阅读说明：本技术 脑电极的连接机构 (Connecting mechanism of brain electrode ) 是由 丁汉卿 蒋军庭 张新国 于 2021-08-04 设计创作，主要内容包括：本发明涉及医疗器械的技术领域,尤其涉及一种脑电极的连接机构。这种深部电极排母的连接机构包括贴片排母,贴片排母的上端连接电路板,所述电路板上设有锡焊孔,所述贴片排母上端的连接柱穿过锡焊孔与连接片锡焊连接。这种深部电极排母的连接机构具有连接效果可靠稳定、制作工艺稳定的特点。(The invention relates to the technical field of medical instruments, in particular to a connecting mechanism of brain electrodes. The connecting mechanism of the deep electrode row nut comprises a patch row nut, wherein the upper end of the patch row nut is connected with a circuit board, a soldering hole is formed in the circuit board, and a connecting column at the upper end of the patch row nut penetrates through the soldering hole to be connected with a connecting sheet in a soldering mode. The connecting mechanism of the deep electrode busbar has the characteristics of reliable and stable connecting effect and stable manufacturing process.)

1. The utility model provides a coupling mechanism of brain electrode, includes female (4) of paster row, its characterized in that: the upper end of the paster row nut (4) is connected with the circuit board (2), the circuit board (2) is provided with a tin welding hole (3), and a connecting column at the upper end of the paster row nut (4) penetrates through the tin welding hole (3) to be connected with the connecting sheet (1) in a tin welding mode.

2. The brain electrode connecting mechanism according to claim 1, wherein: the connecting piece (1) is a stainless steel sheet.

3. The brain electrode connecting mechanism according to claim 1, wherein: each connecting column at the upper end of the paster row bus (4) is connected with a connecting sheet (1) in a soldering mode.

4. The brain electrode connecting mechanism according to claim 1, wherein: gaps are arranged between the connecting pieces (1).

5. The brain electrode connecting mechanism according to claim 1, wherein: and the connecting sheet (1) is spot-welded with a guide wire.

Technical Field

The invention relates to a deep electrode, in particular to a connecting mechanism of brain electrodes.

Background

Deep electrode and cable junction adopt row's of needle to arrange female design more, and the structure of deep electrode is mostly row female, and its coupling part material is the brass, is difficult to be connected with the seal wire in the electrode. At present, the manufacturing process mainly comprises two types:

1. bonding the guide wire and the busbar metal part by using conductive epoxy;

2. and the guide wire and the metal part of the busbar are plugged into the plastic part to be pressed and connected.

At present, the phenomenon that the connection resistance of a certain connection point is unstable or overhigh easily occurs in the two modes.

Disclosure of Invention

The invention aims to solve the defects and provides a connecting mechanism of a deep electrode busbar.

In order to overcome the defects in the background art, the technical scheme adopted by the invention for solving the technical problems is as follows: the connecting mechanism of the deep electrode row nut comprises a patch row nut, wherein the upper end of the patch row nut is connected with a circuit board, a soldering hole is formed in the circuit board, and a connecting column at the upper end of the patch row nut penetrates through the soldering hole to be connected with a connecting sheet in a soldering mode.

According to another embodiment of the invention, it is further comprised that the connecting piece is a stainless steel sheet.

According to another embodiment of the invention, the patch array further comprises a connecting piece soldered to each connecting column at the upper end of the patch array.

According to another embodiment of the present invention, it further comprises a space provided between the connection pieces.

According to another embodiment of the present invention, further comprising spot welding a connecting wire on the connecting piece.

The invention has the beneficial effects that: the connecting mechanism of the deep electrode busbar has the characteristics of reliable and stable connecting effect and stable manufacturing process.

Drawings

The invention is further illustrated with reference to the following figures and examples.

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the embodiment;

wherein: 1. connecting sheet, 2, circuit board, 3, soldering hole, 4, paster row mother.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1, the printed circuit board comprises a patch row bus 4, the upper end of the patch row bus 4 is connected with a circuit board 2, a soldering hole 3 is arranged on the circuit board 2, and a connecting column at the upper end of the patch row bus 4 penetrates through the soldering hole 3 to be connected with a connecting sheet 1 in a soldering mode. The circuit board 2 and the connecting column at the upper end of the paster row bus 4 are connected with the connecting sheet 1 by tin soldering by using the tin soldering hole 3 on the circuit board, so that a connecting structure with reliable and stable connection is formed.

Further, the connecting sheet 1 is a stainless steel sheet. The stainless steel sheet can facilitate the spot welding of the connecting sheet to connect the guide wire.

Furthermore, each connecting column at the upper end of the paster row bus 4 is connected with a connecting sheet 1 through tin soldering. A connecting piece 1 is connected to each connecting column in a tin welding mode, and a guide wire is connected to the connecting piece 1 in a spot welding mode, so that the connecting effect is stable, the overall manufacturing process is simple and stable, and the connecting effect is good.

Furthermore, a gap is arranged between the connecting sheets 1. In order to prevent the independent structure of each connection line, a gap needs to be provided between the tabs 1.

Further, a guide wire is spot-welded on the connecting sheet 1. The two related welding processes are very mature processes, and the overall manufacturing process is simple and stable.

Examples

As shown in fig. 2, the structure of the connection sheet 1, the circuit board 2, and the patch array bus 4 after soldering is such that the lead wire of the deep electrode is spot-welded to the stainless connection sheet 1 after the connection is completed.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.