阅读说明：本技术 一种半导体芯片的快速分选编带机装置 (Quick sorting braider device for semiconductor chips ) 是由 陈娇凤 陈有鸿 于 2021-08-17 设计创作，主要内容包括：本发明涉及编带机技术领域,尤其涉及一种半导体芯片的快速分选编带机装置,旋转组件设有用于旋转送料的旋转圆盘；旋转圆盘上间隔设置有多个透明的放料台；测试组件设置于旋转圆盘的上方和下方与放料台正对的位置；编带组件的进料端与分料组件相接；还包括取料组件,取料组件包括用于进料组件与旋转圆盘之间取料的第一取料组件和用于分料组件与旋转圆盘之间取料的第二取料组件；通过设置芯片放置的放料台取代现有的吸附转台的方式,保证芯片稳定且快速的转移测试,不会发生掉落的问题；同时放料台设置为透明的放料台,在其上下方设置测试相机,无需对芯片进行翻转换向即可实现双向测试,有效的减少检测的工序,提升检测效率,方便实用。(The invention relates to the technical field of braiders, in particular to a quick sorting braider device for semiconductor chips, wherein a rotating assembly is provided with a rotating disc for rotating and feeding materials; a plurality of transparent material placing tables are arranged on the rotating disc at intervals; the test components are arranged above and below the rotating disc and opposite to the material placing table; the feed end of the braid component is connected with the material distribution component; the material taking assembly comprises a first material taking assembly used for taking materials between the feeding assembly and the rotary disc and a second material taking assembly used for taking materials between the material distributing assembly and the rotary disc; the chip is stably and quickly transferred and tested in a mode of replacing the conventional adsorption rotary table by the discharging table for placing the chip, and the problem of falling is avoided; simultaneously the blowing platform sets up to transparent blowing platform, sets up the test camera in its upper and lower side, need not to overturn the switching-over to the chip and can realize two-way test, and the effectual process that reduces the detection promotes detection efficiency, convenient and practical.)

1. The quick sorting braider device for the semiconductor chips is characterized by comprising a rotating assembly, a feeding assembly, a distributing assembly, a testing assembly, a control assembly and a braiding assembly for braiding and packaging qualified semiconductor chips, wherein the rotating assembly is provided with a rotating disc for rotating and feeding; a plurality of transparent material placing tables are arranged on the rotating disc at intervals; the test assemblies are arranged above and below the rotating disc and opposite to the material placing table; the material distribution assembly and the feeding assembly are respectively oppositely arranged on two sides of the rotary disc, and the feeding end of the braid assembly is connected with the material distribution assembly; the material taking assembly comprises a first material taking assembly and a second material taking assembly, wherein the first material taking assembly is used for taking materials between the feeding assembly and the rotating disc, and the second material taking assembly is used for taking materials between the distributing assembly and the rotating disc; the rotating assembly, the feeding assembly, the distributing assembly, the testing assembly, the braiding assembly and the taking assembly are electrically connected with the control assembly.

2. The device of claim 1, wherein the discharge table is an arc discharge table with high periphery and low middle, and a test slot adapted to the semiconductor chip is recessed inward at the middle bottom of the arc discharge table.

3. The quick sorting braider device for semiconductor chips according to claim 2, characterized in that the rotating assembly comprises a vibrating motor, an output end of the vibrating motor is connected with the rotating disk, and vibration generated by the vibrating motor is transmitted into the arc-shaped discharge disk through the rotating disk, so that chips in the arc-shaped discharge disk are adapted to fall into the test slot through vibration.

4. The device as claimed in claim 1, wherein the testing assembly includes a first testing camera and a second testing camera, the first testing camera is disposed above the rotating disc and opposite to the stopping position of the discharging table, the second testing camera is disposed below the rotating disc and opposite to the stopping position of the discharging table, and lenses of the first testing camera and the second testing camera face the discharging table.

5. The device as claimed in claim 4, wherein the testing assembly further comprises a mounting plate and a testing plate, the mounting plate is fixed above the rotary disk through a support rod, the testing plate is slidably connected to the support rod, the mounting plate is provided with a lifting motor, an output end of the lifting motor is connected to the testing plate, and the first testing camera is mounted on the testing plate.

6. The device of claim 1, wherein the feeding assembly is provided with a static elimination assembly near the feeding end of the rotating disc, the static elimination assembly comprises a first ion fan and an air-extracting and dust-removing mechanism, an air outlet of the first ion fan faces the chip, and an air-extracting opening of the air-extracting and dust-removing mechanism faces the air duct direction of the first ion fan.

7. The device of claim 1, wherein the rotary disc is located between the feeding assembly and the separating assembly, one end of the rotary disc, which is far away from the testing assembly, is provided with a second ion blower, and an air outlet of the second ion blower is arranged above the rotary disc and at a position opposite to the stopping position of the discharging table.

8. The device of claim 1, wherein the separating assembly comprises an accommodating groove for collecting unqualified chips and a feeding guide rail for conveying qualified chips, the control assembly receives test information from the test assembly to form a corresponding control signal and transmits the control signal to the second material taking assembly, and the second material taking assembly sends the corresponding chips to the accommodating groove or the feeding guide rail according to the control information.

9. The device as claimed in claim 8, wherein the taping assembly includes a first feeding wheel, a second feeding wheel, a receiving wheel and a material track, the material track is connected to the feeding guide rail, and the tapes of the first feeding wheel and the second feeding wheel are combined on the material track to package the chips and are transported to the receiving wheel for storage.

10. The device of claim 1, further comprising a display screen for displaying the test identification result, wherein the control module converts the test information of the test module into a display signal and sends the display signal to the display screen for displaying.

Technical Field

The invention relates to the technical field of braiders, in particular to a quick sorting braider device for semiconductor chips.

Background

The braider can be divided into a semi-automatic type and a full-automatic type, and bulk component products are put into a carrier tape after passing through stations such as detection, reversing, testing and the like; along with the continuous upgrading, thinning and high integration of electronic products, the electronic elements are also converted from the past plug-in type into the patch type to save the installation space of a circuit board and expand the functions of the products; is a large revolution in the electronic industry; the working principle of the braider is as follows: after the electric and pneumatic connection of the braid packaging machine is completed, if the braid packaging machine is used for hot packaging, the cutter is raised to a proper temperature, and the carrier band and the air pressure of an air source are adjusted; the SMD components are placed into the carrier tape by manual or automatic feeding equipment, the motor rotates to pull the carrier tape forming carrier tape to a packaging position, the position is covered with the tape at the upper part, the carrier tape is under the lower part, and two blades heated press the cover tape and the carrier tape, so that the SMD component port on the carrier tape is sealed by the cover tape, and the purpose of packaging the SMD components is achieved; the take-up reel then takes up the encapsulated carrier tape.

In the prior art, the braider can provide functions of unifying directions, testing product polarity, appearance inspection, laser marking and the like according to the production requirements of customers; the disc that has a plurality of sucking discs is usually set up to current braider, adsorb semiconductor chip and detect one by one in a plurality of stations and the step, steps such as switching-over and test, this kind of mode is though can reach the purpose that the test was selected separately, but the process of test is comparatively complicated and absorbent mode has the not enough problem of stability, need detect the chip before the beginning test and can detect after the switching-over, and the absorption of sucking disc is a lot of and place and appear not adsorb firmly or adsorb unstable problem in middle step easily, seriously influence efficiency of software testing, the urgent need a new braider in order to solve defect and not enough among the prior art.

Disclosure of Invention

Aiming at the defects in the prior art, the invention provides the rapid sorting braider device for the semiconductor chips, which ensures the stable and rapid transfer test of the chips and avoids the problem of falling off by arranging the discharge table for placing the chips to replace the conventional adsorption rotary table; simultaneously the blowing platform sets up to transparent blowing platform, sets up the test camera in its upper and lower side, need not to overturn the switching-over to the chip and can realize two-way test, and the effectual process that reduces the detection promotes detection efficiency, convenient and practical.

In order to achieve the purpose, the invention provides a rapid sorting braider device for semiconductor chips, which comprises a rotating assembly, a feeding assembly, a distributing assembly, a testing assembly, a control assembly and a braiding assembly for braiding and packaging qualified semiconductor chips, wherein the rotating assembly is provided with a rotating disc for rotationally feeding; a plurality of transparent material placing tables are arranged on the rotating disc at intervals; the test assemblies are arranged above and below the rotating disc and opposite to the material placing table; the material distribution assembly and the feeding assembly are respectively oppositely arranged on two sides of the rotary disc, and the feeding end of the braid assembly is connected with the material distribution assembly; the material taking assembly comprises a first material taking assembly and a second material taking assembly, wherein the first material taking assembly is used for taking materials between the feeding assembly and the rotating disc, and the second material taking assembly is used for taking materials between the distributing assembly and the rotating disc; the rotating assembly, the feeding assembly, the distributing assembly, the testing assembly, the braiding assembly and the taking assembly are electrically connected with the control assembly.

Specifically, the method comprises the following steps: the discharging table is an arc-shaped discharging table with the periphery high and the middle low, and a test groove matched with the semiconductor chip in shape is inwards recessed in the middle bottom of the arc-shaped discharging table.

Preferably, the method comprises the following steps: the rotating assembly comprises a vibrating motor, the output end of the vibrating motor is connected with the rotating disc, and vibration generated by the vibrating motor is conducted to the arc-shaped discharging disc through the rotating disc, so that chips located in the arc-shaped discharging disc are made to fall into the test slots through vibration adaptation.

Specifically, the method comprises the following steps: the testing component comprises a first testing camera and a second testing camera, the first testing camera is arranged above the rotating disc and at a position right opposite to the stopping position of the discharging table, the second testing camera is arranged below the rotating disc and at a position right opposite to the stopping position of the discharging table, and lenses of the first testing camera and the second testing camera face towards the discharging table.

Preferably, the method comprises the following steps: the test assembly further comprises a mounting plate and a test plate, the mounting plate is fixed above the rotary disc through a support rod, the test plate is connected with the support rod in a sliding mode, the mounting plate is provided with a lifting motor, the output end of the lifting motor is connected with the test plate, and a first test camera is installed on the test plate.

Specifically, the method comprises the following steps: the feeding assembly is close to the feeding end of the rotating disc and is provided with a static electricity removing assembly, the static electricity removing assembly comprises a first ion fan and an air pumping and dust removing mechanism, an air outlet of the first ion fan faces the chip, and an air pumping opening of the air pumping and dust removing mechanism faces the air channel direction of the first ion fan.

Preferably, the method comprises the following steps: the rotary disc is positioned between the feeding assembly and the material distributing assembly, one end of the rotary disc, which is far away from the testing assembly, is provided with a second ion fan, and an air outlet of the second ion fan is arranged above the rotary disc and at a position right opposite to the stopping position of the discharging table.

Preferably, the method comprises the following steps: the material distribution assembly comprises a storage groove for collecting unqualified chips and a feeding guide rail for conveying qualified chips, the control assembly receives test information from the test assembly to form corresponding control signals and transmits the control signals to the second material taking assembly, and the second material taking assembly sends the corresponding chips to the storage groove or the feeding guide rail according to the control information.

Preferably, the method comprises the following steps: the braid subassembly includes first feeding wheel, second feeding wheel, receipts material wheel and material track, the material track with the pay-off guide rail meets, the material area of first feeding wheel with the second feeding wheel is in the material track merges packing chip and carries to receive the material wheel and accomodate.

Specifically, the method comprises the following steps: the test device is characterized by further comprising a display screen for displaying test identification results, and the control assembly converts the test information of the test assembly into display signals and sends the display signals to the display screen for displaying.

The invention has the beneficial effects that: compared with the prior art, the rapid sorting braider device for the semiconductor chips comprises a rotating assembly, a feeding assembly, a distributing assembly, a testing assembly, a control assembly and a braiding assembly for packaging qualified semiconductor chips in a braiding mode, wherein the rotating assembly is provided with a rotating disc for rotating and feeding; a plurality of transparent material placing tables are arranged on the rotating disc at intervals; the test components are arranged above and below the rotating disc and opposite to the material placing table; the material distributing assembly and the material feeding assembly are respectively oppositely arranged on two sides of the rotary disc, and the material feeding end of the braid assembly is connected with the material distributing assembly; the material taking assembly comprises a first material taking assembly used for taking materials between the feeding assembly and the rotary disc and a second material taking assembly used for taking materials between the material distributing assembly and the rotary disc; the rotating assembly, the feeding assembly, the distributing assembly, the testing assembly, the braiding assembly and the taking assembly are electrically connected with the control assembly; the chip is stably and quickly transferred and tested in a mode of replacing the conventional adsorption rotary table by the discharging table for placing the chip, and the problem of falling is avoided; simultaneously the blowing platform sets up to transparent blowing platform, sets up the test camera in its upper and lower side, need not to overturn the switching-over to the chip and can realize two-way test, and the effectual process that reduces the detection promotes detection efficiency, convenient and practical.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a top view of the present invention;

FIG. 3 is a front view of the present invention;

FIG. 4 is a schematic view of the discharge table of the present invention.

The main element symbols are as follows:

1. a feed assembly; 11. an air-extracting and dust-removing mechanism; 12. a first ion blower; 2. a material distributing component; 21. a receiving groove; 22. a feeding guide rail; 3. testing the component; 31. a first test camera; 32. a second test camera; 33. mounting a plate; 34. a test board; 35. a lifting motor; 4. a display screen; 5. a rotating assembly; 51. a discharge table; 511. a test slot; 52. rotating the disc; 53. a vibration motor; 6. a braid assembly; 61. a first feed wheel; 62. a material receiving wheel; 63. a second feed wheel; 64. a material track; 7. a material taking assembly; 71. a first take-off assembly; 72. a second take-off assembly; 8. and a second ion blower.

Detailed Description

In order to more clearly describe the present invention, the present invention will be further described with reference to the accompanying drawings.

The comparatively complicated and absorbent mode of process of braider test has the problem that stability is not enough among the prior art, need detect the chip before the beginning test and can detect after the switching-over, and the absorption of sucking disc and placing appear not adsorbing in the middle step easily many times and live or adsorb unstable problem, seriously influence efficiency of software testing, so need a new braider in order to solve defect and not enough among the prior art urgently.

To solve the defects and shortcomings in the prior art, the present invention specifically provides a semiconductor chip rapid sorting braider device, which refers to fig. 1-4, and includes: the semiconductor chip taping machine comprises a rotating assembly 5, a feeding assembly 1, a distributing assembly 2, a testing assembly, a control assembly and a taping assembly 6 for taping and packaging qualified semiconductor chips, wherein the rotating assembly 5 is provided with a rotating disc 52 for rotating and feeding; a plurality of transparent material placing tables 51 are arranged on the rotating disc 52 at intervals; the testing assemblies 3 are arranged above and below the rotating disc 52 and are opposite to the material discharging table 51; the material distributing component 2 and the feeding component 1 are respectively and oppositely arranged on two sides of the rotating disc 52, and the feeding end of the braid component 6 is connected with the material distributing component 2; the material taking assembly 7 comprises a first material taking assembly 71 used for taking materials between the feeding assembly 1 and the rotary disc 52 and a second material taking assembly 72 used for taking materials between the distributing assembly 2 and the rotary disc 52; the rotating assembly 5, the feeding assembly 1, the distributing assembly 2, the testing assembly, the braiding assembly 6 and the taking assembly 7 are electrically connected with the control assembly; the rotating disc 52 is connected to a rotating motor, the rotating motor drives the rotating disc 52 to rotate, the rotating motor is connected to the control assembly, and the rotation and pause are controlled by the control assembly to be cooperated with the grabbing actions of the first material taking assembly 71 and the second material taking assembly 72; transparent blowing platform 51 is used for accepting the chip that waits to detect from feeding subassembly 1, the chip transports to first getting material subassembly 71 through the guide rail of feeding subassembly 1 when, first getting material subassembly 71 adsorbs and transports the chip to blowing platform 51 in, blowing platform 51 keeps in and consigns the chip, rotatory position to the test assembly along with the rotating disc, the test assembly sets up respectively in blowing platform 51 just right top and below, main aim at can follow the top simultaneously through transparent blowing platform 51 and detect the chip below, need not the step of one more detection and switching-over, effectual step and the process that reduces the detection, guarantee the precision and the accuracy that detect simultaneously.

In the present embodiment, mention is made of: the discharging table 51 is an arc-shaped discharging table 51 with high periphery and low middle part, and a test slot 511 matched with the semiconductor chip in shape is inwards sunken at the bottom of the arc-shaped discharging table 51; set up the blowing platform 51 to the arc that is low in the middle of high all around, can get material subassembly 71 and shift the chip to blowing platform 51 when first, even the location is not accurate, also can slide to the minimum along the arc lateral wall, through the test groove 511 of setting up with chip shape looks adaptation at the minimum, then can guarantee the accurate counterpoint of chip, can be accurate when reaching test assembly 3's position and test assembly 3 are accurate.

In a preferred embodiment, mention is made of: the rotating assembly 5 comprises a vibrating motor 53, the output end of the vibrating motor 53 is connected with the rotating disc 52, and the vibration generated by the vibrating motor 53 is transmitted into the arc-shaped material placing disc through the rotating disc 52, so that the chips positioned in the arc-shaped material placing disc are adapted through vibration and fall into the test slot 511; the vibration motor 53 can emit continuous vibration, when the first material taking assembly 71 transfers the chip to the discharging table 51, even if the positioning is not accurate, the chip can slide to the lowest point along the arc-shaped side wall, but the problems that the arc-shaped side wall is not smooth enough to cause the chip to slide to the lowest point and the lowest point cannot be matched with the shape still exist, the position of the chip in the discharging table 51 can be continuously changed through slow vibration by the continuous vibration until the chip falls into the test slot 511, and 100% of falling position can be realized.

In the present embodiment, mention is made of: the testing assembly 3 comprises a first testing camera 31 and a second testing camera 32, the first testing camera 31 is arranged above the rotating disc 52 and opposite to the stop position of the discharging table 51, the second testing camera 32 is arranged below the rotating disc 52 and opposite to the stop position of the discharging table 51, and lenses of the first testing camera 31 and the second testing camera 32 face the discharging table 51; first test camera 31 and second test camera 32 mainly are IC chip visual inspection equipment, set up these two cameras in the top and the below of blowing groove simultaneously, can be when the chip reachs this position, first test camera 31 directly can shoot and detect the one side of chip, and second test camera 32 can shoot and detect the another side of chip equally through transparent blowing platform 51, need not specially to carry out the turn-over to the chip, utilize the positive and negative shooting mode of two test cameras, no matter what state the chip is in can acquire the test surface that needs, only need through the discernment of control assembly with arrange can, IC chip visual inspection equipment, can effectually discern and detect the pit, the fish tail, it is defective, discolour and the pin deformation of chip, help quick discernment chip whether qualified.

In a preferred embodiment, mention is made of: the testing component 3 further comprises a mounting plate 33 and a testing plate 34, the mounting plate 33 is fixed above the rotating disc 52 through a supporting rod, the testing plate 34 is connected with the supporting rod in a sliding mode, the mounting plate 33 is provided with a lifting motor 35, the output end of the lifting motor 35 is connected with the testing plate 34, and the first testing camera 31 is mounted on the testing plate 34; a clamping piece is arranged on one surface, close to the discharging table 51, of the test board 34, the clamping piece can be used for detachably clamping a first test camera 31 for testing, and the first test camera 31 is connected to the console through a data line; the first testing camera 31 for testing the chip is detachably mounted on the testing board 34, so that the first testing camera 31 can select different types or specifications of the first testing camera 31 according to different tested chips, and the testing information tested by the first testing camera 31 is transmitted to the control assembly through the data line for processing; the preferred second test camera 32 is also removably mounted beneath the rotating disk 52.

In the present embodiment, mention is made of: the feeding end of the feeding component 1, which is close to the rotating disc 52, is provided with a static electricity removing component, the static electricity removing component comprises a first ion fan 12 and an air extracting and dust removing mechanism 11, an air outlet of the first ion fan 12 faces to the chip, and an air extracting opening of the air extracting and dust removing mechanism 11 faces to the air duct direction of the first ion fan 12; the static electricity removing component is additionally arranged on the feeding component 1, so that static electricity removing and dust removing effects can be achieved on the semiconductor chip in the guide rail of the feeding component 1, and dust accumulation and semiconductor chip blockage in the guide rail of the feeding component 1 can be prevented; set up simultaneously and bleed dust removal mechanism 11 and can effectually collect the dust that removes, avoid the dust in disorder to waft in other positions secondary deposit, effectual protection device.

In a preferred embodiment, mention is made of: the rotating disc 52 is positioned between the feeding assembly 1 and the material distributing assembly 2, one end of the rotating disc far away from the testing assembly is provided with a second ion fan 8, and an air outlet of the second ion fan 8 is arranged above the rotating disc 52 and opposite to the stopping position of the discharging table 51; after the chip accomplished the test in test assembly 3 position, accomplish dividing the material back in dividing material assembly 2 position, then blowing platform 51 can be in the idle state, changes to the rear of device, and it is inevitable to accumulate the dust in test groove 511 under long-term use this moment, can play static and dust removal effect to test groove 511 through second ionic wind machine 8.

In a preferred embodiment, mention is made of: the material distribution assembly 2 comprises a receiving groove 21 for collecting unqualified chips and a feeding guide rail 22 for conveying qualified chips, the control assembly receives test information from the test assembly 3 to form a corresponding control signal and transmits the control signal to the second material taking assembly 72, and the second material taking assembly 72 sends the corresponding chips to the receiving groove 21 or the feeding guide rail 22 according to the control information; the material distributing assembly 2 is mainly used for classifying tested chips, the control assembly marks the discharging platform 51 according to a tested chip result and marks the chips as qualified products or unqualified products, when the discharging platform 51 marked as unqualified products rotates to the position of the material distributing assembly 2, the second material taking assembly 72 adsorbs and conveys the chips to the accommodating groove 21 for subsequent operation, and when the discharging platform 51 marked as qualified products rotates to the position of the material distributing assembly 2, the second material taking assembly 72 adsorbs and conveys the chips to the feeding guide rail 22 for subsequent conveying to the braiding assembly 6 for braiding and packaging.

In a preferred embodiment, mention is made of: the braiding component 6 comprises a first feeding wheel 61, a second feeding wheel 63, a receiving wheel 62 and a material track 64, wherein the material track 64 is connected with the feeding guide rail 22, and the material belts of the first feeding wheel 61 and the second feeding wheel 63 are combined on the material track 64 to package chips and are conveyed to the receiving wheel 62 to be stored; the material area is packed the chip clamp in the centre through the mode of merging, accomodates through receipts material wheel 62 after the packing, and the overall process is quick and accurate.

In the present embodiment, mention is made of: the test device also comprises a display screen 4 for displaying the test identification result, and the control component converts the test information of the test component 3 into a display signal and sends the display signal to the display screen 4 for displaying; the display screen 4 receives information from the control component for displaying, and the control component transmits the test pictures shot by the first test camera 31 and the second test camera 32 to the display for displaying for the operator to check and operate.

The invention has the advantages that:

1. the feeding table placed through the chip replaces the existing mode of the adsorption rotary table, stable and quick transfer testing of the chip is guaranteed, and the problem of falling cannot occur.

2. Simultaneously the blowing platform sets up to transparent blowing platform, sets up the test camera in its upper and lower side, need not to overturn the switching-over to the chip and can realize two-way test, and the effectual process that reduces the detection promotes detection efficiency, convenient and practical.

The above disclosure is only for a few specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.