High-temperature-resistant adhesive, masking tape applying adhesive and preparation method of masking tape

文档序号:1682809 发布日期:2020-01-03 浏览:30次 中文

阅读说明:本技术 一种耐高温胶黏剂和应用该胶黏剂的美纹纸胶带及其制备方法 (High-temperature-resistant adhesive, masking tape applying adhesive and preparation method of masking tape ) 是由 夏有贵 龙冲 周亮 于 2018-12-27 设计创作,主要内容包括:本发明揭示了一种耐高温胶黏剂,先提供一种混炼胶组合物A,按份数计包括以下组分:天然烟片胶70份;丁苯橡胶23份;硬脂酸0.7份;氧化锌4.9份;抗氧剂1份;光稳定剂0.3份;按质量百分比计包括以下组分:组合物A 8~12%;改性氢化石油树脂5~8%;溴化烷基酚醛树脂0.5~2%;古马隆树脂0.5~1.5%;白油0.5~2%;硫化促进剂0.5~1‰;树脂酸锌1~3‰;交联剂1~2%;溶剂75~82%。本发明的一种耐高温胶黏剂采用丁苯橡胶和天然烟片胶混炼体系,中和了天然烟片胶老化发粘和丁苯橡胶老化发脆的缺点,同时天然烟片胶和丁苯橡胶都可以参与交联,进一步提高了耐老化性能;整个体系为环境友好型胶粘剂,无酸或弱酸、呈现惰性,不腐蚀被贴材质,且不影响电子材料的功能。(The invention discloses a high-temperature-resistant adhesive, which firstly provides a rubber compound composition A, and the rubber compound composition A comprises the following components in parts by weight: 70 parts of natural tobacco sheet glue; 23 parts of styrene butadiene rubber; 0.7 part of stearic acid; 4.9 parts of zinc oxide; 1 part of an antioxidant; 0.3 part of light stabilizer; the composite material comprises the following components in percentage by mass: 8-12% of a composition A; 5-8% of modified hydrogenated petroleum resin; 0.5-2% of brominated alkyl phenolic resin; 0.5-1.5% of coumarone resin; 0.5-2% of white oil; 0.5-1% o of vulcanization accelerator; 1-3 per mill of zinc resinate; 1-2% of a cross-linking agent; 75-82% of a solvent. The high-temperature-resistant adhesive disclosed by the invention adopts a mixing system of the styrene-butadiene rubber and the natural smoked sheet rubber, the defects of ageing and stickiness of the natural smoked sheet rubber and ageing and brittleness of the styrene-butadiene rubber are neutralized, and meanwhile, the natural smoked sheet rubber and the styrene-butadiene rubber can participate in crosslinking, so that the ageing resistance is further improved; the whole system is an environment-friendly adhesive, has no acid or weak acid, is inert, does not corrode the pasted material, and does not affect the function of the electronic material.)

1. A high temperature resistant adhesive is characterized in that: the composite material comprises the following components in percentage by mass:

Figure FDA0001925487980000011

the composition A is obtained by mixing the following components in parts by weight:

Figure FDA0001925487980000012

2. the high temperature resistant adhesive of claim 1, wherein: the natural tobacco flake glue is first-grade tobacco flake glue; the styrene butadiene rubber is emulsion polymerized styrene butadiene rubber, the styrene content is 15-25%, and the elongation at break is 350-800%.

3. The high temperature resistant adhesive of claim 1, wherein: the modified hydrogenated petroleum resin has a falling ball softening point of 80-110 ℃, a melt viscosity of 500-1300 mPa.s, a molecular weight of 300-1500 and a glass transition temperature of 50-110 ℃.

4. The high temperature resistant adhesive of claim 1, wherein: the brominated alkyl phenolic resin has a falling ball softening point of 70-100 ℃, a bromine content of 3-10% and a Tg of 50-80 ℃.

5. The high temperature resistant adhesive of claim 1, wherein: the coumarone resin has a falling ball softening point of 110-150 ℃ and a molecular weight of 500-3000.

6. The high temperature resistant adhesive of claim 1, wherein: the vulcanization accelerator is one or more of zinc dibutylaminothioformate, zinc diethylaminothiocarbamate, tetramethylthiuram disulfide, tetraethylthiuram disulfide and zinc oxide.

7. The high temperature resistant adhesive of claim 1, wherein: the zinc resinate is zinc salt of resin acid and abietic acid.

8. The high temperature resistant adhesive of claim 1, wherein: the antioxidant is one or more of 2, 6-di-tert-butyl-p-cresol, styrene phenol, 2, 5-di-tert-butyl-p-diphenol, 2' -dimethylene bis- (4-methyl-6-tert-butylphenol), octadecyl-3, 5-bis (1, 1-dimethylethyl) -4-hydroxyphenyl propionate, tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester and tri (2, 4-di-tert-butylphenyl) phosphite ester.

9. The high temperature resistant adhesive of claim 1, wherein: the light stabilizer is an o-hydroxybenzophenone, benzotriazole, salicylate, triazine, substituted acrylonitrile and hindered amine light stabilizer; further, the light stabilizer is one or more of UV-2, UV-328, UV-292, UV-326, UV-328, UV-944, UV-1577 and UV-144.

10. The high temperature resistant adhesive of claim 1, wherein: the cross-linking agent is isocyanate or peroxide cross-linking agent.

11. The high temperature resistant adhesive of claim 1, wherein: the solvent is one or more of ethyl acetate, butyl acetate, methyl isobutyl ketone, isophorone, acetone, butanone, cyclohexanone, toluene, xylene, n-heptane and cyclohexane.

12. The masking tape using the high temperature resistant adhesive of claim 1, wherein: the paper sequentially comprises a textured paper and a high-temperature-resistant adhesive layer coated on one side of the textured paper, wherein the high-temperature-resistant adhesive layer is composed of the high-temperature-resistant adhesive in claim 1.

13. The preparation method of the high temperature resistant adhesive according to claim 1, comprising the following steps:

a) putting the natural tobacco flake glue into an open mill for open milling, wherein the open milling temperature is 45 +/-5 ℃, putting zinc oxide, stearic acid, an antioxidant and a light stabilizer while carrying out open milling, putting styrene butadiene rubber for mixing when carrying out open milling for the fourth time, finishing mixing when carrying out open milling for the eighth time to obtain a mixed material, and slicing and cooling for more than 6 hours;

b) putting the mixed material obtained in the step a) into a solvent, simultaneously putting white oil, modified hydrogenated petroleum resin, brominated alkyl phenolic resin, coumarone resin, vulcanization accelerator and zinc resinate, and stirring and dissolving to obtain a pressure-sensitive adhesive solution;

c) adding a cross-linking agent into the pressure-sensitive adhesive solution obtained in the step b), and uniformly stirring to obtain the high-temperature-resistant adhesive.

Technical Field

The invention belongs to the technical field of adhesives, and particularly relates to a high-temperature-resistant adhesive, a masking tape using the adhesive and a preparation method of the masking tape.

Background

The adhesive tape is divided into kraft paper adhesive tape, box sealing adhesive tape, stationery adhesive tape, masking tape, cloth base adhesive tape, metal foil adhesive tape, etc. according to different materials. The masking tape is a roll-shaped tape which is prepared by coating pressure-sensitive adhesive on one surface of masking paper and coating anti-sticking material on the other surface of the masking paper, has the characteristics of high temperature resistance, good chemical solvent resistance, high adhesive force, softness, conformability, no residual adhesive after tearing and the like, and is widely applied to industries of indoor decoration, paint spraying of household appliances, shielding of automobile spraying, fixing of semiconductor elements and the like. The color separation effect interface of the masking tape is clear and bright, and the masking tape has an arc-shaped art effect, so that the masking tape brings a huge promotion effect to industries such as decoration, spraying, semiconductor fixing and the like. Due to the particularity of the use occasion, the masking tape needs to have the characteristics of high temperature resistance, solvent resistance, high adhesive force and the like. Especially when the high-temperature-resistant masking tape is applied to occasions of high-temperature baking varnish shielding, semiconductor element fixing and the like, if the high-temperature-resistant performance of the masking tape can not meet the use requirement, the masking tape can generate phenomena of degumming, cracking, residual glue and the like due to the reduction of the cohesive force and adhesive force of the pressure-sensitive adhesive in the use process, so that the surface of a protected object is polluted or the fixed electronic semiconductor element is damaged. The highest resistance of the conventional masking tape can only reach 120 ℃, and when the temperature of the conventional masking tape exceeds 120 ℃, the conventional silicone pressure-sensitive adhesive is used as the pressure-sensitive adhesive of the masking tape, so that the high-temperature resistance requirement of the masking tape is met, but the initial adhesion of the silicone pressure-sensitive adhesive is poor, silicon pollution is generated on the surface of an electronic product, the preparation cost is high, and the use of the silicone pressure-sensitive adhesive is greatly limited.

At present, a small amount of related high-temperature-resistant masking tape technologies are disclosed, for example, a chinese patent with publication number CN102363718A discloses a high-temperature masking tape, which adopts high-temperature-resistant glue to improve the temperature resistance, and the high-temperature-resistant glue includes one of silicone glue, phenolic resin glue, urea-formaldehyde resin glue, temperature-resistant epoxy glue and polyimide glue, although the temperature resistance of the masking tape is improved, the initial adhesion is poor. For example, chinese patent with publication number CN202220152U discloses a method for manufacturing textured capacitor tape, which uses polyisoprene rubber graft polymerization monomer to realize the high temperature resistance of pressure sensitive adhesive by grafting and crosslinking, but the patent does not specifically disclose the graft polymerization process, but from the technical content disclosed in the patent, the pressure sensitive adhesive is used as the core functional component of the pressure sensitive adhesive tape, and the graft polymerization method is used to prepare the pressure sensitive adhesive, which has low grafting efficiency, poor controllability and high production cost, and is not objective and practical for industrial production and popularization, and the high temperature resistance of the pressure sensitive adhesive can not be realized on the basic premise that the basic adhesion performance and the process manufacturing requirement of the pressure sensitive adhesive can not be satisfied, and has a great defect. In the invention, stannous chloride dihydrate is adopted to promote the crosslinking of a mixed system of NR and SBR and isocyanate to achieve high temperature resistance, and although the problems of adhesion and cohesion in a high-temperature environment are solved, the highest temperature resistance of the high-temperature-resistant rubber is 139 ℃, and a space for continuously and upwardly improving the high temperature resistance is still provided.

Disclosure of Invention

In view of the defects in the prior art, the invention aims to provide a high-temperature-resistant adhesive, a masking tape using the high-temperature-resistant adhesive and a preparation method of the masking tape.

The purpose of the invention is realized by the following technical scheme:

the high-temperature-resistant adhesive comprises the following components in percentage by mass:

Figure RE-GDA0002276268930000031

the composition A is obtained by mixing the following components in parts by weight:

Figure RE-GDA0002276268930000032

further, the natural tobacco sheet glue is first-grade tobacco sheet glue; the styrene butadiene rubber is emulsion polymerized styrene butadiene rubber, the styrene content is 15-25%, and the elongation at break is 350-800%.

Furthermore, the falling ball softening point of the modified hydrogenated petroleum resin is 80-110 ℃, the melt viscosity is 500-1300 mPa.s, the molecular weight is 300-1500, and the glass transition temperature is 50-110 ℃.

Furthermore, the brominated alkyl phenolic resin has a falling ball softening point of 70-100 ℃, a bromine content of 3-10% and a Tg of 50-80 ℃.

Further, the coumarone resin has a falling ball softening point of 110-150 ℃ and a molecular weight of 500-3000.

Further, the vulcanization accelerator is one or more of zinc dibutylaminothioformate, zinc diethylcarbamothioate, tetramethylthiuram disulfide, tetraethylthiuram disulfide and zinc oxide.

Furthermore, the zinc resinate is zinc salt of resin acid and abietic acid.

Further, the antioxidant is one or more of 2, 6-di-tert-butyl-p-cresol, styryl phenol, 2, 5-di-tert-butyl-p-diphenol, 2' -dimethylene bis- (4-methyl-6-tert-butylphenol), octadecyl-3, 5-bis (1, 1-dimethylethyl) -4-hydroxyphenyl propionate (1076), pentaerythritol tetrakis [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ] (1010) and tris (2, 4-di-tert-butylphenyl) phosphite (168).

Further, the light stabilizer is an o-hydroxybenzophenone, benzotriazole, salicylate, triazine, substituted acrylonitrile and hindered amine light stabilizer; further, the light stabilizer is one or more of UV-2, UV-328, UV-292, UV-326, UV-328, UV-944, UV-1577 and UV-144.

Further, the cross-linking agent is isocyanate or peroxide cross-linking agent.

Further, the solvent is one or more of ethyl acetate, butyl acetate, methyl isobutyl ketone, isophorone, acetone, butanone, cyclohexanone, toluene, xylene, n-heptane and cyclohexane.

The masking tape using the high-temperature-resistant adhesive sequentially comprises masking paper and a high-temperature-resistant adhesive layer coated on one side of the masking paper, wherein the high-temperature-resistant adhesive layer is composed of the high-temperature-resistant adhesive.

A preparation method of a high-temperature-resistant adhesive comprises the following steps:

a) putting the natural tobacco flake glue into an open mill for open milling, wherein the open milling temperature is 45 +/-5 ℃, putting zinc oxide, stearic acid, an antioxidant and a light stabilizer while carrying out open milling, putting styrene butadiene rubber for mixing when carrying out open milling for the fourth time, finishing mixing when carrying out open milling for the eighth time to obtain a mixed material, and slicing and cooling for more than 6 hours;

b) putting the mixed material obtained in the step a) into a solvent, simultaneously putting white oil, modified hydrogenated petroleum resin, brominated alkyl phenolic resin, coumarone resin, vulcanization accelerator and zinc resinate, and stirring and dissolving to obtain a pressure-sensitive adhesive solution;

c) adding a cross-linking agent into the pressure-sensitive adhesive solution obtained in the step b), and uniformly stirring to obtain the high-temperature-resistant adhesive.

The invention has the outstanding effects that: the high-temperature-resistant adhesive disclosed by the invention adopts a mixing system of the styrene-butadiene rubber and the natural smoked sheet rubber, the defects of ageing and stickiness of the natural smoked sheet rubber and ageing and brittleness of the styrene-butadiene rubber are neutralized, and meanwhile, the natural smoked sheet rubber and the styrene-butadiene rubber can participate in crosslinking, so that the ageing resistance is further improved; brominated alkyl phenolic resin can be crosslinked with the rubber main body into a whole, so that double bonds in rubber molecular chains are reduced, and the heat resistance and the aging resistance are improved; by adopting a peroxide crosslinking system, the rubber molecules can be effectively initiated to polymerize free radicals, so that the heat resistance and the aging resistance are further improved; the modified hydrogenated petroleum resin and the coumarone resin are adopted, and the modified hydrogenated petroleum resin does not contain double bonds among molecules, is matched with a light stabilizer and an antioxidant for use, so that the aging performance is excellent, and is matched with the coumarone resin, so that the high-temperature resistance is improved; the whole system is an environment-friendly adhesive, has no acid or weak acid, is inert, does not corrode the pasted material, and does not affect the function of the electronic material.

The following detailed description of the embodiments of the present invention is provided in connection with the examples to facilitate understanding and understanding of the technical solutions of the present invention.

Detailed Description

The process of the present invention is illustrated below by means of specific examples, but the present invention is not limited thereto. The experimental methods described in the following examples are all conventional methods unless otherwise specified; the reagents and materials are commercially available, unless otherwise specified.

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