Prepreg composition, prepreg, laminated board and preparation method thereof

文档序号:1682635 发布日期:2020-01-03 浏览:27次 中文

阅读说明:本技术 预浸料组合物、半固化片、层压板及其制备方法 (Prepreg composition, prepreg, laminated board and preparation method thereof ) 是由 韩梦娜 卢悦群 任英杰 董辉 于 2019-09-25 设计创作,主要内容包括:本发明涉及一种预浸料组合物、半固化片、层压板及其制备方法;所述预浸料组合物包括树脂、填料和助剂,所述树脂中磁性物质的含量小于等于150ppm,所述填料中磁性物质的含量小于等于1150ppm,所述助剂中磁性物质的含量小于等于60ppm,所述磁性物质包括铁、钴、镍中的至少一种。本发明的预浸料组合物中,通过对树脂、填料和助剂中的磁性物质的含量进行控制,以使采用该预浸料组合物制备得到的层压板能够有效降低因材料非线性引起的无源互调产物的干扰,从而提高通信系统的通信质量。(The invention relates to a prepreg composition, a prepreg, a laminated board and a preparation method thereof; the prepreg composition comprises resin, filler and an auxiliary agent, wherein the content of a magnetic substance in the resin is less than or equal to 150ppm, the content of the magnetic substance in the filler is less than or equal to 1150ppm, the content of the magnetic substance in the auxiliary agent is less than or equal to 60ppm, and the magnetic substance comprises at least one of iron, cobalt and nickel. In the prepreg composition, the content of the magnetic substance in the resin, the filler and the auxiliary agent is controlled, so that the laminated board prepared by the prepreg composition can effectively reduce the interference of a passive intermodulation product caused by material nonlinearity, and the communication quality of a communication system is improved.)

1. The prepreg composition is characterized by comprising resin, filler and auxiliaries, wherein the content of a magnetic substance in the resin is less than or equal to 150ppm, the content of a magnetic substance in the filler is less than or equal to 1150ppm, the content of a magnetic substance in the auxiliaries is less than or equal to 60ppm, and the magnetic substance comprises at least one of iron, cobalt and nickel.

2. The prepreg composition of claim 1, wherein the resin contains 50ppm or less of iron, cobalt, and nickel.

3. The prepreg composition according to claim 1, wherein the filler contains iron in an amount of 1000ppm or less, cobalt in an amount of 100ppm or less, and nickel in an amount of 50ppm or less.

4. The prepreg composition of claim 1, wherein the auxiliaries each contain less than or equal to 20ppm of iron, cobalt, and nickel.

5. The prepreg composition according to any one of claims 1 to 4, wherein the filler is used in an amount of 60 to 150 parts by weight and the auxiliary is used in an amount of 1 to 30 parts by weight, based on 100 parts by weight of the resin.

6. A prepreg comprising a reinforcing material and the prepreg composition of any one of claims 6 to 8 attached to the reinforcing material.

7. The prepreg according to claim 6, wherein the reinforcing material contains a magnetic substance in an amount of 2300ppm or less, and the magnetic substance comprises at least one of iron, cobalt and nickel.

8. The prepreg according to claim 7, wherein the reinforcing material contains iron in an amount of 2000ppm or less, cobalt in an amount of 200ppm or less, and nickel in an amount of 100ppm or less.

9. A method of making a laminate, comprising:

providing a prepreg according to any one of claims 6 to 8;

and covering a metal foil on at least one surface of the prepreg, and curing to enable the prepreg to react to form a dielectric layer, thereby obtaining the laminated board.

10. The method for preparing the laminated board according to claim 9, wherein the number of the prepregs is multiple, the prepregs are stacked to form a prepreg layer, and the metal foil covers at least one surface of the prepreg layer.

11. A laminate obtained by the production method according to claim 9 or 10, comprising a dielectric layer and a metal foil provided on at least one surface of the dielectric layer.

12. The laminate of claim 11, wherein the metal foil has a content of magnetic material comprising at least one of iron, cobalt, and nickel of 1500ppm or less.

13. The laminate of claim 12, wherein the metal foil comprises copper foil, and wherein the copper foil has an iron, cobalt, and nickel content of 500ppm or less.

Technical Field

The invention relates to the field of electronic laminating composite materials, in particular to a prepreg composition, a prepreg, a laminated board and a preparation method thereof.

Background

Passive Intermodulation (PIM) is caused by the non-linear nature of various passive devices in the transmission system, which in high power, multi-channel systems, generate higher order harmonics relative to the operating frequency, which, when mixed with the operating frequency, create a new set of frequencies, the end result being a set of unwanted spectrum in the air that affects normal communications.

In recent years, with the great increase of the number of communication systems and their users, passive intermodulation products in mobile communication systems have become one of the important parasitic interferences affecting the communication quality of the systems. Therefore, researching how to scientifically and effectively avoid the generation of the passive intermodulation product has important significance for improving the communication quality of the whole communication system.

Disclosure of Invention

In view of the above, there is a need to provide a prepreg composition, a prepreg, a laminate and a preparation method thereof, wherein the content of the magnetic material in each component is controlled, and the laminate prepared by using the prepreg composition can effectively reduce the interference of passive intermodulation products caused by material nonlinearity.

A prepreg composition comprises resin, filler and auxiliary agent, wherein the content of a magnetic substance in the resin is less than or equal to 150ppm, the content of a magnetic substance in the filler is less than or equal to 1150ppm, the content of a magnetic substance in the auxiliary agent is less than or equal to 60ppm, and the magnetic substance comprises at least one of iron, cobalt and nickel.

In one embodiment, the content of iron, cobalt and nickel in the resin is less than or equal to 50 ppm.

In one embodiment, the filler contains 1000ppm or less of iron, 100ppm or less of cobalt and 50ppm or less of nickel.

In one embodiment, the content of iron, cobalt and nickel in the auxiliary agent is less than or equal to 20 ppm.

In one embodiment, the prepreg composition includes 60 to 150 parts by weight of the filler and 1 to 30 parts by weight of the auxiliary, based on 100 parts by weight of the resin.

A prepreg comprising a reinforcing material and a prepreg composition as described above adhered to the reinforcing material.

In one embodiment, the content of the magnetic substance in the reinforcing material is less than or equal to 2300ppm, and the magnetic substance comprises at least one of iron, cobalt and nickel.

In one embodiment, the reinforcing material contains iron less than or equal to 2000ppm, cobalt less than or equal to 200ppm and nickel less than or equal to 100 ppm.

A method of making a laminate comprising:

providing a prepreg as described above;

and covering a metal foil on at least one surface of the prepreg, and curing to enable the prepreg to react to form a dielectric layer, thereby obtaining the laminated board.

In one embodiment, the number of the prepregs is multiple, the prepregs are stacked to form a prepreg layer, and the metal foil covers at least one surface of the prepreg layer.

The laminated board obtained by the preparation method comprises a dielectric layer and a metal foil arranged on at least one surface of the dielectric layer.

In one embodiment, the content of the magnetic substance in the metal foil is less than or equal to 1500ppm, and the magnetic substance comprises at least one of iron, cobalt and nickel.

In one embodiment, the metal foil comprises copper foil, and the content of iron, cobalt and nickel in the copper foil is less than or equal to 500 ppm.

The inventor finds that the resin and the additive are doped with a small amount of magnetic substances such as iron, cobalt, nickel and the like due to the influence of production process, transportation, storage and the like, and the raw material of the filler contains high magnetic substances, so when the resin, the additive and the filler are mixed to form the laminated board and applied to communication equipment, the magnetic substances have high magnetic permeability and show hysteresis characteristics along with nonlinear change of a magnetic field, so that strong passive intermodulation products are generated to influence the communication quality. Based on the control, the prepreg composition controls the content of the magnetic substance in the resin, the filler and the auxiliary agent, so that the laminated board prepared by the prepreg composition can effectively reduce the interference of passive intermodulation products in communication equipment, thereby improving the communication quality.

Detailed Description

The prepreg composition, prepreg, laminate and method for preparing the same according to the present invention will be further described below.

The prepreg composition provided by the invention is mainly used for preparing prepregs, and then the laminates are prepared by adopting the prepregs, and the prepared laminates can effectively reduce the interference of passive intermodulation products caused by material nonlinearity due to low content of magnetic substances, so that the communication quality of a communication system is improved.

In satellite communication systems and mobile communication systems, PIM interference of microwave devices mainly comes from contact nonlinearity and material nonlinearity. The applicant has long and intensive research and unexpectedly found that the resin and the auxiliary agent can be doped into trace magnetic substances such as iron, cobalt, nickel and the like due to the influence of production process, transportation, storage and the like, and the filler contains higher magnetic substances due to the raw materials. In communication systems, these magnetic substances have a high permeability and vary non-linearly with the magnetic field, exhibiting hysteresis characteristics, and when the content is too high, strong passive intermodulation products can be generated.

Therefore, the prepreg composition provided by the invention comprises resin, filler and auxiliary agent, wherein the content of the magnetic substance in the resin is less than or equal to 150ppm, the content of the magnetic substance in the filler is less than or equal to 1150ppm, the content of the magnetic substance in the auxiliary agent is less than or equal to 60ppm, and the magnetic substance comprises at least one of iron, cobalt and nickel. By controlling the content of the magnetic substances in the resin, the filler and the auxiliary agent, the laminated board prepared by the prepreg composition can effectively reduce the interference of passive intermodulation products caused by material nonlinearity, thereby improving the communication quality of a communication system.

It is understood that the magnetic substance content in the resin, filler and adjuvant is the content of the magnetic substance in the raw materials of the resin, filler and adjuvant used. For example, the content of the magnetic substance in the resin is 150ppm or less, which means that the content of the magnetic substance in the resin raw material is 150ppm or less, and the total content of the magnetic substance in all resin components in the prepreg composition is not 150ppm or less.

Specifically, the content of iron, cobalt and nickel in the resin is less than or equal to 50ppm, preferably less than 50ppm, and more preferably less than 20 ppm. In the filler, the content of iron is less than or equal to 1000ppm, preferably less than 1000ppm, and more preferably less than 500 ppm; the cobalt content is 100ppm or less, preferably 100ppm or less, and more preferably 50ppm or less; the content of nickel element is 50ppm or less, preferably 50ppm or less, and more preferably 20ppm or less. In the additive, the contents of iron, cobalt and nickel are less than or equal to 20ppm, preferably less than 20ppm, and more preferably less than 10 ppm.

Specifically, in the prepreg composition, the filler is used in an amount of 60 to 150 parts by weight and the auxiliary is used in an amount of 1 to 30 parts by weight, based on 100 parts by weight of the resin.

The auxiliary agent comprises at least one of a curing agent, a coupling agent and an auxiliary crosslinking agent, wherein the using amount of the curing agent is 1-10 parts by weight, the using amount of the coupling agent is 0-5 parts by weight, and the using amount of the auxiliary crosslinking agent is 0-20 parts by weight. In the auxiliary agent, the content of the magnetic substance in each component is less than or equal to 60ppm, and the content of iron, cobalt and nickel in each component is less than or equal to 20ppm, preferably less than 10 ppm.

Wherein the resin comprises at least one of polytetrafluoroethylene, polybutadiene, a copolymer of polybutadiene and styrene, polyisoprene, modified polybutadiene, a block copolymer or a graft copolymer which can perform copolymerization and crosslinking reaction, thermosetting liquid crystal resin, cyanate ester, polyphenyl ether, modified polyphenyl ether and polyimide.

The filler comprises at least one of polytetrafluoroethylene, titanium dioxide, barium titanate, strontium titanate, silicon dioxide, corundum, wollastonite, solid glass microspheres, hollow silicon dioxide microspheres, hollow titanium dioxide microspheres, synthetic glass, quartz, boron nitride, aluminum carbide, beryllium oxide, aluminum hydroxide, magnesium oxide, mica, talc and magnesium hydroxide.

The coupling agent comprises at least one of silane coupling agent, titanate coupling agent and aluminate coupling agent.

The curing agent comprises at least one of 2, 5-dimethyl-2, 5-di (benzyl peroxide) hexane, di-tert-butyl peroxide, 2, 5-dimethyl-2, 5-bis (tert-butylperoxy) hexane, 2, 5-dimethyl-2, 5-di-tert-butylperoxy-3-hexyne and dicumyl peroxide.

The auxiliary crosslinking agent comprises at least one of triallyl isocyanurate, triallyl cyanurate, diallyl terephthalate, divinylbenzene and multifunctional acrylate.

The invention also provides a prepreg, which comprises a reinforcing material and the prepreg composition attached to the reinforcing material.

Wherein the content of the magnetic substance in the reinforcing material is less than or equal to 2300ppm, and the magnetic substance comprises at least one of iron, cobalt and nickel.

Specifically, the iron content in the reinforcing material is less than or equal to 2000ppm, preferably less than 2000ppm, further preferably less than 1000ppm, and more preferably less than 500 ppm; the cobalt content is 200ppm or less, preferably 200ppm or less, and more preferably 100ppm or less; the content of nickel element is 100ppm or less, preferably 100ppm or less, and more preferably 50ppm or less.

Specifically, the preparation method of the prepreg comprises the following steps:

s10, providing the prepreg composition as described above, dissolving the prepreg composition in a solvent to obtain a glue solution;

and S11, placing the glue solution on a reinforcing material, and removing the solvent to obtain a prepreg.

In step S10, the solvent includes at least one of xylene, toluene, acetone, methyl ethyl ketone, and dimethylformamide. And after mixing the resin, the filler and the auxiliary agent, diluting the mixture to proper viscosity by using the solvent, stirring and mixing the mixture to uniformly disperse the filler in a resin system to prepare the glue solution.

The invention also provides a preparation method of the laminated plate, which comprises the following steps:

s20, providing a prepreg as described above;

and S21, covering a metal foil on at least one surface of the prepreg, and curing to enable the prepreg to react to form a dielectric layer, thereby obtaining the laminated board.

In step S20, the number of the prepregs may be multiple, including two, three, four, five, six, etc., and the number of the prepregs is determined according to actual use requirements, and the multiple prepregs are stacked to form the prepreg layer.

In step S21, the curing temperature is 150-280 ℃ and the pressure is 10Kg/cm2-80Kg/cm2So that the resin in the prepreg generates a crosslinking reaction to form the dielectric layer.

It is understood that the metal foil is disposed on one surface of the prepreg or on both surfaces of the prepreg oppositely, preferably on both surfaces of the prepreg oppositely.

The invention also provides a laminated board obtained by the preparation method, which comprises a dielectric layer and a metal foil arranged on at least one surface of the dielectric layer.

Specifically, the content of a magnetic substance in the metal foil is less than or equal to 1500ppm, and the magnetic substance comprises at least one of iron, cobalt and nickel.

The metal foil is preferably a copper foil, and the content of iron, cobalt and nickel in the copper foil is less than or equal to 500ppm, preferably less than 500ppm, and more preferably less than 300 ppm.

When the metal foil is a copper foil, the laminated board is a copper-clad board, and the copper-clad board can effectively reduce the interference of a passive intermodulation product caused by material nonlinearity, so that the communication quality of a communication system is improved.

The prepreg composition, prepreg, laminate and methods for producing the same will be further described below with reference to specific examples.

Table 1: the content of the magnetic substance in each raw material in examples 1 to 8

Figure BDA0002214869810000071

Table 2: components and parts by weight of the prepreg compositions of examples 1 to 8

Figure BDA0002214869810000072

9页详细技术资料下载
上一篇:一种医用注射器针头装配设备
下一篇:树脂组合物及具有其的半固化片、层压板、印制线路板

网友询问留言

已有0条留言

还没有人留言评论。精彩留言会获得点赞!

精彩留言,会给你点赞!