阅读说明：本技术 面包板及测试设备 (Bread board and test equipment ) 是由 张升义 肖永军 叶莎莎 陈敏 曾庆栋 何武光 于 2021-07-02 设计创作，主要内容包括：本发明公开了一种面包板及测试设备,涉及电子技术领域。本发明通过设置底板、顶板及触点阵列构成面包板；其中,底板设置有多条第一导通线；顶板设置有多条第二导通线；触点阵列,设置于底板与顶板之间,触点阵列中各触点的第一连接端与第一导通线连接、触点的第二连接端与第二导通线连接、触点的第三连接端与测试元件连接。在本发明中,测试元件插接在触点上,各测试元件之间可经触点及导通线连接,从而减少额外走线,线路简洁,便于测试人员进行调整。(The invention discloses a bread board and test equipment, and relates to the technical field of electronics. The bread board is formed by arranging the bottom board, the top board and the contact array; the bottom plate is provided with a plurality of first conducting wires; the top plate is provided with a plurality of second communication lines; and the contact array is arranged between the bottom plate and the top plate, a first connecting end of each contact in the contact array is connected with the first conduction line, a second connecting end of each contact is connected with the second conduction line, and a third connecting end of each contact is connected with the test element. In the invention, the test elements are inserted on the contacts, and the test elements can be connected through the contacts and the conducting wires, thereby reducing extra wiring, having simple circuits and being convenient for a tester to adjust.)

1. A bread board characterized in that the bread board comprises:

the bottom plate is provided with a plurality of first conducting wires;

the top plate is provided with a plurality of second communication lines;

the contact array is arranged between the bottom plate and the top plate, a first connecting end of each contact in the contact array is connected with the first conduction line, a second connecting end of each contact is connected with the second conduction line, and a third connecting end of each contact is connected with a test element.

2. The bread board as claimed in claim 1, wherein the plurality of first conductive lines are arranged in parallel in a first direction on the bottom plate.

3. The bread board as claimed in claim 2, wherein the plurality of second through-lines are arranged in parallel in the second direction on the top board.

4. The bread board as claimed in claim 3, wherein the first direction and the second direction are perpendicular to each other.

5. The bread board as claimed in any of claims 1 to 4, wherein the contact includes a first switch, a second switch and a conducting member;

the first connection end of the conduction piece is connected with the first end of the first switch, the second connection end of the conduction piece is connected with the first end of the second switch, the third connection end of the conduction piece is connected with the test element, the second end of the first switch is connected with the first conduction line, and the second end of the second switch is connected with the second conduction line.

6. The bread board as claimed in claim 5, wherein the bread board further comprises a control circuit, and the third terminal of the first switch and the third terminal of the second switch are connected to the output terminal of the control circuit;

the control circuit is used for outputting a control signal to the first switch and/or the second switch so as to control the on-off of the first switch and/or the second switch.

7. The bread board as claimed in claim 6, wherein said first switch is a MOS tube electronic switch, a control terminal of said MOS tube electronic switch is connected to an output terminal of said control circuit, a first connection terminal of said MOS tube electronic switch is connected to a first conduction line on said bottom plate, and a second connection terminal of said MOS tube electronic switch is connected to a second conduction line on said top plate.

8. The bread board as claimed in claim 6, wherein the control circuit comprises a microcontroller and a plurality of shift buffers, the microcontroller being connected to each shift buffer, respectively, the shift buffers being connected to the first switch and/or the second switch;

and the displacement buffer is used for converting the control signal sent by the microcontroller into a driving signal and controlling the on-off of the first switch and/or the second switch according to the driving signal.

9. The bread board of claim 8, wherein the control circuit further comprises a communication circuit, the communication circuit being connected to the microcontroller;

and the microcontroller is used for generating a control signal according to the control information sent by the communication circuit.

10. A test device, characterized in that it comprises a bread board according to any of claims 1-9.

Technical Field

The invention relates to the technical field of electronics, in particular to a bread board and test equipment.

Background

In the early stage of design of electronic products, the function of a designed circuit is often required to be tested, which is irreplaceable by software simulation. At present, the testing method mainly comprises the following steps: and (3) carrying out component plugging by using the bread board, carrying out wiring connection after the components are plugged, and then carrying out testing. However, in this way, there are often many wires, and when a circuit is faulty, it is difficult to find out the problem from the disordered and complicated external connection, and the adjustment of the wires is difficult. Therefore, how to conveniently test the circuit is an urgent technical problem to be solved.

The above is only for the purpose of assisting understanding of the technical aspects of the present invention, and does not represent an admission that the above is prior art.

Disclosure of Invention

The invention mainly aims to provide a bread board and test equipment, and aims to solve the technical problems that in the prior art, the bread board has more wiring and is difficult to adjust.

In order to achieve the above object, the present invention provides a bread board, including:

the bottom plate is provided with a plurality of first conducting wires;

the top plate is provided with a plurality of second communication lines;

and the contact array is arranged between the bottom plate and the top plate, a first connecting end of each contact in the contact array is connected with the first conduction line, a second connecting end of each contact is connected with the second conduction line, and a third connecting end of each contact is connected with the test element.

Optionally, the plurality of first via lines are arranged in parallel on the base plate along the first direction.

Optionally, the plurality of second via lines are arranged in parallel on the top plate along the second direction.

Optionally, the first direction and the second direction are perpendicular to each other.

Optionally, the contact includes a first switch, a second switch and a conducting piece;

the first connecting end of the conducting piece is connected with the first end of the first switch, the second connecting end of the conducting piece is connected with the first end of the second switch, the third connecting end of the conducting piece is connected with the test element, the second end of the first switch is connected with the first conducting wire, and the second end of the second switch is connected with the second conducting wire.

Optionally, the bread board further comprises a control circuit, and the third end of the first switch and the third end of the second switch are both connected with the output end of the control circuit;

and the control circuit is used for outputting a control signal to the first switch and/or the second switch so as to control the on-off of the first switch and/or the second switch.

Optionally, the first switch is an MOS transistor electronic switch, a control end of the MOS transistor electronic switch is connected to an output end of the control circuit, a first connection end of the MOS transistor electronic switch is connected to the first connection line on the bottom plate, and a second connection end of the MOS transistor electronic switch is connected to the second connection line on the top plate.

Optionally, the control circuit includes a microcontroller and a plurality of displacement buffers, the microcontroller is connected to each displacement buffer, and the displacement buffers are connected to the first switch and/or the second switch;

and the displacement buffer is used for converting the control signal sent by the microcontroller into a driving signal and controlling the on-off of the first switch and/or the second switch according to the driving signal.

Optionally, the control circuit further includes a communication circuit, and the communication circuit is connected to the microcontroller;

and the microcontroller is used for generating a control signal according to the control information sent by the communication circuit.

In order to achieve the above object, the present invention further provides a test apparatus, which includes the bread board as described above.

The bread board is formed by arranging the bottom board, the top board and the contact array; the bottom plate is provided with a plurality of first conducting wires; the top plate is provided with a plurality of second communication lines; and the contact array is arranged between the bottom plate and the top plate, a first connecting end of each contact in the contact array is connected with the first conduction line, a second connecting end of each contact is connected with the second conduction line, and a third connecting end of each contact is connected with the test element. In the invention, the test elements are inserted on the contacts, and the test elements can be connected through the contacts and the conducting wires, thereby reducing extra wiring, having simple circuits and being convenient for a tester to adjust.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a front view of a first embodiment of a bread board in accordance with the present invention;

FIG. 2 is a bottom view of a first embodiment of the bread board of the present invention;

FIG. 3 is a top view of a first embodiment of the bread board in accordance with the present invention;

FIG. 4 is a front view of a second embodiment of the bread board in accordance with the present invention;

fig. 5 is a functional diagram of a bread board control circuit according to an embodiment of the invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	Base plate	70	Second switch
20	Top board	80	Conducting part
				30	Contact array	90	Micro-controller
40	First conduction line	100	Displacement buffer
				50	Second conductive line	110	Communication circuit
60	First switch

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should be considered to be absent and not within the protection scope of the present invention.

Referring to fig. 1, 2 and 3, fig. 1 is a front view of a first embodiment of a bread board according to the present invention;

fig. 2 is a bottom view of a first embodiment of the bread board according to the present invention, and fig. 3 is a top view of the first embodiment of the bread board according to the present invention. The present invention proposes a first embodiment of a bread board.

In the first embodiment, the bread board includes a base plate 10 provided with a plurality of first conductive lines 40; a top plate 20 provided with a plurality of second via lines 50; the contact array 30 is disposed between the bottom plate 10 and the top plate 20, a first connection end of each contact in the contact array 30 is connected to the first via 40, a second connection end of the contact is connected to the second via 50, and a third connection end of the contact is connected to the test element.

The first and second conductive lines 40 and 50 are made of a conductive material, so that the connection points formed by the contacts on the respective conductive lines are communicated with each other. The number of the conducting lines on the bottom plate 10 and the top plate 20 may be set as required, for example, four or five, which is not limited in this embodiment.

Each contact in the contact array 30 is also made of a conductive material, and each contact is provided with a portion, such as a jack or the like, for connecting a pin of a test element; the test element comprises components such as a resistor, a capacitor and the like.

After a test element is connected to a contact, the test element can communicate with the first and second conductive lines 40 and 50 corresponding to the contact through the contact, and thus communicate with the test element connected to the other contact on the first or second conductive line 40 or 50. According to different arrangement relations of the pins of the test elements on the conducting wires, the two test elements can form a parallel or series relation, therefore, the routing between the test elements can be reduced, and the test circuit is simplified.

In order to make the circuit layout of the test circuit more flexible, the directions of the conducting lines on the bottom plate 10 and the top plate 20 may be different, for example, the bottom plate 10 may be provided with conducting lines parallel to one side, may be provided with conducting lines perpendicular to the side, and may be provided with conducting lines intersecting the side.

Of course, in order to make the circuit more concise, the directions of the conducting wires on the bottom plate 10 and the top plate 20 may be the same; that is, the first via lines 40 are disposed in parallel on the base plate 10 along the first direction; the second via lines 50 are arranged in parallel in the second direction on the top plate 20. The first direction and the second direction can be set according to user requirements.

In addition, in order to facilitate the arrangement of the contact array, the contacts are uniformly distributed and convenient to operate, and the first direction is perpendicular to the second direction. In a specific implementation, for each conductive line to facilitate printing, each first conductive line 40 on the bottom plate 10 is distributed in a longitudinal direction as shown in fig. 2, and each second conductive line 50 on the top plate 20 is distributed in a transverse direction as shown in fig. 3.

The first embodiment constitutes a bread board by providing a bottom plate 10, a top plate 20, and a contact array 30; wherein, the bottom plate 10 is provided with a plurality of first conducting wires 40; a top plate 20 provided with a plurality of second via lines 50; the contact array 30 is disposed between the bottom plate 10 and the top plate 20, a first connection end of each contact in the contact array 30 is connected to the first via 40, a second connection end of the contact is connected to the second via 50, and a third connection end of the contact is connected to the test element. In this embodiment, the test elements are inserted into the contacts, and the test elements can be connected via the contacts and the conducting wires, so that additional wiring is reduced, the circuit is simple, and the adjustment by a tester is facilitated.

Referring again to fig. 2, 3 and 4, fig. 4 is a front view of a second embodiment of the bread board according to the present invention. Based on the first embodiment described above, the present invention proposes a second embodiment of a bread board.

In the second embodiment, the contact includes a first switch 60, a second switch 70, and a conducting member 80. The first connection end of the conduction member 80 is connected to the first end of the first switch 60, the second connection end of the conduction member 80 is connected to the first end of the second switch 70, the third connection end of the conduction member 80 is connected to the test element, the second end of the first switch 60 is connected to the first conduction 40 line, and the second end of the second switch 70 is connected to the second conduction line 50.

In order to improve convenience of the bread board in adjusting the circuit lines, the contacts include a first switch 60, a second switch 70, and a conducting member 80 in the present embodiment. The conducting part 80 is made of a conductor material, and the conducting part 80 is provided with a jack which can be used for connecting a pin of a test element.

The test element is connected by inserting the pin into the socket of the pass-through 80, and when the first switch 60 is closed, the test element communicates with the first pass-through 40; when the second switch 70 is closed, the test element is in communication with the second conductive line 50. When a tester modulates a circuit route, the tester can adjust the connection relationship between the test elements by controlling the closed states of the first switch 60 and the second switch 70, so that the adjustment of the test elements is reduced.

In a specific implementation, the first switch 60 or the second switch 70 may be an electric control switch or a manual control switch, and after a tester inserts a test element into each conducting member 80, the tester controls the first switch 60 or the second switch 70 to be turned on or off, so as to adjust the circuit line to a required line, and the specific configuration of the first switch 60 or the second switch 70 may be set as required, which is not limited in this embodiment.

In order to clearly explain the control of the first switch 60 or the second switch 70, the first switch 60 or the second switch 70 is exemplified as an electrically controlled switch in the present embodiment.

In this embodiment, the bread board further includes a control circuit, and the third terminal of the first switch 60 and the third terminal of the second switch 70 are both connected to the output terminal of the control circuit. And the control circuit is used for outputting a control signal to the first switch 60 and/or the second switch 70 so as to control the on-off of the first switch 60 and/or the second switch 70.

In a specific implementation, a processor may be provided in the control circuit, and the processor outputs control information to the first switch 60 or the second switch 70 through a preset control program, where the control signal may be a low level signal or a high level signal. The first switch 60 or the second switch 70 may be closed when a low level signal is received or may be closed when a high level signal is received.

For convenience of control, the first switch 60 is a MOS transistor electronic switch, a control end of the MOS transistor electronic switch is connected to an output end of the control circuit, a first connection end of the MOS transistor electronic switch is connected to the first connection line on the bottom plate, and a second connection end of the MOS transistor electronic switch is connected to the second connection line on the top plate.

Similarly, the second switch 70 may be a MOS transistor electronic switch. The MOS transistor electronic switch is an integrated device, which can realize physical connection between the conducting device 80 and each conducting line, and the logic control level of the closing and conducting of the MOS transistor electronic switch is related to the specific model thereof, which is not limited in this embodiment.

Referring to fig. 5, fig. 5 is a functional diagram of a bread board control circuit according to an embodiment of the present invention.

As shown in fig. 5, the control circuit includes a microcontroller 90 and a plurality of shift buffers 100, the microcontroller 90 is connected to each shift buffer 100, and the shift buffers 100 are connected to the first switch 60 and/or the second switch 70. And the displacement buffer 100 is used for converting the control signal sent by the microcontroller 90 into a driving signal and controlling the on/off of the first switch 60 and/or the second switch 70 according to the driving signal.

It should be noted that the control signal and the driving signal may be current signals, and the output current of the microcontroller 90 is low, which is difficult to reach the control current of the first switch 60 or the second switch 70, so that the control current may be amplified by the displacement buffer 100 to obtain the driving current meeting the requirement.

In addition, when the number of the first switches 60 and the second switches 70 is large, the number of the control pins of the single microcontroller 90 is insufficient, and the control pins need to be extended by the shift buffer 100, so that all the first switches 60 and the second switches 70 are controlled. The microcontroller 90 inputs the bit data to be input to the data input of the shift register 100; the shift buffer 100 concatenates the data; and then parallel data output, namely data output in parallel, is realized according to the control sequence.

In order to facilitate the adjustment of the control program, the control circuit further comprises a communication circuit 110, the communication circuit 110 being connected to the microcontroller 90; and a microcontroller 90 for generating a control signal according to the control information transmitted by the communication circuit 110.

It should be noted that the Communication circuit 110 may employ a conventional Communication Interface, such as a Serial Communication Interface (SCI), a Serial Peripheral Interface (SPI), or others. The communication circuit 110 may receive control information from an external device and forward the control information to the microcontroller 90, and the microcontroller 90 may generate corresponding control information by compiling the control information.

In specific implementation, the first switch 60 or the second switch 70 may be numbered in advance, such as 01, 02 or 03; meanwhile, the control state is well programmed, for example, the closing state is 00, and the opening state is 01. The external device generates information of the protection switch number and the state number according to the requirement, and transmits the generated signals to the microcontroller 90, so that the microcontroller 90 determines the control strategy of each switch.

In the second embodiment, the contact includes the first switch 60, the second switch 70 and the conducting member 80, each switch is driven by the control circuit, and when a tester adjusts the circuit line, the tester can modify the circuit line by changing the state of the switch, so that the adjustment of the test element is reduced, and the test is more convenient.

In order to achieve the above object, the present invention further provides a test apparatus, which includes the bread board as described above. Since the bread board adopts all the technical schemes of all the embodiments, at least all the beneficial effects brought by the technical schemes of the embodiments are achieved, and no further description is given here.

Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention or portions thereof that contribute to the prior art may be embodied in the form of a software product, where the computer software product is stored in a storage medium (e.g., a Read Only Memory (ROM)/Random Access Memory (RAM), a magnetic disk, an optical disk), and includes several instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.