阅读说明：本技术 介质通信器件及其制备方法和用于其制备的同心度定位工装 (Medium communication device, preparation method thereof and concentricity positioning tool for preparing medium communication device ) 是由 黄名政 于 2021-09-06 设计创作，主要内容包括：本发明提供了一种介质通信器件及其制备方法和用于其制备的同心度定位工装,涉及通信器材制备技术领域。所述介质通信器件包括第一部件和第二部件；所述第一部件与第二部件层叠设置且接触面与水平面平行,所述第一部件与第二部件两者相抵接并通过粘结材料连接。上述介质通信器件通过粘结材料粘结的方式将第一部件与第二部件层叠结合,具有结构简单,可靠性强的优势,可以广泛应用于微波通信器件的制备过程中。(The invention provides a medium communication device, a preparation method thereof and a concentricity positioning tool for preparing the medium communication device, and relates to the technical field of communication device preparation. The media communication device comprises a first component and a second component; the first component and the second component are stacked, the contact surface of the first component and the contact surface of the second component are parallel to the horizontal plane, and the first component and the second component are abutted and connected through an adhesive material. The dielectric communication device combines the first component and the second component in a laminating way through the bonding of the bonding material, has the advantages of simple structure and strong reliability, and can be widely applied to the preparation process of the microwave communication device.)

1. A media communication device, comprising a first component and a second component;

the first component and the second component are stacked, the contact surface of the first component and the contact surface of the second component are parallel to the horizontal plane, and the first component and the second component are abutted and connected through an adhesive material.

2. A media communication device according to claim 1, wherein the first member has a larger volumetric shape than the second member;

the first component is provided with a plate surface A and a plate surface B which are arranged oppositely, the plate surface B faces the second component, and the bonding material is arranged on the plate surface B;

the second part has face C towards the first part and face D of setting back on the back rather than the back of the body, face C is connected through bonding material with face B, and face B's area is greater than face C.

3. A media communication device according to claim 1, wherein the first member has a regular facade that is one of circular or rectangular, the first member having a board a and a board B that are parallel to a horizontal plane;

the second part is provided with a regular outer vertical surface, the outer vertical surface is one of a cylinder or a rectangle, and the plate surface C and the plate surface D of the second part are parallel to the horizontal plane;

the second component is vertically provided with a through hole for positioning.

4. A dielectric communication device according to claim 1, wherein the adhesive material comprises one of silver paste, EP138 glue or SE4450 glue, preferably EP138 glue.

5. A concentricity positioning tool for preparing a medium communication device according to any one of claims 1 to 4, which is characterized by comprising a positioning tool body;

the positioning tool body is provided with a groove, and the volume shape of the groove is matched with the volume shape of the first component and the second component which are arranged in a stacked mode; a positioning pin is arranged in the center of the groove; the positioning pin is matched with a through hole vertically arranged on the second component.

6. A method for manufacturing a dielectric communication device according to any of claims 1 to 4, wherein the method comprises the steps of:

(a) the second component is sleeved on a locating pin of the locating tool through a vertical through hole arranged on the second component;

the surface D of the second component faces downwards, and the outer vertical surface of the second component is matched with the groove of the positioning tool;

(b) providing a first component, arranging a bonding material on a plate surface B, and then bonding the first component and a second component through a positioning tool, wherein the plate surface B faces the second component to obtain an intermediate A;

(c) and curing the intermediate A at high temperature to obtain the medium communication device.

7. The method for manufacturing a dielectric communication device according to claim 6, wherein the step (B) comprises disposing the adhesive material on the board B by screen printing;

preferably, the printing glue area of the screen printing is smaller than the area to be bonded of the board surface B.

8. The method for manufacturing a media communication device according to claim 7, wherein the screen printing has a mesh number of 50 to 150 mesh.

9. The method for manufacturing a dielectric communication device according to claim 6, wherein the temperature of the high-temperature curing in the step (c) is 105 to 165 ℃ for 30 to 120 min.

10. Use of a dielectric communication device according to any of claims 1 to 4 in the manufacture of a microwave communication device;

preferably, the microwave communication device includes one of a dielectric resonator, a dielectric filter, a dielectric antenna, a dielectric duplexer, and a multiplexer.

Technical Field

The invention relates to the technical field of communication equipment preparation, in particular to a medium communication device, a preparation method thereof and a concentricity positioning tool for preparing the medium communication device.

Background

With the miniaturization development of 5g base stations, microwave communication ceramic devices are also rapidly developed, and more typical communication ceramic devices comprise communication ceramic filters and dielectric resonators. Compared with the traditional metal cavity device, the microwave communication ceramic device has the advantages of small volume, high frequency selectivity, high quality factor, low temperature drift coefficient, small insertion loss and the like. The microwave communication device is composed of a plurality of parts, so the bonding combination among the parts is particularly important, wherein, the parts are generally bonded with each other in a concentric manner through the glue effect.

In order to ensure the concentricity of all parts in the preparation stage of a prototype and improve the reliability of product performance, a concentricity bonding process and a positioning tool of a communication device are urgently needed to be designed so as to improve the reliability of the product performance of the prepared prototype, and the concentricity bonding process becomes necessary and urgent.

In view of the above, the present invention is particularly proposed.

Disclosure of Invention

The invention aims to provide a preparation method of a medium communication device and a processing and positioning tool thereof.

In order to achieve the above purpose of the present invention, the following technical solutions are adopted:

the invention provides a medium communication device, which comprises a first part and a second part;

the first component and the second component are stacked, the contact surface of the first component and the contact surface of the second component are parallel to the horizontal plane, and the first component and the second component are abutted and connected through an adhesive material.

Further, the first part is larger in volume shape than the second part; the first component is provided with a plate surface A and a plate surface B which are arranged oppositely, the plate surface B faces the second component, and the bonding material is arranged on the plate surface B;

the second part has face C towards the first part and face D of setting back on the back rather than the back of the body, face C is connected through bonding material with face B, and face B's area is greater than face C.

Further, the first part is provided with a regular outer vertical surface, the outer vertical surface is one of a circle or a rectangle, and the plate surface A and the plate surface B of the first part are parallel to the horizontal plane;

the second part is provided with a regular outer vertical surface, the outer vertical surface is one of a cylinder or a rectangle, and the plate surface C and the plate surface D of the second part are parallel to the horizontal plane;

the second component is vertically provided with a through hole for positioning.

Further, the bonding material comprises one of silver paste, EP138 glue or SE4450 glue, preferably EP138 glue.

The concentricity positioning tool for preparing the medium communication device comprises a positioning tool body;

the positioning tool body is provided with a groove, and the volume shape of the groove is matched with the volume shape of the first component and the second component which are arranged in a stacked mode; a positioning pin is arranged in the center of the groove; the positioning pin is matched with a through hole vertically arranged on the second component.

The invention provides a preparation method of the medium communication device, which comprises the following steps:

(a) the second component is sleeved on a locating pin of the locating tool through a vertical through hole arranged on the second component;

the surface D of the second component faces downwards, and the outer vertical surface of the second component is matched with the groove of the positioning tool;

(b) providing a first component, arranging a bonding material on a plate surface B, and then bonding the first component and a second component through a positioning tool, wherein the plate surface B faces the second component to obtain an intermediate A;

(c) and curing the intermediate A at high temperature to obtain the medium communication device.

Further, in the step (B), a bonding material is arranged on the board surface B by adopting a screen printing method;

preferably, the printing glue area of the screen printing is smaller than the area to be bonded of the board surface B.

Furthermore, the screen printing mesh number of the screen printing is 50-150 meshes.

Further, the temperature of high-temperature curing in the step (c) is 105-165 ℃, and the time is 30-120 min.

The invention provides an application of the medium communication device in the preparation of microwave communication devices;

preferably, the microwave communication device includes one of a dielectric resonator, a dielectric filter, a dielectric antenna, a dielectric duplexer, and a multiplexer.

Compared with the prior art, the invention has the beneficial effects that:

the invention provides a medium communication device, which comprises a first part and a second part; the first component and the second component are stacked, the contact surface of the first component and the contact surface of the second component are parallel to the horizontal plane, and the first component and the second component are abutted and connected through an adhesive material. The medium communication device combines the first component and the second component in a laminating way through bonding materials, and has the advantages of simple structure and strong reliability.

The concentricity positioning tool for preparing the medium communication device is characterized in that a groove is formed in a body of the concentricity positioning tool, and the volume shape of the groove is matched with the volume shape of a first part and a second part which are stacked; a positioning pin is arranged in the center of the groove; the positioning pin is matched with a through hole vertically arranged on the second component. The positioning tool positions the first component and the second component through the grooves which are arranged on the body and matched with the volume shapes of the first component and the second component, so that the concentricity and the reliability of the medium communication device are guaranteed.

The invention provides a preparation method of a medium communication device, which comprises the following steps of firstly, sleeving a second component on a positioning pin of a positioning tool through a vertical through hole arranged on the second component, wherein the plate surface D of the second component faces downwards; then, arranging a bonding material on a plate surface B of the first component, and bonding the first component and the second component through a positioning tool, wherein the plate surface B faces the second component to obtain an intermediate A; and then curing the intermediate A at high temperature to obtain the medium communication device. The preparation method has the advantages of simple preparation process and easy operation, and can effectively ensure the concentricity of the medium communication device.

The medium communication device provided by the invention can be widely applied to the preparation process of microwave communication devices.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic diagram of a glue pattern for screen printing provided in embodiment 1 of the present invention; the printing area is a polyester net; wherein, a is a printing area inner ring, and b is a printing area outer ring;

fig. 2 is a schematic structural view of a first part and a second part in a dielectric resonator provided in embodiment 1 of the present invention;

fig. 3 is a schematic structural view of a dielectric resonator provided in embodiment 1 of the present invention after a first member and a second member are bonded;

fig. 4 is a schematic structural view of a concentricity positioning tool provided in embodiment 1 of the present invention.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

According to one aspect of the present invention, a media communication device comprises a first component and a second component;

the first component and the second component are stacked, the contact surface of the first component and the contact surface of the second component are parallel to the horizontal plane, and the first component and the second component are abutted and connected through an adhesive material.

The invention provides a medium communication device, which comprises a first part and a second part; the first component and the second component are stacked, the contact surface of the first component and the contact surface of the second component are parallel to the horizontal plane, and the first component and the second component are abutted and connected through an adhesive material. The medium communication device combines the first component and the second component in a laminating way through bonding materials, and has the advantages of simple structure and strong reliability.

In a preferred embodiment of the present invention, the first member has a larger volume than the second member, the first member has a plate surface a and a plate surface B which are oppositely arranged, the plate surface B faces the second member, and the adhesive material is arranged on the plate surface B;

the second part has face C towards the first part and face D of setting back on the back rather than the back of the body, face C is connected through bonding material with face B, and face B's area is greater than face C.

In a preferred embodiment of the invention, the first member has a regular outer facade, the outer facade being one of circular or rectangular, the first member's panel a and panel B being parallel to a horizontal plane;

the second part is provided with a regular outer vertical surface, the outer vertical surface is one of a cylinder or a rectangle, and the plate surface C and the plate surface D of the second part are parallel to the horizontal plane;

in a preferred embodiment, the first component and the second component both have regular outer vertical surfaces to be matched with the positioning tool to fix the first component and the second component.

In a preferred embodiment of the invention, the second part is vertically provided with a through-going hole for positioning.

In a preferred embodiment of the invention, the bonding material comprises one of a silver paste, EP138 glue or SE4450 glue, preferably EP138 glue.

According to one aspect of the invention, the concentricity positioning tool for preparing the medium communication device comprises a positioning tool body;

the positioning tool body is provided with a groove, and the volume shape of the groove is matched with the volume shape of the first component and the second component which are arranged in a stacked mode; a positioning pin is arranged in the center of the groove; the positioning pin is matched with a through hole vertically arranged on the second component.

The concentricity positioning tool for preparing the medium communication device is characterized in that a groove is formed in a body of the concentricity positioning tool, and the volume shape of the groove is matched with the volume shape of a first part and a second part which are stacked; a positioning pin is arranged in the center of the groove; the positioning pin is matched with a through hole vertically arranged on the second component. The positioning tool positions the first component and the second component through the grooves which are arranged on the body and matched with the volume shapes of the first component and the second component, so that the concentricity and the reliability of the medium communication device are guaranteed.

According to an aspect of the present invention, a method for manufacturing the above-mentioned medium communication device, the method for manufacturing includes the steps of:

(a) the second component is sleeved on a locating pin of the locating tool through a vertical through hole arranged on the second component;

the surface D of the second component faces downwards, and the outer vertical surface of the second component is matched with the groove of the positioning tool;

(b) providing a first component, arranging a bonding material on a plate surface B, and then bonding the first component and a second component through a positioning tool, wherein the plate surface B faces the second component to obtain an intermediate A;

(c) and curing the intermediate A at high temperature to obtain the medium communication device.

The invention provides a preparation method of a medium communication device, which comprises the following steps of firstly, sleeving a second component on a positioning pin of a positioning tool through a vertical through hole arranged on the second component, wherein the plate surface D of the second component faces downwards; then, arranging a bonding material on a plate surface B of the first component, and bonding the first component and the second component through a positioning tool, wherein the plate surface B faces the second component to obtain an intermediate A; and then curing the intermediate A at high temperature to obtain the medium communication device. The preparation method has the advantages of simple preparation process and easy operation, and can effectively ensure the concentricity of the medium communication device.

Preferably, the electrical properties of the dielectric communication device prepared by the method are as follows: a dielectric constant of 8 to 80 and a quality factor of 5000 to 120000 GHZ.

In a preferred embodiment of the present invention, in the step (B), the bonding material is disposed on the board surface B by using a screen printing method;

in a preferred embodiment, the adhesive material is disposed on the plate surface B by screen printing, which has advantages of low cost, simple operation, high concentricity, and the like, compared to other coating methods.

In a preferred embodiment of the invention, the area of the screen-printed printing paste is smaller than the area of the board surface B to be bonded.

As a preferred embodiment, the printing glue area of the screen printing is smaller than the area to be bonded of the board surface B, so that the glue overflow phenomenon can be effectively prevented.

In a preferred embodiment of the present invention, the screen printing has a mesh number of 50 to 150.

In a preferred embodiment, the screen printing has a mesh number of 50 to 150 mesh, and the screen printing is performed at the mesh number, so that the occurrence of screen clogging can be effectively avoided.

In a preferred embodiment of the present invention, the temperature of the high temperature curing in step (c) is 105 to 165 ℃ for 30 to 120 min.

In a preferred embodiment, the high temperature curing is performed at 120 ℃ for 1.5 hours.

According to one aspect of the invention, a use of a dielectric communication device as described above for the manufacture of a microwave communication device.

The medium communication device provided by the invention can be widely applied to the preparation process of microwave communication devices.

Preferably, the microwave communication device includes one of a dielectric resonator, a dielectric filter, a dielectric antenna, a dielectric duplexer, and a multiplexer.

The technical solution of the present invention will be further described with reference to the following examples.

Note: the glue used for screen printing in the embodiment of the application is EP 138.

Example 1

FIG. 1 is a schematic diagram of a glue pattern for screen printing according to the present embodiment; the printing area is a polyester net, wherein a is an inner ring of the printing area, and b is an outer ring of the printing area;

fig. 2 is a schematic structural diagram of a first part and a second part in the dielectric resonator of the present embodiment;

fig. 3 is a schematic structural diagram of the dielectric resonator of the present embodiment after the first part and the second part are bonded;

fig. 4 is a schematic structural view of the concentricity positioning tool in this embodiment.

As shown in fig. 1 to 4, a method for manufacturing a dielectric resonator includes the following steps:

(1) centrifugally stirring the glue to be bonded for use, wherein the environment is vacuum, 1250r/min, and the positive and negative are alternated for 5 min;

(2) the second component is sleeved on a locating pin of the locating tool through a vertical through hole arranged on the second component; the surface D of the second component faces downwards, and the outer vertical surface of the second component is matched with the groove of the positioning tool;

then, printing glue on the area to be printed on the board surface C of the second component by a screen printing technology;

(3) providing a first component, and then bonding the first component and a second component through a positioning tool, wherein the plate surface B faces the second component to obtain an intermediate A;

(4) and curing the intermediate A at the high temperature of 150 ℃ for 120min to realize the bonding between the dielectric resonators.

Example 2

A method of making a dielectric communication device, the method comprising the steps of:

(1) centrifugally stirring the glue to be bonded for use, wherein the environment is vacuum and 1000r/min, and the positive and negative sides are alternated for 10 min;

(2) the second component is sleeved on a locating pin of the locating tool through a vertical through hole arranged on the second component;

the surface D of the second component faces downwards, and the outer vertical surface of the second component is matched with the groove of the positioning tool;

(3) providing a first component, and then printing glue on an area to be printed on the board surface B of the first component by a screen printing technology; the screen printing mesh number of the screen printing is 50 meshes.

(4) Then, the first component and the second component are bonded through a positioning tool, and the plate surface B faces the second component to obtain an intermediate A;

(5) and curing the intermediate A at the high temperature of 120 ℃ for 100min to realize the bonding between the medium communication devices.

Example 3

A method of making a dielectric communication device, the method comprising the steps of:

(1) centrifugally stirring the glue to be bonded for use, wherein the environment is vacuum and 1500r/min, and the positive and negative sides are alternated for 10 min;

(2) the second component is sleeved on a locating pin of the locating tool through a vertical through hole arranged on the second component;

the surface D of the second component faces downwards, and the outer vertical surface of the second component is matched with the groove of the positioning tool;

(3) providing a first component, and then printing glue on an area to be printed on the board surface B of the first component by a screen printing technology; the number of the printing meshes of the silk-screen printing is 150 meshes;

(4) then, the first component and the second component are bonded through a positioning tool, and the plate surface B faces the second component to obtain an intermediate A;

(5) and curing the intermediate A at a high temperature of 165 ℃ for 60min to realize the bonding between the medium communication devices.

Example 4

A method of making a dielectric communication device, the method comprising the steps of:

(1) centrifugally stirring the glue to be bonded for use, wherein the environment is vacuum, 1250r/min, and the positive and negative are alternated for 5 min;

(2) the second component is sleeved on a locating pin of the locating tool through a vertical through hole arranged on the second component;

the surface D of the second component faces downwards, and the outer vertical surface of the second component is matched with the groove of the positioning tool;

(3) providing a first component, and then printing glue on an area to be printed on the board surface B of the first component by a screen printing technology; the number of the printing meshes of the silk-screen printing is 100 meshes;

(4) then, the first component and the second component are bonded through a positioning tool, and the plate surface B faces the second component to obtain an intermediate A;

(5) and curing the intermediate A at the high temperature of 150 ℃ for 80min to realize the bonding between the medium communication devices.

Experimental example 1

And (3) carrying out high-low temperature cycle test on the bonded first part and the bonded second part, wherein the temperature is-40-120 ℃, and the cycle number is set to be 3.

The bonded first member and second member were subjected to concentricity measurement, and the concentricity was 0.05mm to 0.1 mm. Meanwhile, the bonded first component and second component are subjected to electrical property detection (temperature drift and Q value), and the performance is good.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.