阅读说明：本技术 一种用于cpu散热的铜-电气石复合散热材料的制造方法 (Method for manufacturing copper-tourmaline composite heat dissipation material for CPU heat dissipation ) 是由 张敬敏 于 2019-10-29 设计创作，主要内容包括：本发明公开了一种用于CPU散热的铜-电气石复合散热材料及其制造方法,该散热材料由两部分组成：内部是紫铜15份-20份、粒度500目-800目的铁电气石100份-120份混合烧结的铜-电气石复合材料,表层是紫铜5份-15份浇覆而成的铜皮；该复合散热材料内部设置有多个孔径Φ2mm-Φ3mm网格间距5mm-6mm的主要三维孔路系统,在其内部其它区域还有密布的无规律孔隙。本发明具有高效辐射散热能力、具有良好导热性、表面抗冲击、整体强度高。(The invention discloses a copper-tourmaline composite heat dissipation material for CPU heat dissipation and a manufacturing method thereof, wherein the heat dissipation material consists of two parts: the interior is copper-tourmaline composite material mixed and sintered by 15 to 20 portions of red copper and 100 to 120 portions of ferroelectric tourmaline with the granularity of 500 to 800 meshes, and the surface layer is copper sheet formed by pouring 5 to 15 portions of red copper; the composite heat dissipation material is internally provided with a plurality of main three-dimensional pore path systems with the aperture phi of 2mm to phi 3mm and the grid interval of 5mm to 6mm, and other areas in the composite heat dissipation material are also provided with densely distributed irregular pores. The invention has the advantages of high-efficiency radiation heat dissipation capability, good heat conductivity, surface impact resistance and high overall strength.)

1. A method for manufacturing a copper-tourmaline composite heat dissipation material for CPU heat dissipation is characterized by comprising the following steps:

1) raw material preparation

Preparing raw materials: preparing 25-30 parts by weight of red copper with the purity of more than 99% and 100-120 parts by weight of iron tourmaline with the granularity of 500-800 meshes;

preparing auxiliary materials: sufficient absolute ethyl alcohol, sufficient deionized water, sufficient carbon paper with the thickness of 0.1mm-0.2mm, and sufficient paraffin;

2) sintering and forming

Mixing 15-20 parts of red copper prepared in the step 1) with iron tourmaline, putting into a ceramic ball mill, and ball-milling for 1.5-2 h at a ball-milling speed of 120-180 rpm/min to obtain copper-iron tourmaline composite powder;

completely immersing the copper-iron tourmaline composite powder obtained in the step one in absolute ethyl alcohol, cleaning for 10-12 min by adopting ultrasonic waves with the power of 300-500W, then filtering the absolute ethyl alcohol, immersing the powder in sufficient deionized water for ultrasonic cleaning for 5-8 min, filtering the deionized water, and drying at 65-70 ℃ to obtain the surface-cleaned activated copper-iron tourmaline composite powder;

covering the bottom and the periphery of the stainless steel sintering mold to be used with the carbon paper prepared in the step 1), and then putting paraffin rods with the diameter phi of 2 mm-phi 3mm into the mold, and vertically lapping the paraffin rods with the diameter phi of 45 degrees with the bottom surface in pairs to form a three-dimensional frame with the grid spacing of 5mm-6mm, so as to obtain the stainless steel sintering mold with the built-in wax core;

filling the surface-cleaning activated copper-iron tourmaline composite powder obtained in the step two into the stainless steel sintering mold obtained in the step three, then putting the sintering mold into a vacuum furnace, vacuumizing, heating to 500-560 ℃, preserving heat for 20-30 min, heating to 900-920 ℃ at a heating rate of 3-5 ℃/min, keeping for 40-50 min, stopping heating, cooling to 180 ℃ along with the furnace, discharging, and demolding to obtain a sintered rough blank;

3) modification by heat treatment

Putting the sintered rough blank obtained in the step (4) in the stage 2) into a vacuum furnace, heating to 720-760 ℃, preserving the heat for 1-1.5 h, and air-cooling to room temperature to obtain a pretreated blank;

secondly, placing the pretreated blank obtained in the first step in a vacuum furnace, heating to 520-560 ℃, preserving heat for 2-3 h, stopping heating, cooling the furnace to 300-320 ℃, then starting to heat, preserving heat for 30-40 min, and obtaining a heat-treated blank;

discharging the heat treatment blank obtained in the step two out of the furnace and air cooling to obtain a modified blank;

4) structural curing process

Mechanically removing burrs and sharp edges on the surface of the obtained modified blank to obtain a preprocessed blank;

heating the residual red copper prepared in the step 1) to be molten to obtain copper liquid;

uniformly spraying the copper liquid obtained in the step II on the preprocessed blank obtained in the step I to obtain a preprocessed blank solidified with a copper mold;

fourthly, after the preprocessed blank solidified with the copper mold obtained in the third step is completely cooled, mechanically removing burrs and sharp edges on the surface of the blank, and simultaneously opening a hole path blocked by solidification of copper liquid to obtain a refined blank;

fifthly, processing the bottom of the refined blank obtained in the step (iv) into a structure which is matched with the upper surface of the CPU, and processing the top of the refined blank into a structure which is matched with the shape of the fan, thus obtaining the copper-tourmaline composite heat dissipation material which is required to be used for CPU heat dissipation.

2. A copper-tourmaline composite heat dissipation material for CPU heat dissipation is characterized in that: the heat dissipation material is composed of two parts: the interior is copper-tourmaline composite material mixed and sintered by 15 to 20 portions of red copper and 100 to 120 portions of ferroelectric tourmaline with the granularity of 500 to 800 meshes, and the surface layer is copper sheet formed by pouring 5 to 15 portions of red copper; the composite heat dissipation material is internally provided with a plurality of main three-dimensional pore path systems with the aperture phi of 2mm to phi 3mm and the grid interval of 5mm to 6mm, and other areas in the composite heat dissipation material are also provided with densely distributed irregular pores.

Technical Field

The invention relates to the technical field of heat dissipation materials for electrical devices, in particular to a manufacturing method of a copper-tourmaline composite heat dissipation material for CPU heat dissipation.

Background

The radiating fin is a device for radiating heat of electronic elements which are easy to generate heat in electrical appliances, and is made of aluminum alloy, brass or bronze into a plate shape, a sheet shape, a plurality of sheet shapes and the like, for example, a CPU (central processing unit) in a computer needs to use a relatively large radiating fin, and power tubes, row tubes and power amplifier tubes in a power amplifier in a television set need to use the radiating fin.

At present, the best air-cooled radiating fin is a copper radiating fin, but the copper radiating fin is limited by materials, and the required cooling efficiency cannot be completely achieved when the copper radiating fin is applied to a high-power-consumption CPU (central processing unit), namely, the copper radiating fin is basically only provided with a contact type conduction radiating mechanism and does not have a radiation radiating mechanism, and the copper part has low integral strength and is not impact-resistant, so that part of radiators are damaged to a certain extent in transportation or installation, and the radiating performance is influenced.

Therefore, a manufacturing method of a copper-tourmaline composite heat dissipation material for CPU heat dissipation, which has high-efficiency radiation heat dissipation capacity, good heat conductivity, surface impact resistance and high overall strength, is urgently needed in the market.

Disclosure of Invention

The invention aims to provide a method for manufacturing a copper-tourmaline composite heat dissipation material for CPU heat dissipation, which has high-efficiency radiation heat dissipation capacity, good heat conductivity, surface impact resistance and high overall strength.

In order to achieve the purpose, the invention adopts the following technical scheme: a method for manufacturing a copper-tourmaline composite heat dissipation material for CPU heat dissipation comprises the following steps:

1) raw material preparation

Preparing raw materials: preparing 25-30 parts by weight of red copper with the purity of more than 99% and 100-120 parts by weight of iron tourmaline with the granularity of 500-800 meshes;

preparing auxiliary materials: sufficient absolute ethyl alcohol, sufficient deionized water, sufficient carbon paper with the thickness of 0.1mm-0.2mm, and sufficient paraffin;

2) sintering and forming

Mixing 15-20 parts of red copper prepared in the step 1) with iron tourmaline, putting into a ceramic ball mill, and ball-milling for 1.5-2 h at a ball-milling speed of 120-180 rpm/min to obtain copper-iron tourmaline composite powder;

completely immersing the copper-iron tourmaline composite powder obtained in the step one in absolute ethyl alcohol, cleaning for 10-12 min by adopting ultrasonic waves with the power of 300-500W, then filtering the absolute ethyl alcohol, immersing the powder in sufficient deionized water for ultrasonic cleaning for 5-8 min, filtering the deionized water, and drying at 65-70 ℃ to obtain the surface-cleaned activated copper-iron tourmaline composite powder;

covering the bottom and the periphery of the stainless steel sintering mold to be used with the carbon paper prepared in the step 1), and then putting paraffin rods with the diameter phi of 2 mm-phi 3mm into the mold, and vertically lapping the paraffin rods with the diameter phi of 45 degrees with the bottom surface in pairs to form a three-dimensional frame with the grid spacing of 5mm-6mm, so as to obtain the stainless steel sintering mold with the built-in wax core;

filling the surface-cleaning activated copper-iron tourmaline composite powder obtained in the step two into the stainless steel sintering mold obtained in the step three, then putting the sintering mold into a vacuum furnace, vacuumizing, heating to 500-560 ℃, preserving heat for 20-30 min, heating to 900-920 ℃ at a heating rate of 3-5 ℃/min, keeping for 40-50 min, stopping heating, cooling to 180 ℃ along with the furnace, discharging, and demolding to obtain a sintered rough blank;

3) modification by heat treatment

Putting the sintered rough blank obtained in the step (4) in the stage 2) into a vacuum furnace, heating to 720-760 ℃, preserving the heat for 1-1.5 h, and air-cooling to room temperature to obtain a pretreated blank;

secondly, placing the pretreated blank obtained in the first step in a vacuum furnace, heating to 520-560 ℃, preserving heat for 2-3 h, stopping heating, cooling the furnace to 300-320 ℃, then starting to heat, preserving heat for 30-40 min, and obtaining a heat-treated blank;

discharging the heat treatment blank obtained in the step two out of the furnace and air cooling to obtain a modified blank;

4) structural curing process

Mechanically removing burrs and sharp edges on the surface of the obtained modified blank to obtain a preprocessed blank;

heating the residual red copper prepared in the step 1) to be molten to obtain copper liquid;

uniformly spraying the copper liquid obtained in the step II on the preprocessed blank obtained in the step I to obtain a preprocessed blank solidified with a copper mold;

fourthly, after the preprocessed blank solidified with the copper mold obtained in the third step is completely cooled, mechanically removing burrs and sharp edges on the surface of the blank, and simultaneously opening a hole path blocked by solidification of copper liquid to obtain a refined blank;

fifthly, processing the bottom of the refined blank obtained in the step (iv) into a structure which is matched with the upper surface of the CPU, and processing the top of the refined blank into a structure which is matched with the shape of the fan, thus obtaining the copper-tourmaline composite heat dissipation material which is required to be used for CPU heat dissipation.

A copper-tourmaline composite heat dissipation material for CPU heat dissipation is composed of two parts: the interior is copper-tourmaline composite material mixed and sintered by 15 to 20 portions of red copper and 100 to 120 portions of ferroelectric tourmaline with the granularity of 500 to 800 meshes, and the surface layer is copper sheet formed by pouring 5 to 15 portions of red copper; the composite heat dissipation material is internally provided with a plurality of main three-dimensional pore path systems with the aperture phi of 2mm to phi 3mm and the grid interval of 5mm to 6mm, and other areas in the composite heat dissipation material are also provided with densely distributed irregular pores.

Compared with the prior art, the invention has the following advantages: (1) the heat dissipation efficiency of the invention is 2.04-2.84 times of that of pure red copper. (2) The overall hardness of the invention is 190HB-230HB, which is much higher than about 45HB of pure copper and 70-90HB of copper alloy. (3) The surface of the invention is provided with the leather film made of pure copper, which can help the invention to overcome the defect of high brittleness of tourmaline and simultaneously ensure that the invention obtains the bending strength of 35MPa-42MPa integrally. (4) The invention can obtain a large amount of randomly distributed pores (the theoretical density of the structure used by the invention under the condition of complete compactness is 3.23 g/cm)³The actual density of the invention is 1.72g/cm³-1.84g/cm³) Therefore, the present invention has an extremely high specific surface area. (5) The base number of radiation heat dissipation is the fourth power of the temperature difference, and the conduction-resistant heat dissipation is only the second power of the temperature difference, so the radiation heat dissipation has better heat dissipation efficiency under the same temperature difference, meanwhile, the tourmaline part of the invention can convert the heat into infrared rays with the wavelength of 4-14 mu m, and the infrared rays with the wavelength can not be absorbed by oxygen and nitrogen which account for the main proportion in the air, so the invention can dissipate most of the heat under the condition of not causing the temperature rise of the ambient air. Therefore, the invention has the characteristics of high-efficiency radiation heat dissipation capability, good heat conductivity, surface impact resistance and high overall strength.

Detailed Description