阅读说明：本技术 一种抗氧化铜丝的加工方法 (processing method of antioxidant copper wire ) 是由 顾火良 于 2019-09-30 设计创作，主要内容包括：本发明公开了一种抗氧化铜丝的加工方法,涉及金属材料加工领域。其技术要点是：一种抗氧化铜丝的加工方法,包括如下步骤：(1)拉丝：将成品的粗铜丝进行拉丝处理,得到所需尺寸的铜丝；(2)退火：将步骤(1)中得到的铜丝通入温度为200-250℃的氮、氢混合气体中进行退火处理；(3)将退火后的铜丝通入到抗氧化液中进行冷却；(4)将冷却后的铜丝进行烘干,得到抗氧化铜丝。本发明得到的铜丝具有高耐蚀性和高抗氧化性的优点。(the invention discloses a method for processing an antioxidant copper wire, and relates to the field of metal material processing. The technical key points are as follows: a processing method of an antioxidant copper wire comprises the following steps: (1) drawing: carrying out wire drawing treatment on the finished coarse copper wire to obtain a copper wire with a required size; (2) annealing: introducing the copper wire obtained in the step (1) into nitrogen-hydrogen mixed gas at the temperature of 200-; (3) introducing the annealed copper wire into an antioxidant solution for cooling; (4) and drying the cooled copper wire to obtain the antioxidant copper wire. The copper wire obtained by the invention has the advantages of high corrosion resistance and high oxidation resistance.)

1. The processing method of the antioxidant copper wire is characterized by comprising the following steps:

(1) Drawing: carrying out wire drawing treatment on the finished coarse copper wire to obtain a copper wire with a required size;

(2) annealing: introducing the copper wire obtained in the step (1) into nitrogen-hydrogen mixed gas at the temperature of 200-;

(3) introducing the annealed copper wire into an antioxidant solution for cooling;

(4) And drying the cooled copper wire to obtain the antioxidant copper wire.

2. The processing method of the antioxidant copper wire as recited in claim 1, wherein the antioxidant liquid comprises the following components in parts by weight:

Epoxy acrylate emulsion: 20-30 parts of a solvent;

benzotriazole: 2-5 parts;

sodium lauryl sulfate: 0.2 to 0.8 portion.

3. The processing method of the antioxidant copper wire as recited in claim 2, wherein the antioxidant liquid is further added with 15-20 parts by weight of a silane coupling agent.

4. The processing method of the antioxidant copper wire as recited in claim 3, wherein the silane coupling agent is KH 560.

5. the processing method of the antioxidant copper wire as recited in claim 2, wherein citric acid is further added to the antioxidant solution, and the concentration of citric acid in the antioxidant solution is 1-3 g/L.

6. the processing method of the antioxidant copper wire as recited in claim 1, wherein the cooling temperature of the antioxidant liquid is 35-45 ℃.

7. The processing method of the antioxidant copper wire as recited in claim 1, wherein the drying temperature in the step (4) is 60-80 ℃.

8. The processing method of antioxidant copper wires as recited in claim 1, wherein the drying time in the step (4) is 1-2 mim.

Technical Field

The invention relates to the field of metal material processing, in particular to a method for processing an antioxidant copper wire.

Background

The processing method of the copper wire mainly comprises the steps of smelting, wire drawing and annealing. However, copper is easy to oxidize, oxidation discoloration often occurs after cleaning and drying for several hours, oxidation slag is generated after several days, and the thermal conductivity and the electrical conductivity of the oxidized copper wire are reduced.

in order to prevent the oxidation of the copper wire, the prior art generally performs an anti-oxidation treatment during the processing process or performs an anti-oxidation treatment on the finished product after the processing. The anti-oxidation treatment after processing usually adopts the mode of isolating oxygen and protecting inert gas to prevent the copper wire from being oxidized in the processing process. In the annealing process, nitrogen and hydrogen mixed gas is adopted to reduce oxidized copper, so that the purpose of preventing the copper wire from being oxidized is achieved. However, although the copper wire can be effectively prevented from being oxidized in a short time, the long-term effect is limited, and the prepared finished product can be oxidized to different degrees in the subsequent processing, packaging, storage, transportation and other processes, so that the finished copper wire can not meet the requirements in use.

therefore, a new solution is needed to solve the above problems.

Disclosure of Invention

Aiming at the defects in the prior art, the invention aims to provide an antioxidant copper wire which has the advantages of high corrosion resistance and high oxidation resistance.

in order to achieve the purpose, the invention provides the following technical scheme:

a processing method of an antioxidant copper wire comprises the following steps:

(1) Drawing: carrying out wire drawing treatment on the finished coarse copper wire to obtain a copper wire with a required size;

(2) Annealing: introducing the copper wire obtained in the step (1) into nitrogen-hydrogen mixed gas at the temperature of 200-;

(3) introducing the annealed copper wire into an antioxidant solution for cooling;

(4) And drying the cooled copper wire to obtain the antioxidant copper wire.

by adopting the technical scheme, the invention firstly draws the thick copper wire into the thin copper wire with proper size, then carries out annealing treatment on the thin copper wire by utilizing high temperature, rearranges crystal lattices in the copper wire, and introduces mixed gas of nitrogen and hydrogen into the process, wherein the hydrogen is a strong reducing agent to remove oxides on the surface of the copper wire, and then the copper wire is cooled when being introduced into a cooling process. The cooling water in the invention is replaced by the antioxidant liquid, so that the oxidation reaction of the high-temperature copper wire and oxygen in water is avoided, and then the copper wire is dried by the oven, thus a layer of compact and bright protective film is formed on the surface of the copper wire, and the corrosion resistance and the oxidation resistance of the copper wire are improved.

Further preferably, the antioxidant liquid comprises the following components in parts by weight:

Epoxy acrylate emulsion: 20-30 parts of a solvent;

benzotriazole: 2-5 parts;

sodium lauryl sulfate: 0.2 to 0.8 portion.

by adopting the technical scheme, the acrylic ester has good film forming property, excellent light stability, good water resistance, alkali resistance, chemical resistance and bonding property, but has poor temperature resistance and easy re-adhesion, and the epoxy acrylic ester is modified by the epoxy resin to obtain the epoxy acrylic ester, which not only has the characteristics of high modulus, high strength, chemical resistance and excellent corrosion resistance of the epoxy resin, but also has the characteristics of good glossiness, fullness, weather resistance and the like of the acrylic ester, and the obtained protective film is compact and strong in protection property.

Benzotriazole has the characteristics of wide source and low price, is used in antioxidant liquid, is adsorbed on the surface of a copper wire, replaces hydrogen atoms on N-H chemical bonds in molecules by copper atoms to form Cu-N covalent bonds, and forms coordination bonds with copper atoms by lone pair electrons of other two nitrogen atoms in benzotriazole molecules. Thus, copper and benzotriazole molecules alternately form a complex structure.

The surfactant molecule contains active groups of atoms such as N, O, P and hydroxyl nonpolar groups, so that the surfactant has the performances of hydrophilicity, wetting, emulsification and the like of the surfactant, and also has the surface corrosion resistance, and the surfactant has a good synergistic effect when being compounded with benzotriazole, so that the prepared protective film is more compact.

through compounding the epoxy acrylate emulsion, the ammonium dodecyl sulfate and the benzotriazole, a protective film formed by the epoxy acrylate emulsion, the ammonium dodecyl sulfate and the benzotriazole is crosslinked, so that the protective film is more compact, and the corrosion resistance and the oxidation resistance are further improved.

More preferably, the antioxidant solution is further added with 15-20 parts by weight of silane coupling agent.

By adopting the technical scheme, the silane molecules simultaneously contain polar and nonpolar structures, and can simultaneously react with inorganic matters and organic matters to generate a compound with certain binding force, so that the inorganic matters and the organic matters are firmly bound together, and the adhesive force of the protective film is improved.

Further preferably, KH560 is used as the silane coupling agent.

By adopting the technical scheme, the silane coupling agent KH560 is a colorless transparent liquid, is easily dissolved in various organic solvents, is easy to hydrolyze, is condensed to form polysiloxane, is easy to polymerize in the presence of overheating, illumination and peroxide, and can improve the binding power between the resin and the copper wire substrate.

More preferably, citric acid is further added into the antioxidant liquid, and the concentration of the citric acid in the antioxidant liquid is 1-3 g/L.

by adopting the technical scheme, the passivation of benzotriazole on the surface of the copper wire can be promoted by adding a certain amount of citric acid, a layer of compact passivation film is formed on the surface of the copper wire due to a certain passivation effect on the surface of the copper wire, and the corrosion resistance and the oxidation resistance of the protective film can be improved after the passivation film is used in cooperation with the benzotriazole.

More preferably, the cooling temperature of the antioxidant liquid is 35-45 ℃.

by adopting the technical scheme, the corrosion resistance and the oxidation resistance of the protective film formed on the surface of the copper wire by the oxidation resistant liquid change along with the temperature change of the oxidation resistant liquid, the temperature is too high or too low, the corrosion resistance and the oxidation resistance are poor, and the temperature is controlled between 35 ℃ and 45 ℃, so that the protective film with better corrosion resistance and oxidation resistance can be obtained.

more preferably, the drying temperature in the step (4) is 60-80 ℃.

By adopting the technical scheme, the drying temperature has very important influence on the formation of the protective film, the protective film can be formed in a natural state, but the protective film is unstable and easy to fall off, the structure of the protective film can be damaged due to overhigh temperature, the corrosion resistance and the oxidation resistance of the protective film are reduced, and the optimal curing temperature of the protective film is 60-80 ℃.

more preferably, the drying time in the step (4) is 1 to 2 mim.

by adopting the technical scheme, the corrosion resistance and the oxidation resistance of the protective film can not be obviously improved along with the prolonging of the drying time, so that the drying time can be controlled within 1-2min in order to improve the production efficiency, and the rapid formation of the protective film on the surface of the copper wire is ensured.

In summary, compared with the prior art, the invention has the following beneficial effects:

(1) The cooling water in the invention is replaced by the antioxidant liquid, so that the oxidation reaction of the high-temperature copper wire and oxygen in water is avoided, and then the copper wire is dried by the oven, thus a layer of compact and bright protective film is formed on the surface of the copper wire, and the corrosion resistance and the oxidation resistance of the copper wire are improved;

(2) through compounding the epoxy acrylate emulsion, the ammonium dodecyl sulfate and the benzotriazole, a protective film formed by the epoxy acrylate emulsion and the ammonium dodecyl sulfate is crosslinked, so that the protective film is more compact, and the corrosion resistance and the oxidation resistance are further improved;

(3) the invention also adds silane coupling agent, the silane molecule contains polar and non-polar structure, which can react with inorganic substance and organic substance to generate compound with certain binding force, to combine the inorganic substance and organic substance, to improve the adhesive force of protective film.

Drawings

FIG. 1 is a process flow diagram of the present invention.

Detailed Description

the invention is described in detail below with reference to the figures and examples. It is to be noted that those not indicated for specific conditions, carried out under the conventional conditions or conditions recommended by the manufacturer, and those not indicated for the reagents or equipment, are conventional products which can be obtained by commercially purchasing them.

Wherein, KH560 is selected from new silicone materials GmbH of Nanjing Silaoxiangfei;

The citric acid is selected from chemical agents of national drug group;

The ammonium fluotitanate is selected from Wuhan Yuancheng science and technology development Co., Ltd;

The ammonium fluorozirconate is selected from Shanghai eosin industries, Inc.;

The epoxy acrylate emulsion is selected from Shanghai Temei paint company Limited, and the solid content of the epoxy acrylate emulsion is 20-30%.