阅读说明：本技术 芯片模块的生产 (Production of chip modules ) 是由 H.K.叶 于 2017-05-02 设计创作，主要内容包括：本发明涉及一种用于生产芯片模块的方法。该方法包括：提供载体；将半导体芯片布置在载体上；在载体上施加电绝缘材料；以及结构化载体以使得提供芯片模块。芯片模块包括通过对载体结构化而产生的分离的载体区段。芯片模块的载体区段被借助于电绝缘材料连接。本发明更进一步地涉及一种芯片模块。(The invention relates to a method for producing a chip module. The method comprises the following steps: providing a vector; arranging a semiconductor chip on a carrier; applying an electrically insulating material on a carrier; and structuring the carrier such that a chip module is provided. The chip module comprises separate carrier sections which are produced by structuring the carrier. The carrier sections of the chip module are connected by means of an electrically insulating material. The invention further relates to a chip module.)