阅读说明：本技术 显示装置及其制造方法 (Display device and method for manufacturing the same ) 是由 刘昌� 王佳祥 林新琦 杨杰 李雅琪 冯彬峰 王艳丽 于 2021-07-28 设计创作，主要内容包括：本公开关于一种显示装置及其制造方法,涉及显示技术领域。本公开的显示装置包括显示面板、支撑层、电路板和屏蔽层。支撑层设于显示面板的背光侧,支撑层为导电材质。电路板设于支撑层背离显示面板的一侧,且与显示面板电连接。屏蔽层覆盖于电路板背离显示面板的一侧,且包括沿背离显示面板的方向分布的第一绝缘层和导电层；导电层包括电连接的屏蔽部和引出部,第一绝缘层露出引出部的至少部分区域；屏蔽部在显示面板上的正投影位于电路板在显示面板上的正投影以内,引出部在显示面板上的正投影位于电路板在显示面板上的正投影以外,引出部与支撑层电连接。本公开的显示装置可屏蔽静电干扰。(The disclosure relates to a display device and a manufacturing method thereof, and relates to the technical field of display. The display device of the present disclosure includes a display panel, a support layer, a circuit board, and a shielding layer. The supporting layer is arranged on the backlight side of the display panel and made of conductive materials. The circuit board is arranged on one side of the supporting layer, which deviates from the display panel, and is electrically connected with the display panel. The shielding layer covers one side of the circuit board, which is far away from the display panel, and comprises a first insulating layer and a conducting layer which are distributed along the direction far away from the display panel; the conductive layer comprises a shielding part and a lead-out part which are electrically connected, and the first insulating layer exposes at least partial region of the lead-out part; the orthographic projection of the shielding part on the display panel is positioned within the orthographic projection of the circuit board on the display panel, the orthographic projection of the lead-out part on the display panel is positioned outside the orthographic projection of the circuit board on the display panel, and the lead-out part is electrically connected with the supporting layer. The display device of the present disclosure can shield electrostatic interference.)

1. A display device, comprising:

a display panel;

the supporting layer is arranged on the backlight side of the display panel and is made of a conductive material;

the circuit board is arranged on one side, away from the display panel, of the supporting layer and is electrically connected with the display panel;

the shielding layer covers one side of the circuit board, which is far away from the display panel, and comprises a first insulating layer and a conducting layer which are distributed along the direction far away from the display panel; the conductive layer comprises a shielding part and a lead-out part which are electrically connected, and the first insulating layer exposes at least partial region of the lead-out part; the orthographic projection of the shielding part on the display panel is positioned within the orthographic projection of the circuit board on the display panel, the orthographic projection of the lead-out part on the display panel is positioned outside the orthographic projection of the circuit board on the display panel, and the lead-out part is electrically connected with the supporting layer.

2. The display device according to claim 1, wherein an orthogonal projection of the first insulating layer on the display panel is located within an orthogonal projection of the circuit board on the display panel;

an orthographic projection of the lead-out portion on the display panel is located outside an orthographic projection of the first insulating layer on the display panel.

3. The display device according to claim 1, wherein the circuit board comprises:

a substrate;

the circuit layer is arranged on one side, close to the display panel, of the substrate; the circuit layer is provided with a static electricity leading-out part, and the orthographic projection of the static electricity leading-out part on the display panel is at least partially overlapped with the orthographic projection of the supporting layer on the display panel;

a protective layer covering the circuit layer and exposing the static electricity lead-out part;

the static electricity lead-out part is electrically connected with the supporting layer.

4. The display device according to claim 1, wherein a material of the conductive layer includes at least one of a conductive paste and a conductive fabric.

5. The display device according to any one of claims 1 to 4, wherein the shielding layer further comprises:

and the second insulating layer is arranged on the surface of the conducting layer, which deviates from the display panel, and covers the shielding part and the leading-out part.

6. The display device according to any one of claims 1 to 4, wherein the shielding layer further comprises:

the wave-absorbing layer is arranged between the conducting layer and the first insulating layer, the orthographic projection of the wave-absorbing layer on the display panel is located within the orthographic projection of the first insulating layer on the display panel, and the wave-absorbing layer is made of wave-absorbing materials capable of absorbing electromagnetic waves.

7. A display device as claimed in claim 6, characterised in that the wave-absorbing material comprises graphite.

8. The display device according to claim 6, wherein the shielding layer further comprises:

the heat dissipation layer is arranged between the wave absorbing layer and the conducting layer, and the orthographic projection of the heat dissipation layer on the display panel is located within the orthographic projection of the first insulating layer on the display panel.

9. The display device according to claim 8, wherein a material of the heat dissipation layer comprises copper.

10. The display device according to claim 2, wherein the display panel has a display area and a peripheral area outside the display area; the display panel comprises a driving backboard and a light-emitting layer positioned on one side of the driving backboard, and the light-emitting layer is positioned in the display area;

the display device further includes:

one end of the flexible connecting circuit board is laminated in the area, close to the surface of the light emitting layer, of the driving back plate, located in the peripheral area, and is electrically connected with the driving back plate; the other end is bent to one side of the supporting layer, which is far away from the circuit board, and is electrically connected with the circuit board.

11. The display device according to claim 10, wherein a distance between the lead-out portion and the support layer is smaller than a distance between the shield portion and the support layer.

12. The display device according to claim 11, wherein the conductive layer at the lead-out portion is directly attached to the support layer or is electrically connected to the support layer through a conductive medium.

13. A method of manufacturing a display device, comprising:

forming a display panel, a circuit board and a shielding layer; the shielding layer comprises a first insulating layer and a conducting layer positioned on one side of the first insulating layer; the conductive layer comprises a shielding part and a lead-out part which are electrically connected, and the first insulating layer exposes at least partial region of the lead-out part;

forming a support layer on a backlight side of the display panel;

electrically connecting the circuit board with the display panel and placing the circuit board on the backlight side of the display panel;

covering the shielding layer on one side of the circuit board, which is far away from the display panel, so that the first insulating layer and the conductive layer are distributed along the direction, which is far away from the display panel, the orthographic projection of the shielding part on the display panel is positioned within the orthographic projection of the circuit board on the display panel, and the orthographic projection of the leading-out part on the display panel is positioned outside the orthographic projection of the circuit board on the display panel;

and electrically connecting the lead-out part with the support layer.

Technical Field

The disclosure relates to the technical field of display, in particular to a display device and a manufacturing method thereof.

Background

At present, in order to reduce the width of the frame of the display panel, a circuit board for driving the display panel is generally disposed on the back side of the display panel, so that a space for disposing the circuit board at the edge of the display panel is omitted, and the width of the frame is reduced. However, the circuit board is provided with a circuit including electronic devices and traces, which is easily interfered by static electricity and affects normal display.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

An object of the present disclosure is to provide a display device and a method of manufacturing the same.

According to an aspect of the present disclosure, there is provided a display device including:

a display panel;

the supporting layer is arranged on the backlight side of the display panel and is made of a conductive material;

the circuit board is arranged on one side, away from the display panel, of the supporting layer and is electrically connected with the display panel;

the shielding layer covers one side of the circuit board, which is far away from the display panel, and comprises a first insulating layer and a conducting layer which are distributed along the direction far away from the display panel; the conductive layer comprises a shielding part and a lead-out part which are electrically connected, and the first insulating layer exposes at least partial region of the lead-out part; the orthographic projection of the shielding part on the display panel is positioned within the orthographic projection of the circuit board on the display panel, the orthographic projection of the lead-out part on the display panel is positioned outside the orthographic projection of the circuit board on the display panel, and the lead-out part is electrically connected with the supporting layer.

In an exemplary embodiment of the present disclosure, an orthogonal projection of the first insulating layer on the display panel is located within an orthogonal projection of the circuit board on the display panel;

an orthographic projection of the lead-out portion on the display panel is located outside an orthographic projection of the first insulating layer on the display panel.

In an exemplary embodiment of the present disclosure, the circuit board includes:

a substrate;

the circuit layer is arranged on one side, close to the display panel, of the substrate; the circuit layer is provided with a static electricity leading-out part, and the orthographic projection of the static electricity leading-out part on the display panel is at least partially overlapped with the orthographic projection of the supporting layer on the display panel;

a protective layer covering the circuit layer and exposing the static electricity lead-out part;

the static electricity lead-out part is electrically connected with the supporting layer.

In an exemplary embodiment of the present disclosure, a material of the conductive layer includes at least one of a conductive adhesive and a conductive fabric.

In an exemplary embodiment of the present disclosure, the shielding layer further includes:

and the second insulating layer is arranged on the surface of the conducting layer, which deviates from the display panel, and covers the shielding part and the leading-out part.

In an exemplary embodiment of the present disclosure, the shielding layer further includes:

the wave-absorbing layer is arranged between the conducting layer and the first insulating layer, the orthographic projection of the wave-absorbing layer on the display panel is located within the orthographic projection of the first insulating layer on the display panel, and the wave-absorbing layer is made of wave-absorbing materials capable of absorbing electromagnetic waves.

In an exemplary embodiment of the present disclosure, the wave-absorbing material comprises graphite.

In an exemplary embodiment of the present disclosure, the shielding layer further includes:

the heat dissipation layer is arranged between the wave absorbing layer and the conducting layer, and the orthographic projection of the heat dissipation layer on the display panel is located within the orthographic projection of the first insulating layer on the display panel.

In an exemplary embodiment of the present disclosure, the material of the heat dissipation layer includes copper.

In an exemplary embodiment of the present disclosure, the display panel has a display area and a peripheral area located outside the display area; the display panel comprises a driving backboard and a light-emitting layer positioned on one side of the driving backboard, and the light-emitting layer is positioned in the display area;

the display device further includes:

one end of the flexible connecting circuit board is laminated in the area, close to the surface of the light emitting layer, of the driving back plate, located in the peripheral area, and is electrically connected with the driving back plate; the other end is bent to one side of the supporting layer, which is far away from the circuit board, and is electrically connected with the circuit board.

In an exemplary embodiment of the present disclosure, a distance between the lead-out portion and the support layer is smaller than a distance between the shielding portion and the support layer.

In an exemplary embodiment of the present disclosure, the conductive layer at the lead-out portion is directly attached to the support layer or electrically connected to the support layer through a conductive medium.

According to an aspect of the present disclosure, there is provided a method of manufacturing a display device, including:

forming a display panel, a circuit board and a shielding layer; the shielding layer comprises a first insulating layer and a conducting layer positioned on one side of the first insulating layer; the conductive layer comprises a shielding part and a lead-out part which are electrically connected, and the first insulating layer exposes at least partial region of the lead-out part;

forming a support layer on a backlight side of the display panel;

electrically connecting the circuit board with the display panel and placing the circuit board on the backlight side of the display panel;

covering the shielding layer on one side of the circuit board, which is far away from the display panel, so that the first insulating layer and the conductive layer are distributed along the direction, which is far away from the display panel, the orthographic projection of the shielding part on the display panel is positioned within the orthographic projection of the circuit board on the display panel, and the orthographic projection of the leading-out part on the display panel is positioned outside the orthographic projection of the circuit board on the display panel;

and electrically connecting the lead-out part with the support layer.

According to the display device and the manufacturing method thereof, the shielding layer covers one side of the circuit board, which is far away from the display panel, the first insulating layer is located between the conducting layer and the circuit board, the conducting layer is electrically connected with the supporting layer, static electricity can be led out to the supporting layer through the conducting layer, a path of conducting the external static electricity of the display device to the circuit board is blocked through the conducting layer and the supporting layer, the circuit board is prevented from being interfered by the external static electricity, abnormal display caused by the fact that the display device is interfered by the static electricity is avoided, and the display effect is guaranteed. Meanwhile, the leading-out part of the conducting layer is positioned on the outer side of the circuit board and is opposite to the supporting layer, so that the requirement on positioning precision is low, and the installation is convenient.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

Fig. 1 is a schematic cross-sectional view of an embodiment of a display device according to the present disclosure.

Fig. 2 is a schematic diagram of a backlight side of a display panel according to an embodiment of the display device of the disclosure.

Fig. 3 is a schematic cross-sectional view of another embodiment of a display device according to the present disclosure.

Fig. 4 is a schematic cross-sectional view of yet another embodiment of a display device of the present disclosure.

Fig. 5 is a schematic cross-sectional view of another embodiment of a display device according to the present disclosure.

Fig. 6 is a schematic diagram of a circuit board in an embodiment of a display device according to the present disclosure.

Description of reference numerals:

1. a display panel; 11. driving the back plate; 12. a light emitting layer; 101. a display area; 102. a peripheral region;

2. a support layer;

3. a circuit board; 31. a substrate; 32. a circuit layer; 321. a static electricity lead-out part; 33. a protective layer;

4. a flexible connection circuit board;

5. a shielding layer; 51. a first insulating layer; 52. a conductive layer; 521. a shielding part; 522. a lead-out section; 53. a second insulating layer; 54. a wave-absorbing layer; 55. a heat dissipation layer;

6. a conductive medium.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted. Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale.

The terms "a," "an," "the," "said," and "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.

The disclosed embodiments provide a display device, which can be used for electronic devices with a display function, such as mobile phones, tablet computers, televisions, and the like. As shown in fig. 1 to 5, the display device may include a display panel 1, a support layer 2, a circuit board 3, and a shield layer 5, wherein:

the supporting layer 2 is arranged on the backlight side of the display panel 1, and the supporting layer 2 is made of a conductive material;

the circuit board 3 is arranged on one side of the support layer 2, which is far away from the display panel 1, and is connected with the display panel 1;

the shielding layer 5 covers one side of the circuit board 3 departing from the display panel 1, and comprises a first insulating layer 51 and a conductive layer 52 which are distributed along the direction departing from the display panel 1; the conductive layer 52 includes a shield 521 and a lead-out portion 522 electrically connected, and the first insulating layer 51 exposes at least a partial region of the lead-out portion 522; the orthographic projection of the shielding part 521 on the display panel 1 is positioned within the orthographic projection of the circuit board 3 on the display panel 1, the orthographic projection of the lead-out part 522 on the display panel 1 is positioned outside the orthographic projection of the circuit board 3 on the display panel 1, and the lead-out part 522 is electrically connected with the support layer 2.

In the display device of the embodiment of the present disclosure, the circuit board 3 is used to drive the display panel 1 to emit light to display an image. Because the shielding layer 5 covers one side of the circuit board 3 departing from the display panel 1, the first insulating layer 51 is located between the conductive layer 52 and the circuit board 3, and the conductive layer 52 is electrically connected with the supporting layer 2, static electricity can be led out to the supporting layer 2 through the conductive layer 52, and a path for conducting external static electricity of the display device to the circuit board 3 is blocked by the conductive layer 52 and the supporting layer 2, so that the circuit board 3 is prevented from being interfered by the external static electricity, abnormal display caused by the display device receiving the static electricity interference is avoided, and the display effect is ensured. Meanwhile, the lead-out part 522 of the conductive layer 52 is positioned outside the circuit board 3 and is opposite to the support layer 2, so that the requirement on positioning accuracy is low, and the installation is convenient.

The following describes in detail the structure of the display device of the present disclosure that realizes the display function:

as shown in fig. 1, the display device of the present disclosure may include a display panel 1 and a circuit board 3, where the display panel 1 may emit light to one side, and the side departing from the light emitting direction is a backlight side. The display panel 1 may be a liquid crystal display panel, an OLED (Organic Light-Emitting Diode) display panel, or a Micro LED display panel, and the type thereof is not particularly limited. The circuit board 3 is connected to the display panel 1 and is used for driving the display panel 1 to emit light. An OLED display panel using an OLED as a light emitting device is described herein as an example.

The display panel 1 may include a driving backplane 11 and a light emitting layer 12, the light emitting layer 12 is disposed on one side of the driving backplane 11, the light emitting layer 12 includes a plurality of light emitting devices, and a side of the driving backplane 11 away from the light emitting layer 12 is a backlight side of the display panel 1; wherein:

the driving backplate 11 may include a substrate and a driving circuit layer, the substrate may be a plate-shaped structure, and the material of the substrate may be a hard material such as glass, or a soft material such as polyimide. The driver circuit layer of the substrate facing away from the light-emitting layer 12 may be provided on the side of the substrate and comprise driver circuits. As shown in fig. 1 and 2, the display panel 1 may be divided into at least a display area 101 and a peripheral area 102 located outside the display area 101. Accordingly, the driving circuit layer may include a pixel circuit at least partially located in the display region 101 and a peripheral circuit located in the peripheral region 102, wherein the pixel circuit may be a pixel circuit such as 6T1C, 6T2C, 7T1C, 7T2C, and the like, as long as the light emitting device can be driven to emit light, and the structure thereof is not particularly limited. The number of the pixel circuits is the same as that of the light emitting devices, and the pixel circuits are connected to the light emitting devices in a one-to-one correspondence so as to control the light emitting devices to emit light, respectively. Where nTmC denotes that one pixel circuit includes n transistors (denoted by the letter "T") and m capacitors (denoted by the letter "C").

The peripheral circuit is located in the peripheral region 102, and the peripheral circuit is connected to the pixel circuit for inputting a driving signal to the pixel circuit so as to control the light emitting device to emit light. The peripheral circuit is connected to the pixel circuit, and includes a light emission control circuit, a gate driver circuit, a source driver circuit, a power supply circuit, and the like, and the structure thereof is not particularly limited.

The driving circuit layer may include a plurality of thin film transistors and capacitors, wherein each thin film transistor may be a top gate or bottom gate thin film transistor, each thin film transistor may include an active layer, a gate electrode, a source electrode, and a drain electrode, the gate electrode may be a dual gate electrode or a single gate electrode, the active layers of the thin film transistors are disposed in the same layer, the gate electrodes are disposed in the same layer, and the source electrode and the drain electrode are disposed in the same layer, so as to simplify the process.

Taking a top gate type thin film transistor as an example, the driving circuit layer can comprise an active layer, a first gate insulating layer, a gate electrode, a second gate insulating layer, an interlayer dielectric layer, a source drain layer and a flat layer, wherein the active layer is arranged on one side surface of the substrate, and the first gate insulating layer covers the active layer and the substrate; the grid electrode is arranged on the surface of the first grid insulating layer, which is deviated from the substrate, and is opposite to the active layer; the second gate insulating layer covers the gate electrode and the first gate insulating layer; the interlayer dielectric layer covers the second gate insulating layer; the source drain layer is arranged on the surface of the interlayer dielectric layer, which is deviated from the substrate, and comprises a source electrode and a drain electrode, and the source electrode and the drain electrode are connected to two ends of the active layer through contact holes; the flat layer covers the source drain layer and the interlayer dielectric layer. Of course, the driving circuit layer may further include other film layers as long as the light emitting device can be driven to emit light, and details thereof are not described herein.

As shown in fig. 1, the light-emitting layer 12 is provided on the side of the driving backplane 11, for example, the light-emitting layer 12 is provided on the surface of the planarization layer facing away from the substrate. And at least a partial region of the light emitting layer 12 is located within the display region 101. The light-emitting layer 12 may comprise a plurality of light-emitting devices distributed in an array. For example, the light emitting device is an OLED, which may include a first electrode, a light emitting functional layer, and a second electrode sequentially stacked in a direction away from the driving backplane 11, wherein:

the first electrode can be arranged on one side of the flat layer, which is far away from the substrate, and is connected with a pixel circuit through the contact hole. The light emitting function layer may include a hole injection layer, a hole transport layer, a light emitting material layer, an electron transport layer, and an electron injection layer, which are sequentially stacked in a direction away from the driving back plate 11. The second electrode may cover the light emitting function layer and extend to the peripheral region 102. The specific principle of OLED emission is not described in detail here.

In addition, in order to define the range of each light emitting device, the light emitting layer 12 may further include a pixel defining layer, which may be disposed on the surface of the driving circuit layer away from the substrate, with the first electrode, and is provided with a plurality of openings exposing the first electrodes in a one-to-one correspondence. The light emitting functional layer is laminated on the region of the first electrode in the opening. The light emitting functional layers of each light emitting device are distributed at intervals independently of each other. The emission colors of the different light-emitting functional layers may be different. The second electrode covers the light emitting function layer so that the respective light emitting devices can share the same second electrode. Each light emitting device can be defined by the plurality of openings, and the boundary of any light emitting device is the boundary of the light emitting function layer in the corresponding opening.

Of course, in some embodiments of the present disclosure, the light emitting function layer of each light emitting device may belong to the same continuous light emitting film layer, the light emitting film layer covers the surface of each first electrode and the surface of the pixel defining layer away from the substrate, the light emitting film layer is located in the opening, the area stacked on the first electrode is the light emitting function layer of the light emitting device, and two adjacent light emitting function layers are connected through other areas of the light emitting film layer. That is, the light emitting devices may share the light emitting film layer, and thus the light emitting colors of the light emitting devices are the same. Correspondingly, in order to realize color display, a color film layer can be arranged on one side of the light-emitting layer 12 departing from the driving back plate 11, the color film layer is provided with a plurality of light-filtering parts, each light-filtering part is arranged in one-to-one correspondence with each light-emitting unit, and the colors of the light rays which are permeable by different light-filtering parts can be different, so that the color display can be realized by matching the color film layer with the light-emitting layer 12.

In addition, the display panel 1 may further include an encapsulation layer, which may cover the surface of the light emitting layer 12 away from the driving backplane 11 and cover all the light emitting devices, so as to protect the light emitting layer 12 and prevent the light emitting devices from being corroded by external water and oxygen. Meanwhile, the boundary of the encapsulation layer extends into the peripheral region 102, but does not exceed the peripheral region 102, and the peripheral circuit of the peripheral region 102 can also be protected.

In some embodiments of the present disclosure, the Encapsulation may be implemented by using a Thin-Film Encapsulation (TFE), the Encapsulation layer may include a first inorganic layer, an organic layer, and a second inorganic layer, the first inorganic layer covers a surface of the light-emitting layer 12 facing away from the driving back plate 11, the organic layer may be disposed on a surface of the first inorganic layer facing away from the driving back plate 11, and an edge of the organic layer is limited inside a boundary of the first inorganic layer, the second inorganic layer covers the organic layer and the first inorganic layer not covered by the organic layer, water and oxygen can be blocked by the second inorganic layer, and the planarization is implemented by the organic layer having flexibility.

In addition, the display panel 1 may further include a transparent cover plate, which may cover a side of the encapsulation layer away from the driving backplane 11; or, if there is a color film layer in the display panel 1, the transparent cover plate covers one side of the color film layer away from the driving back plate 11.

As shown in fig. 1, in order to provide support for the display panel 1, especially for the flexible display panel 1 with a flexible substrate, a support layer 2 may be disposed on the backlight side of the display panel 1, and the support layer 2 may be attached to the display panel 1, and the material may be stainless steel or other material with higher strength than the display panel 1. The thickness of the support layer 2 is lower than that of the display panel 1, and if the display panel 1 is a flexible display panel 1, the support layer 2 may be bent along with the bending of the display panel 1.

As shown in fig. 1 and 6, the circuit board 3 may be connected to the display panel 1, and specifically, the circuit board 3 may be connected to a peripheral region 102 of the display panel 1, and inputs a signal to the peripheral circuit so as to drive the display panel 1 to emit light. Meanwhile, the circuit board 3 may be disposed on a side of the support layer 2 departing from the display panel 1, and an orthographic projection of the circuit board 3 on the display panel 1 is at least partially overlapped with an orthographic projection of the support layer 2 on the display panel 1. The circuit board 3 may be a flexible circuit board 3(FPC), but of course, other structures are also possible and are not particularly limited herein.

In order to realize that the circuit board 3 is disposed on a side of the supporting layer 2 away from the display panel 1 when the peripheral area 102 of the display panel 1 is connected to the circuit board 3, as shown in fig. 1, in some embodiments of the present disclosure, a bonding area connected to the peripheral circuit is disposed in the peripheral area 102, and the bonding area and the circuit board 3 are connected by a flexible connection circuit board 4, so as to realize electrical connection between the circuit board 3 and the peripheral circuit, for example, the flexible connection circuit board 4 is a flip chip film. The flexible connecting circuit board 4 can be bent towards the backlight side of the display panel 1 while realizing the electrical connection, so that the circuit board 3 can be positioned at one side of the supporting layer 2 departing from the display panel 1. For example: as shown in fig. 1, one end of the flexible connection circuit board 4 is stacked on the surface of the driving backplane 11 close to the light emitting layer 12 in the region of the peripheral region 102, and is electrically connected to the binding region of the driving backplane 11, and can be connected to the peripheral circuit through the binding region, of course, the end of the flexible connection circuit board 4 electrically connected to the driving backplane 11 and the light emitting layer 12 can be located on the same surface of the driving backplane 11. The other end of the flexible connection circuit board 4 is bent to the side of the support layer 2 departing from the circuit board 3 and is electrically connected with the circuit board 3, so that the circuit board 3 is electrically connected with the peripheral circuit.

In other embodiments of the present disclosure, as shown in fig. 3, the substrate of the driving backplate 11 may be made of a flexible material, so that the driving backplate 11 has a flexible structure. The peripheral region 102 is provided with a bonding region to be connected to a peripheral circuit, and the circuit board 3 may be directly electrically connected to the bonding region of the peripheral circuit. Due to the flexibility of the driving backplane 11, at least the bonding area may be bent towards the backlight side of the display panel 1, such that the circuit board 3 may be located at a side of the supporting layer 2 facing away from the display panel 1.

Of course, in other embodiments of the present disclosure, the circuit board 3 may be electrically connected to the display panel 1 in other manners, as long as the circuit board 3 is located on a side of the support layer 2 away from the display panel 1 while the electrical connection is achieved.

As shown in fig. 1, in some embodiments of the present disclosure, the circuit board 3 may include a substrate 31, a circuit layer 32, and a protective layer 33, wherein:

the substrate 31 may be an insulating material, and for the flexible circuit board 3, the substrate 31 may be a flexible material such as polyimide. The circuit layer 32 may be disposed on a side of the substrate 31 close to the display panel 1, and the pattern of the circuit layer 32 and the contained electronic devices are not particularly limited herein. The protection layer 33 may cover the circuit layer 32, and the material of the protection layer 33 is an insulating material to prevent the circuit layer 32 from contacting the outside.

The following describes in detail a scheme of the display panel 1 of the present disclosure for implementing the electrostatic shielding function:

as shown in fig. 1, in order to avoid interference of static electricity outside the display device on the circuit board 3 and the electronic devices, the shielding layer 5 may cover the circuit board 3 from a side of the circuit board 3 away from the display panel 1, and the supporting layer 2 may be made of metal material such as stainless steel, and the shielding layer 5 may be electrically connected to the supporting layer 2, so as to conduct external static electricity to the supporting layer 2 without causing interference on the circuit board 3.

As shown in fig. 1, the shielding layer 5 may include a first insulating layer 51 and a conductive layer 52, wherein:

the first insulating layer 51 covers at least part of the surface of the circuit board 3 departing from the display panel 1; the material of the first insulating layer 51 may be a polyester material, such as polyimide, but may be other insulating materials. The first insulating layer 51 may cover the circuit board 3 completely, or may cover only a partial region of the circuit board 3. Further, in some embodiments of the present disclosure, an orthogonal projection of the first insulating layer 51 on the display panel 1 is located within an orthogonal projection of the circuit board 3 on the display panel 1, that is, a boundary of the first insulating layer 51 is limited by a boundary of the circuit board 3, and a boundary of the first insulating layer 51 is at most aligned with a boundary of the circuit board 3 without exceeding the boundary of the circuit board 3.

The conductive layer 52 is disposed on a side of the first insulating layer 51 facing away from the display panel 1, and the conductive layer 52 can be separated from the circuit board 3 by the first insulating layer 51, so as to prevent the circuit board 3 from being electrically connected to the conductive layer 52, and thus the conductive layer 52 can short the circuit board 3. Meanwhile, the conductive layer 52 may be electrically connected to the support layer 2 so as to conduct static electricity from the outside. Specifically, the conductive layer 52 may include a shield 521 and a lead-out 522, in which:

the orthographic projection of the shielding part 521 on the display panel 1 is positioned within the orthographic projection of the circuit board 3 on the display panel 1, that is, the range of the shielding part 521 does not exceed the boundary of the circuit board 3. Meanwhile, the boundary of the shielding part 521 may be aligned with the boundary of the first insulating layer 51, or be located within the boundary of the first insulating layer 51, that is, the first insulating layer 51 completely covers the shielding part 521, so as to prevent the shielding part 521 from directly contacting the circuit board 3, and prevent the shielding part 521 from contacting the circuit board 3 to cause short circuit of the circuit board 3.

As shown in fig. 1 and 2, the lead portion 522 and the shield portion 521 are electrically connected, and may be different regions of the same continuous film layer or may be electrically connected to each other to form an independent structure. The orthographic projection of the lead-out portion 522 on the display panel 1 is located outside the orthographic projection of the circuit board 3 on the display panel 1, that is, the lead-out portion 522 protrudes out of the boundary of the circuit board 3. Meanwhile, the first insulating layer 51 exposes at least a partial region of the lead-out portion 522, that is, at least a partial region of the lead-out portion 522 is not covered with the first insulating layer 51; for example, the orthographic projection of the lead-out portion 522 on the display panel 1 may be located outside the orthographic projection of the first insulating layer 51 on the display panel 1, that is, the lead-out portion 522 is located outside the boundary of the first insulating layer 51, and is not covered by the first insulating layer 51 at all; alternatively, the first insulating layer 51 may cover the lead portion 522, but a through hole exposing the lead portion 522 may be opened in the first insulating layer 51 to expose a partial region of the lead portion 522.

The material of the conductive layer 52 may be at least one of a conductive paste including a substrate and conductive particles such as metal particles in the substrate and a conductive fabric, which may be a conductive cloth. Of course, other materials can be used for the conductive layer 52 as long as they can achieve the conductive effect.

The lead-out portion 522 not covered with the first insulating layer 51 may be electrically connected to the support layer 2 to form a path for conducting static electricity. Further, for convenience of connection, the lead-out portion 522 may be bent toward the direction close to the support layer 2, so that a distance between the lead-out portion 522 and the support layer 2 is smaller than a distance between the shielding portion 521 and the support layer 2, and the lead-out portion 522 may be directly attached to the support layer 2 to achieve electrical connection, or may be electrically connected to the support layer 2 through the conductive medium 6. For example: if the material of the conductive layer 52 is a conductive adhesive, the lead portion 522 may be directly bent toward the support layer 2, and the lead portion 522 may be bonded to the support layer 2. If the material of the conductive layer 52 is a conductive cloth or other conductive material, the lead portion 522 may be electrically connected to the support layer 2 through a conductive medium 6, and the conductive medium 6 may be a conductive adhesive. Of course, the lead portion 522 may be bent toward the support layer 2 regardless of whether the lead portion 522 and the support layer 2 are electrically connected by the conductive medium 6.

In the above embodiment, on the basis of shielding external static electricity by the shielding layer 5, static electricity inside the circuit board 3 can be derived, and interference on the circuit board 3 is prevented. Therefore, as shown in fig. 1, in some embodiments of the present disclosure, the circuit layer 32 of the circuit board 3 may be electrically connected to the supporting layer 2, so as to lead out static electricity generated inside the circuit board 3, and further enhance the electrostatic shielding effect. For example, the circuit layer 32 may have a static electricity leading-out portion 321, an orthogonal projection of the static electricity leading-out portion 321 on the display panel 1 and an orthogonal projection of the supporting layer 2 on the display panel 1 at least partially overlap, the protective layer 33 exposes the static electricity leading-out portion 321, and the static electricity leading-out portion 321 may be electrically connected to the supporting layer 2 through the conductive medium 6 so as to lead out static electricity in the circuit board 3. The pattern of the static electricity discharge portion 321 is not particularly limited as long as static electricity in the circuit board 3 can be discharged.

The shielding layer 5 of the present disclosure may also include other film layers, exemplified below:

as shown in fig. 4 and 5, in some embodiments of the present disclosure, the shielding layer 5 further includes a second insulating layer 53, which may be disposed on a surface of the conductive layer 52 facing away from the display panel 1 and cover the shielding portion 521 and the lead-out portion 522, so as to prevent the conductive layer 52 from contacting with the outside, and perform the functions of insulation and isolation. The boundary of the second insulating layer 53 may be aligned with the boundary of the conductive layer 52, that is, the orthographic projection of the second insulating layer 53 on the display panel 1 may be coincident with the orthographic projection of the conductive layer 52 on the display panel 1.

As shown in fig. 4, in some embodiments of the present disclosure, the shielding layer 5 may further include a wave-absorbing layer 54, which may be disposed between the conductive layer 52 and the first insulating layer 51, and an orthogonal projection of the wave-absorbing layer 54 on the display panel 1 is located within an orthogonal projection of the first insulating layer 51 on the display panel 1, that is, a boundary of the wave-absorbing layer 54 does not exceed a boundary of the first insulating layer 51, so as to avoid shielding the lead portion 522. Meanwhile, the material of the wave-absorbing layer 54 includes a wave-absorbing material capable of absorbing electromagnetic waves so as to absorb electromagnetic waves that may interfere with the operation of the circuit board 3. For example, the wave-absorbing material may be graphite, or of course, a material having a similar function, such as silicon carbide, ferrite, or the like.

As shown in fig. 5, in some embodiments of the present disclosure, the shielding layer 5 may further include a heat dissipation layer 55, which may be disposed between the wave-absorbing layer 54 and the conductive layer 52, and the heat dissipation layer 55 may absorb heat generated by the circuit board 3 and conduct the heat outwards, so as to prevent the temperature of the circuit board 3 from being too high. Meanwhile, the orthographic projection of the heat dissipation layer 55 on the display panel 1 is located within the orthographic projection of the first insulation layer 51 on the display panel 1, and the boundary of the heat dissipation layer 55 does not exceed the boundary of the first insulation layer 51, so that the lead-out portion 522 is prevented from being shielded. The material of the heat dissipation layer 55 includes copper, but may be aluminum or other materials.

Embodiments of the present disclosure also provide a method of manufacturing a display device, which may be the display device of any of the above embodiments, and the structure thereof will not be described in detail here. The manufacturing method may include steps S110 to S150, in which:

step S110, forming a display panel, a circuit board and a shielding layer; the shielding layer comprises a first insulating layer and a conducting layer positioned on one side of the first insulating layer; the conductive layer comprises a shielding part and a lead-out part which are electrically connected, and the first insulating layer exposes at least partial region of the lead-out part.

Step S120, forming a support layer on a backlight side of the display panel.

Step S130, connecting the circuit board with the display panel and placing the circuit board on the backlight side of the display panel.

Step S140, covering the shielding layer on one side of the circuit board, which is far away from the display panel, so that the first insulating layer and the conducting layer are distributed along the direction far away from the display panel, the orthographic projection of the shielding part on the display panel is positioned within the orthographic projection of the circuit board on the display panel, and the orthographic projection of the leading-out part on the display panel is positioned outside the orthographic projection of the circuit board on the display panel.

Step S150 of electrically connecting the lead portion to the support layer.

The specific structure and beneficial effects of the display device involved in the above steps have been described in detail in the above embodiments of the display device, and are not described again here.

It should be noted that although the various steps of the manufacturing method of the present disclosure are depicted in the drawings in a particular order, this does not require or imply that all of the steps must be performed in that particular order to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.