阅读说明：本技术 一种压力感应装置及电子设备 (Pressure sensing device and electronic equipment ) 是由 林学朋 黄拓夏 于 2021-07-30 设计创作，主要内容包括：本申请提供了一种压力感应装置及电子设备,压力感应装置包括：传力件,所述传力件用于被按压以产生形变；刚性件,所述刚性件包括相背对的第一侧和第二侧,所述刚性件的第一侧通过至少三个间隔设置的粘接体与所述传力件相抵接,以使所述传力件背对所述刚性件的一侧在被按压时产生的形变传递至所述刚性件上；压力传感器,所述压力传感器与所述刚性件的第二侧相抵接,以使所述刚性件的第一侧产生的形变传递至所述压力传感器上。本申请解决了现有压感装置的压力感应区域不足的问题。(The application provides a forced induction device and electronic equipment, forced induction device includes: a force transfer member for being pressed to deform; the rigid part comprises a first side and a second side which are opposite, the first side of the rigid part is abutted with the force transmission part through at least three bonding bodies arranged at intervals, so that the deformation generated when one side of the force transmission part, which is opposite to the rigid part, is pressed is transmitted to the rigid part; and the pressure sensor is abutted against the second side of the rigid part, so that the deformation generated by the first side of the rigid part is transmitted to the pressure sensor. The problem that the forced induction region of current pressure-sensitive device is not enough has been solved in this application.)

1. A pressure sensing device, comprising:

a force transfer member (10), the force transfer member (10) being adapted to be pressed to cause a deformation;

the rigid part (20) comprises a first side (21) and a second side (22) which are opposite, the first side (21) of the rigid part (20) is abutted to the force transmission part (10) through at least three bonding bodies (30) which are arranged at intervals, so that deformation generated when one side of the force transmission part (10) opposite to the rigid part (20) is pressed is transmitted to the rigid part (20);

the pressure sensor is abutted against the second side (22) of the rigid part (20), so that deformation generated by the first side (21) of the rigid part (20) is transmitted to the pressure sensor, and pressure sensing is realized.

2. Pressure sensing device according to claim 1, wherein the pressure sensor comprises a pressure measurement circuit having at least one resistor, wherein at least one of the resistors is a strain sensitive resistor (40) for detecting deformation of the rigid member.

3. A pressure sensitive device according to claim 2, wherein there are three of said adhesive bodies (30), a first adhesive body (31), a second adhesive body (32) and a third adhesive body (33);

the first bonding body (31) and the third bonding body (33) are respectively positioned at two ends of the rigid member (20);

the second adhesive body (32) is located between the first adhesive body (31) and the third adhesive body (33), and the second adhesive body (32) is located at the middle position of the rigid member (20);

the strain sensing resistor (40) is arranged opposite to the second bonding body (32).

4. A pressure sensing device according to claim 3, wherein the second side (22) of the rigid member (20) is provided with a strain amplifying groove (50);

the strain sensing resistor (40) is arranged at the notch of the strain amplifying groove (50).

5. The pressure sensing device according to any one of claims 2-4, wherein the pressure sensor further comprises a signal processing circuit, and the signal processing circuit is electrically connected to the pressure measuring circuit and is configured to convert the pressure value obtained by the pressure measuring circuit into an electrical signal to realize pressure sensing.

6. Pressure sensing device according to claim 5, wherein the pressure measuring circuit has four resistors, the pressure measuring circuit being a Wheatstone bridge electrically connected by one of the strain sensitive resistors (40) to three reference resistors;

or the pressure measuring circuit is provided with two resistors, and the pressure measuring circuit is a voltage dividing circuit formed by connecting one strain sensing resistor (40) and one reference resistor in series;

alternatively, the pressure measurement circuit has two resistors, and the pressure measurement circuit is a shunt circuit formed by connecting one of the strain sensitive resistors (40) in parallel with one of the reference resistors.

7. A pressure sensing device according to claim 5, wherein the pressure measurement circuit has a resistor and a capacitor, the pressure measurement circuit being an RC series circuit formed by a said strain sensitive resistor (40) in series with a capacitor;

alternatively, the pressure measurement circuit has a resistor, the pressure measurement circuit also has a capacitance and an inductance, and the pressure measurement circuit is an RLC parallel resonant circuit electrically connected by one of the strain sensing resistors (40), one of the capacitances and one of the inductances.

8. Pressure-sensitive device according to claim 6 or 7, characterized in that the adhesive body (30) is a gel.

9. A pressure sensing device according to claim 3, further comprising a reference pressure sensor abutting the second side (22) of the rigid member (20);

the reference pressure sensor comprises at least one reference strain sensing resistor (60);

the included angle between the current direction of the strain sensing resistor (40) and the length direction of the rigid part (20) is 0-30 degrees, and the included angle between the current direction of the reference strain sensing resistor (60) and the length direction of the rigid part (20) is 60-90 degrees.

10. An electronic device, characterized in that it comprises a pressure-sensitive device as claimed in any one of claims 1 to 9.

Technical Field

The present disclosure relates to pressure sensing technologies, and particularly to a pressure sensing device and an electronic apparatus.

Background

The existing pressure sensing device is generally provided with a supporting piece below the pressure sensor so that the pressure sensor is fixed with a force transmission piece, but the space for installing the pressure sensing device on general electronic equipment is small, so that the supporting piece occupies a part of space, the installation space of other parts of the pressure sensing device is small, the installation difficulty is increased, in order to solve the problems, the pressure sensing device directly bonding the whole surface of the pressure sensor and the force transmission piece together is provided, but practice shows that the deformation loss of the force transmission piece sensed by the pressure sensor is fast due to the pressure sensing device, and the pressure sensing area of the pressure sensing device is not enough.

Disclosure of Invention

The embodiment of the application provides a pressure sensing device and electronic equipment, and solves the problem that the pressure sensing area of the existing pressure sensing device is insufficient.

The present invention is achieved as such, and a pressure sensing apparatus includes:

a force transfer member for being pressed to deform;

the rigid part comprises a first side and a second side which are opposite, the first side of the rigid part is abutted with the force transmission part through at least three bonding bodies arranged at intervals, so that the deformation generated when one side of the force transmission part, which is opposite to the rigid part, is pressed is transmitted to the rigid part;

and the pressure sensor is abutted against the second side of the rigid part, so that the deformation generated by the first side of the rigid part is transmitted to the pressure sensor, and the pressure sensing is realized.

According to the pressure sensing device provided by the embodiment of the application, the first side of the rigid part is abutted with the force transmission part through at least three bonding bodies arranged at intervals, and the pressure sensor is abutted with the second side of the rigid part, so that the deformation of the force transmission part generated by the pressing force can be transmitted to the rigid part and then to the pressure sensor, and the pressure sensing is realized; the first side of rigidity piece is through the body that bonds and biography power piece looks butt that at least three interval set up, presses down the deformation that biography power piece produced like this and will concentrate the transmission in the position department that the body that bonds is connected to the rigidity piece, then transmits to pressure sensor again on to the deformation loss that pressure sensor sensed diminishes, under the prerequisite that satisfies high sensitivity and triggers, pressure sensor's response area is wider, the regional grow of pressure sensor response pressure promptly.

In one embodiment, the pressure sensor comprises a pressure measurement circuit having at least one resistor, wherein at least one of the resistors is a strain sensitive resistor for detecting deformation of the rigid member.

In one embodiment, the number of the bonding bodies is three, namely a first bonding body, a second bonding body and a third bonding body;

the first bonding body and the third bonding body are respectively positioned at two ends of the rigid piece;

the second bonding body is positioned between the first bonding body and the third bonding body and is positioned in the middle of the rigid piece;

the strain sensing resistor is arranged opposite to the second bonding body.

In one embodiment, the second side of the rigid member is provided with a strain amplifying groove;

the strain sensing resistor is arranged on a notch of the strain amplifying groove.

In one embodiment, the pressure sensor further includes a signal processing circuit, and the signal processing circuit is electrically connected to the pressure measuring circuit and is configured to convert a pressure value obtained by the pressure measuring circuit into an electrical signal, so as to implement pressure sensing.

In one embodiment, the pressure measurement circuit has four resistors, and the pressure measurement circuit is a Wheatstone bridge electrically connected by one of the strain sensing resistors and three reference resistors;

or the pressure measuring circuit is provided with two resistors, and the pressure measuring circuit is a voltage dividing circuit formed by connecting one strain sensing resistor and one reference resistor in series;

or the pressure measuring circuit is provided with two resistors, and the pressure measuring circuit is a shunt circuit formed by connecting one strain sensing resistor and one reference resistor in parallel.

In one embodiment, the pressure measurement circuit has a resistor and a capacitor, and the pressure measurement circuit is an RC series circuit formed by connecting a strain sensitive resistor and a capacitor in series;

or the pressure measuring circuit is provided with a resistor, the pressure measuring circuit is also provided with a capacitor and an inductor, and the pressure measuring circuit is an RLC parallel resonance circuit electrically connected by the strain sensing resistor, the capacitor and the inductor.

In one embodiment, the adhesive body is a colloid.

In one embodiment, the device further comprises a reference pressure sensor abutting the second side of the rigid member;

the reference pressure sensor comprises at least one reference strain sensing resistor;

the included angle between the current direction of the strain sensing resistor and the length direction of the rigid part is 0-30 degrees, and the included angle between the current direction of the reference strain sensing resistor and the length direction of the rigid part is 60-90 degrees.

The embodiment also provides an electronic device comprising the pressure sensing device according to any one of the above embodiments.

According to the technical scheme, the embodiment of the invention has the following beneficial effects: the force transmission piece is connected with the rigid piece, and the pressure sensor is connected with the rigid piece, so that when the force transmission piece is subjected to pressure bending deformation, the rigid piece and the pressure sensor can deform along with the force transmission piece, and the pressure sensor can sense pressure according to the deformation quantity; pass the connection between power piece and the rigidity piece and realize through the body that bonds that at least three interval set up, press like this and pass the deformation that power piece produced and will concentrate the transmission in the position department that the body that bonds is connected to the rigidity piece, then transmit to pressure sensor on to the deformation volume that pressure sensor sensed can increase, and pressure signal can enlarge, and under the prerequisite that satisfies high sensitivity and trigger, pressure sensor's corresponding region is bigger, and pressure sensor responds to pressure's region is bigger promptly.

Drawings

Fig. 1 is a schematic structural diagram of a pressure sensing device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of the pressure sensing device according to the embodiment of the present application after being pressed.

Fig. 3 is a circuit diagram of a wheatstone bridge as a pressure measurement circuit according to an embodiment of the present application.

Fig. 4 is a circuit diagram of a pressure measurement circuit as a voltage divider circuit according to an embodiment of the present application.

Fig. 5 is a circuit diagram of a pressure measurement circuit as a shunt circuit according to an embodiment of the present application.

Fig. 6 is a circuit diagram of the pressure measurement circuit provided in the embodiment of the present application as an RC series circuit.

Fig. 7 is a circuit diagram of the pressure measurement circuit provided in the embodiment of the present application as an RLC parallel resonant circuit.

Fig. 8 is a circuit diagram of a pressure measurement circuit in a bridge oscillation circuit according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of a pressure sensing device provided with a reference pressure sensor according to an embodiment of the present application.

Fig. 10 is a schematic diagram of a reference strain sensing resistor and an arrangement of the strain sensing resistor on a rigid member in a pressure sensing device provided in an embodiment of the present application.

Fig. 11 is a schematic structural diagram of an application of the pressure sensing apparatus provided in the embodiment of the present application to an electronic device.

Fig. 12 is a schematic view of a simple beam structure formed by pressure applied to a pressure sensing device according to an embodiment of the present application.

Description of the drawings: 10. a force transfer member;

20. a rigid member; 21. a first side; 22. a second side;

30. an adhesive body; 31. a first adhesive body; 32. a second adhesive body; 33. a third adhesive body;

40. a strain sensing resistor;

50. a strain amplifying groove;

60. a reference strain sensing resistor;

70. and (6) installing a position.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The embodiment of the application provides a pressure sensing device and electronic equipment, and solves the problem that the pressure sensing area of the existing pressure sensing device is insufficient.

Referring to fig. 1-2, the pressure sensing device provided by the embodiment of the present application includes a force transmission member 10, wherein the force transmission member 10 is configured to be pressed to generate a deformation; the rigid part 20, the rigid part 20 includes a first side 21 and a second side 22 opposite to each other, the first side 21 of the rigid part 20 is abutted against the force transmission part 10 through at least three bonding bodies 30 arranged at intervals, so that the deformation generated when the side of the force transmission part 10 opposite to the rigid part 20 is pressed is transmitted to the rigid part 20; and the pressure sensor is abutted with the second side 22 of the rigid part 20, so that the deformation generated on the first side 21 of the rigid part 20 is transmitted to the pressure sensor to realize pressure sensing.

According to the pressure sensing device provided by the embodiment of the application, the first side 21 of the rigid part 20 is abutted with the force transmission part 10 through at least three bonding bodies 30 arranged at intervals, and the pressure sensor is abutted with the second side 22 of the rigid part 20, so that the deformation of the force transmission part 10 generated by the pressing force is transmitted to the rigid part 20 and then transmitted to the pressure sensor, and the pressure sensing is realized; the first side 21 of the rigid part 20 is abutted to the force transmission part 10 through the bonding bodies 30 arranged at least three intervals, so that deformation generated by pressing the force transmission part 10 is concentrated and transmitted to the position where the rigid part 20 is connected with the bonding bodies 30 and then transmitted to the pressure sensor, and therefore the deformation loss sensed by the pressure sensor is reduced, on the premise that high-sensitivity triggering is met, the response area of the pressure sensor is wider, namely the area of the pressure sensor sensing pressure is increased.

Specifically, the force transmission member 10 in this embodiment may be made of a material with a low dielectric constant, such as a plastic panel, glass, ceramic, or sapphire; the rigid member 20 may be a steel sheet, a copper sheet, an aluminum sheet, a ceramic, a glass, or the like having a certain rigidity, and is weakened in a specific region; the pressure sensor is typically a micro-pressure strain sensor, but it is needless to say that other pressure-sensitive materials such as a wire strain gauge, a silicon wafer strain gauge, a polycrystalline or amorphous semiconductor, a copper-nickel alloy, a carbon nanotube, graphene, FSR, a piezoelectric ceramic, a conductor-insulator composite material, and the like may be used for this structure.

In one embodiment, the pressure sensor optionally comprises a pressure measurement circuit having at least one resistor, wherein the at least one resistor is a strain sensitive resistor 40 for detecting deformation of the rigid member 20. The resistance value of the strain sensitive resistor 40 changes when the strain sensitive resistor 40 is deformed (extended or shortened) by a force, so that when the force transmission member 10 is bent by a pressure, the rigid member 20 is deformed accordingly, and the deformation is transmitted to the strain sensitive resistor 40 to deform the strain sensitive resistor 40, so that the resistance value changes, and thus, a pressure signal is converted into a resistance signal, and a pressure value can be obtained only by measuring the resistance value.

In one embodiment, referring to fig. 1-2, there are three bonds 30, a first bond 31, a second bond 32, and a third bond 33; the first adhesive body 31 and the third adhesive body 33 are respectively positioned at both ends of the rigid member 20; the second adhesive body 32 is positioned between the first adhesive body 31 and the third adhesive body 33, and the second adhesive body 32 is positioned in the middle of the rigid member 20; the strain sensitive resistor 40 is disposed opposite to the second adhesive body 32.

The number of the adhesive bodies 30 in this embodiment is three, and the first adhesive body 31 and the third adhesive body 33 are respectively located at both ends of the rigid member 20; the second bonding body 32 is positioned in the middle of the rigid part 20, the force transmission part 10 and the rigid part 20 are connected into a whole through the second bonding body 32, the force transmission part 10, the first bonding body 31 and the third bonding body 33 form a simple beam structure, the deflection of the force transmission part 10 after being stressed and deformed and the curvature value of the force transmission part 10 after being deformed can be known according to the stress deformation principle of the simple beam structure, the deformation generated by the force transmission part 10 can be transmitted to the pressure sensor, at the moment, the strain sensing resistor 40 can be deformed to change the resistance value, the deformation generated by the stress of the force transmission part 10 can be combined with the resistance change rate generated by the strain sensing resistor 40 according to the strain resistance effect principle, the resistance change rate of the strain sensing resistor 40 is obtained to be in direct proportion to the pressure value borne by the force transmission part 10, and the pressure exerted on the force transmission part 10 can be detected by detecting the resistance change rate of the strain sensing resistor 40, thereby realizing pressure sensing. Because the deformation amount of the middle position of the force transmission piece 10 is the largest when the force transmission piece is bent under pressure, the strain sensing resistor 40 is arranged opposite to the second bonding body 32, so that the deformation of the strain sensing resistor 40 is more obvious and sensitive, and the sensitivity of the pressure sensor for sensing the pressure is higher.

The second adhesive body 32 is located at the middle position of the rigid member 20, specifically, the second adhesive body 32 may be located at the center position of the rigid member 20, or the second adhesive body 32 may be located on the central axis between the two ends of the rigid member 20 where the first adhesive body 31 and the third adhesive body 33 are disposed.

In one embodiment, referring to fig. 1-2, the second side 22 of the rigid member 20 is provided with a strain relief groove 50; the strain sensitive resistor 40 is disposed in the notch of the strain amplifying groove 50. Set up strain amplification groove 50 at second side 22 of rigidity piece 20, strain amplification groove 50 has the effect that the increase is met an emergency, and strain sensing resistor 40 sets up in strain amplification groove 50's notch, like this when rigidity piece 20 produces deformation bending, set up and to produce bigger deformation in strain sensing resistor 40 of strain amplification groove 50 notch for strain sensing resistor 40's resistance change is more obvious, and the pressure measurement circuit can produce output signal, has improved pressure sensor induced pressure's sensitivity.

In one embodiment, the pressure sensor further includes a signal processing circuit, and the signal processing circuit is electrically connected to the pressure measuring circuit and is configured to convert the pressure value obtained by the pressure measuring circuit into an electrical signal to implement pressure sensing.

In one embodiment, referring to fig. 3, the pressure measurement circuit has four resistors, and is a wheatstone bridge electrically connected to three reference resistors R2, R2, R3 by one strain sensitive resistor R1; the Wheatstone bridge outputs differential signals, so that the noise is low and the anti-interference capability is strong; the proportion range of the strain sensing resistor 40 facing the area below the second bonding body 32 is 0% -100%, and the reference resistor can be set arbitrarily; or, the pressure measuring circuit has four resistors, the pressure measuring circuit is a half bridge formed by electrically connecting two strain sensing resistors 40 and two reference resistors, the two strain sensing resistors 40 are aligned and arranged in different proportions in the area below the second adhesive body 32, and the reference resistors can be arbitrarily arranged; alternatively, the pressure measurement circuit has four resistors and is a bridge circuit formed by three strain sensitive resistors 40 electrically connected to a reference resistor. The above solutions can generate a measurement signal by the strain sensitive resistor 40 following the bending deformation of the rigid member 20 when the pressure is transmitted to the rigid member 20, so as to realize pressure sensing.

In one embodiment, referring to fig. 4, the pressure measurement circuit has two resistors, and the pressure measurement circuit is a voltage divider circuit formed by a strain sensitive resistor R2 in series with a reference resistor R1; the constant voltage source is adopted, input voltage Ui is applied to two ends of V + and V-, the potential at Vo is detected, or the output voltage Uo between Vo and the ground is measured, and an input-output voltage formula is provided:the output voltage Uo is detected by means of ADC or voltage measuring instrument, if Ui and R1 are known, the value of the strain sensing resistor R2 can be obtained, the pressure value applied to the strain sensing resistor 40 can be calculated according to the change of the electrical characteristics of the strain sensing resistor 40 after deformation, and the corresponding electrical signal output is obtained through the signal processing circuit, so that pressure identification and detection are realized. When the reference resistor R1 is provided, the reference resistor R1 can be arranged at any position. The strain sensitive resistor 40 is aligned with the area under the second adhesive body 32 in a proportion ranging from 0% to 100%.

In one embodiment, referring to FIG. 5, the pressure measurement circuit has two resistors and is a shunt circuit formed by a strain sensitive resistor R1 in parallel with a reference resistor R2. The constant current source is adopted, the input current I is added at the I + and I-ends, the output current I1 on the branch of the strain sensing resistor R1 is measured, and the input current and the output current are publicFormula (II):the pressure measuring circuit obtains the output current I1, the value of the strain sensing resistor R1 can be obtained by knowing I and R2, the pressure value of the strain sensing resistor 40 can be calculated according to the change of the electrical characteristics of the strain sensing resistor 40 after deformation, and the corresponding electrical signal output is obtained through the signal processing circuit, so that pressure identification and detection are realized. When the reference resistor R2 is provided, the reference resistor R2 can be arranged at any position. The strain sensitive resistor 40 is aligned with the area under the second adhesive body 32 in a proportion ranging from 0% to 100%.

In one embodiment, referring to FIG. 6, the pressure measurement circuit has a resistor and a capacitor, and the pressure measurement circuit is an RC series circuit formed by a strain sensitive resistor R and a capacitor C in series; τ ═ RC. The strain sensing resistor R and the known capacitor C form a series circuit, and a voltage formula of a signal output by the capacitor C is as follows:and (3) obtaining the time tau of the voltage on the capacitor C falling to 1/e of the initial value by detecting the voltage of the output signal of the capacitor C, and further calculating the value of the strain sensing resistor R. According to the change of the electrical characteristics of the strain sensing resistor 40 after deformation, the pressure value of the strain sensing resistor 40 can be calculated, and the corresponding electrical signal output is obtained through the signal processing circuit, so that pressure identification and detection are realized.

In one embodiment, referring to FIG. 7, the pressure measurement circuit has a resistor, a capacitance and an inductance, and the pressure measurement circuit is an RLC parallel resonant circuit electrically connected by a strain sensitive resistor R, a capacitance C and an inductance L. The angular frequency of the RLC parallel resonant circuit is:knowing L and C, the value of the strain sensitive resistance R can be calculated from the measured angular frequency ω according to the above formula.According to the change of the electrical characteristics of the strain sensing resistor 40 after deformation, the pressure value of the strain sensing resistor 40 can be calculated, and the corresponding electrical signal output is obtained through the signal processing circuit, so that pressure identification and detection are realized.

In one embodiment, referring to fig. 8, the pressure measurement circuit may be an RC oscillation circuit, the RC oscillation circuit includes an RC bridge oscillator circuit, an RC phase shift oscillation circuit, and the like, in this embodiment, taking the RC bridge oscillation circuit as an example, the series-parallel circuit of R1C1 and R2C2 forms a frequency selection network and a positive feedback circuit, and RF and R' are connected between the output end and the inverting input end of the operational amplifier to form negative feedback. The RC series-parallel frequency selection network is combined with the amplifier to form an RC oscillating circuit. R1 and R2 in the RC oscillator circuit are strain sensitive resistors 40,when this network resonates:since the frequency fo is very sensitive to the change of the resistance R, R1 and R2 are designed as two resistors with the same initial value and the same change direction, i.e., R1-R2-R, C1-C2-C, at this time,according to the formula, if the capacitance C of the capacitor is known, the resistance value R can be calculated through the measured frequency fo, wherein the calculated resistance value R is the resistance value of the strain sensing resistor 40, the pressure value of the strain sensing resistor 40 can be calculated according to the change of the electrical characteristics of the strain sensing resistor 40 after deformation, and the corresponding electrical signal output is obtained through the signal processing circuit, so that pressure identification and detection are realized.

In one embodiment, the adhesive 30 is a gel. The rigid part 20 and the force transmission part 10 are connected by using glue, so that the assembly is easy, the rigid part 20 and the force transmission part 10 are connected more firmly, and the deformation can be transmitted. The adhesive body 30 may be VHB, double-sided tape, 502 tape, thermosetting tape, UV tape, epoxy film, AB tape, foam adhesive, or the like. The material selection and thickness of these colloids can be determined according to the materials of the force-transmitting member 10 and the rigid member 20.

In one of the embodiments, with reference to fig. 9, the pressure-sensitive device also comprises a reference pressure sensor, which is in abutment with the second side 22 of the rigid element 20; the reference pressure sensor comprises at least one reference strain sensing resistor 60; the angle Q1 between the direction of current flow of the strain sensitive resistor 40 and the length of the rigid member 20 is 0-30 deg., and the angle Q2 between the direction of current flow of the reference strain sensitive resistor 60 and the length of the rigid member 20 is 60-90 deg.. In order to increase the deformation of the strain sensitive resistor 40 and make the change of the strain sensitive resistor 40 more sensitive when the strain amplifying groove 50 is not disposed on the second side 22 of the rigid member 20, the above structure can be adopted, that is, the reference pressure sensor is disposed on the second side 22 of the rigid member 20, and the directions of the reference pressure sensor and the pressure sensor are set to have a certain included angle therebetween, referring to fig. 10, the current directions of the reference strain sensitive resistor 60 and the strain sensitive resistor 40 will have a certain included angle, specifically, the included angle Q1 between the current direction of the strain sensitive resistor 40 and the length direction of the rigid member 20 is 0 to 30 degrees, the included angle Q2 between the current direction of the reference strain sensitive resistor 60 and the length direction of the rigid member 20 is 60 to 90 degrees, and it is of course the most desirable that the current directions of the reference strain sensitive resistor 60 and the strain sensitive resistor 40 are perpendicular to each other, when the force-transmitting member 10 is subjected to a pressure and is bent and deformed downwards, the strain-sensing resistor 40 has a larger variation than the reference strain-sensing resistor 60, and the variation of the strain-sensing resistor 40 can be measured to obtain the pressure value, so as to generate an electrical signal related to the pressure. The reference strain sensing resistor 60 can make the variation of the strain sensing resistor 40 more obvious, and the pressure sensing device with such a structure is simpler to manufacture and has low cost.

For example, referring to fig. 12, a downward force is applied to the force transmission member 10, and assuming that the downward force is centered on the application point of the force transmission member 10, the middle portion of the force transmission member 10 is deformed, and the two ends of the force transmission member 10 are fixed without any deformation, so that the pressure sensing device of the present application is a standard simply supported beam structure.

The deflection of the AC section (X1 is more than or equal to 0 and less than or equal to a) can be known to beThe deflection of the CB section (a is more than or equal to X2 is more than or equal to l)Wherein E is the elastic modulus, and I is the section moment of inertia;

referring to fig. 12, the force point is centered, i.e., a ═ b ═ l/2; x1 ═ X2 ═ X ═ a.

So that the beam has a deflection of

Corner is

Curvature of

Wherein h is the thickness of the rigid member 20;

the strain sensitive resistor 40 has a resistance change rate ofWherein K is the strain coefficient;

therefore, the resistance change rate (pressure electric signal) is in direct proportion to the value F (pressure), and the pressure applied to the force transmission piece 10 can be detected by detecting the resistance change rate of the pressure sensor, so that the pressure sensing is realized.

An embodiment of the present application further provides an electronic device, including the pressure sensing device in any of the above embodiments.

Referring to fig. 11, the electronic device is provided with a mounting location 70 for mounting a pressure sensing device, when the pressure sensing device is mounted on the electronic device, two ends of the force transmission member 10 are fixed on the mounting location 70, so that when a user presses the force transmission member 10, because two ends of the force transmission member 10 are fixed, the force transmission member 10 is bent, a displacement M of downward bending deformation at a position M of the force transmission member 10 corresponding to the end bonding body 30 is smaller than a displacement N of downward bending deformation at a middle position N of the force transmission member 10, a displacement of bending deformation between the M position and the N position of the force transmission member 10 forms a relative displacement N-M, a pressing force applied to the force transmission member 10 is transmitted to the strain sensing resistor 40 through the rigid member 20 to deform the strain sensing resistor 40, so that the pressure measuring circuit detects an electrical signal of a pressure at the middle position D of the rigid member 20, and obtains a displacement D of bending deformation at the middle position D of the rigid member 20 according to the electrical signal of the pressure, namely, the relative displacement N-M formed by the bending deformation displacement between the M position and the N position of the force transmission piece 10, and the relative displacement N-M formed by the bending deformation displacement between the M position and the N position of the force transmission piece 10 is in direct proportion to the pressure applied to the force transmission piece 10, so that the relative displacement N-M formed by the bending deformation displacement between the M position and the N position of the force transmission piece 10 can be obtained by detecting the pressure electric signal at the middle position D of the rigid piece 20, the pressure value applied to the force transmission piece 10 is obtained, and the pressure sensing is realized.

When the force transmission piece 10 is bent and deformed, the strain sensing resistor 40 is greatly deformed, and at the moment, the pressure measurement circuit can generate an output signal. The pressure sensing device is easy to manufacture and assemble, compact in structure, capable of realizing pressure identification and detection, high in sensitivity, and capable of avoiding the conditions of extremely high requirement, low pressure detection precision and high manufacturing cost of the existing pressure sensor assembling method. The pressure sensing device is arranged in the electronic equipment, so that the ability of accurately identifying the touch pressure can be increased for the electronic equipment, the user experience of the electronic equipment is increased, and the functional application of products is expanded. The electronic equipment with the pressure sensing device does not need high-precision installation requirements, and is simple in structure, low in cost, convenient to install and wide in application range.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.