阅读说明：本技术 用于触摸屏的单层导电膜结构及其制作方法及触摸屏 (Single-layer conductive film structure for touch screen, manufacturing method of single-layer conductive film structure and touch screen ) 是由 凌云志 李子白 崔银花 胡川 陈志涛 于 2021-07-30 设计创作，主要内容包括：本发明公开了一种用于触摸屏的单层导电膜结构的制作方法,其包括以下步骤：分别制备具有连接桥导电网络结构的转移胶和涂布有连接桥绝缘材料的导电膜结构；将转移胶上的全部连接桥导电网络结构或部分连接桥导电网络结构与导电膜结构上的连接桥绝缘材料相对应设置,采用将转移胶与导电膜结构复合,形成单层的、具有在两个方向上各自独立的导通的电极组的单层导电膜结构。通过采用该方法,先分别制备连接桥导电网络结构和导电膜结构,再将其复合形成单层导电膜结构,与现有的单纯涂布工艺形成的导电膜相比,其工艺稳定性更高,从而能够形成稳定有效的欧姆接触,显著提高连接桥联通距离,具有很高的商业化价值。(The invention discloses a manufacturing method of a single-layer conductive film structure for a touch screen, which comprises the following steps: respectively preparing a transfer adhesive with a connecting bridge conductive network structure and a conductive film structure coated with a connecting bridge insulating material; and (3) correspondingly arranging all or part of the connecting bridge conductive network structure on the transfer adhesive and the connecting bridge insulating material on the conductive film structure, and compounding the transfer adhesive and the conductive film structure to form a single-layer conductive film structure with electrode groups which are independently conducted in two directions. By adopting the method, the connecting bridge conductive network structure and the conductive film structure are respectively prepared firstly, and then the conducting film structure is compounded to form a single-layer conductive film structure, compared with the conductive film formed by the existing simple coating process, the process stability is higher, so that stable and effective ohmic contact can be formed, the connecting bridge communication distance is obviously improved, and the method has very high commercial value.)

1. A manufacturing method of a single-layer conductive film structure for a touch screen is characterized by comprising the following steps: the method comprises the following steps:

respectively preparing a transfer adhesive (3) with a connecting bridge conductive network structure (2) and a conductive film structure coated with a connecting bridge insulating material (7), wherein the conductive film structure comprises at least one continuous first electrode group (41) formed in a first direction (411) and at least one second electrode group (42) formed in a second direction (421), the second electrode group (422) is a discontinuous electrode formed by conductive blocks (422) arranged at intervals, and the connecting bridge insulating material (7) is coated between the adjacent conductive blocks (422) on the same discontinuous electrode;

and correspondingly arranging the connecting bridge conductive network structure (2) on the transfer adhesive (3) and the connecting bridge insulating material (7) on the conductive film structure, and compounding the transfer adhesive (3) and the conductive film structure to ensure that the same second electrode groups (42) which are arranged at intervals in the second direction are conducted to form a single-layer conductive film structure with the electrode groups which are independently conducted in the two directions.

2. The method of claim 1, wherein the method comprises: the step of preparing a transfer glue (3) with a connecting bridge conductive network structure (2) comprises:

pre-preparing a connecting bridge conductive network structure (2);

and transferring the pre-prepared connecting bridge conductive network structure (2) to an adhesive layer (31) to obtain the transfer adhesive (3) with the connecting bridge conductive network structure (2).

3. The method of claim 2, wherein the single-layer conductive film structure comprises: the step of preparing the connecting bridge conductive network structure (2) in advance comprises the following steps:

arranging a temporary carrier plate (1);

adopting one or any combination of at least two of dry spinning, electrostatic spinning, slit coating and ink-jet printing to form a connecting bridge conductive network on the temporary carrier plate (1);

and sintering the connecting bridge conductive network to form a connecting bridge conductive network structure (2).

4. The method of claim 1, wherein the method comprises: the discontinuous electrodes are a plurality of conductive blocks (422) which are arranged at intervals and are formed by separating the second electrode group (42) by the continuous first electrode group (41), and the connecting bridge insulating material (7) covers the boundary of the first electrode group (41) and the second electrode group (42).

5. The method of claim 1, wherein the method comprises: the step of preparing a conductive film structure coated with a connecting bridge insulating material (7) comprises:

coating transparent conductive slurry on the substrate (6) to form a uniform transparent conductive film layer (5);

processing a first electrode group (41) and a second electrode group (42) on the transparent conductive film layer (5) by adopting a patterning processing technology;

a connecting bridge insulating material (7) is coated between adjacent conductive blocks (422) on the same discontinuous electrode.

6. A manufacturing method of a touch screen with a single-layer conductive film structure is characterized by comprising the following steps: the method specifically comprises the following steps:

the manufacturing method of the single-layer conductive film structure for the touch screen is adopted to manufacture the single-layer conductive film structure (8) according to any one of the claims 1 to 5;

two ends of leads of the first electrode group (41) and the second electrode group (42) in the single-layer conductive film structure (8) are externally connected to a processor (92);

a single-layer conductive film structure (8) and a processor (92) are attached to a cover plate (91).

7. A single-layer conducting film structure for touch-sensitive screen, its characterized in that: comprises that

A conductive film structure coated with a connecting bridge insulating material (7), wherein the conductive film structure comprises at least one continuous first electrode group (41) formed in a first direction (411) and at least one second electrode group (42) formed in a second direction (421), the second electrode group (42) is a discontinuous electrode formed by conductive bumps (422) arranged at intervals, and the connecting bridge insulating material (7) is coated between adjacent conductive bumps (422) on the same discontinuous electrode; and

the transfer glue (3) is compounded on the conductive film structure, a connection bridge conductive network structure (2) is arranged on the transfer glue (3), the connection bridge conductive network structure (2) is arranged on the connection bridge insulating material (7) and is connected with two adjacent conductive blocks (422) on the same discontinuous electrode, so that the same second electrode group (42) arranged at intervals in the second direction is conducted.

8. The single-layer conductive film structure for a touch panel according to claim 7, wherein: the discontinuous electrodes are formed by separating the second electrode group (42) into a plurality of conductive blocks (422) arranged at intervals by the continuous first electrode group (41), and the connecting bridge insulating material (7) covers the boundary of the first electrode group (41) and the second electrode group (42).

9. A touch screen with a single-layer conductive film structure is characterized in that: comprises that

A single-layer conductive film structure (8) produced by the method for producing a single-layer conductive film structure for a touch panel according to any one of claims 1 to 5, or the single-layer conductive film structure (8) for a touch panel according to any one of claims 8 or 9;

a processor (92), wherein two end leads of the first electrode group (41) and the second electrode group (42) in the single-layer conductive film structure (8) are externally connected to the processor (92); and

and the cover plate (91) is attached to the processor (92) through the single-layer conductive film structure (8).

10. A touch screen with a single-layer conductive film structure is characterized in that: the touch screen is manufactured by the manufacturing method of the touch screen with the single-layer conductive film structure in claim 6.

Technical Field

The invention relates to the technical field of touch screens, in particular to a single-layer conductive film structure for a touch screen, a manufacturing method of the single-layer conductive film structure and the touch screen.

Background

The touch screen is widely applied to various electronic devices such as mobile phones, computers, vehicle-mounted equipment, industrial production and the like, and is the most common form for realizing control by man-machine interaction. The core part of the touch screen is a conductive block which is continuous in the X-axis direction and the Y-axis direction and is independent of each other, and the positioning information is given out by calculating the strength and the position of the human finger coupling current at the receiving ends of the X-axis and the Y-axis respectively.

At present, touch screens available in the market all adopt a two-layer film structure, namely an X-axis conductive block and a Y-axis conductive block are respectively constructed and combined together to realize a touch function. If the single-layer conductive film structure can decouple the information of the X axis and the Y axis, the processing technology can be simplified, and the material cost can be reduced. The connecting bridge conduction technology is a feasible development direction of a single-layer conductive film, but because a height difference exists between the connecting bridge and the conductive blocks, a connecting bridge conductive network formed by a pure coating process is difficult to form stable and effective ohmic contact with the conductive blocks due to process problems, and the effective conductive blocks communicated with the connecting bridge are short.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a single-layer conductive film structure for a touch screen, a manufacturing method thereof and the touch screen, which can obviously improve the communication distance of a connecting bridge and have high commercial value.

According to an aspect of the present invention, there is provided a method for manufacturing a single-layer conductive film structure for a touch screen, including the steps of:

respectively preparing a transfer adhesive with a connecting bridge conductive network structure and a conductive film structure coated with a connecting bridge insulating material, wherein the conductive film structure comprises at least one continuous first electrode group formed in a first direction and at least one second electrode group formed in a second direction, the second electrode group is a discontinuous electrode formed by conductive blocks arranged at intervals, and the connecting bridge insulating material is coated between adjacent conductive blocks on the same discontinuous electrode;

and correspondingly arranging the connecting bridge conductive network structure on the transfer adhesive and the connecting bridge insulating material on the conductive film structure, and compounding the transfer adhesive and the conductive film structure to ensure that the conductive blocks on the same second electrode group arranged at intervals in the second direction are conducted to form a single-layer conductive film structure with the electrode groups which are respectively and independently conducted in the two directions.

By adopting the method, the connecting bridge conductive network structure and the conductive film structure which is provided with the first electrode group and the second electrode group and coated with the connecting bridge insulating material are respectively prepared, and then the conductive film structure is formed by compounding the conductive film structure and the conductive film structure by utilizing a rolling process.

In some embodiments, the step of preparing the transfer paste having the connecting bridge conductive network structure may include:

preparing a connecting bridge conductive network structure in advance;

and transferring the pre-prepared connecting bridge conductive network structure to an adhesive layer to obtain the transfer adhesive with the connecting bridge conductive network structure.

Therefore, the connecting bridge conductive network structure can be prepared in advance to be high in precision and quality according to actual needs, meanwhile, the connecting bridge conductive network structure can be prepared into various different specification styles according to actual needs, the connecting bridge conductive network structure is transferred by the aid of the glue layer to form transfer glue, and accordingly the connecting bridge conductive network structure can be sealed.

In some embodiments, the step of preparing the connecting bridge conductive network structure in advance may include:

arranging a temporary carrier plate;

one or at least two of dry spinning, electrostatic spinning, slit coating and ink-jet printing are adopted to be randomly combined on the temporary carrier plate to form a connecting bridge conductive network;

and sintering the connecting bridge conductive network to form a connecting bridge conductive network structure.

Therefore, the connecting bridge conductive network structures of different structural styles can be selected to be transferred by presetting the connecting bridge conductive network of different styles to be used on the temporary carrier plate and then manufacturing the conductive films and the touch screens of different specifications and styles according to needs.

In some embodiments, the glue layer may be a clear glue layer. Therefore, the transparent adhesive layer is adopted, so that the transparency of the whole product is facilitated.

In some embodiments, the discontinuous electrodes are formed by covering the interface of the first electrode group and the second electrode group with a plurality of conducting block connecting bridge insulating materials which are arranged at intervals and formed by separating the second electrode group by the continuous first electrode group.

Therefore, the structural style of the first electrode group and the second electrode group can be designed on the substrate, the first electrode group is used for forming the plurality of conductive blocks at intervals on the second electrode group, or the second electrode group is used for forming the plurality of conductive blocks at intervals on the first electrode group, so that the required conductive film structure can be formed quickly and conveniently, the positions of the conductive blocks of the conductive film structure are closely arranged, the induction effect of the formed touch screen is good, and then only the corresponding positions of the single-layer conductive film structure are coated with the insulating material of the connecting bridge, so that the state of the jumper structure can be formed only by poor connecting bridge conductive network, and the difficulty of final rolling and compounding is reduced.

In some embodiments, the step of preparing a conductive film structure coated with a connecting bridge insulating material comprises:

coating transparent conductive slurry on the substrate to form a uniform transparent conductive film layer;

processing a first electrode group and a second electrode group on the transparent conductive film layer by adopting a patterning processing technology;

and a connecting bridge insulating material is coated between adjacent conductive blocks on the same discontinuous electrode.

Therefore, the first electrode group and the second electrode group of the single-layer conductive film structure can be directly processed by coating the transparent conductive film layer on the substrate and adopting a patterning processing technology, so that the structures of the first electrode group and the second electrode group required by the conductive film structure can be quickly formed, and then the required conductive film structure can be prepared by further coating the connecting bridge insulating material.

According to another aspect of the present invention, a method for manufacturing a touch screen with a single-layer conductive film structure is provided, which specifically includes the following steps:

the single-layer conducting film structure is manufactured by adopting the manufacturing method of the single-layer conducting film structure for the touch screen;

connecting leads at two ends of a first electrode group and a second electrode group in the single-layer conductive film structure to a processor;

and attaching the single-layer conductive film structure and the processor to the cover plate.

The touch screen manufactured by the method can achieve the touch function realized by combining the double-layer conductive films only by using the single-layer conductive film, so that the consumption of conductive materials can be reduced, and the cost can be reduced; on the other hand, the method of firstly preparing the connecting bridge conductive network structure and then compounding the connecting bridge conductive network structure with the patterned conductive transparent film is adopted, so that the method can be selectively used in the prefabricated connecting bridge conductive network structure according to touch screens with different formats, the communication distance of the connecting bridge can be obviously increased, and the method has high commercial value.

According to still another aspect of the present invention, there is provided a single-layer conductive film structure for a touch screen, including

The conductive film structure is coated with a connecting bridge insulating material, wherein the conductive film structure comprises at least one continuous first electrode group formed in a first direction and at least one second electrode group formed in a second direction, the second electrode group is a discontinuous electrode formed by conductive blocks arranged at intervals, and the connecting bridge insulating material is coated between the adjacent conductive blocks on the same discontinuous electrode; and

the transfer adhesive is compounded on the conductive film structure, a connecting bridge conductive network structure is arranged on the transfer adhesive, and the connecting bridge conductive network structure is arranged on a connecting bridge insulating material and is connected with two adjacent conductive blocks on the same discontinuous electrode, so that the same second electrode group arranged at intervals in the second direction is conducted.

By adopting the single-layer conductive film structure, the effect of the double-layer conductive film combination can be realized by only using the single-layer conductive film, the consumption of conductive materials can be effectively reduced, and the cost is reduced.

In some embodiments, the discontinuous electrodes are formed by covering the interface of the first electrode group and the second electrode group with a plurality of conducting block connecting bridge insulating materials which are arranged at intervals and formed by separating the second electrode group by the continuous first electrode group.

Therefore, the continuous electrodes in one direction and the discontinuous electrodes in the other direction can be formed through the design mode, the design mode of a first electrode group and a second electrode group required by the conductive film structure can be further simplified, the positions of the conductive blocks of the single-layer conductive film structure are closely arranged, the formed touch screen is good in induction effect, and then the insulating materials of the connecting bridges are coated on the corresponding positions of the single-layer conductive film structure.

According to still another aspect of the present invention, there is provided a touch screen of a single-layer conductive film structure, including: the single-layer conductive film structure is prepared by adopting the manufacturing method of the single-layer conductive film structure for the touch screen, or is the single-layer conductive film structure for the touch screen;

the two ends of leads of the first electrode group and the second electrode group in the single-layer conductive film structure are externally connected to the processor; and

the single-layer conducting film structure and the processor are attached to the cover plate.

The touch screen can achieve the touch function realized by the combination of the double-layer conductive films in the prior art only by the single-layer conductive layer, and can reduce the consumption of conductive materials and reduce the cost.

According to another aspect of the present invention, a touch screen with a single-layer conductive film structure is provided, and the touch screen is manufactured by using the method for manufacturing the touch screen with the single-layer conductive film structure.

The touch screen can achieve the touch function realized by the combination of the double-layer conductive films in the prior art only by the single-layer conductive layer, and can reduce the consumption of conductive materials and reduce the cost.

Drawings

Fig. 1 is a flowchart of a method for manufacturing a single-layer conductive film structure for a touch panel according to an embodiment of the invention;

FIG. 2 is a flow chart of a method for fabricating a single-layer conductive film structure for a touch panel according to another embodiment of the present invention;

fig. 3 is a schematic structural diagram of a temporary carrier and a connecting bridge conductive network structure of a method for manufacturing a single-layer conductive film structure for a touch screen according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a transfer paste used in a method for manufacturing a single-layer conductive film structure of a touch panel according to an embodiment of the invention;

fig. 5 is a schematic structural diagram of a single-layer conductive film structure of a method for manufacturing the single-layer conductive film structure for a touch panel according to an embodiment of the invention;

fig. 6 is a schematic structural view of a single-layer conductive film structure coated with only a connecting bridge insulating material according to a method for manufacturing the single-layer conductive film structure for a touch panel according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a composite conductive film of a method for manufacturing a single-layer conductive film structure for a touch panel according to an embodiment of the present invention;

fig. 8 is a flowchart of a method for manufacturing a touch panel having a single-layer conductive film structure according to an embodiment of the invention;

fig. 9 is a schematic structural diagram of a touch panel with a single-layer conductive film structure according to the present invention.

Description of reference numerals: 1. a temporary carrier plate; 2. connecting the bridge conductive network structure; 3. transferring glue; 31. a glue layer; 41. a first electrode group; 411. a first direction; 42. a second electrode group; 421. a second direction; 422. a conductive block; 5. a transparent conductive film layer; 6. a substrate; 7. connecting bridge insulating material; 8. a conductive film structure; 91. a cover plate; 92. a processor.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Example one

Fig. 1 schematically shows a flowchart of a method for manufacturing a single-layer conductive film structure for a touch screen according to an embodiment of the present invention, as shown in fig. 1, which includes the following steps:

step S1, respectively preparing a transfer glue 3 having a connecting bridge conductive network structure 2 and a conductive film structure coated with a connecting bridge insulating material 7, wherein the conductive film structure comprises at least one continuous first electrode group 41 formed in a first direction 411 and at least one second electrode group 42 formed in a second direction 421, the second electrode group 42 is a discontinuous electrode formed by conductive blocks arranged at intervals, and the connecting bridge insulating material 7 is coated between adjacent conductive blocks 422 on the same discontinuous electrode;

the connection bridge conductive network structure 2 mentioned in this step refers to a metal connection bridge structure in a jumper structure disposed at an intersection of the first electrode group 41 and the second electrode group 42 in the touch panel of a single-layer conductive film structure. The conductive film structure mentioned in this step refers to a conductive film structure in which the positions of the first electrode group 41 and the second electrode group 42 are designed and patterned on the substrate 6, but no jumper structure is provided, one of the first electrode group 41 and the second electrode group 42 is a discontinuous electrode, and the connecting bridge insulating material 7 is coated on the adjacent conductive block 422 to form a semi-finished product state. Specifically, in the present embodiment, the first electrode group 41 is provided as a continuous electrode, the second electrode group 42 is provided as a discontinuous electrode formed of conductive bumps 422 provided at intervals, and a connecting bridge insulating material is coated between the adjacent conductive bumps 422 on the same second electrode group 42.

Step S2, the connecting bridge conductive network structure 2 on the transfer glue 3 and the connecting bridge insulating material 7 on the conductive film structure are correspondingly arranged, and the transfer glue 3 and the conductive film structure are combined, so that the conductive blocks 422 on the same second electrode group 42 are conducted, and a single-layer conductive film structure 8 with electrode groups that are independently conducted in two directions is formed.

In this step, all the connecting bridge conductive network structures 2 on the transfer glue 3 may be used, or a part of the connecting bridge conductive network structures 2 on the transfer glue 3 may be selected for use according to the design structure style of the single-layer conductive film structure, and the remaining transfer glue 3 may be sealed for use when the single-layer conductive film structures of other structure styles need to be subjected to jumper wire. The compounding method may include a roll forming process, and when the roll compounding is performed, the roll speed may be 1m/s to 10m/s, the roll temperature may be 100 ℃ to 160 ℃, specifically, in this embodiment, 1m/s, and the roll temperature may be 100 ℃. After the composite molding, the second electrode group 42 continuously conducted in the second direction 421 is formed, so that electrode groups independently conducted in both directions are formed on the single-layer conductive film structure.

By adopting the method, the connecting bridge conductive network structure 2 and the conductive film structure in a semi-finished product state are respectively prepared firstly, and then the rolling process is utilized to compound the conductive film structure to form the single-layer conductive film structure 8, compared with the conductive film formed by the existing simple coating process, the process stability is higher, so that stable and effective ohmic contact can be formed between the connecting bridge conductive network structure 2 and the conductive block 422, the connecting bridge communication distance is obviously improved, and the method has high commercial value.

Example two

Fig. 2 schematically shows a flowchart of a method for manufacturing a single-layer conductive film structure for a touch screen according to another embodiment. Fig. 3 to 7 schematically show the product structure state of the single-layer conductive film structure 8 in each step in the manufacturing method thereof.

Step S1, respectively preparing a transfer glue 3 having a connecting bridge conductive network structure 2 and a conductive film structure coated with a connecting bridge insulating material 7, wherein the conductive film structure comprises at least one first electrode group 41 formed in a first direction 411 and at least one second electrode group 42 formed in a second direction 421, the first electrode group 41 or the second electrode group 42 are discontinuous electrodes formed by conductive blocks arranged at intervals, and the connecting bridge insulating material 7 is coated between adjacent conductive blocks 422 on the same discontinuous electrode;

in some embodiments, as shown in fig. 2, the step of preparing the transfer paste 3 having the connecting bridge conductive network structure 2 in step S1 may include:

step S111, prefabricating a connecting bridge conductive network structure 2;

as shown in fig. 3, the connecting bridge conductive network structure 2 can be prepared according to the requirement of a conductive film structure which is actually required to be prepared, or can be prepared according to the requirement of a conductive film structure pattern which may be required to be used. The connecting bridge conductive network structure 2 can be prepared in a plurality of pieces at one time, and can also be prepared in a single piece. The connecting bridge conductive network structure 2 can also be a mesh structure, so that the height of the connecting bridge conductive network structure 2 can be reduced through the mesh connecting bridge conductive network structure 2, and the stability of the connecting bridge conductive network can be improved.

The pattern of the connecting bridge conductive network structure 2 that may be used may include structures formed with different shapes, areas, porosities, line widths, line distances, etc., the areas are selected from 1 μm to 10 μm, the porosities are selected from 20% to 90%, the line widths are selected from 1 μm to 5 μm, and the line distances are selected from 5 μm to 50 μm. Specifically, one of the patterns 2 of the connecting bridge conductive network structure is taken as an example, and the shape of the connecting bridge conductive network structure is rectangular, the area of the connecting bridge conductive network structure is 10 μm by 5 μm, the porosity of the connecting bridge conductive network structure is 80%, the line width of the connecting bridge conductive network structure is 1 μm, and the line distance of the connecting bridge conductive network structure is 20 μm. That is, the prefabricated connecting bridge conductive network structure 2 may be all in the above-mentioned form, and may also include other forms. Through prefabricating the connecting bridge conductive network structure 2, the method can improve the communication distance of the connecting bridge, and meanwhile, the connecting bridge conductive network structure 2 with high precision and quality can be manufactured according to actual process requirements.

In some embodiments, the step of preparing the connecting bridge conductive network structure 2 in step S111 may include:

arranging a temporary carrier plate 1;

a connecting bridge conductive network structure 2 is prepared on the temporary carrier plate 1.

In this step, the temporary carrier plate 1 is specifically a carrier for designing and preparing the connecting bridge conductive network structure 2, the manner of preparing the connecting bridge conductive network structure 2 on the temporary carrier plate 1 may be to form the connecting bridge conductive network by combining one or more of dry spinning, electrostatic spinning, slit coating and inkjet printing on the temporary carrier plate 1, the used materials may be silver nanowires, gold nanowires, carbon nanotubes, conductive silver paste, ITO, graphene, etc., and then the temporary carrier plate 1 is placed in a calcining furnace for sintering to form the connecting bridge conductive network structure 2. In particular, AgNO can be dry spun on the temporary carrier plate 1₃And PVP mixed wire, the shape, area, porosity, line width and line distance of the connecting bridge conductive network required to be arranged are designed, and the temperature can be controlled at 250 ℃ during sintering for 30 minutes. Since the temporary carrier 1 needs to have a certain heat resistance, the material of the temporary carrier 1 may be one or more of glass, silicon, ceramic, and the like.

Therefore, different types of connecting bridge conductive networks required to be used can be designed on the temporary carrier plate 1 in advance, and then the connecting bridge conductive network structures 2 with different structural types can be selected to be transferred according to the conductive films and the touch screens with different specifications and types which are required to be manufactured.

Step S112, transferring the pre-prepared connecting bridge conductive network structure 2 to the adhesive layer 31 to obtain the transfer adhesive 3 with the connecting bridge conductive network structure 2.

As shown in fig. 4, in this step, the adhesive layer 31 may be a transparent adhesive layer 31, so that the transparent adhesive layer 31 may be used to facilitate the transparentization of the whole product. The specific material of the adhesive layer 31 may be OC adhesive, acrylic resin, epoxy resin, etc., which are all materials of the transparent adhesive layer 31 commonly used in the art. The adhesive layer 31 can transfer all the prefabricated connecting bridge conductive network structures 2, and also can transfer part of the prefabricated connecting bridge conductive network structures 2 according to the requirements of the single-layer conductive film structure manufactured according to actual requirements, or can be divided into a plurality of different transfer adhesives 3 according to different specification styles of the prefabricated connecting bridge conductive network structures 2.

Through the steps, when the transfer adhesive 3 with the connecting bridge conductive network structure 2 is prepared, the connecting bridge conductive network structure 2 can be prepared in advance to prepare the connecting bridge conductive network structure 2 with high precision and high quality according to actual needs, meanwhile, the connecting bridge conductive network structure 2 can be prepared into various different specification styles according to actual needs, the connecting bridge conductive network structure 2 is transferred by the adhesive layer 31 to form the transfer adhesive 3, and the transfer adhesive 3 can be sealed.

In some embodiments, as shown in fig. 2, the step of preparing the conductive film structure coated with the connection bridge insulating material 7 in step S1 includes:

step S121, forming at least one first electrode group 41 continuous in the first direction 411 and at least one second electrode group 42 discontinuous in the second direction 421 on the substrate 6, wherein the first electrode group 41 forms a plurality of conductive blocks 422 at intervals on the second electrode group 42;

in this step, the purpose is to create a conductive film structure having a first electrode group 41 and a second electrode group 42, which includes the first electrode group 41 that is continuous in the first direction 411 and the second electrode group 42 that is discontinuous in the second direction 421. In the manufactured conductive film structure, the first electrode groups 41 are all continuous, the second electrode groups 42 are all discontinuous, and meanwhile, the second electrode groups 42 are spaced by the plurality of first electrode groups 41 to form the plurality of conductive blocks 422, that is, after the conductive film structure is manufactured, the first electrode groups 41 can work normally immediately, and the second electrode groups 42 can not work normally after being manufactured, so that a jumper structure, that is, a connecting bridge is arranged to electrically connect the discontinuous conductive blocks 422 on the second electrode groups 42, so that the conductive film structure can work normally. The conducting film structure designed by the method utilizes the first electrode group 41 to form the plurality of conducting blocks 422 at intervals on the second electrode group 42, so that the required conducting film structure can be formed quickly and conveniently, the conducting blocks 422 of the conducting film structure are closely arranged, the induction effect of the formed touch screen is good, and then the connecting bridge insulating material 7 is coated on the corresponding position of the single-layer conducting film structure 8, so that the state of a jumper structure can be formed only by poor connecting bridge conducting network, and the difficulty of final rolling and compounding is reduced. In this section, the first electrode group 41 and the second electrode group 42 may be reversed, that is, the first electrode group 41 is discontinuous, the second electrode group 42 is continuous, the first electrode group 41 is separated by a plurality of second electrode groups 42 to form a plurality of conductive bumps 422, and the first electrode group 41 and the second electrode group 42 only need to be continuous, while the other is discontinuous.

Specifically, as shown in fig. 5, the first electrode group 41 continuous in the first direction 411 may be a Y-axis conductive strip formed by a plurality of connected Y-axis conductive blocks in the Y-axis direction, and the second electrode group 42 discontinuous in the second direction 421 may be an X-axis conductive strip formed by a plurality of independent X-axis conductive blocks spaced apart by the Y-axis conductive strip in the X-axis direction. Each of the X-axis conductive blocks and the Y-axis conductive blocks may be designed in a diamond shape and staggered, thereby facilitating formation of a single-layer conductive film structure having the first electrode group 41 and the second electrode group 42. Although the first direction 411 and the second direction 421 are perpendicular to each other in the specific conductive film structure shown in fig. 5, actually, the first direction 411 and the second direction 421 may be two directions forming other included angles, and it is only necessary that the first direction 411 and the second direction 421 are different.

In summary, the arrangement of the first electrode group 41 and the second electrode group 42 may include the following cases: 1) the first electrode group 41 may be continuous in the Y-axis direction, the second electrode group 42 may be discontinuous in the X-axis direction, 2) the first electrode group 41 may be continuous in the X-axis direction, and the second electrode group 42 may be discontinuous in the Y-axis direction, 3) the first electrode group 41 may be discontinuous in the Y-axis direction, and the second electrode group 42 may be continuous in the X-axis direction, 4) the first electrode group 41 may be discontinuous in the X-axis direction, and the second electrode group 42 may be continuous in the Y-axis direction.

In some embodiments, the step of forming at least one first electrode group 41 that is continuous in the first direction 411 and at least one second electrode group 42 that is discontinuous in the second direction 421 on the substrate 6 in step S121 may include:

coating transparent conductive slurry on the substrate 6 to form a uniform transparent conductive film layer 5;

a first electrode set 41 and a second electrode set 42 are formed on the transparent conductive film layer 5 by a patterning process.

In the step, the transparent conductive paste can be one or more of silver nanowires, gold nanowires, carbon nanotubes, conductive silver paste, ITO, graphene and the like which are combined randomly, and the thickness of the formed transparent conductive film is 0.1-2 μm. The substrate 6 may also be made of a transparent material, and the material of the transparent substrate 6 may be formed by combining one or more of PET, PMMA, PI, and PDMS.

In this step, the patterning process may include any combination of one or more of laser processing, dry etching, and wet etching.

Thus, the first electrode group 41 and the second electrode group 42 having a single-layer conductive film structure can be directly processed by applying the transparent conductive film layer 5 on the substrate 6 and using a patterning process, so that the structures of the first electrode group 41 and the second electrode group 42 required for the single-layer conductive film structure can be rapidly formed.

Step S122, coating a connecting bridge insulating material 7 between two adjacent conductive bumps 422 on the same second electrode group 42, so that the connecting bridge insulating material 7 covers the boundary between the first electrode group 41 and the second electrode group 42.

As shown in fig. 6, the coated connecting bridge insulating material 7 in this step is used to prevent the connecting bridge conductive network structure 2 on the second electrode group 42 from contacting the first electrode group 41, thereby affecting the independent operation between the first electrode group 41 and the second electrode group 42. The bridge insulating material 7 is not required to be applied excessively, and is only required to be connected between two adjacent conductive bumps 422 on the same second electrode group 42 and to cover the first electrode group 41 that separates the two adjacent conductive bumps 422. The material of the bridge insulating material 7 may be OC glue, PET, PDMS, or the like.

Through the steps, when the conducting film structure coated with the connecting bridge insulating material 7 is prepared, the structure of the part can form a semi-finished product state which can form a jumper wire structure only by poor connecting bridge conducting networks, and the difficulty of finally rolling and forming the composite conducting film 8 is reduced.

Step S2, arranging all or part of the connection bridge conductive network structure 2 on the transfer glue 3 corresponding to the connection bridge insulating material 7 on the conductive film structure, and combining the transfer glue 3 and the conductive film structure by using a rolling process to form a single-layer conductive film structure 8.

As shown in fig. 7, in this step, after the rolling process, the single-layer conductive film structure 8 is formed to have three layers, including the glue layer 31 at the uppermost layer, the transparent conductive film layer 5 in the middle, and the substrate 6 at the lowermost layer. The single-layer conductive film structure 8 manufactured by the manufacturing method is higher in process stability, so that stable and effective ohmic contact can be formed, the communication distance of the connecting bridge is remarkably increased, and the method has a high commercial value.

EXAMPLE III

Fig. 8 schematically shows a flowchart of a method for manufacturing a touch panel having a single-layer conductive film structure according to an embodiment.

As shown in fig. 8, according to another aspect of the present invention, there is provided a method for manufacturing a touch screen with a single-layer conductive film structure, which specifically includes the following steps:

step S1, respectively preparing a transfer glue 3 having a connecting bridge conductive network structure 2 and a conductive film structure coated with a connecting bridge insulating material 7, wherein the conductive film structure comprises at least one continuous first electrode group 41 formed in a first direction 411 and at least one second electrode group 42 formed in a second direction 421, the second electrode group 42 is a discontinuous electrode formed by conductive blocks arranged at intervals, and the connecting bridge insulating material 7 is coated between adjacent conductive blocks 422 on the same discontinuous electrode;

step S2, arranging the connecting bridge conductive network structure 2 on the transfer glue 3 and the connecting bridge insulating material 7 on the conductive film structure correspondingly, and combining the transfer glue 3 and the conductive film structure to conduct the conductive blocks 422 on the same second electrode group 42, so as to form a single-layer conductive film structure 8 with electrode groups that are conducted independently in two directions;

step S3, connecting the leads at the two ends of the first electrode group 41 and the second electrode group 42 in the single-layer conductive film structure 8 to the processor 92;

in step S4, the single-layer conductive film structure 8 and the processor 92 are attached to the cover plate 91.

The method for manufacturing the single-layer conductive film structure for a touch screen mentioned in the first embodiment or the second embodiment can be adopted in the steps S1 and S2.

The steps S3 and S4 mainly function to further process the fabricated single-layer conductive film structure 8 into a touch screen. In this step, the cover plate 91 may be made of glass, sapphire, PET, CPI, PC, or the like.

The touch screen manufactured by the method can achieve the touch function realized by combining the double-layer conductive films only by using the single-layer conductive film, so that the consumption of conductive materials can be reduced, and the cost can be reduced; on the other hand, the connection bridge conductive network structure 2 is prepared firstly, the touch screen with different formats can be selected and used in the prefabricated connection bridge conductive network structure 2, and then the connection bridge conductive network structure is compounded with the patterned conductive transparent film, so that the connection distance of the connection bridge can be obviously increased, and the method has high commercial value.

Example four

Fig. 7 schematically shows a structural diagram of a single-layer conductive film structure for a touch screen.

Referring to fig. 7, according to another aspect of the present invention, there is provided a single-layer conductive film structure for a touch screen, including: a conductive film structure coated with a connecting bridge insulating material 7, wherein the conductive film structure comprises at least one continuous first electrode group 41 formed in a first direction 411 and at least one second electrode group 42 formed in a second direction 421, the second electrode group 42 is a discontinuous electrode formed by conductive bumps 422 arranged at intervals, and the connecting bridge insulating material 7 is coated between adjacent conductive bumps 422 on the same discontinuous electrode; and

the transfer glue 3 compounded on the conductive film structure is provided with a connecting bridge conductive network structure 2 on the transfer glue 3, the connecting bridge conductive network structure 2 is arranged on a connecting bridge insulating material 7 and is connected with two adjacent conductive blocks 422 on the same discontinuous electrode, so that the same second electrode group 42 arranged at intervals in the second direction is conducted.

The conductive film structure is a semi-finished product state in which the first electrode group 41 and the second electrode group 42 are formed by patterning, wherein the first electrode group 41 can be set as a continuous electrode, the second electrode group 42 can be set as a discontinuous electrode, or the first electrode group 41 can be set as a discontinuous electrode, and the second electrode group 42 can be set as a continuous electrode; the first direction 411 and the second direction 421 may be two directions forming various included angles, and it is only necessary that the first direction 411 and the second direction 421 are different, for example, the first direction 411 may be an X-axis direction, and the second direction may be a Y-axis direction, or the first direction 411 may be a Y-axis direction, and the second direction may be an X-axis direction. Taking the first electrode group 41 as a continuous electrode in the Y-axis direction and the second electrode group 42 as a discontinuous electrode in the X-axis direction as an example, the second electrode group 42 is formed by a plurality of conductive bumps 422 arranged at intervals, and the distance between the conductive bumps 422 of the second electrode group 42 can be designed according to the required touch sensitivity of the single-layer conductive film structure. Preferably, the second electrode group 42 is partitioned by the first electrode groups 41 to form a plurality of conductive blocks 422 arranged at intervals, and the connecting bridge insulating material 7 covers the boundary between the first electrode group 41 and the second electrode group 42, so that the design can quickly and conveniently form the required conductive film structure, and the positions of the conductive blocks of the conductive film structure are closely arranged, so that the sensitivity of the formed touch screen is higher.

The transfer glue 3 is a glue layer 31 of the connecting bridge conductive network structure 2 provided with a plurality of connecting bridges designed according to the conductive film structure. The connecting bridge conductive network structure 2 on the transfer adhesive 3 can be designed into a plurality of structures with different styles in advance according to different actual requirements, so that the structure can be used mechanically quickly when needed.

By adopting the single-layer conductive film structure, the effect of the double-layer conductive film combination can be realized by only using the single-layer conductive film, the consumption of conductive materials can be effectively reduced, and the cost is reduced. And through the glue layer 31 structure of the transfer glue 3, more stable and effective ohmic contact can be formed between the conductive network structure of the connecting bridge and the electrode in the single-layer conductive film structure formed by compounding, the stability and the communication distance of the connecting bridge are obviously improved, and the commercial value is very high.

EXAMPLE five

Fig. 9 schematically shows a structural diagram of a touch screen with a single-layer conductive film structure.

As shown in fig. 9, according to still another aspect of the present invention, there is provided a touch screen of a single-layer conductive film structure, including: a single-layer conductive film structure 8 that is manufactured by the method for manufacturing a single-layer conductive film structure for a touch panel according to the first embodiment or the second embodiment, or the single-layer conductive film structure 8 for a touch panel according to the fourth embodiment;

a processor 92, wherein two end leads of the first electrode group 41 and the second electrode group 42 in the single-layer conductive film structure 8 are externally connected to the processor 92; and

the cover plate 91, the single-layer conductive film structure 8 and the processor 92 are attached to the cover plate 91.

The touch screen can achieve the touch function realized by the combination of the double-layer conductive films in the prior art only by the single-layer conductive layer, and can reduce the consumption of conductive materials and reduce the cost.

EXAMPLE six

According to another aspect of the present invention, a touch panel with a single-layer conductive film structure is provided, and the touch panel is manufactured by the method for manufacturing a touch panel with a single-layer conductive film structure according to the third embodiment.

By adopting the touch screen, the touch function realized by the combination of the double-layer conductive films in the prior art can be achieved only by the single-layer conductive layer, the consumption of conductive materials can be reduced, and the cost can be reduced.

The foregoing are only some embodiments of the invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.