Automatic acquisition device and system for vibrating wire sensor

文档序号:1813736 发布日期:2021-11-09 浏览:11次 中文

阅读说明:本技术 一种振弦传感器自动采集装置、及系统 (Automatic acquisition device and system for vibrating wire sensor ) 是由 徐伟忠 王喜超 俞金宏 杨峰 何铁 于 2021-07-05 设计创作,主要内容包括:本申请提供的一种振弦传感器自动采集装置、及系统,包括:MCU控制单元;振弦传感器管理单元,用于连接多路标准或非标准的振弦传感器,并对一或多路的振弦传感器进行切换选择,以采集对应的振弦式传感参数信息;调节单元,用于远程调节,以适配不同种类振弦传感器;通信单元,提供多种有线与无线通信方式;用于通信连接各振弦传感器或云平台;通信总线,用于级联其他采集装置;测温单元,用于检测各振弦传感器的温度;GNSS定位单元,用于对各振弦传感器同步测量,实现GIS管理。本申请通过合理的位置安装,可实现集中与分布式混合自动化监测系统,大大减少了监测电缆敷设,在降低系统成本的同时,提高了系统可靠性、可维护性、作业效率,可保证作业安全。(The application provides a vibrating wire sensor automatic acquisition device and system includes: an MCU control unit; the vibration wire sensor management unit is used for connecting multiple paths of standard or nonstandard vibration wire sensors and switching and selecting one or multiple paths of vibration wire sensors to acquire corresponding vibration wire type sensing parameter information; the adjusting unit is used for remotely adjusting to adapt to different kinds of vibrating wire sensors; a communication unit providing a plurality of wired and wireless communication modes; the system is used for being in communication connection with each vibrating wire sensor or the cloud platform; the communication bus is used for cascading other acquisition devices; the temperature measuring unit is used for detecting the temperature of each vibrating wire sensor; and the GNSS positioning unit is used for synchronously measuring each vibrating wire sensor and realizing GIS management. This application can realize concentrating and the automatic monitoring system of distributing type mixture through reasonable position installation, and the monitoring cable that has significantly reduced lays, when lowering system cost, has improved system reliability, maintainability, operating efficiency, can guarantee the operation safety.)

1. An automatic collection device for a vibrating wire sensor, the collection device comprising:

the MCU control unit is connected with each unit and is used for acquiring signals and controlling and processing;

the vibration wire sensor management unit is used for connecting multiple paths of standard or nonstandard vibration wire sensors and switching and selecting one or multiple paths of vibration wire sensors to acquire corresponding vibration wire type sensing parameter information;

the adjusting unit is used for remotely adjusting to adapt to different kinds of vibrating wire sensors;

a communication unit providing a plurality of wired and wireless communication modes; the system is used for being in communication connection with each vibrating wire sensor or the cloud platform;

the communication bus is used for cascading other acquisition devices;

the temperature measuring unit is used for detecting the temperature of each vibrating wire sensor;

and the GNSS positioning unit is used for synchronously measuring each vibrating wire sensor and realizing GIS management.

2. The acquisition device according to claim 1, wherein the vibrating wire sensor management unit comprises:

the vibrating wire sensor interfaces are used for being connected with the vibrating wire sensors in a one-to-one correspondence mode;

the multi-path switching circuit is used for integrally connecting the vibrating wire sensor interfaces;

and the driving circuit is used for driving the multi-path switching circuit according to the instruction of the MCU control unit so as to switch one or more connected vibrating wire sensors and obtain one or more pieces of vibrating wire type sensing parameter information selected by the multi-path switching circuit.

3. The acquisition device as set forth in claim 1, wherein the vibrating wire sensing parameters include: any one of displacement, pressure, water level, temperature, tension, axial force, and osmotic pressure.

4. The acquisition device according to claim 1, wherein the adjustment unit comprises:

the vibrating wire exciting circuit is used for adjusting or controlling the excitation voltage of each vibrating wire sensor;

and the vibrating wire signal processing circuit is used for adjusting or controlling the signal amplification gain of each vibrating wire sensor.

5. The acquisition device according to claim 1, wherein the communication unit comprises a wired communication mode and/or a wireless communication mode;

the wired communication method includes: any one or more of USB1.0/2.0/3.x, MicroUSB, MiniUSB, RS-232-C bus, RS-485 bus, RS-422 bus, CAN bus, IEEE-488 bus and Microwire bus;

the wireless communication method comprises the following steps: any one or a plurality of combinations of 2G/3G/4G/5G, Bluetooth, infrared, NB-IoT, Rola, Zigbee, MavLink, Lora, WIFI, NFC, GPRS, GSM and Ethernet.

6. The acquisition device of claim 1, wherein the acquisition device is directly connectable to a cloud platform in a wireless communication mode of a communication unit in an area with good wireless communication signals; the acquisition device is connected to an upper acquisition device through a wire communication bus in an area with poor wireless communication signals; the plurality of acquisition devices can be cascaded through respective communication buses, so that when any acquisition device is in a good wireless communication signal area, all cascaded data can be sent to the cloud platform.

7. The acquisition device according to claim 1, wherein the temperature measurement unit provides two temperature measurement modes of thermal resistance temperature monitoring and temperature sensor temperature measurement for the vibrating wire sensor.

8. The acquisition device as claimed in claim 1, further comprising: the power supply management unit is used for supplying power to each unit; the power types include: comprises any one or a combination of a plurality of storage batteries, rechargeable batteries, dry batteries and solar energy.

9. A vibrating wire sensor automatic acquisition system, characterized in that the system comprises:

a plurality of automatic collection devices of the vibrating wire sensor according to any one of claims 1 to 8, which are installed at different monitoring points; the data transmission among the acquisition devices can be carried out in a cascade mode;

the cloud platform is used for being in communication connection with each acquisition device and providing data receiving, database, data processing and WEB service for the acquisition devices; wherein, each collection system can direct communication connection cloud platform.

Technical Field

The application relates to the technical field of automatic acquisition of vibrating wire sensors, in particular to an automatic acquisition device and system of a vibrating wire sensor.

Background

Modern construction is informatization construction, various rock and soil parameters and the like need to be measured in the construction process, and the measurement and calculation results provide data support for field safety risk management and control, but the traditional manual monitoring means has high cost, low efficiency and poor consistency and cannot meet the requirements of the new era; in the aspect of modern city construction, along with the aggravation of urbanization process, the scale of the urban construction is larger and larger, the construction of large underground infrastructures such as subways and municipal buildings is greatly increased, and secondary disasters caused by soil disturbance, water and soil loss and the like due to underground space construction are promoted year by year; with the increasing amount of basic facilities and buildings such as urban overpasses, rail transit, tunnel bridges and the like, a large number of buildings (structures) lack effective monitoring throughout the year, and special systemic risks of large cities are accumulated; the method is influenced by various natural factors (such as earthquakes, typhoons, rainfall and the like) and human factors, frequent geological disasters such as landslide, land settlement and the like occur, and accidents such as reservoir leakage, mine collapse and the like are accompanied to cause casualties and property loss, so that the social attention to the events is high, and the accommodation degree is low.

In order to solve the problems, various monitoring technologies are used at present, and the monitoring contents comprise rock-soil displacement, axial force, stress, settlement, deep soil displacement and layered settlement, soil pressure, anchor rod stress, osmotic pressure, water level and the like.

By adopting a high-precision photoelectric measurement system, a high-precision photoelectric measurement device and GNSS monitoring equipment, all requirements of ground monitoring can be well met in the technical aspect; however, for means for monitoring internal elements of rock mass, wall body or soil body, such as measuring methods of soil pressure, stress, water level, osmotic pressure and the like, the traditional vibrating wire sensor is mainly used, and parameters are still obtained by adopting a manual reading method, so that an automatic acquisition mode is required to improve the working efficiency; the latest fiber grating sensor can be used for measuring the internal elements of the rock-soil body, but has the problems of difficult installation, high use cost, difficult maintenance and the like.

In view of the increasing demand for monitoring information and the increasing labor costs, much effort has been devoted to developing automated monitoring; in the current stage, for monitoring key point information, various scattered intelligent instruments, equipment and sensors are arranged in a monitoring area, and measurement of a plurality of parameters is completed by adopting various means.

The pain points of the monitoring application of the existing vibrating wire sensor are summarized as follows:

(1) the vibrating wire sensors are distributed dispersedly, the field environment of the installation position is severe, personnel are not easy to reach, the detection is time-consuming and labor-consuming, the requirement on the personnel is high, and the monitoring data management is troublesome;

(2) in order to reduce the operation risk of monitoring personnel, a sensor cable is often required to be laid in an operation convenient area during manual detection, so that the cable laying workload, the cost and the field cable protection are difficult problems which cannot be avoided;

(3) the existing method of the developed automatic acquisition system of the vibrating wire sensors can be called as centralized automatic monitoring, and is characterized in that all vibrating wire sensor signal cables are added to be long enough and then are led into a centralized wiring cabinet along a rock (wall) body and the ground; a vibrating wire signal acquisition host, an interface expansion unit, a communication unit, a power supply unit, a lightning protection unit and the like are arranged in the cabinet; according to the automatic scheme, the cable laying distance is long, the construction difficulty is high, the line protection is difficult, the system is fragile (caused by complete centralization), the automation cost is high, and a monitoring unit feels that the system is "afraid of using" (difficult to unfold), "not using" (the field line is often damaged by construction influence), and "using" is impossible "(the cost of cable laying maintenance is possibly more expensive than that of automatic equipment).

(4) Another disadvantage of the centralized automatic monitoring system is that the adaptability to the accessed vibrating wire sensors is not good for sensors of recommended manufacturers of compatible systems, but the compatibility to other non-recommended vibrating wire sensors is not good.

(5) The position of the vibrating wire sensor equipment cannot be sensed by the centralized automatic monitoring system, so that GIS management cannot be realized;

in the face of the problems, how to realize the automatic acquisition of the vibrating wire sensor through a scientific and technological means which is convenient, practical and high in cost performance and acquire real-time and accurate monitoring data is a problem to be solved.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, it is an object of the present application to provide an automatic pick-up device and system for a vibrating wire sensor to solve at least one problem of the prior art.

To achieve the above and other related objects, the present application provides an automatic pickup device for a vibrating wire sensor, and a system thereof, the pickup device including: the MCU control unit is connected with each unit and is used for acquiring signals and controlling and processing; the vibration wire sensor management unit is used for connecting multiple paths of standard or nonstandard vibration wire sensors and switching and selecting one or multiple paths of vibration wire sensors to acquire corresponding vibration wire type sensing parameter information; the adjusting unit is used for remotely adjusting to adapt to different kinds of vibrating wire sensors; a communication unit providing a plurality of wired and wireless communication modes; the system is used for being in communication connection with each vibrating wire sensor or the cloud platform; the communication bus is used for cascading other acquisition devices; the temperature measuring unit is used for detecting the temperature of each vibrating wire sensor; and the GNSS positioning unit is used for synchronously measuring each vibrating wire sensor and realizing GIS management.

In an embodiment of the present application, the vibrating wire sensor management unit includes: the vibrating wire sensor interfaces are used for being connected with the vibrating wire sensors in a one-to-one correspondence mode; the multi-path switching circuit is used for integrally connecting the vibrating wire sensor interfaces; and the driving circuit is used for driving the multi-path switching circuit according to the instruction of the MCU control unit so as to switch one or more connected vibrating wire sensors and obtain one or more pieces of vibrating wire type sensing parameter information selected by the multi-path switching circuit.

In an embodiment of the present application, the vibrating wire sensing parameters include: any one of displacement, pressure, water level, temperature, tension, axial force, and osmotic pressure.

In an embodiment of the present application, the adjusting unit includes: the vibrating wire exciting circuit is used for adjusting or controlling the excitation voltage of each vibrating wire sensor; and the vibrating wire signal processing circuit is used for adjusting or controlling the signal amplification gain of each vibrating wire sensor.

In an embodiment of the present application, the communication unit includes a wired communication mode and/or a wireless communication mode; the wired communication method includes: any one or more of USB1.0/2.0/3.x, MicroUSB, MiniUSB, RS-232-C bus, RS-485 bus, CAN bus, RS-422 bus, IEEE-488 and Microwire bus; the wireless communication method comprises the following steps: any one or a plurality of combinations of 2G/3G/4G/5G, Bluetooth, infrared, NB-IoT, Rola, Zigbee, MavLink, Lora, WIFI, NFC, GPRS, GSM and Ethernet

In an embodiment of the application, the acquisition device is in an area with good wireless communication signals, and can be directly connected with the cloud platform through a wireless communication mode of the communication unit; the acquisition device is connected to an upper acquisition device through a wire communication bus in an area with poor wireless communication signals; the plurality of acquisition devices can be cascaded through respective communication buses, so that when any acquisition device is in a good wireless communication signal area, all cascaded data can be sent to the cloud platform.

In an embodiment of the present application, the temperature measurement unit provides two temperature measurement modes, namely, thermal resistance temperature monitoring and temperature measurement by the temperature sensor, for the vibrating wire sensor.

In an embodiment of the present application, the collecting device further includes: the power supply management unit is used for supplying power to each unit; the power types include: comprises any one or a combination of a plurality of storage batteries, rechargeable batteries, dry batteries and solar energy.

To achieve the above and other related objects, there is provided an automatic pick-up system for a vibrating wire sensor, the system comprising: the vibrating wire sensor automatic acquisition devices are arranged at different monitoring points; the data transmission among the acquisition devices can be carried out in a cascade mode; the cloud platform is used for being in communication connection with each acquisition device and providing data receiving, database, data processing and WEB service for the acquisition devices; wherein, each collection system can direct communication connection cloud platform.

To sum up, the application discloses vibrating wire sensor automatic acquisition device and system, acquisition device includes: the MCU control unit is connected with each unit and is used for acquiring signals and controlling and processing; the vibration wire sensor management unit is used for connecting multiple paths of standard or nonstandard vibration wire sensors and switching and selecting one or multiple paths of vibration wire sensors to acquire corresponding vibration wire type sensing parameter information; the adjusting unit is used for remotely adjusting to adapt to different kinds of vibrating wire sensors; a communication unit providing a plurality of wired and wireless communication modes; the system is used for being in communication connection with each vibrating wire sensor or the cloud platform; the communication bus is used for cascading other acquisition devices; the temperature measuring unit is used for detecting the temperature of each vibrating wire sensor; and the GNSS positioning unit is used for synchronously measuring each vibrating wire sensor and realizing GIS management.

Has the following beneficial effects:

this application can realize concentrating and the automatic monitoring system of distributing type mixture through reasonable position installation, and the monitoring cable that has significantly reduced lays, when lowering system cost, has improved system reliability, maintainability, operating efficiency, can guarantee the operation safety.

Drawings

Fig. 1 is a schematic structural diagram of an automatic acquisition device of a vibrating wire sensor according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural diagram of an automatic acquisition system of a vibrating wire sensor according to an embodiment of the present disclosure.

Detailed Description

The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. The present application is capable of other and different embodiments and its several details are capable of modifications and/or changes in various respects, all without departing from the spirit of the present application. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.

It should be noted that the drawings provided in the following embodiments are only schematic and illustrate the basic idea of the present application, and although the drawings only show the components related to the present application and are not drawn according to the number, shape and size of the components in actual implementation, the type, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complex.

Throughout the specification, when a part is referred to as being "connected" to another part, this includes not only a case of being "directly connected" but also a case of being "indirectly connected" with another element interposed therebetween. In addition, when a certain part is referred to as "including" a certain component, unless otherwise stated, other components are not excluded, but it means that other components may be included.

The terms first, second, third, etc. are used herein to describe various elements, components, regions, layers and/or sections, but are not limited thereto. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the scope of the present application.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," and/or "comprising," when used in this specification, specify the presence of stated features, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, operations, elements, components, items, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions or operations are inherently mutually exclusive in some way.

In an operating system, compared with other modules, a file system is the most flexible part and can best cope with diversified device characteristics, the file system belongs to management of nonvolatile external memory data due to setting in the operating system, but the relationship with a process management module is very close, more conveniently, the specific file system is a detachable module, modification of the file system hardly has any influence on a kernel, market introduction is very easy to complete, the front-end device of the internet of things is more important, and due to the fact that the front-end device of the internet of things mainly adopts an embedded system, cutting and modification of the kernel of the operating system and dependence on a specific version enable the operating system to be very difficult to update.

The automatic acquisition device has the advantages that the automatic acquisition device is installed at a reasonable position, the centralized and distributed hybrid automatic monitoring system is realized, the laying of monitoring cables is greatly reduced, the system cost is reduced, the reliability and maintainability of the system are improved, and a new scheme is provided for effectively completing the real-time acquisition of the vibrating wire sensor.

Fig. 1 is a schematic structural diagram of an automatic pickup device of a vibrating wire sensor according to an embodiment of the present application. As shown, the acquisition device 100 includes:

and the MCU control unit 110 is connected with each unit and used for acquiring signals and controlling and processing. In short, all operations in this application are performed in the MCU control unit 110.

And the vibrating wire sensor management unit 120 is configured to connect multiple paths of standard or non-standard vibrating wire sensors, and perform switching selection on one or multiple paths of vibrating wire sensors to acquire corresponding vibrating wire type sensing parameter information.

In this embodiment, the vibrating wire sensor management unit 120 includes:

and the vibrating wire sensor interfaces 121 are used for being connected with the vibrating wire sensors in a one-to-one correspondence mode. For example, the present application may provide a 4-way reference vibrating wire sensor interface 121, which may include a vibrating wire sensing parameter signal and a temperature signal; or 8-way non-standard vibrating wire sensor interface 121, which may only contain vibrating wire sensing parameter signals.

A resonant sensor (vibrating wire transducer) is a resonant sensor with a strained metal wire as a sensing element. After the length of the string is determined, the variation of the natural vibration frequency can represent the magnitude of the tensile force applied to the string, and an electric signal in a certain relation with the tensile force can be obtained through a corresponding measuring circuit.

In the present embodiment, the sensing parameters that can be acquired by the vibrating wire sensor in the present application include, but are not limited to: displacement, pressure, water level, temperature, tension, axial force, osmotic pressure, etc.

And the multi-way switching circuit 122 is used for integrally connecting the vibrating wire sensor interfaces 121.

And the driving circuit 123 is configured to drive the multi-path switching circuit 122 according to an instruction of the MCU control unit 110, so as to switch one or more connected vibrating wire sensors, so as to obtain one or more pieces of vibrating wire sensing parameter information selected by the multi-path switching circuit 122.

The collected signals selected by the multi-path switching circuit 122 are input to the adjusting unit 130 for further adjustment.

And the adjusting unit 130 is used for remotely adjusting the voltage so as to adapt to different kinds of vibrating wire sensors.

In this embodiment, the adjusting unit 130 includes:

and a vibrating wire exciting circuit 131 for adjusting or controlling the excitation voltage of each vibrating wire sensor. For example, the adjustment of the excitation voltage can be remotely and programmably controlled, and the adjustment can correspond to different kinds of vibrating wire sensors.

And the vibrating wire signal processing circuit 132 is used for adjusting or controlling the signal amplification gain of each vibrating wire sensor. For example, the adjustment of the amplification gain of the remote programmable control signal corresponds to different kinds of vibrating wire sensors. For example, the signals obtained by the multi-path switching circuit are sequentially subjected to echo amplification, band-pass filtering, amplification and shaping, and square wave formation, wherein the amplification and shaping processes are adjusted by gain adjustment.

And the temperature measuring unit 160 is used for detecting the temperature of each vibrating wire sensor. In this embodiment, the temperature measuring unit 160 includes: the temperature monitoring circuit 161 and the IC temperature sensor detecting unit 162 are used for providing two temperature measuring modes, i.e. thermal resistance temperature monitoring and temperature sensor IC temperature measurement, for the vibrating wire sensor.

It should be noted that the collection device 100 of the present application is compatible with substantially all types of commercially available vibrating wire sensors based on the adjustment unit 130 and the temperature measurement unit 160.

A communication unit 140 providing various wired and wireless communication modes; the device is used for being in communication connection with each vibrating wire sensor or the cloud platform. Briefly, the automatic vibrating wire sensor acquisition device 100 can be used for wireless transmission and can also be designated as a master station or a slave station for wired transmission, so that various wireless communication modes are supported, each automatic vibrating wire sensor acquisition device 100 can be directly connected to a cloud platform, and a user computer or a mobile terminal can obtain the equipment state and the monitoring result of the acquisition device 100 through the cloud platform; in addition, a plurality of wired communication modes are supported.

In this embodiment, the communication unit 140 includes a wired communication method and/or a wireless communication method, i.e. wired and wireless network compatibility; the wired communication means includes but is not limited to: any one or more of USB1.0/2.0/3.x, MicroUSB, MiniUSB, RS-232-C bus, RS-485 bus, RS-422 bus, CAN bus, IEEE-488 bus and Microwire bus; the wireless communication means includes but is not limited to: any one or a plurality of combinations of 2G/3G/4G/5G, Bluetooth, infrared, NB-IoT, Rola, Zigbee, MavLink, Lora, WIFI, NFC, GPRS, GSM and Ethernet.

And the communication bus 150 is used for cascading other acquisition devices 100.

In this embodiment, the acquisition device 100 may be directly connected to the cloud platform in an area with good wireless communication signals through the wireless communication mode of the communication unit 140; the acquisition device 100 is connected to the upper acquisition device 100 through a wire communication bus 150 in an area with poor wireless communication signals; the plurality of acquisition devices 100 may be cascaded through respective communication buses 150, so that when any one of the acquisition devices 100 is in a good wireless communication signal area, all the cascaded data is sent to the cloud platform. As shown with reference to fig. 2.

In short, when there is a vibrating wire sensor automatic acquisition device 100 in a bad wireless signal position, it can be cascaded to the vibrating wire sensor acquisition device 100 in a good wireless signal area.

For example, the communication bus 150 cable is used in the method, not only can cascade communication be completed, but also the power supply of the upper computer to the cascaded automatic acquisition device 100 can be completed, the wiring amount of the system is greatly reduced, and the difficult problems that a plurality of installation positions have no alternating current and cannot use solar energy are solved.

It should be noted that, based on the communication unit 140 and the communication bus 150, the acquisition apparatus 100 according to the present application can basically implement integration of centralized acquisition and distributed acquisition.

And the GNSS positioning unit 170 is used for synchronously measuring each vibrating wire sensor, supporting GNSS positioning and realizing GIS management.

For example, synchronous measurement of all vibrating wire sensors can be completed through satellite time service in a good satellite signal area; and realize the GIS management of the vibrating wire sensor acquisition device 100.

In this embodiment, the collecting device 100 further includes: a power management unit 180 for supplying power to each unit; the power types include: comprises any one or a combination of a plurality of storage batteries, rechargeable batteries, dry batteries and solar energy.

For example, the power management unit 180 may also provide low power management, and operating status management.

Fig. 2 is a schematic structural diagram of an automatic acquisition system of a vibrating wire sensor according to an embodiment of the present application. As shown, the system comprises:

a plurality of vibrating wire sensor automatic acquisition devices 100 as shown in FIG. 1 installed at different monitoring points; wherein, data transmission can be carried out among the acquisition devices 100 in a cascade mode;

the cloud platform 200 is used for being in communication connection with each acquisition device 100 and providing data receiving, database, data processing and WEB service for the acquisition devices; wherein, each acquisition device 100 can be directly connected to the cloud platform 200 in a communication manner.

Preferably, a user computer or a mobile terminal can obtain the device state and the monitoring result of the acquisition device 100 through the cloud platform 200; the mobile terminal can be a user computer or a mobile phone or a tablet personal computer, so that operation and maintenance personnel can realize early warning through the portable data monitoring terminal, and timely and effective monitoring information is provided for operating personnel, management personnel, owners and the like.

To sum up, this application a vibrating wire sensor automatic acquisition device and system, acquisition device includes: the MCU control unit is connected with each unit and is used for acquiring signals and controlling and processing; the vibration wire sensor management unit is used for connecting multiple paths of standard or nonstandard vibration wire sensors and switching and selecting one or multiple paths of vibration wire sensors to acquire corresponding vibration wire type sensing parameter information; the adjusting unit is used for remotely adjusting to adapt to different kinds of vibrating wire sensors; a communication unit providing a plurality of wired and wireless communication modes; the system is used for being in communication connection with each vibrating wire sensor or the cloud platform; the communication bus is used for cascading other acquisition devices; the temperature measuring unit is used for detecting the temperature of each vibrating wire sensor; and the GNSS positioning unit is used for synchronously measuring each vibrating wire sensor and realizing GIS management.

This application can realize concentrating and the automatic monitoring system of distributing type mixture through reasonable position installation, and the monitoring cable that has significantly reduced lays, when lowering system cost, has improved system reliability, maintainability, operating efficiency, can guarantee the operation safety.

The application effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

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