阅读说明：本技术 一种热浸镀锡铜材及其制造方法 (Hot-dip tinned copper material and manufacturing method thereof ) 是由 鲁长建 刘爱奎 刘栋 吕刚 刘国伟 张英 段广超 王世中 赵红生 将延续 沈朝辉 于 2019-09-30 设计创作，主要内容包括：本发明公开了一种热浸镀锡铜材,所述铜材外表面覆盖有铜锡金属间化合物。本发明还公开了制造上述热浸镀锡铜材的方法,包括以下步骤：将热浸镀锡后的铜材料进行热处理,热处理的温度为150-210℃,时间为13-28小时。这种外表面覆盖有铜锡金属间化合物的热浸镀锡铜材具有良好的机械性能、耐腐蚀性和导电性,提高了产品的使用寿命。本发明公开的热浸镀锡铜材,其表面的铜锡间化合物可以为两层,分别为Cu<Sub>6</Sub>Sn<Sub>5</Sub>层和Cu<Sub>3</Sub>Sn层,所述Cu<Sub>3</Sub>Sn层位于Cu<Sub>6</Sub>Sn<Sub>5</Sub>层和Cu基体之间,这种具有两层铜锡金属间化合物层的结构使得铜锡间化合物整体与铜基体结合更加牢固、不易脱落。(The invention discloses a hot-dip tinned copper material, wherein a copper-tin intermetallic compound is covered on the outer surface of the copper material. The invention also discloses a method for manufacturing the hot-dip tinned copper material, which comprises the following steps: the copper material after hot-dip tinning is subjected to heat treatment at the temperature of 150-210 ℃ for 13-28 hours. The hot-dip tinned copper material with the outer surface covered with the copper-tin intermetallic compound has good mechanical property, corrosion resistance and electrical conductivity, and the service life of the product is prolonged.The invention discloses a hot-dip tinned copper material, wherein the surface of the hot-dip tinned copper material can be divided into two layers of copper-tin compounds which are respectively Cu 6 Sn 5 Layer and Cu 3 Sn layer, said Cu 3 A Sn layer is located on Cu 6 Sn 5 Between the layer and the Cu matrix, the structure with two copper-tin intermetallic compound layers ensures that the whole copper-tin intermetallic compound is combined with the copper matrix more firmly and is not easy to fall off.)

1. A hot-dip tinned copper material, characterized in that, the copper material surface is covered with copper tin intermetallic compound.

2. The hot-dip tinned copper product of claim 1, characterized in that the copper-tin intermetallic compound is in two layers.

3. The hot-dip tinned copper product of claim 2, in which the two layers of copper-tin intermetallic compound are each Cu₆Sn₅Layer and Cu₃Sn layer, said Cu₃A Sn layer is located on Cu₆Sn₅Between the layer and the Cu substrate.

4. The hot dip tinned copper product of claim 3, in which the Cu is₆Sn₅The thickness of the layer is 0.5-4 μm, and the Cu₃The thickness of the Sn layer is 0.5-2.5 μm.

5. A method for manufacturing a hot-dip tinned copper product according to one of claims 1 to 4, characterized in that it comprises the following steps: and carrying out heat treatment on the copper material subjected to hot-dip tinning, wherein the heat treatment temperature is 150-210 ℃, and the time is 13-28 hours.

6. Method for manufacturing hot dip tinned copper product according to claim 5, characterized in that the heat treatment is carried out in N₂Atmosphere or H₂The reaction is carried out under an atmosphere.

Technical Field

The invention relates to a hot-dip tinned copper material, in particular to a hot-dip tinned copper material and a manufacturing method thereof.

Background

The protection of metal materials is a major issue in modern materials science, and the metal materials are usually protected by surface coating. For copper and copper alloys, tin plating of the surface is a relatively common protective measure. The surface tin plating can obviously improve the corrosion resistance and oxidation resistance of copper and copper alloy, improve the friction performance and the like. At present, the surface tin plating of copper materials is mainly divided into electrotinning and hot dip tin plating, wherein the hot dip tin plating has the advantages of wide processing range, high production efficiency, no pollution and the like. In addition, the hot-dip tinning can effectively remove the internal stress of the copper material and prevent the generation of tin whiskers, so that the plating layer has the performance advantages of stronger adhesiveness, difficult falling-off and the like, and the method is a development direction of future tinning of the copper material. However, the hardness of pure tin is only HB14.8, the pure tin plating layer is very soft, and the tin layer of a tin-plated product is easy to wear in the using process, so that the service life of the tin-plated product is greatly shortened.

Disclosure of Invention

The invention aims to provide a hot-dip tinned copper material which has high plating layer surface hardness and is wear-resistant.

The technical scheme of the invention is as follows:

a hot-dip tinned copper material, the outer surface of the copper material is covered with a copper-tin intermetallic compound. The copper-tin intermetallic compound has good wear resistance and higher hardness, so that the tin-plated copper material not only has corrosion resistance, but also has high hardness and higher wear resistance, thereby improving the service performance of the copper member.

Preferably, the copper-tin intermetallic compound is two layers.

Preferably, the two layers of copper-tin intermetallic compounds are Cu respectively₆Sn₅Layer and Cu₃Sn layer, said Cu₃A Sn layer is located on Cu₆Sn₅Between the layer and the Cu substrate. Such as Cu₃Sn intermetallic compound as the coating of intermediate transition layer, the intermediate transition layer Cu₃Sn intermetallic compound, Cu matrix and Cu₆Sn₅The layers all have stronger adhesiveness, so that the copper-tin intermetallic compound layer is combined with the copper matrix more firmly and is not easy to fall off.

Preferably, the Cu₆Sn₅The thickness of the layer is 0.5-4 μm, and the Cu₃The thickness of the Sn layer is 0.5-2.5 μm.

Another object of the present invention is to provide a method for manufacturing the above-mentioned wear-resistant hot-dip tinned copper material having high surface hardness, which comprises the following steps:

a method of manufacturing hot-dip tinned copper, comprising the steps of: and carrying out heat treatment on the copper material subjected to hot-dip tinning, wherein the heat treatment temperature is 150-210 ℃, and the time is 13-28 hours. At the temperature of 150-210 ℃, copper in the substrate diffuses towards the surface free tin layer, and Sn in the surface free tin layer diffuses towards the Cu substrate; when the heat preservation time is 13-28 hours, the coating surface of the hot-dip tinned copper stripConversion of all surfaces to Cu₆Sn₅And surface Cu₆Sn₅Cu is formed between the layer and the copper matrix₃Sn。

Preferably, the heat treatment is in N₂Atmosphere or H₂The reaction is carried out under an atmosphere. In N₂Atmosphere or H₂The formation of oxides can be avoided by carrying out the reaction under the atmosphere.

The invention has the beneficial effects that:

by using the method for manufacturing the hot-dip tinned copper material, the hot-dip tinning is followed by the heat treatment, so that the tinning layer on the surface of the copper is converted into a copper-tin intermetallic compound. Therefore, the hot-dip tinned copper material has the outer surface covered with the copper-tin intermetallic compound and the surface hardness of HB 358. Because the copper-tin intermetallic compound has high hardness and good wear resistance, the hot-dip tinned copper product with the outer surface covered with the copper-tin intermetallic compound has good mechanical property, corrosion resistance and electrical conductivity, thereby prolonging the service life of the product and being widely applied to industries of automobiles, machine manufacturing, electrical connectors and the like.

Drawings

FIG. 1 is a scanning electron micrograph of the surface of a hot-dip tin-plated copper strip before heat treatment in example 1.

FIG. 2 is a scanning electron micrograph of the surface of the hot dip tin-coated copper strip after the heat treatment in example 1.

FIG. 3 is an EDS chart of the surface of a hot-dip tinned copper strip before heat treatment in example 1.

FIG. 4 is an EDS map of the surface of a hot-dip tin-plated copper strip after heat treatment in example 1.

FIG. 5 is a cross-sectional EBSD of hot-dip tinned copper tape prior to heat treatment in example 1.

FIG. 6 is a cross-sectional EBSD of hot-dip tinned copper tape after heat treatment in example 1.

Detailed Description

The present invention will be described in detail with reference to examples.