阅读说明：本技术 一种多层陶瓷基板制作方法和系统 (Method and system for manufacturing multilayer ceramic substrate ) 是由 成鹏 刘俊 于 2019-09-24 设计创作，主要内容包括：本发明公开了一种多层陶瓷基板制作方法和系统,方法包括：将流延胚体冲压形成流延生胚；在流延生胚的表面生成导电层,基于导电层生成线路,得到初始基板；重叠初始基板,得到重叠板；基于排胶炉处理重叠板得到多层基板；基于烧结炉处理多层基板,得到多层陶瓷基板。系统用于执行方法。本发明实施例通过将流延胚体冲压形成流延生胚；在流延生胚的表面生成导电层,基于导电层生成线路,得到初始基板；重叠初始基板,得到重叠板；基于排胶炉处理重叠板得到多层基板；基于烧结炉处理多层基板,得到多层陶瓷基板,能够针对陶瓷的性质和PCB基板的结构要求,通过合理的步骤获得多层陶瓷基板以满足PCB新工艺的要求。(The invention discloses a method and a system for manufacturing a multilayer ceramic substrate, wherein the method comprises the following steps: stamping the casting blank body to form a casting blank; generating a conducting layer on the surface of the casting green blank, and generating a circuit based on the conducting layer to obtain an initial substrate; overlapping the initial substrates to obtain an overlapped plate; processing the overlapped plate based on a glue discharging furnace to obtain a multilayer substrate; the multilayer substrate is processed based on a sintering furnace to obtain a multilayer ceramic substrate. The system is used for executing the method. In the embodiment of the invention, the casting blank body is punched to form the casting blank; generating a conducting layer on the surface of the casting green blank, and generating a circuit based on the conducting layer to obtain an initial substrate; overlapping the initial substrates to obtain an overlapped plate; processing the overlapped plate based on a glue discharging furnace to obtain a multilayer substrate; the multilayer ceramic substrate is obtained by processing the multilayer substrate based on the sintering furnace, and can meet the requirements of a new PCB process by obtaining the multilayer ceramic substrate through reasonable steps according to the properties of ceramics and the structural requirements of the PCB substrate.)

1. A method for manufacturing a multilayer ceramic substrate is characterized by comprising the following steps:

Stamping the casting blank body to form a casting blank;

Generating a conducting layer on the surface of the casting green blank, and generating a circuit based on the conducting layer to obtain an initial substrate;

overlapping the initial substrates to obtain an overlapped plate;

processing the overlapped plate based on a glue discharging furnace to obtain a multilayer substrate;

And processing the multilayer substrate based on a sintering furnace to obtain the multilayer ceramic substrate.

2. the method as claimed in claim 1, wherein the conductive layer is a metal conductive layer, and the conductive layer is processed by etching or exposure to form a circuit.

3. The method of claim 1, further comprising:

and performing drilling and through hole copper plating on the overlapped plate or the multilayer substrate or the multilayer ceramic substrate.

4. the method of claim 1, wherein the step of forming a conductive layer on the surface of the cast green body comprises:

forming a conductive layer on one surface of the casting blank, or forming conductive layers on two surfaces of the casting blank, correspondingly,

In the overlapping plate, the contact surface comprises a conductive layer;

Or, in the overlapping plate, the contact surface comprises two conductive layers, and the corresponding circuits are consistent.

5. The method of claim 1, wherein the de-glue oven is heated to 600 ° according to a predetermined temperature profile, and the temperature is maintained for 4 hours to process the overlapped plates to obtain the multi-layered substrate.

6. The method according to any one of claims 1 to 5, wherein the sintering furnace is a nitrogen sintering furnace, and is configured to heat the multilayer substrate from 1400 ° to 1650 ° within 4 hours according to a preset temperature profile, thereby obtaining the multilayer ceramic substrate.

7. The method of claim 1, wherein the forming the casting blank comprises:

And carrying out ball milling, vacuum defoaming and tape casting on the ceramic powder, the dysprosium trioxide, the dispersing agent and the plasticizer to obtain a tape casting blank.

8. The method of claim 7, wherein the dispersant comprises xylene, a 1:1 mixture of absolute ethanol, and oleic acid, in respective weight ratios of 3 wt% and 40 wt%;

The plasticizer comprises polyvinyl butyral, a 1:2.5 mixture of polyethylene glycol and dibutyl phthalate, and the corresponding weight ratio is 5 wt% and 10 wt%;

The weight ratio of the ceramic powder to the dysprosium trioxide is 65 wt%: 35 wt%.

9. A system for fabricating a multilayer ceramic substrate, comprising:

the stamping module is used for stamping the casting blank body to form a casting blank;

the circuit manufacturing module is used for generating a conducting layer on the surface of the casting green blank, and generating a circuit based on the conducting layer to obtain an initial substrate;

the combined module is used for overlapping the initial substrates to obtain an overlapped plate;

The glue discharging module is used for processing the overlapped plate based on a glue discharging furnace to obtain a multilayer substrate;

and the sintering module is used for processing the multilayer substrate based on the sintering furnace to obtain the multilayer ceramic substrate.

Technical Field

The invention relates to the technical field of PCBs, in particular to a method and a system for manufacturing a multilayer ceramic substrate.

Background

the substrate is used as the basis of an industrial integrated circuit, along with the improvement of the requirements of circuit processing precision and circuit performance, the requirements for the performance of the substrate are also improved, and the traditional substrate material can not meet the requirements of the 5G era gradually.

Ceramic materials have good development prospects as materials with good rigidity and high hardness, and therefore, a corresponding production method needs to be provided for substrates made of the ceramic materials.

Disclosure of Invention

Embodiments of the present invention aim to address, at least to some extent, one of the technical problems in the related art. To this end, it is an object of embodiments of the present invention to provide a method and system for fabricating a multilayer ceramic substrate.

The technical scheme adopted by the invention is as follows:

in a first aspect, an embodiment of the present invention provides a method for manufacturing a multilayer ceramic substrate, including: stamping the casting blank body to form a casting blank; generating a conducting layer on the surface of the casting green blank, and generating a circuit based on the conducting layer to obtain an initial substrate; overlapping the initial substrates to obtain an overlapped plate; processing the overlapped plate based on a glue discharging furnace to obtain a multilayer substrate; the multilayer substrate is processed based on a sintering furnace to obtain a multilayer ceramic substrate.

preferably, the conductive layer is a metallic conductive layer, which is correspondingly processed on the basis of etching or exposure to create the line.

Preferably, the method for manufacturing a multilayer ceramic substrate further includes: on the superposed board or multilayer substrate or multilayer ceramic substrate, drilling, through hole copper plating is performed.

Preferably, creating the conductive layer on the surface of the cast green body comprises: forming a conductive layer on one surface of the casting blank, or forming conductive layers on two surfaces of the casting blank, wherein the contact surface of the overlapping plate comprises a conductive layer; or, in the overlapped plate, the contact surface comprises two conductive layers, and the corresponding circuits are consistent.

preferably, the glue discharging furnace is heated to 600 ℃ according to a preset temperature curve, and the temperature is kept for 4 hours to process the overlapped plates to obtain the multilayer substrate.

Preferably, the sintering furnace is a nitrogen sintering furnace and is used for raising the temperature from 1400 ℃ to 1650 ℃ in 4 hours according to a preset temperature curve, and pressureless sintering is carried out on the multilayer substrate to obtain the staggered-layer ceramic substrate.

preferably, the generating the casting blank comprises: and carrying out ball milling, vacuum defoaming and tape casting on the ceramic powder, the dysprosium trioxide, the dispersing agent and the plasticizer to obtain a tape casting blank.

Preferably, the dispersant comprises xylene, a 1:1 mixture of absolute ethanol and oleic acid, in respective weight ratios of 3 wt% and 40 wt%; the plasticizer comprises polyvinyl butyral, a 1:2.5 mixture of polyethylene glycol and dibutyl phthalate, and the corresponding weight ratio is 5 wt% and 10 wt%; the weight ratio of the ceramic powder to the dysprosium oxide is 65 wt%: 35 wt%.

In a second aspect, an embodiment of the present invention provides a system for manufacturing a multilayer ceramic substrate, including: the stamping module is used for stamping the casting blank body to form a casting blank; the circuit manufacturing module is used for generating a conducting layer on the surface of the curtain coating green body, generating a circuit based on the conducting layer and obtaining an initial substrate; the combined module is used for overlapping the initial substrates to obtain an overlapped plate; the glue discharging module is used for processing the overlapped plate based on the glue discharging furnace to obtain a multilayer substrate; and the sintering module is used for processing the multilayer substrate based on the sintering furnace to obtain the multilayer ceramic substrate.

The embodiment of the invention has the beneficial effects that:

In the embodiment of the invention, the casting blank body is punched to form the casting blank; generating a conducting layer on the surface of the casting green blank, and generating a circuit based on the conducting layer to obtain an initial substrate; overlapping the initial substrates to obtain an overlapped plate; processing the overlapped plate based on a glue discharging furnace to obtain a multilayer substrate; the multilayer ceramic substrate is obtained by processing the multilayer substrate based on the sintering furnace, and can meet the requirements of a new PCB process by obtaining the multilayer ceramic substrate through reasonable steps according to the properties of ceramics and the structural requirements of the PCB substrate.

drawings

FIG. 1 is a flow chart of one embodiment of a method of fabricating a multilayer ceramic substrate;

FIG. 2 is a connection diagram of an embodiment of a method of fabricating a multilayer ceramic substrate.

Detailed Description

it should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.