阅读说明：本技术 一种改善差分硅振梁加速度计温度特性的陶瓷转接板 (A kind of ceramic pinboard improving difference silicon vibrating beam accelerometer temperature characterisitic ) 是由 黄丽斌 丁姝 赵立业 李宏生 丁徐锴 于 2019-09-02 设计创作，主要内容包括：本发明公布了一种改善差分硅振梁加速度计温度特性的陶瓷转接板,包括转接板本体,在转接板本体中间有十字形通孔,转接板本体表面印刷了四个金属直角框线,四个金属直角框线与十字形通孔边缘共同形成四个矩形粘接面,整个结构呈中心对称。本发明的优点在于克服了粘接剂的流动性对粘接层与芯片接触部分形状的不利影响,提高了四点涂抹粘接剂后差分硅振梁加速度计整体结构的对称性,使加速度计充分发挥对由热应力引起的共模干扰的抑制作用,从而提高加速度计的温度性能。(The invention discloses a kind of ceramic pinboards for improving difference silicon vibrating beam accelerometer temperature characterisitic, including pinboard ontology, there is cross-shaped through hole among pinboard ontology, pinboard body surface has printed four metal right angle wires, four rectangle bonding planes are collectively formed in four metal right angle wires and cross-shaped through hole edge, and total is centrosymmetric.The advantage of the invention is that overcoming adverse effect of the mobility to adhesive layer and chip contacting portion shape of bonding agent, improve the integrally-built symmetry of difference silicon vibrating beam accelerometer after 4 points of smearing bonding agents, accelerometer is set to give full play to the inhibiting effect to the common mode interference as caused by thermal stress, to improve the temperature performance of accelerometer.)

1. a kind of ceramic pinboard for improving difference silicon vibrating beam accelerometer temperature characterisitic, including pinboard ontology (3), feature It is: has cross-shaped through hole among pinboard ontology (3), four metal right angle wires of pinboard ontology (3) surface printing (4), four rectangle bonding planes are collectively formed in four metal right angle wires (4) and cross-shaped through hole edge, and total is in center Symmetrically.

2. a kind of ceramic pinboard for improving difference silicon vibrating beam accelerometer temperature characterisitic as described in claim 1, feature Be: the outside dimension in the cross-shaped through hole maximum length direction and maximum width direction is greater than chip size 1mm.

3. a kind of ceramic pinboard for improving difference silicon vibrating beam accelerometer temperature characterisitic as described in claim 1, feature Be: four metal right angle wires (4) mark off one and difference silicon vibrating beam accelerometer chip (1) consistent region of shape, When patch, difference silicon vibrating beam accelerometer chip (1) edge is placed in ceramic pinboard after being aligned with metal right angle wire (4) On.

4. a kind of ceramic pinboard for improving difference silicon vibrating beam accelerometer temperature characterisitic as described in claim 1, feature Be: when patch, bonding agent is uniformly applied on rectangle bonding plane, so that bonding plane is completely covered in bonding agent.

5. a kind of ceramic pinboard for improving difference silicon vibrating beam accelerometer temperature characterisitic as described in claim 1, feature Be: under the premise of meeting adhesive strength, cross-shaped through hole area is big as far as possible, so that rectangle bonding plane area is as far as possible It is small.

Technical field

The invention belongs to MEMS package technical fields, and in particular to a kind of improvement difference silicon vibrating beam accelerometer temperature characterisitic Ceramic pinboard.

Background technique

Silicon vibrating beam accelerometer is the force-frequency effect according to resonator, and acceleration is changed into adding for resonant frequency variation Velocity sensor.Silicon vibrating beam accelerometer is mainly made of detection mass block, lever construction, resonator and supporting mechanism, wherein Two levers and two resonators are symmetrical, and two resonator difference under tensions and pressure effect are so that one humorous when loaded Vibration device frequency increases the reduction of another resonant frequency, and carrying out calculating using the difference of two resonant frequencies can be obtained input Acceleration.Therefore, the common mode as caused by the factors such as temperature can be effectively suppressed in the difference silicon vibrating beam accelerometer of this symmetrical configuration Interference.

Silicon vibrating beam accelerometer in the application, needs suitable encapsulating structure to provide support and radiating condition for it, protection Chip is free from the influence of the external environment and destroys, while realizing the interconnection with external signal.Be typically used as encapsulating material has gold Belong to, ceramic and plastics, wherein Metal Packaging has good heat-sinking capability and electromagnetic shielding capability, is widely used in MEMS envelope In dress.Metal shape for hat encapsulating structure mainly includes metal cap, ceramic pinboard and the tube socket with pin.Chip passes through paster technique Fixed on ceramic pinboard, paster technique carrys out adhering chip usually using solder or bonding agent, is compared to solder, uses Bonding agent such as epoxide-resin glue etc. is bonded, and has that technological temperature is low, at low cost, internal stress is low and easy to operate etc. excellent Point, therefore be usually applied in the MEMS chip encapsulation sensitive to stress variation, such as micro-acceleration gauge, gyroscope etc..

When being bonded with bonding agent to silicon vibrating beam accelerometer, common smearing mode can be divided into bonding plane and all apply Smear with 4 points smear, wherein the mode of full coat due to bond area it is big, thermal stress is also big, and 4 points smearing mode bond areas Small, thermal stress is lower than the mode of full coat.But since bonding agent has mobility, the shape of each adhesive spots is irregular, especially It is the shape of bonding agent and chip contacting portion, therefore the adhesive layer symmetry of 4 points of smearings is poor, so that thermal stress is in structure In be unevenly distributed, thus reduce accelerometer differential configuration to inhibit common-mode error effect, affect accelerometer Temperature performance.

Summary of the invention

The purpose of the present invention is to solve the above problems, provide a kind of improvement difference silicon vibrating beam accelerometer temperature characterisitic Ceramic pinboard, thus improve silicon vibrating beam accelerometer 4 points smear bonding agent in the case where symmetry.

In order to achieve the above object, the method that the present invention uses is: a kind of improvement difference silicon vibrating beam accelerometer temperature is special Property ceramic pinboard, including pinboard ontology has cross-shaped through hole, the printing of pinboard body surface among pinboard ontology Four metal right angle wires, four metal right angle wires and cross-shaped through hole edge are collectively formed four rectangle bonding planes, whole A structure is centrosymmetric.

As an improvement of the present invention, the cross-shaped through hole maximum length direction and maximum width direction is outer Size is greater than chip size 1mm.

As an improvement of the present invention, four metal right angles wire marks off one and difference silicon vibration beam acceleration The consistent region of chip form is counted, difference silicon vibrating beam accelerometer chip edge is placed in ceramic switching after being aligned with metal wire On plate.

As an improvement of the present invention, when patch, bonding agent is uniformly applied on rectangle bonding plane, so that bonding agent is complete All standing bonding plane.

As an improvement of the present invention, under the premise of meeting adhesive strength, increase the area of cross-shaped through hole as far as possible, Reduce rectangle bonding plane area.

The utility model has the advantages that

A kind of ceramic pinboard of improvement difference silicon vibrating beam accelerometer temperature characterisitic proposed by the invention, is in original MEMS On the basis of Metal Packaging, ceramic pinboard is improved.Four metal right angle wires of ceramic pinboard surface printing, on the one hand It defines the symmetry of the range and glue sites of smearing bonding agent, on the other hand provides positioning for the fixation of chip；Ceramics turn Cross-shaped through hole among fishplate bar, on the one hand reduces bond area, reduces thermal stress, and another aspect clear size of opening is slightly larger than Chip size eliminates the adhesion of bonding agent Yu chip non-adhesive region, it is ensured that chip and bonding agent contact portion rectangle are viscous The shape of junction improves the symmetry of structure after four glue dispensings, eliminates difference silicon vibrating beam accelerometer sufficiently by thermal stress Caused common mode interference.

Detailed description of the invention

Fig. 1 is the ceramic pinboard of improvement difference silicon vibrating beam accelerometer temperature characterisitic of the invention and the knot of die bonding Structure schematic diagram；

Fig. 2 is that the ceramic pinboard of improvement difference silicon vibrating beam accelerometer temperature characterisitic and the structure of die bonding of the invention cut open Face schematic diagram；

Fig. 3 is the structural schematic diagram of the ceramic pinboard of improvement difference silicon vibrating beam accelerometer temperature characterisitic of the invention.

Each component in figure are as follows: 1, difference silicon vibrating beam accelerometer chip；2, adhesive layer；3, ceramic pinboard；4, metal is straight Angle wire.

Specific embodiment

With reference to the accompanying drawing, embodiments of the present invention are illustrated.

Referring to Fig. 1 and Fig. 2, a kind of ceramics switching improving difference silicon vibrating beam accelerometer temperature characterisitic proposed by the present invention Plate, including pinboard ontology 3, there are four metal right angle wires 4 for 3 surface printing of pinboard ontology, and position can be according to difference silicon The size of vibrating beam accelerometer chip 1 determines.

The region that metal right angle wire 4 is confined is 1 placement region of difference silicon vibrating beam accelerometer chip, should be at transferring The center of plate ontology 3.It is completely the same that wire 4 interior zone in metal right angle is divided into four shapes by intermediate cross-shaped through hole Rectangle bonding region.

When patch, bonding agent is smeared on the surface of ceramic pinboard 3 first, bonding agent is made sufficiently to cover metal right angle wire Bonding region inside 4 forms adhesive layer 2, difference silicon vibrating beam accelerometer chip 1 is then centrally placed in metal right angle frame In line 4, keep the edge of difference silicon vibrating beam accelerometer chip 1 concordant with metal right angle wire 4.According to the invention method, can have Effect improves the symmetry of 4 viscose glues.

Certainly, in order to further reduce thermal stress, under the premise of meeting adhesive strength, cross should be increased as far as possible Via area, to reduce rectangle bonding plane area.

A kind of ceramic pinboard of improvement difference silicon vibrating beam accelerometer temperature characterisitic proposed by the invention, is original On the basis of MEMS Metal Packaging, ceramic pinboard is improved.Four metal right angle wires of ceramic pinboard surface printing, one Aspect defines the symmetry of the range and glue sites of smearing bonding agent, on the other hand provides positioning for the fixation of chip；Pottery Cross-shaped through hole among porcelain pinboard, on the one hand reduces bond area, reduces thermal stress, and another aspect clear size of opening omits Greater than chip size, the adhesion of bonding agent Yu chip non-adhesive region is eliminated, it is ensured that chip and bonding agent contact portion square The shape of shape bonding plane improves the symmetry of structure after four glue dispensings, eliminates difference silicon vibrating beam accelerometer sufficiently by heat Common mode interference caused by stress.

It is only ideal embodiment of the invention in summary, is not intended to limit the present invention, that is, is not departing from The improvement and deformation made on the basis of the method for the present invention principle, comes under protection scope of the present invention.