阅读说明：本技术 芯片模块的生产 (Production of chip modules ) 是由 H.K.叶 于 2017-05-02 设计创作，主要内容包括：本发明涉及一种用于生产芯片模块的方法。该方法包括：提供载体；将半导体芯片布置在载体上；在载体上施加电绝缘材料；以及结构化载体以使得提供芯片模块。芯片模块包括通过对载体结构化而产生的分离的载体区段。芯片模块的载体区段被借助于电绝缘材料连接。本发明更进一步地涉及一种芯片模块。(The invention relates to a method for producing a chip module. The method comprises the following steps: providing a vector; arranging a semiconductor chip on a carrier; applying an electrically insulating material on a carrier; and structuring the carrier such that a chip module is provided. The chip module comprises separate carrier sections which are produced by structuring the carrier. The carrier sections of the chip module are connected by means of an electrically insulating material. The invention further relates to a chip module.)

1. A method for producing a chip module (100), comprising:

Providing a carrier (110, 111, 112, 113, 114, 120);

arranging semiconductor chips (140, 141, 142, 143) on a carrier (110, 111, 112, 113, 114, 120);

applying an electrically insulating material (160) on a carrier (110, 111, 112, 113, 114, 120); and

Structuring the carrier (110, 111, 112, 113, 114, 120) in such a way that a chip module (100) is provided,

Wherein the chip module (100) comprises separate carrier sections (121, 122, 210) produced by structuring the carrier, the carrier sections (121, 122, 210) of the chip module (100) being connected by means of an electrically insulating material (160).

2. The method of claim 1, wherein the first and second light sources are selected from the group consisting of,

Wherein the semiconductor chips (140, 141, 142, 143) are radiation-emitting semiconductor chips.

3. The method according to any one of the preceding claims,

Wherein a semiconductor chip (141) configured for generating a first optical radiation, a semiconductor chip (142) configured for generating a second optical radiation and a semiconductor chip (143) configured for generating a third optical radiation are arranged on the carrier.

4. The method according to any one of the preceding claims,

Wherein the electrically insulating material (160) is a flexible material.

5. The method according to any one of the preceding claims,

Wherein a carrier (110, 112, 113, 114) is provided comprising an electrically insulating carrier material (130, 170) and an electrical conductor structure (121, 122, 171, 172, 221, 222, 223).

6. the method according to any one of the preceding claims,

Wherein the carrier (110, 113, 114) provided comprises a metal lead frame (120) and a molding compound (130) connected to the metal lead frame (120).

7. The method of claim 6, wherein the first and second light sources are selected from the group consisting of,

Wherein the carrier (110, 114) provided comprises molded bodies (131) formed of a molding compound (130), each molded body (131) enclosing a cavity (132),

Wherein the semiconductor chips (140, 141, 142, 143) are arranged on the metal lead frame (120) in the cavity (132) of the molded body (131),

And wherein an electrically insulating material (160) is applied on the carrier (110, 114) transversely to the molded bodies (131) and in the region between the molded bodies (131).

8. The method of any one of claims 1 to 5,

Wherein the provided carrier (112) is one of:

A printed circuit board; or

A ceramic carrier comprising an electrical conductor structure (171, 172).

9. The method of any one of claims 1 to 4,

Wherein the carrier provided is a metal leadframe (120).

10. The method according to any one of the preceding claims,

Wherein an electrically insulating material (160) is applied on the carrier in the form of a lens structure (161).

11. The method according to any one of the preceding claims,

Wherein the provided chip module (100) is singulated into smaller chip modules (100) only by severing the electrically insulating material (160).

12. a chip module (100) comprising: separate carrier sections (121, 122, 210) connected by means of an electrically insulating material (160); and a semiconductor chip (140, 141, 142, 143) arranged on at least a part of the carrier section (121, 210).

13. the chip module according to claim 12, wherein,

Wherein the semiconductor chips (140, 141, 142, 143) are radiation-emitting semiconductor chips.

14. chip module according to one of claims 12 or 13,

Wherein the electrically insulating material (160) is a flexible material.

15. Chip module according to one of claims 12 to 14,

Wherein the vector segments (121, 122, 210) are segments of a structured vector.

16. The chip module according to any one of claims 12 to 15,

Wherein each carrier section (210) comprises an electrically insulating carrier material (130, 170) and an electrical conductor structure (121, 122, 171, 172, 221, 222, 223).

17. The chip module according to any one of claims 12 to 16,

Wherein each carrier segment (210) comprises a metallic leadframe segment (121, 122, 221, 222, 223) and a molding compound (130) connected to the leadframe segment (121, 122, 221, 222, 223),

Wherein each carrier section (210) comprises a molded body (131) formed by a molding compound (130), the molded body (131) enclosing a cavity (132),

wherein the semiconductor chips (140, 141, 142, 143) are arranged on leadframe segments (121, 221) in a cavity (132) of the molded body (131),

And wherein an electrically insulating material (160) is arranged in regions transverse to the molded bodies (131) and between the molded bodies (131).

18. the chip module according to any one of claims 11 to 16,

Wherein the vector segment is one of:

Segments (121, 122) of a metal leadframe;

A section (210) of a printed circuit board; or

A segment (210) of a ceramic carrier comprising an electrical conductor structure (171, 172).

19. chip module according to one of claims 11 to 18,

wherein the electrically insulating material (160) is arranged in the form of a lens structure (161).