阅读说明：本技术 一种电子元器件镀银后处理工艺 (Silver plating post-treatment process for electronic component ) 是由 杨小宽 于 2021-06-19 设计创作，主要内容包括：本发明公开了一种电子元器件镀银后处理工艺,属于电子元器件处理技术领域,本发明工艺通过中和液中和残留在镀银后电子元器件表面的电镀液,再通过牙刷刷洗、超声波清洗、纯水喷淋清洗、纯水超声波清洗,酒精脱水以及真空干燥等工艺彻底将残留在电子元器件表面的电镀液清洗掉,进而避免了电镀液残留在表面导致电连接引线、玻璃或陶瓷绝缘子被腐蚀的情况发生。(The invention discloses a silver-plating post-treatment process for an electronic component, which belongs to the technical field of electronic component treatment.)

1. A silver plating post-treatment process for electronic components is characterized by comprising the following steps: the method comprises the following steps:

(1) adding anhydrous sodium carbonate and plasma water into a cleaning tank, and uniformly stirring and mixing to obtain a neutralized solution, wherein the weight ratio of the anhydrous sodium carbonate to the plasma water is 1: 100;

(2) heating the neutralization solution prepared in the step (1) to 70-90 ℃, and then soaking the electronic component in the hot neutralization solution for 8-10 min;

(3) cleaning the electronic components treated in the step (2) with pure water, and brushing the glass or ceramic surfaces of the electronic components in the pure water by using a toothbrush;

(4) putting the electronic component treated in the step (3) into pure water at the temperature of 70-80 ℃, and carrying out ultrasonic cleaning;

(5) taking out the electronic component cleaned by the ultrasonic wave in the step (4), and suspending and airing until no large amount of water drops fall off for later use;

(6) soaking the electronic component treated in the step (5) in absolute ethyl alcohol for 5-10min, taking out, and blowing the electronic component with hot air at 80-100 ℃ until no alcohol residue exists for later use;

(7) and (4) putting the electronic component treated in the step (6) into a vacuum drying box, vacuumizing and drying, taking out, and cooling to room temperature.

2. The electronic component silver plating post-treatment process according to claim 1, characterized in that: and (3) completely soaking the electronic components in the steps (2), (4) and (6).

3. The electronic component silver plating post-treatment process according to claim 1, characterized in that: in the step (4), the ultrasonic cleaning frequency is 40KHz, and the cleaning time is 5-10 min.

4. The electronic component silver plating post-treatment process according to claim 1, characterized in that: in the steps (2) to (7), the electronic components can be arranged in the stainless steel filter sieve for operation, and the whole volume of the electronic components is less than half of the volume of the stainless steel filter sieve.

5. The electronic component silver plating post-treatment process according to claim 1, characterized in that: in the operation process of the step (5), a blower or a blower can be adopted to blow and dry the electronic components.

6. The electronic component silver plating post-treatment process according to claim 1, characterized in that: the vacuumizing time in the step (7) is 5-10min, the drying temperature is 100-120 ℃, and the drying time is 1-2 h.

7. The electronic component silver plating post-treatment process according to claim 1, characterized in that: and (4) in the brushing process of the toothbrush in the step (3), the operation force is light, the needle body is not stressed, and the needle body is not inclined.

Technical Field

The invention relates to the technical field of electronic component processing, in particular to a silver-plating post-processing technology for an electronic component.

Background

With the rapid advance of industries such as aviation, aerospace, ships, exploration and the like, agriculture and military industry, the increase of various working environments and working equipment such as high temperature, high pressure, corrosion, radiation and the like, the demand of electronic components with unconventional requirements such as high strength, corrosion resistance, high heat resistance and the like is increasing day by day.

In the prior art, electronic components packaged by glass and ceramic need to be plated with silver to improve the conductivity, but the existing silver plating process often causes the electroplating surface to be acidic due to incomplete neutralization after electroplating, so that the surface of the electric connection lead is corroded, and simultaneously, glass or ceramic insulators can be corroded to cause the reduction of the insulating property of the electronic components, so that the product quality cannot be guaranteed.

Disclosure of Invention

The invention aims to provide a silver-plating post-treatment process for an electronic component, which solves the problems that the surface of an electric connection lead is corroded due to the fact that the electroplating surface is acidic because neutralization is not thorough after electroplating, and simultaneously glass or a ceramic insulator can be corroded, so that the insulating property of the electronic component is reduced, the product quality cannot be guaranteed and the like in the conventional silver-plating process.

The technical scheme of the invention is as follows:

a silver plating post-treatment process for an electronic component comprises the following steps:

(1) adding anhydrous sodium carbonate and plasma water into a cleaning tank, and uniformly stirring and mixing to obtain a neutralized solution, wherein the weight ratio of the anhydrous sodium carbonate to the plasma water is 1: 100;

(2) heating the neutralization solution prepared in the step (1) to 70-90 ℃, and then soaking the electronic component in the hot neutralization solution for 8-10 min;

(3) cleaning the electronic components treated in the step (2) with pure water, and brushing the glass or ceramic surfaces of the electronic components in the pure water by using a toothbrush;

(4) putting the electronic component treated in the step (3) into pure water at the temperature of 70-80 ℃, and carrying out ultrasonic cleaning;

(5) taking out the electronic component cleaned by the ultrasonic wave in the step (4), and suspending and airing until no large amount of water drops fall off for later use;

(6) soaking the electronic component treated in the step (5) in absolute ethyl alcohol for 5-10min, taking out, and blowing the electronic component by hot air until no alcohol residue exists for later use;

(7) and (4) putting the electronic component treated in the step (6) into a vacuum drying box, vacuumizing and drying, taking out, and cooling to room temperature.

Preferably, the step (2), the step (4) and the step (6) all need to completely soak the electronic component.

Preferably, the ultrasonic cleaning frequency in the step (4) is 40KHz, and the cleaning time is 5-10 min.

Preferably, in the steps (2) to (7), the electronic components can be arranged in a stainless steel filter sieve for operation, and the whole volume of the electronic components is less than half of the volume of the stainless steel filter sieve.

Preferably, during the operation of the step (5), a blower or a blower may be used to blow and dry the electronic components.

Preferably, the vacuumizing time in the step (7) is 5-10min, the drying temperature is 100-120 ℃, and the drying time is 1-2 h.

Preferably, in the brushing process of the toothbrush in the step (3), the operation force is light, so that the needle body is not stressed and is not inclined.

The invention has the following beneficial effects:

1. the treatment process thoroughly cleans the electroplating solution remained on the surface of the electronic component by neutralizing the electroplating solution remained on the surface of the electronic component after silver plating through processes of ultrasonic cleaning, pure water spray cleaning, pure water ultrasonic cleaning, alcohol dehydration, vacuum drying and the like, thereby avoiding the occurrence of the condition that the electroplating solution remained on the surface causes the corrosion of an electric connection lead, glass or a ceramic insulator;

2. compared with untreated silver-plated electronic components, the insulativity of the electronic components treated by the process is obviously improved, and the process can effectively improve the product quality.

Detailed Description

The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention, and that various changes or modifications may be suggested to one skilled in the art after reading the teachings herein, and that such equivalents are within the scope of the appended claims.

In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

The weight of the related components mentioned in the description of the embodiments of the present invention may not only refer to the specific content of each component, but also represent the proportional relationship of the weight among the components, and therefore, the content of the related components is scaled up or down within the scope disclosed in the description of the embodiments of the present invention as long as it is in accordance with the description of the embodiments of the present invention. Specifically, the weight described in the description of the embodiment of the present invention may be a unit of mass known in the chemical industry field, such as μ g, mg, g, and kg.

The present invention will be described in more detail with reference to examples. It is to be understood that the practice of the invention is not limited to the following examples, and that any variations and/or modifications may be made thereto without departing from the scope of the invention.

In the invention, all parts and percentages are weight units, and all equipment, raw materials and the like can be purchased from the market or are commonly used in the industry, if not specified. The methods in the following examples are conventional in the art unless otherwise specified.

Example 1

A silver plating post-treatment process for an electronic component comprises the following steps:

(1) adding anhydrous sodium carbonate and plasma water into a cleaning tank, and uniformly stirring and mixing to obtain a neutralized solution, wherein the weight ratio of the anhydrous sodium carbonate to the plasma water is 1: 100;

(2) heating the neutralization solution prepared in the step (1) to 70 ℃, then placing electronic components in a stainless steel filter sieve, and then placing the stainless steel filter sieve in the heated neutralization solution for soaking for 8-10 min;

(3) taking out the stainless steel filter sieve, cleaning the electronic components treated in the step (2) with pure water, and brushing the glass or ceramic surface of the electronic components in the pure water by using a toothbrush, wherein the operation force is light in the brushing process, so that the needle body is not stressed and is not inclined;

(4) putting pure water with the temperature of 70 ℃ into an ultrasonic cleaning machine, putting the stainless steel filter screen provided with the electronic components processed in the step (3) into the ultrasonic cleaning machine, and cleaning for 5min at the frequency of 40 KHz;

(5) taking out the electronic components cleaned by the ultrasonic wave in the step (4), hanging and drying the stainless steel filter sieve until no large amount of water drops fall off for later use, and performing auxiliary drying on the electronic components by using a blower or a blower to accelerate the drying speed of the electronic components;

(6) soaking the stainless steel filter sieve filled with the electronic components treated in the step (5) in absolute ethyl alcohol for 5min, taking out, and blowing the electronic components with hot air until no alcohol residue exists for later use;

(7) and (3) placing the electronic component treated in the step (6) into a vacuum drying oven, opening the vacuum drying oven to the maximum, vacuumizing for 5-10min at the drying temperature of 100 ℃, drying for 2h, taking out after drying, cooling to room temperature, and preferably cooling in a dryer.

And (4) placing the processed electronic components into a material tray, and checking whether the surface is damaged or not.

Example 2

A silver plating post-treatment process for an electronic component comprises the following steps:

(1) adding anhydrous sodium carbonate and plasma water into a cleaning tank, and uniformly stirring and mixing to obtain a neutralized solution, wherein the weight ratio of the anhydrous sodium carbonate to the plasma water is 1: 100;

(2) heating the neutralization solution prepared in the step (1) to 80 ℃, then placing electronic components in a stainless steel filter sieve, and then placing the stainless steel filter sieve in the heated neutralization solution for soaking for 8-10 min;

(3) taking out the stainless steel filter sieve, cleaning the electronic components treated in the step (2) with pure water, and brushing the glass or ceramic surface of the electronic components in the pure water by using a toothbrush, wherein the operation force is light in the brushing process, so that the needle body is not stressed and is not inclined;

(4) filling pure water with the temperature of 75 ℃ into an ultrasonic cleaning machine, and putting the stainless steel filter screen provided with the electronic components processed in the step (3) into the ultrasonic cleaning machine, wherein the cleaning time is 7min at the frequency of 40 KHz;

(5) taking out the electronic components cleaned by the ultrasonic wave in the step (4), hanging and drying the stainless steel filter sieve until no large amount of water drops fall off for later use, and performing auxiliary drying on the electronic components by using a blower or a blower to accelerate the drying speed of the electronic components;

(6) soaking the stainless steel filter sieve filled with the electronic components treated in the step (5) in absolute ethyl alcohol for 7min, taking out, and blowing the electronic components with hot air until no alcohol residue exists for later use;

(7) and (3) placing the electronic component treated in the step (6) into a vacuum drying oven, opening the vacuum drying oven to the maximum, vacuumizing for 5-10min at the drying temperature of 110 ℃, drying for 1.5h, taking out after drying, cooling to room temperature, and preferably cooling in a dryer.

And (4) placing the processed electronic components into a material tray, and checking whether the surface is damaged or not.

Example 3

A silver plating post-treatment process for an electronic component comprises the following steps:

(1) adding anhydrous sodium carbonate and plasma water into a cleaning tank, and uniformly stirring and mixing to obtain a neutralized solution, wherein the weight ratio of the anhydrous sodium carbonate to the plasma water is 1: 100;

(2) heating the neutralization solution prepared in the step (1) to 90 ℃, then placing electronic components in a stainless steel filter sieve, and then placing the stainless steel filter sieve in the heated neutralization solution for soaking for 8-10 min;

(3) taking out the stainless steel filter sieve, cleaning the electronic components treated in the step (2) with pure water, and brushing the glass or ceramic surface of the electronic components in the pure water by using a toothbrush, wherein the operation force is light in the brushing process, so that the needle body is not stressed and is not inclined;

(4) filling pure water with the temperature of 80 ℃ into an ultrasonic cleaning machine, and putting the stainless steel filter sieve filled with the electronic components processed in the step (3) into the ultrasonic cleaning machine, wherein the cleaning time is 10min at the frequency of 40 KHz;

(5) taking out the electronic components cleaned by the ultrasonic wave in the step (4), hanging and drying the stainless steel filter sieve until no large amount of water drops fall off for later use, and performing auxiliary drying on the electronic components by using a blower or a blower to accelerate the drying speed of the electronic components;

(6) soaking the stainless steel filter sieve filled with the electronic components treated in the step (5) in absolute ethyl alcohol for 10min, taking out, and blowing the electronic components with hot air until no alcohol residue exists for later use;

(7) and (3) placing the electronic component treated in the step (6) into a vacuum drying oven, opening the vacuum drying oven to the maximum, vacuumizing for 5-10min at the drying temperature of 120 ℃, drying for 1h, taking out after drying, cooling to room temperature, and preferably cooling in a dryer.

And (4) placing the processed electronic components into a material tray, and checking whether the surface is damaged or not.

Examples of the experiments

5 electronic component products are selected to be electroplated according to the existing silver plating process, an insulation and voltage resistance detector is adopted to detect the insulation performance under the condition that the detection parameter is DC 1000V 30s, and the detection data are shown in the following table 1:

TABLE 1 result of testing insulation performance of silver-plated electronic device

Electronic component	1	2	3	4	5
						The result of the detection	340MΩ	380MΩ	410MΩ	320MΩ	360MΩ

Then, the 5 electronic component products are processed by the process method of embodiment 2 of the present invention, and then the insulation performance is detected by the insulation withstand voltage detector under the same detection parameters, and the detection data are shown in table 2 below:

TABLE 2 insulation performance test results of electronic components neutralized after silver plating

Electronic component	1	2	3	4	5
						The result of the detection	1.3GΩ	2.8GΩ	1.6GΩ	2.2GΩ	2.5GΩ

As can be seen from tables 1 and 2, the insulating property of the electronic component treated by the process of the present invention is significantly improved, which indicates that the process can effectively improve the insulating property of the silver-plated electronic component and more effectively ensure the product quality.