阅读说明：本技术 一种显示面板及其制备方法和显示装置 (Display panel, preparation method thereof and display device ) 是由 陈启燊 秦快 谢宗贤 郭恒 欧阳小波 王昌奇 莫华莲 冯飞成 于 2021-07-16 设计创作，主要内容包括：本申请实施例属于显示技术领域,涉及一种显示面板及其制备方法和显示装置。该显示面板包括：基板、焊盘、发光单元组、散热层和色转换结构组,发光单元组中含有一个或多个连续的发光单元,发光单元设置在所述焊盘上,所述焊盘设置在所述基板上；色转换结构组设置在发光单元的发光侧上,色转换结构组中含有一个或多个色转换结构,色转换结构与发光单元一一对应设置；散热层设置在发光单元与色转换结构之间,散热层分布在两个相邻发光单元组的间隔区域上；显示面板设有散热通道,散热层设置在所述散热通道的端部上,散热通道填充有导热材料。本申请提供的技术方案能够提高显示面板的散热效率,提高显示的可靠性及显示效果。(The embodiment of the application belongs to the technical field of display, and relates to a display panel, a preparation method thereof and a display device. The display panel includes: the LED display device comprises a substrate, a bonding pad, a light emitting unit group, a heat dissipation layer and a color conversion structure group, wherein the light emitting unit group comprises one or more continuous light emitting units, the light emitting units are arranged on the bonding pad, and the bonding pad is arranged on the substrate; the color conversion structure group is arranged on the light emitting side of the light emitting unit, one or more color conversion structures are contained in the color conversion structure group, and the color conversion structures are arranged in one-to-one correspondence with the light emitting unit; the heat dissipation layer is arranged between the light emitting units and the color conversion structure and is distributed on the interval area of the two adjacent light emitting unit groups; the display panel is provided with a heat dissipation channel, the heat dissipation layer is arranged on the end part of the heat dissipation channel, and the heat dissipation channel is filled with heat conduction materials. The technical scheme that this application provided can improve display panel's radiating efficiency, improves the reliability and the display effect of demonstration.)

1. A display panel, comprising:

a substrate, a bonding pad, at least two light-emitting unit groups, a heat dissipation layer and at least two color conversion structure groups,

the light emitting unit group comprises at least one continuous light emitting unit, the light emitting unit is arranged on the bonding pad, and the bonding pad is arranged on the substrate;

the color conversion structure group is arranged on the light emitting side of the light emitting unit, the color conversion structure group comprises at least one color conversion structure, the color conversion structures are arranged in one-to-one correspondence with the light emitting unit, and the color conversion structures are used for converting the light color emitted by the light emitting unit;

the heat dissipation layer is arranged between the light emitting units and the color conversion structure, and the heat dissipation layer is distributed on a spacing area of two adjacent light emitting unit groups so as to conduct heat of the light emitting units in the light emitting unit groups;

the display panel is provided with a heat dissipation channel, the heat dissipation channel penetrates through the substrate, the heat dissipation layer is arranged on the end portion of the heat dissipation channel, and the heat dissipation channel is filled with heat conduction materials.

2. The display panel according to claim 1, wherein one of the light emitting unit groups is composed of three consecutive light emitting units, the color conversion structure group includes a red conversion structure, a green conversion structure and a blue conversion structure, the red conversion structure, the green conversion structure and the blue conversion structure in one of the color conversion structure groups are respectively arranged in one-to-one correspondence with the light emitting units in one of the light emitting unit groups, the red conversion structure is used for converting light emitted by the light emitting units into red light, the green conversion structure is used for converting light emitted by the light emitting units into green light, and the blue conversion structure is used for converting light emitted by the light emitting units into blue light.

3. The display panel according to claim 2, wherein when the light emitted from the light emitting unit is blue light, quantum dots are disposed on each of the red conversion structure and the green conversion structure;

when the light emitted by the light emitting unit is purple light, quantum dots are arranged on the red conversion structure, the green conversion structure and the blue conversion structure.

4. The display panel according to claim 1, further comprising an insulating adhesive layer, wherein the insulating adhesive layer is disposed on the substrate, the insulating adhesive in the insulating adhesive layer is filled between the bonding pad and the light emitting unit, the heat dissipation layer is disposed on the insulating adhesive layer, the insulating adhesive layer covers the light emitting unit, and a thickness difference between the insulating adhesive layer and the light emitting unit is (0, 50] μm.

5. The display panel according to claim 1, wherein a straight-line distance a from the bottom of the heat dissipation layer to the nearest one of the pads is [10, 100] μm.

6. The display panel according to claim 5, wherein the ratio of the minimum distance c from the bottom of the heat dissipation layer to the substrate to the length b of the heat dissipation layer located at the spacing region between two adjacent light emitting unit groups is [0.2,1 ].

7. The display panel according to claim 1, wherein the heat dissipation layer has a thickness of [30,80] μm.

8. The display panel according to any one of claims 1 to 7, wherein the heat conductive material is one or more of graphite powder, metal powder, or a mixture of graphite powder and a resin material.

9. The display panel according to any one of claims 1 to 7, further comprising an adhesive layer disposed between the light emitting unit and the color conversion structure, the adhesive layer being for adhering the color conversion structure on a light emitting side of the light emitting unit.

10. The display panel according to any one of claims 1 to 7, wherein the heat dissipation layer is a graphite heat dissipation film.

11. A display device comprising the display panel according to any one of claims 1 to 10.

12. A method of manufacturing a display panel as claimed in any one of the preceding claims 1-10, characterized in that the method comprises the steps of:

arranging a heat dissipation layer on a substrate with a luminous unit group to obtain a heat dissipation panel, wherein the luminous unit group comprises at least one continuous luminous unit, the heat dissipation layer is arranged on the substrate with the luminous unit group, and the heat dissipation layer is distributed on a spacing area of two adjacent luminous unit groups;

the method comprises the steps that a color conversion structure group is arranged on a heat dissipation panel, the color conversion structure group comprises at least one color conversion structure, the color conversion structure group is arranged on the light emitting side of a light emitting unit after the color conversion structure group is arranged on the heat dissipation panel, and the color conversion structures and the light emitting unit are arranged in a one-to-one correspondence mode;

drilling holes in the bottom of a substrate in the radiating panel towards the direction of the radiating layer, obtaining a radiating channel after drilling, and filling a heat conducting material into the radiating channel, wherein the radiating channel obtained after drilling penetrates through the substrate and is in butt joint with the radiating layer.

13. The method for manufacturing a display panel according to claim 12, wherein the step of providing the heat dissipation layer on the substrate with the light emitting unit groups specifically comprises:

arranging insulating glue at the bottom of the heat dissipation layer, combining the heat dissipation layer with the insulating glue on the substrate with the light emitting unit groups, and filling the insulating glue among the light emitting units in the light emitting unit groups after combination;

and removing the heat dissipation layer part positioned on the corresponding position of the light emitting unit group, wherein the rest heat dissipation layers are distributed on the interval regions of two adjacent light emitting unit groups.

14. The method for manufacturing a display panel according to claim 12, wherein the step of disposing the color conversion structure group on the heat dissipation panel specifically includes:

coating optical cement at the bottom of the color conversion layer provided with the color conversion structure group, then attaching one side of the color conversion layer with the optical cement to the heat dissipation panel, attaching the color conversion structure group to the heat dissipation layer through the optical cement, filling the optical cement between the color conversion structure and the light-emitting unit after attachment to form a bonding layer, and covering the bonding layer on the heat dissipation layer so as to bond the light-emitting unit, the color conversion structure and the heat dissipation layer together.

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.

Background

As user demands for color and high resolution, high contrast ratio display devices have increased, interest in fine pitch display technology has also increased. The fine pitch display is an array based on small inorganic semiconductor light emitting diodes, and the use of an array of LEDs allows each pixel to be much smaller than conventional LEDs, enabling higher resolution and contrast ratio.

The existing micro-space display can solve the colorization problem through a quantum dot color conversion mode. The quantum dot display adopting the quantum dots as the color conversion medium generally has the advantages of high color purity, adjustable emission spectrum, controllable luminescent color, good color rendering, high luminescent efficiency, good light stability and the like. However, in the practical application process, because the quantum dots have high sensitivity to factors such as temperature, oxygen, water vapor and the like, especially for the LED display screen, the LED chip generates heat in the working process, the temperature is an inevitable problem of the LED display screen, and once the conventional quantum dots exceed a certain temperature (such as 85 ℃), the conventional quantum dots are easily damaged, and the light emitting performance of the conventional quantum dots is affected.

In order to avoid the influence of the heat of the LED light emitting chip on the performance of the quantum dot, the current method is to increase the distance from the chip to the quantum dot structure, thereby reducing the temperature of the quantum dot structure, but increasing the distance from the chip to the quantum dot structure means increasing the thickness of the colloid, increasing the thickness of the display panel, and simultaneously causing the heat accumulation of the chip itself, affecting the reliability and optical performance of the chip.

Disclosure of Invention

The technical problem that this application embodiment will solve is that current display panel's encapsulation is glued thickly, and the heat of emitting chip takes place the accumulation easily among the display panel to influence the reliability of emitting chip and color conversion structure and the problem of optical property.

In order to solve the above technical problem, an embodiment of the present application provides a display panel, which adopts the following technical solutions:

the display panel includes:

a substrate, a bonding pad, at least two light-emitting unit groups, a heat dissipation layer and at least two color conversion structure groups,

the light emitting unit group comprises at least one continuous light emitting unit, the light emitting unit is arranged on the bonding pad, and the bonding pad is arranged on the substrate;

the color conversion structure group is arranged on the light emitting side of the light emitting unit, the color conversion structure group comprises at least one color conversion structure, the color conversion structures are arranged in one-to-one correspondence with the light emitting unit, and the color conversion structures are used for converting the light color emitted by the light emitting unit;

the heat dissipation layer is arranged between the light emitting units and the color conversion structure, and the heat dissipation layer is distributed on a spacing area of two adjacent light emitting unit groups so as to conduct heat of the light emitting units in the light emitting unit groups;

the display panel is provided with a heat dissipation channel, the heat dissipation channel penetrates through the substrate, the heat dissipation layer is arranged on the end portion of the heat dissipation channel, and the heat dissipation channel is filled with heat conduction materials.

Further, one the luminescence unit group comprises three continuous luminescence units, the color conversion structure group comprises a red conversion structure, a green conversion structure and a blue conversion structure, one of the color conversion structure group the red conversion structure, the green conversion structure and the blue conversion structure are respectively arranged corresponding to one of the luminescence units in the luminescence unit group, the red conversion structure is used for converting the light emitted by the luminescence unit into red light, the green conversion structure is used for converting the light emitted by the luminescence unit into green light, and the blue conversion structure is used for converting the light emitted by the luminescence unit into blue light.

Further, when the light emitted by the light emitting unit is blue light, quantum dots are arranged on the red conversion structure and the green conversion structure;

when the light emitted by the light emitting unit is purple light, quantum dots are arranged on the red conversion structure, the green conversion structure and the blue conversion structure.

Further, the LED lamp further comprises an insulating glue layer, the insulating glue layer is arranged on the substrate, insulating glue in the insulating glue layer is filled between the bonding pad and the light-emitting unit, the heat dissipation layer is arranged on the insulating glue layer, the insulating glue layer covers the light-emitting unit, and the thickness difference between the insulating glue layer and the light-emitting unit is (0, 50) mu m.

Further, the straight distance a from the bottom of the heat dissipation layer to the nearest one of the pads is [10, 100] μm.

Further, the ratio interval of the minimum distance c from the bottom of the heat dissipation layer to the substrate and the length b of the heat dissipation layer on the interval area of two adjacent light emitting unit groups is [0.2,1 ].

Further, the thickness of the heat dissipation layer is [30,80] μm.

Further, the heat conducting material is one or more of graphite powder, metal powder or a mixture of graphite powder and a resin material.

Further, the color conversion device further comprises a bonding layer, wherein the bonding layer is arranged between the light emitting unit and the color conversion structure, and is used for bonding the color conversion structure on the light emitting side of the light emitting unit.

Further, the heat dissipation layer is a graphite heat dissipation film.

In order to solve the above technical problem, an embodiment of the present application further provides a display device, where the display panel according to any of the above aspects is adopted in the display device.

In order to solve the above technical problem, an embodiment of the present application further provides a method for manufacturing the display panel according to any one of the above aspects, where the following technical solutions are adopted:

the method comprises the following steps:

arranging a heat dissipation layer on a substrate with a luminous unit group to obtain a heat dissipation panel, wherein the luminous unit group comprises at least one continuous luminous unit, the heat dissipation layer is arranged on the substrate with the luminous unit group, and the heat dissipation layer is distributed on a spacing area of two adjacent luminous unit groups;

the method comprises the steps that a color conversion structure group is arranged on a heat dissipation panel, the color conversion structure group comprises at least one color conversion structure, the color conversion structure group is arranged on the light emitting side of a light emitting unit after the color conversion structure group is arranged on the heat dissipation panel, and the color conversion structures and the light emitting unit are arranged in a one-to-one correspondence mode;

drilling holes in the bottom of a substrate in the radiating panel towards the direction of the radiating layer, obtaining a radiating channel after drilling, and filling a heat conducting material into the radiating channel, wherein the radiating channel obtained after drilling penetrates through the substrate and is in butt joint with the radiating layer.

Further, the step of providing the heat dissipation layer on the substrate with the light emitting unit group specifically includes:

arranging insulating glue at the bottom of the heat dissipation layer, combining the heat dissipation layer with the insulating glue on the substrate with the light emitting unit groups, and filling the insulating glue among the light emitting units in the light emitting unit groups after combination;

and removing the heat dissipation layer part positioned on the corresponding position of the light emitting unit group, wherein the rest heat dissipation layers are distributed on the interval regions of two adjacent light emitting unit groups.

Further, the step of disposing the color conversion structure group on the heat dissipation panel specifically includes:

coating optical cement at the bottom of the color conversion layer provided with the color conversion structure group, then attaching one side of the color conversion layer with the optical cement to the heat dissipation panel, attaching the color conversion structure group to the heat dissipation layer through the optical cement, filling the optical cement between the color conversion structure and the light-emitting unit after attachment to form a bonding layer, and covering the bonding layer on the heat dissipation layer so as to bond the light-emitting unit, the color conversion structure and the heat dissipation layer together.

Compared with the prior art, the embodiment of the application mainly has the following beneficial effects:

this application is through setting up the heat dissipation layer between luminescence unit and look transform structure, and distribute on the interval region of two adjacent luminescence unit groups, the heat dissipation layer will be conducted the produced heat of luminescence unit in two adjacent luminescence unit groups, make thickness between luminescence unit and the look transform structure can set up thinly, the heat dissipation layer sets up on the tip that is filled with the heat dissipation passageway of heat conduction material, the heat can be conducted the heat dissipation passageway from the heat dissipation layer, further improved the radiating efficiency, effectively reduce luminescence unit's temperature accumulation, thereby avoid luminescence unit and look transform structure because of the high temperature impaired performance, and then improve display panel's reliability.

Drawings

In order to illustrate the solution of the present application more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.

Fig. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention, in which arrows indicate heat conduction directions;

FIG. 2 is a schematic cross-sectional view of a display panel according to another embodiment of the present invention, in which a heat dissipation layer is in a deformed state;

FIG. 3 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a substrate with a light emitting unit according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a heat dissipation layer with an insulating paste according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram illustrating a structure of a heat dissipation layer with an insulating paste bonded to a substrate with a light emitting unit group according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a heat dissipation panel obtained after removing portions of the heat dissipation layer located at positions corresponding to the light emitting unit groups according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram illustrating a color conversion layer provided with a color conversion structure group coated with an optical adhesive according to an embodiment of the present invention;

FIG. 9 is a schematic structural diagram illustrating a side of a color conversion layer with optical cement attached to a heat dissipation panel according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a heat dissipation panel after drilling a hole on one side of a substrate according to an embodiment of the present invention.

Reference numerals: 100. a substrate; 200. a light emitting unit; 300. a heat dissipation layer; 401. a red conversion structure; 402. a green conversion structure; 403. a blue conversion structure; 500. a heat dissipation channel; 600. an insulating glue layer; 700. a bonding layer; 800. and a bonding pad.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the above-described drawings are used for distinguishing between different objects and not for describing a particular order.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Embodiments of the present application provide a display panel, referring to fig. 1 to 2, the display panel includes a substrate 100, a pad 800, at least two light emitting unit groups, a heat dissipation layer 300, and at least two color conversion structure groups,

the light emitting unit group comprises at least one continuous light emitting unit 200, the light emitting unit 200 is arranged on the bonding pad 800, and the bonding pad 800 is arranged on the substrate 100; the color conversion structure group is arranged on the light emitting side of the light emitting unit 200, the color conversion structure group comprises at least one color conversion structure, the color conversion structures are arranged in one-to-one correspondence with the light emitting unit 200, and the color conversion structures are used for converting the light color emitted by the light emitting unit 200; the heat dissipation layer 300 is disposed between the light emitting units 200 and the color conversion structure, and the heat dissipation layer 300 is distributed on a spacing region between two adjacent light emitting unit groups to conduct heat of the light emitting units 200 in the light emitting unit groups; the display panel is provided with a heat dissipation channel 500, the heat dissipation channel 500 penetrates through the substrate 100, the heat dissipation layer 300 is arranged on the end portion of the heat dissipation channel 500, and the heat dissipation channel 500 is filled with a heat conduction material. Through setting up the heat dissipation layer between luminescence unit and look transform structure, and distribute on the interval region of two adjacent luminescence unit groups, the heat dissipation layer can be conducted by the produced heat of luminescence unit in two adjacent luminescence unit groups, make highly can set up thinly between luminescence unit and the look transform structure, the heat dissipation layer sets up on the tip that is filled with the heat dissipation passageway of heat conduction material, the heat can be conducted to the heat dissipation passageway from the heat dissipation layer, further improved the radiating efficiency, effectively reduce luminescence unit's temperature accumulation, thereby avoid luminescence unit and look transform structure because of the high temperature impaired performance, and then improve display panel's reliability.

It can be understood that the working principle of the display panel is as follows:

when the light emitting unit 200 operates, light emitted from the light emitting unit 200 is converted into light color by the corresponding color conversion structure and then emitted to the outside, thereby realizing display colorization. The heat dissipation layer 300 of this application sets up between luminescence unit 200 and look transform structure, and heat dissipation layer 300 distributes on the interval region of two adjacent luminescence unit groups, makes heat dissipation layer 300 can not shelter from luminescence unit 200's among the luminescence unit group light-emitting, can conduct the heat that luminescence unit 200 sent simultaneously through heat dissipation layer 300 to carry out the heat conduction through the heat dissipation channel 500 who has filled the heat conduction material. When the light emitting unit 200 operates, heat generated by the light emitting unit 200 is first conducted to the heat dissipation layer 300, then conducted from the heat dissipation layer 300 to the heat dissipation channel 500, and finally diffused outwards through the heat dissipation channel 500.

Compared with the prior art, the display panel at least has the following technical effects:

this application is through setting up heat dissipation layer 300 between luminescence unit 200 and look transform structure, and distribute on the interval region of two adjacent luminescence unit groups, heat dissipation layer 300 can conduct the produced heat of luminescence unit 200 in two adjacent luminescence unit groups, make thickness between luminescence unit 200 and the look transform structure can set up thinly, heat dissipation layer 300 sets up on the tip that is filled with the heat dissipation channel 500 of heat conduction material, the heat can be conducted heat dissipation channel 500 from heat dissipation layer 300, further the radiating efficiency has been improved, effectively reduce luminescence unit 200's temperature accumulation, thereby avoid luminescence unit 200 because of the high temperature performance impaired and look transform structure's reliability and optical property.

In this embodiment, the length b of the heat dissipation layer in the horizontal direction is less than or equal to the distance between the light emitting units located at two sides of the heat dissipation channel, so as to ensure that the heat dissipation layer does not block the light emitted from the light emitting units in the vertical direction.

In one embodiment, one of the light emitting unit groups is composed of three consecutive light emitting units, the color conversion structure group includes a red conversion structure 401, a green conversion structure 402, and a blue conversion structure 403, and the red conversion structure 401, the green conversion structure 402, and the blue conversion structure 403 in one of the color conversion structure groups are respectively disposed in one-to-one correspondence with the light emitting units 200 in one of the light emitting unit groups. The red conversion structure 401 is used for converting light emitted by the light emitting unit 200 into red light, the green conversion structure 402 is used for converting light emitted by the light emitting unit 200 into green light, and the blue conversion structure 403 is used for converting light emitted by the light emitting unit 200 into blue light.

In this embodiment, a light emitting unit group consisting of three consecutive light emitting units, a color conversion structure group consisting of a red conversion structure 401, a green conversion structure 402, and a blue conversion structure 403 corresponding to each light emitting unit 200 constitute one pixel region, and the heat dissipation layer 300 is disposed in two adjacent pixel regions.

In another embodiment, one of the light emitting units 200 may also be composed of one light emitting unit, and the heat dissipation layer 300 may be disposed on a spaced area between two adjacent light emitting units 200 to accelerate heat dissipation of the light emitting units 200. In addition, two or more continuous light emitting units may be included in one light emitting unit group, and the number of light emitting unit groups included in the light emitting unit group is not particularly limited in the present application. The number of the light emitting units in the light emitting unit group is equal to the number of the color conversion structures in the color conversion structure group.

It should be noted that three consecutive light emitting units may emit light of the same color or light of different colors.

In one embodiment, when the light emitted by three consecutive light emitting units 200 is blue, quantum dots are disposed on each of the red conversion structure 401 and the green conversion structure 402. In this embodiment, the red conversion structure 401 is a red quantum dot film, and the green conversion structure 402 is a green quantum dot film. When the light emitted by the light emitting unit 200 is blue light, the red quantum dot film may convert the blue light into red light, the green conversion structure 402 may convert the blue light into green light, and the blue conversion structure 403 may be a high-transparency material such as glass, polyimide, and the like.

In one embodiment, when the light emitted from three consecutive light emitting units 200 is purple light, quantum dots are disposed on the red conversion structure, the green conversion structure, and the blue conversion structure. The red conversion structure 401 is a red quantum dot film, the green conversion structure 402 is a green quantum dot film, and the blue conversion structure 403 is a blue quantum dot film, so as to convert light emitted from the light emitting unit 200 into red light, green light, and blue light, respectively.

In one embodiment, when the light emitted by three consecutive light emitting units 200 is light of different colors, if the light emitted by the light emitting unit 200 corresponding to the red conversion structure 401 is not red light, the red conversion structure 401 is provided with quantum dots; if the light emitted by the light-emitting unit corresponding to the green conversion structure 402 is not green light, quantum dots are arranged on the green conversion structure 402; if the light emitted from the light emitting unit 200 corresponding to the blue conversion structure 403 is not blue, the blue conversion structure 403 is provided with quantum dots.

The color conversion structure in the present application is not limited to the quantum dots of the film material, and may be a color conversion member formed by printing, spraying, photolithography of quantum dots, or the like.

In other embodiments, the color conversion structure may also be a color conversion member made of phosphor, a fluorescent film, or a color filter, which can perform color conversion.

In one embodiment, the display panel further includes an insulating adhesive layer 600, the insulating adhesive layer 600 is disposed on the substrate 100, the insulating adhesive in the insulating adhesive layer 600 fills the space between the pad 800 and the light emitting unit 200, the heat dissipation layer 300 is disposed on the insulating adhesive layer 600, the insulating adhesive layer covers the light emitting unit, and the thickness difference between the insulating adhesive layer and the light emitting unit is (0, 50) μm in this embodiment, the light emitting unit 200 is insulated from each other by disposing the insulating adhesive to encapsulate the light emitting unit 200, and the heat dissipation layer 300 is disposed on the insulating adhesive, so that the heat dissipation layer 300 and the light emitting unit 200 are not in contact with each other, thereby preventing the light emitting unit 200 from generating a leakage condition, the difference between the thicknesses of the insulating glue layer and the light emitting unit is 30 μm. The thickness difference between the insulating glue layer and the light-emitting unit is (0, 50) μm, which can be understood as that the thickness of the insulating glue layer covering the light-emitting side of the light-emitting unit is greater than 0 μm and less than or equal to 50 μm, and in the range of the thickness difference, the light-emitting side of the light-emitting unit can be covered with the insulating glue, and meanwhile, the insulating glue can cause less influence on the light transmittance and ensure the flatness of the insulating glue layer on the substrate.

In this embodiment, the substrate 100 is formed by laminating a plurality of circuit boards.

In this embodiment, the light emitting unit 200 is a light emitting chip, the light emitting chip is mounted on the substrate 100 through a bonding pad 800, and a cathode and an anode of the light emitting chip are fixed on the bonding pad 800 to achieve circuit connection of the light emitting chip. The insulating glue is filled between the adjacent bonding pad 800 and the light-emitting chip, so that the chip is isolated from being contacted with water, oxygen and the like in the air, the reliability of the chip and welding is ensured, and electric leakage between the adjacent bonding pad 800 and the light-emitting chip is avoided. Because the insulating adhesive layer 600 has a certain thickness, the heat dissipation layer 300 is arranged on the insulating adhesive layer 600, so that a certain distance is generated between the heat dissipation layer 300 and the welding plate, and the problem of electric leakage caused by the contact of the heat dissipation layer 300 and the welding plate is avoided.

In some embodiments, the light emitting unit 200 may be an LED light emitting chip emitting violet light, blue light or other color light, which is not particularly limited in this application.

In this embodiment, the light emitting unit 200 is a blue LED chip. The color conversion structure in the color conversion structure is arranged on the light emitting side of the blue light LED chip to convert the color of the blue light emitted by the blue light LED chip to form light with different colors, so that the colorization of display is realized. The red conversion structure 401 in the color conversion structure converts blue light into red light, the green conversion structure in the color conversion structure converts blue light into green light, and the blue conversion structure in the color conversion structure transmits the blue light outwards.

In one embodiment, referring to fig. 2, the linear distance a from the bottom of the heat dissipation layer 300 to the nearest one of the pads 800 is [10, 100] μm, which can prevent the heat dissipation layer 300 from contacting the pads 800 to form a leakage current due to deformation of the heat dissipation layer 300 during the processing of the heat dissipation layer 300, thereby ensuring the reliability of the panel. The [10, 100] μm means that a linear distance a from the bottom of the thermal layer 300 to the nearest one of the pads 800 is 10 to 100 μm, and includes 10 μm and 100 μm.

In one embodiment, a ratio of a minimum distance c from the bottom of the heat dissipation layer 300 to the substrate 100 to a length b of the heat dissipation layer 300 located on a spaced region between two adjacent light emitting unit groups is [0.2,1], that is, c ═ 0.2 to 1 × b. Under this condition, the flatness of the heat dissipation layer 300 after machining and molding can be ensured. Note that [0.2,1] means that the ratio is between 0.2 and 1, and includes 0.2 and 1.

In one embodiment, the heat spreading layer has a thickness of [30,80] μm. The [30,80] μm is a thickness of 30 to 80 μm, and includes 30 μm and 80 μm. In this embodiment, the heat dissipation layer 300 may conduct heat generated by the light emitting units 200 in two adjacent light emitting unit groups by disposing the heat dissipation layer 300 between the light emitting units 200 and the color conversion structure and distributing the heat dissipation layer on the spacing regions of the two adjacent light emitting unit groups. Wherein, if the thickness of the heat dissipation layer is too small, cracking and breakage are easy to occur; if the thickness of the heat dissipation layer is too large, the light emitting angle of the light emitting unit is affected, and therefore the viewing angle is affected. Preferably, the heat dissipation layer has a thickness of 50 μm, so that heat generated by the light emitting unit can be securely conducted, and the light emitting angle of the light emitting unit can be less affected.

In this embodiment, the heat dissipation layer 300 is a graphite heat dissipation film. The heat conductivity coefficient of the graphite heat dissipation film is (600-1900) W/m.K, and the graphite heat dissipation film is favorable for conducting heat generated by the light emitting unit, so that the heat can be conducted out more quickly, the heat dissipation capacity of the panel is improved, and the production cost is reduced. Because the graphite heat dissipation film has the light absorption performance, the graphite heat dissipation film is arranged on the interval area of the adjacent light emitting unit groups, the light blocking effect on the adjacent light emitting unit groups can be achieved, the phenomenon of crosstalk of the adjacent color conversion structure groups is avoided, on the other hand, the blackness of the substrate is improved, the display contrast is improved, and the display effect is improved. Therefore, in the present application, the space between the red conversion structure 401, the green conversion structure 402 and the blue conversion structure 403 may be transparent or black. When the graphite heat-dissipating film is sufficiently black, the light absorption performance is strong, and the interval between the red conversion structure 401, the green conversion structure 402, and the blue conversion structure 403 does not need to be filled with black partition walls.

In this embodiment, referring to fig. 1 to 2, the graphite heat dissipation film is disposed on the insulating adhesive layer 600, and satisfies the following conditions: the linear distance from the bottom of the graphite heat dissipation film to the bonding pad 800 is greater than 10 μm, and the ratio of the minimum distance from the bottom of the graphite heat dissipation film to the substrate 100 to the length of the graphite heat dissipation film located at the interval between two adjacent light emitting cell groups is [0.2,1 ]. Specifically, the ratio of the minimum distance from the bottom of the graphite heat dissipation film to the substrate 100 to the length of the graphite heat dissipation film located in the interval between two adjacent light emitting unit groups may be selected to be any one of the values between 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, or 0.2 and 1.

In one embodiment, the thermally conductive material has a thermal conductivity greater than 5W/m-K.

In this embodiment, the heat conductive material is one or more of graphite powder, metal powder, or a mixture of graphite powder resin materials (such as graphene). The thermally conductive material may be a black or other colored filler material.

In one embodiment, referring to fig. 1 to 2, the display panel further includes an adhesive layer 700, the adhesive layer 700 is disposed between the light emitting unit 200 and the color conversion structure, and the adhesive layer 700 is used for adhering the color conversion structure on the light emitting side of the light emitting unit 200. In this embodiment, the bonding layer 700 is an optical adhesive, the optical adhesive is disposed between the color conversion mechanism and the light emitting unit 200 and filled in the gap of the heat dissipation layer 300, the color conversion mechanism is bonded on the light emitting unit 200 by the optical adhesive, and the optical adhesive also fixes the position of the heat dissipation layer 300. The light emitted from the light emitting unit 200 may pass through the optical cement and enter the color conversion structure for color conversion.

In this embodiment, the adhesive layer 700 is filled in the gap of the heat dissipation layer 300, and the top surface of the adhesive layer 700 is higher than the top surface of the heat dissipation layer 300, so that the adhesive layer 700 covers the heat dissipation layer 300, and the heat dissipation layer 300 can be bonded to the light emitting unit 200 and the color conversion structure through the adhesive layer 700.

Based on the display panel, an embodiment of the present application further provides a display device, which includes the display panel according to any one of the above aspects. The display device has the advantages of good heat dissipation performance, high reliability, small thickness of packaging glue, strong stability and the like.

Based on the above structure of the display panel, the embodiment of the present application further provides a method for manufacturing a display panel, and referring to fig. 3 to 10, the method includes the steps of:

s200, arranging a heat dissipation layer on a substrate with a luminous unit group to obtain a heat dissipation panel, wherein the luminous unit group comprises at least one continuous luminous unit, and the heat dissipation layer is distributed on a spacing area of two adjacent luminous unit groups after being arranged on the substrate with the luminous unit group;

s300, arranging a color conversion structure group on a heat dissipation panel, wherein the color conversion structure group comprises at least one color conversion structure, the color conversion structure group is arranged on the light emitting side of the light emitting unit after being arranged on the heat dissipation panel, and the color conversion structures and the light emitting unit are arranged in a one-to-one correspondence manner;

s400, drilling towards the direction of the heat dissipation layer from the bottom of the substrate in the heat dissipation panel, obtaining a heat dissipation channel after drilling, and filling a heat conduction material into the heat dissipation channel, wherein the heat dissipation channel obtained after drilling penetrates through the substrate and is in butt joint with the heat dissipation layer.

This application sets up the heat dissipation layer earlier to the base plate that has the luminescence unit on organizing the colour conversion structure and setting up on the luminescence side of luminescence unit, makes the heat dissipation layer be located between luminescence unit and the colour conversion structure group, and the heat of luminescence unit can in time be conducted to the heat dissipation layer, avoids luminescence unit's heat accumulation, can also avoid luminescence unit's heat to the influence of colour conversion structure simultaneously. Through the heat dissipation channel that sets up on the heat dissipation panel and run through in the base plate, the mode that adopts the packing heat conduction material has improved heat dissipation channel's heat dispersion, and heat dissipation channel and heat dissipation layer butt joint make the conduction of heat can be faster go out, have improved the radiating effect of panel.

In this embodiment, step S200 specifically includes:

referring to fig. 5 to 7, an insulating adhesive is disposed at the bottom of the heat dissipation layer, the heat dissipation layer with the insulating adhesive is bonded to the substrate with the light emitting unit groups, and the insulating adhesive is filled between the light emitting units in the light emitting unit groups after bonding;

and removing the heat dissipation layer part positioned on the corresponding position of the light emitting unit group, wherein the rest heat dissipation layers are distributed on the interval regions of two adjacent light emitting unit groups.

Specifically, the heat dissipation layer is a graphite heat dissipation film, and the graphite heat dissipation film is formed by graphite powder and colloid in a hot pressing mode. In this embodiment, the colloid may be a heat-resistant polymer material such as Polyimide (PI).

Specifically, the insulating glue is semi-cured insulating glue, and when the heat dissipation layer with the semi-cured insulating glue is bonded to the substrate with the light emitting units, the semi-cured insulating glue can fill gaps between the light emitting units in the light emitting unit group and gaps between adjacent bonding pads on the substrate, so as to complete the packaging of the light emitting units.

Specifically, this application adopts the mode of heating vacuum laminating to combine the heat dissipation layer that has the semi-solid insulating cement to take on the base plate by luminescence unit.

Specifically, the heat dissipation layer part covering the light emitting unit group is removed to expose the light emitting units in the light emitting unit group, so that the light emitted by the light emitting units can be subjected to color conversion subsequently, and the remaining heat dissipation layers are distributed on the interval area of two adjacent light emitting unit groups, so that the heat dissipation panel is obtained.

In this embodiment, ion etching, micro-cutting, wet etching, or other micro-processing techniques may be used to remove the portion of the heat dissipation layer located at the position corresponding to the light emitting unit group.

In this embodiment, step S300 specifically includes:

referring to fig. 8 to 9, an optical adhesive is coated on the bottom of the color conversion layer provided with the color conversion structure group, one side of the color conversion layer with the optical adhesive is attached to the heat dissipation panel, the color conversion structure group is attached to the heat dissipation layer through the optical adhesive, the optical adhesive is filled between the color conversion structure and the light emitting unit after the attachment to form a bonding layer, and the bonding layer covers the heat dissipation layer to bond the light emitting unit, the color conversion structure and the heat dissipation layer together. The color conversion structure group is positioned on the light emitting side of the light emitting unit, one or more color conversion structures are contained in the color conversion structure group, and the color conversion structures and the light emitting unit are arranged in a one-to-one correspondence mode after the color conversion structures are attached.

In this embodiment, referring to fig. 10, the step of drilling the heat dissipation panel specifically includes:

and laser drilling is carried out on the bottom of the substrate in the radiating panel to obtain a radiating channel which sequentially penetrates through the substrate and the semi-cured insulating glue layer, and the radiating layer is positioned on the end part of the radiating channel.

In this embodiment, referring to fig. 3 and fig. 4, before the step S200, the method further includes:

and S100, laminating the circuit boards in a multi-layer mode to form a substrate, and carrying out die bonding on the light-emitting units on the bonding pads of the substrate to obtain the substrate with the light-emitting unit groups.

In this embodiment, the light emitting unit is a blue LED chip.

In this embodiment, the die bonding of the light emitting unit is performed on the pad of the substrate, specifically, the die bonding of the light emitting unit is performed in a single transfer or a whole bonding manner.

It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.