surface of the diode 1, and the intersection part of the peripheral wall of the positioning cavity and the lowest edge of the bottom wall 2a1 forms a first side wall 2a 2; and the number of the first and second groups,

the conductive block 2b partially replaces the first side wall 2a2 and the bottom wall of the insulating block 2a, and the positioning plate 3a is provided with an escape opening 3a3 which penetrates the positioning plate 3a and exposes the conductive block 2 b.

Specifically, the method comprises the following steps:

the positioning cavity is formed by the bottom wall 2a1 and one first side wall 2a2 and two second side walls 2a3 arranged around the bottom wall 2a1, the two second side walls 2a3 are arranged at two sides of the V-shaped concave surface formed by the bottom wall 2a1 and the first side wall 2a2, and the bottom wall 2a1, the first side wall 2a2 and the second side wall 2a3 are all inclined surfaces inclined outwards.

The conductive block 2b comprises a vertical plate 2b1 and a horizontal plate 2b2 which are perpendicular to each other, wherein the vertical plate 2b1 is embedded in the insulating block 2a and partially replaces the first side wall 2a2, the horizontal plate 2b2 is embedded in the bottom of the insulating block 2a and partially replaces the bottom wall of the insulating block 2a, and the conductive block 2b is made of copper.

After the diode 1 falls into the positioning cavity, the diode 1 slides into the bottom of the positioning cavity along the bottom wall 2a1 under the guidance of the second side wall 2a3, one of two electrodes of the diode 1 is in contact with the first side wall 2a2, and since the first side wall 2a2 and a part of the bottom wall of the insulating block 2a are replaced by the conductive block 2b, one electrode of the diode 1 is in contact with the conductive block 2b, so that one probe 4 can pass through the avoidance opening 3a3 from bottom to top to be in contact with the conductive block 2b, so that the probe 4 is electrified with one electrode of the diode 1, and the other probe 4 is electrified with the other electrode of the diode 1 from top to bottom, so that detection can be carried out.

The other ends of the two probes 4 are connected with a device similar to a multimeter, and the resistance of the detection diode 1 is used for judging whether the short circuit or the open circuit exists, and the electrodes of the two probes 4 can be interchanged through electric brushes.

The advantages of the structure are that: under the action of gravity, one electrode of the diode 1 is always abutted against the conductive block 2b, and when one probe 4 is abutted against the conductive block 2b from bottom to top, the upward thrust of the probe 4 is borne by the conductive block 2b, the insulating block 2a and the positioning template 3, so that no influence is generated on the position and the posture of the diode 1, and the other probe 4 is abutted against the other electrode of the diode 1 from top to bottom, so that only the diode 1 is abutted against the conductive block 2b more tightly.

In order to avoid molding defects at the intersection of the bottom wall 2a1 and the conductive block 2b, such as ribs, particles, etc., which interfere with the contact between the electrode of the diode 1 and the conductive block 2b, the following preferred solutions are provided as shown in fig. 4:

the positioning cavity also has a first recess 2a4 provided at the intersection of the bottom wall 2a1 and the conductive block 2 b.

Even if the ridge or the particle is present inside the first recess 2a4, the electrode of the diode 1 cannot be prevented from contacting the conductive block 2 b.

To solve this problem, it is time and labor consuming to stack several diodes 1 inside each positioning cavity in turn, and as shown in fig. 7 to 15, the following preferred solutions are provided:

the test apparatus may further comprise a test device,

a first feeding unit 5 for outputting the positioning unit 2; and the number of the first and second groups,

a step shifter 6 for receiving the positioning unit 2 output from the first feeding unit 5 and transferring the positioning unit 2 step by step, an output end of the step shifter 6 facing one slot 3a 1; and the number of the first and second groups,

a second feeding unit 7 for outputting the diode 1; and the number of the first and second groups,

a distributor 8 for receiving the diodes 1 output by the second feeding unit 7 and outputting one diode 1 on top of each positioning unit 2 on the step shifter 6; and the number of the first and second groups,

a translation stage 9 for translating the positioning plate 3a so that the different slots 3a1 are aligned with the output of the step-by-step feeder 6.

Specifically, the first feeding unit 5 and the second feeding unit 7 are both common automatic feeding devices, each of which includes a vibrating tray, a conveying track and a vibrating conveying motor, and the specific structure and operation principle thereof are not described herein. Since the step shifter 6 is step-fed, the positioning unit 2 is intermittently moved during the feeding in the step shifter 6, and when the positioning unit 2 stops moving, the dispenser 8 feeds one diode 1 above the positioning unit 2, the diode 1 falls into the positioning chamber, then the diode 1 automatically slides into the bottom of the positioning chamber under the guidance of the bottom wall 2a1, the first side wall 2a2 and the second side wall 2a3, and one electrode of the diode 1 abuts against the conductive block 2 b.

It should also be noted that:

one end of insulating block 2a length direction is provided with bellying 2a5, and bellying 2a5 is used for the direction of supplementary vibration dish screening positioning unit 2 for only orientation the same positioning unit 2 can be exported by first material loading unit 5, has avoided first material loading unit 5 to export orientation different positioning unit 2. The other end of the insulating block 2a in the length direction is provided with a second concave part 2a6 matched with the shape of the convex part 2a5, and the second concave part 2a6 is used for being embedded into the convex part 2a5, so that more positioning units 2 can be arranged in the slot 3a 1.

In order to solve the technical problem of how to transfer the positioning unit 2 in a stepping manner, as shown in fig. 8, 12, 14 and 15, the following preferred technical solutions are provided:

the step-by-step material moving device 6 comprises,

a first material moving rail 6a for the positioning unit 2 to slide; and the number of the first and second groups,

a second transfer rail 6b which is perpendicular to the first transfer rail 6a and is disposed obliquely, a lower end of the second transfer rail 6b is positioned right above one side of a middle end of the first transfer rail 6a, and a bottom wall of the second transfer rail 6b is parallel to the bottom wall 2a1 of the positioning unit 2 positioned on the first transfer rail 6a and is higher than the bottom wall 2a 1; and the number of the first and second groups,

and the power module is used for driving the positioning unit 2 to move in a stepping mode in the first material moving track 6 a.

Specifically, the method comprises the following steps:

the first material moving track 6a comprises a splicing track 6a1, and a feeding track 6a2 and a discharging track 6a3 which are arranged at two ends of the splicing track 6a1, wherein the splicing track 6a1, the feeding track 6a2 and the discharging track 6a3 are all straight grooves, and the feeding track 6a2 and the discharging track 6a3 are both arranged perpendicular to the splicing track 6a 1. The diode 1 slides from the second transfer rail 6b directly above the positioning unit 2 and falls into the positioning chamber.

The power module comprises a first pusher 6c and a second pusher 6d which are arranged at two ends of the splicing track 6a1, the first pusher 6c is parallel to the splicing track 6a1, the second pusher 6d is parallel to the discharging track 6a3, and the first pusher 6c and the second pusher 6d are linear drivers provided with push rods, such as voice coil motors.

The power module further comprises a first sensor 6e and a second sensor 6f which are arranged at two ends of the assembling track 6a1, holes which are located on sensing tracks of the first sensor 6e and the second sensor 6f are formed in the assembling track 6a1, when the positioning unit 2 moves to two ends of the assembling track 6a1, the positioning unit 2 shields the sensing tracks of the first sensor 6e and the second sensor 6f, the first sensor 6e and the second sensor 6f respectively send signals to the controller, and the controller respectively sends signals to drive the first ejector 6c and the second ejector 6d to work, so that the positioning unit 2 can move in a stepping mode along the feeding track 6a2, the assembling track 6a1 and the discharging track 6a 3.

In order to solve the technical problem of how to output one diode 1 to a position unit 2 directly above a stepping material shifter 6 at a time, as shown in fig. 8 and 13, the following preferred technical solutions are provided:

the distributor 8 is provided with a distributor which comprises,

the material lifting rod 8a is arranged beside the higher end of the second material moving rail 6b in a lifting manner, the top surface of the material lifting rod 8a is parallel to the bottom wall of the second material moving rail 6b, and the output end of the second feeding unit 7 is arranged on one side, away from the second material moving rail 6b, of the material lifting rod 8 a; and the number of the first and second groups,

the lifting device 8b is used for driving the lifting rod 8a to lift; and the number of the first and second groups,

and a stopper 8c for stopping the diode 1 from moving from the output end of the second feeding unit 7 onto the lifter bar 8 a.

Specifically, the method comprises the following steps:

the working part of the lifting rod 8a is vertically arranged and is in sliding connection with the second material moving track 6b, the lifting device 8b is a linear driver, such as a voice coil motor, the material blocker 8c is a voice coil motor provided with a material blocking pressing plate, the distributor 8 further comprises a third sensor 8d for detecting whether the diode 1 is positioned on the top surface of the lifting rod 8a, and the third sensor 8d is a photoelectric switch.

The diode 1 is conveyed to the top surface of the lifting rod 8a through the second feeding unit 7, after the third sensor 8d detects the diode 1, the material blocker 8c works to press the diode 1 at the output end of the second feeding unit 7, so that the subsequent diode 1 cannot advance further, then the lifting device 8b works to lift the lifting rod 8a, and the diode 1 at the top end of the lifting rod 8a slides into the position right above the positioning unit 2 along the top surface of the lifting rod 8a and the bottom wall of the second material moving rail 6 b.

In order to solve the technical problem of how to sequentially transfer the positioning units 2 with the diodes 1 positioned therein to different slots 3a1, as shown in fig. 9 to 11, the following preferred technical solutions are provided:

the translation stage 9 is composed of a translation stage,

a shelf 9a having a flat plate shape and horizontally disposed; and the number of the first and second groups,

the clamping block 9b is arranged on the object placing table 9a in a sliding mode, and a groove matched with the positioning plate 3a in shape is formed when the object placing table 9a and the clamping block 9b are close to each other; and the number of the first and second groups,

a first linear driver 9c for driving the clamp block 9b to approach or separate from the placing table 9 a; and the number of the first and second groups,

and the second linear driver 9d is used for driving the object placing table 9a to horizontally move perpendicular to the output end of the stepping type material moving device 6.

Specifically, the method comprises the following steps:

the first linear driver 9c is an air cylinder sliding table, the second linear driver 9d is a ball screw sliding table, the object placing table 9a, the clamping block 9b and the first linear driver 9c form a clamping jaw for clamping and fixing the positioning plate 3a, and the second linear driver 9d is used for driving the clamping jaw to move so as to drive the positioning plate 3a to move, so that different slots 3a1 are aligned to the discharge rail 6a 3.

It should also be noted that:

an avoiding slot 3a4 with the same shape as the second concave part 2a6 is arranged on one surface of the positioning plate 3a at the opening of the slot 3a1, and when the positioning plate 3a is driven by the translation workbench 9 to move horizontally, the avoiding slot 3a4 is used for avoiding the convex part 2a5 on the insulating block 2a at the tail end of the output end of the discharge rail 6a 3.

Correspondingly, the sealing plate 3b is provided with a positioning strip 3b2 matched with the avoidance slot 3a4, and the positioning strip 3b2 is used for positioning the height of the sealing plate 3b and ensuring the parallelism between the sealing plate 3b and the positioning plate 3 a.

The test device described above works by the following method:

s1, the first feeding unit 5 continuously outputs a plurality of positioning units 2 to the input end of the step-type material moving device 6, and the positioning units 2 move step-wise under the driving of the step-type material moving device 6;

s2, intermittently outputting the diodes 1 to the middle end of the stepping type material shifter 6 through the material distributor 8 by the second material loading unit 7, so that one diode 1 falls into a positioning cavity at the top of each positioning unit 2;

s3, the stepping material moving device 6 drives the positioning unit 2 positioned with the diode 1 to enter each slot 3a1 on the positioning plate 3a clamped by the translation workbench 9 in sequence;

s4, splicing the positioning units 2 and the positioning templates 3 into a detection tool, so that each positioning unit 2 is positioned with one diode 1;

s5, placing the positioning template 3 on a detection table;

s6, the two probes 4 are respectively and electrically connected with the two electrodes of the diode 1 to detect the resistance of the diode 1;

s7, the electrodes of the two probes 4 are exchanged, and the resistance of the diode 1 is detected again.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.