阅读说明：本技术 一种晶体生长室及利用其制备碳化硅的方法 (Crystal growth chamber and method for preparing silicon carbide by using same ) 是由 袁振洲 刘欣宇 于 2021-09-01 设计创作，主要内容包括：本发明公开一种晶体生长室及利用其制备碳化硅的方法,涉及晶体生长领域,其中晶体生长室包括：腔体、坩埚、保温毡和加热源,坩埚设置于腔体内部,且坩埚的顶壁上贯通开设有通道,保温毡置于坩埚外侧,且保温毡上开设有测厚孔,保温毡设置于腔体内,测厚孔与通道连通,加热源设置于腔体外侧和内侧；其中制备碳化硅的方法包括采用上述的晶体生长室进行生长,并在生长过程中根据测厚孔周围未结晶区域的实时直径或者实时面积变化,分析得出坩埚内部晶体的生长速率,并据此进行长晶温度和压力的实时调整,这样可以很好的解决晶体生长过程中产生的无效结晶生长或者无法满足客户需求的技术问题。(The invention discloses a crystal growth chamber and a method for preparing silicon carbide by using the same, and relates to the field of crystal growth, wherein the crystal growth chamber comprises: the crucible is arranged in the cavity, a channel is arranged on the top wall of the crucible in a penetrating manner, the heat preservation felt is arranged on the outer side of the crucible, a thickness measuring hole is formed in the heat preservation felt, the heat preservation felt is arranged in the cavity and communicated with the channel, and the heating sources are arranged on the outer side and the inner side of the cavity; the method for preparing the silicon carbide comprises the steps of growing in the crystal growing chamber, analyzing the growth rate of the crystal in the crucible according to the real-time diameter or real-time area change of an uncrystallized area around the thickness measuring hole in the growing process, and adjusting the crystal growing temperature and pressure in real time according to the growth rate, so that the technical problem that invalid crystal growth is generated in the crystal growing process or the customer requirements cannot be met can be well solved.)

1. A crystal growth chamber, comprising:

the crucible is cylindrical and is an accommodating cavity with an opening at the top, and the accommodating cavity is used for placing raw materials;

the crucible cover is arranged above the accommodating cavity and is provided with a channel in a through manner;

the heat preservation felt is arranged on the periphery of the crucible and the crucible cover, and is provided with a thickness measuring hole which is communicated with the channel;

the cavity is sleeved on the outer side of the heat preservation felt;

and the heating source is arranged on the outer side of the cavity or on the inner side of the cavity.

2. The crystal growth chamber of claim 1, wherein the channel is cylindrical or truncated cone-shaped, and when the channel is cylindrical, the cross-sectional diameter of the channel is 1-5 mm; when the channel is in a circular truncated cone shape, the diameter of the minimum position of the channel is 1-5mm, and the diameter of the maximum position of the channel is 1-10 mm.

3. The crystal growth chamber of claim 1, wherein the thickness measurement hole is cylindrical or truncated cone-shaped, and when the thickness measurement hole is cylindrical, the cross-sectional diameter of the thickness measurement hole is 1-10 mm; when the thickness measuring hole is in a circular truncated cone shape, the diameter of the minimum position of the thickness measuring hole is 1-5mm, and the diameter of the maximum position of the channel is 1-10 mm.

4. The crystal growth chamber of claim 1, wherein a top diameter of the channel is no greater than a bottom diameter of the thickness measuring hole.

5. The crystal growth chamber of claim 1, wherein the channel remains through-going as the crystal grows, and the thickness measurement hole changes from through-going to closed as the crystal grows.

6. A method of producing a silicon carbide crystal using the crystal growth chamber of any one of claims 1-5, comprising the steps of:

step S1: placing the pretreated silicon carbide raw material into a crucible of a crystal growth chamber, placing the pretreated seed crystal into the inner side of a crucible cover of the crystal growth chamber, placing a heat-insulating felt with a thickness measuring hole on the outer sides of the crucible and the crucible cover, and finally placing the heat-insulating felt in a cavity;

step S2: heating and depressurizing the cavity to make the temperature and pressure reach the initial technological parameters required by crystal growth, and then carrying out crystal growth on the silicon carbide;

step S3, monitoring the thickness measuring holes of the heat preservation felt in real time, and calculating to obtain growth data of the silicon carbide;

step S4: comparing the growth data of the silicon carbide in the step S3 with preset growth data, and then adjusting the technological parameters of the silicon carbide crystal growth;

step S5: and (5) repeating the steps S3-S4 until the thickness measuring hole on the crucible cover is completely sealed, cooling and inflating the cavity, opening the cavity when the temperature in the cavity is reduced to room temperature and the pressure reaches the atmospheric pressure, taking out the grown silicon carbide crystal, and finishing the crystal growth operation.

7. The method according to claim 6, wherein the specific steps of step S3 are as follows:

s301, acquiring an image of the thickness measuring hole, and analyzing the real-time percentage A of the crystalline area of the cross section of the thickness measuring hole to the average sectional area of the whole thickness measuring hole;

step S302: substituting the real-time percentage a in step S301 into the formula: obtaining the real-time growth thickness h of the silicon carbide crystal from h alpha A D2/D1T/P, wherein T is real-time temperature, and P is real-time pressure; the average diameter of the through holes is D1, the average diameter of the thickness measuring holes is D2, wherein alpha is an empirical constant and ranges from 1.5 to 5.1;

step S303: and calculating the growth thickness increment delta h of the period according to the real-time growth thickness h every fixed period delta t, and calculating the average growth rate v in the fixed period by substituting v into delta h/delta t.

8. The method according to claim 7, wherein the step S4 is adjusted as follows: the preset growth data is a preset growth rate, and when the average growth rate of the crystal is lower than the preset growth rate, the temperature of the cavity is increased according to the rate of 1-5 ℃/min, or the pressure of the cavity is reduced according to the rate of 10-20 Pa/h;

when the average growth rate of the crystal is higher than the preset growth rate, cooling the cavity at the rate of 1-5 ℃/min, or boosting the pressure of the cavity at the rate of 10-20 Pa/h;

the temperature and pressure within the chamber are maintained when the average growth rate of the crystal is the same as the predetermined growth rate.

9. The method according to claim 6, wherein the specific steps of step S3 are as follows:

s301, acquiring an image of the thickness measuring hole, and analyzing the real-time percentage A of the crystalline area of the cross section of the thickness measuring hole to the average sectional area of the whole thickness measuring hole;

step S302: substituting the real-time percentage a in step S301 into the formula: obtaining the real-time growth thickness h of the silicon carbide crystal from h alpha A D2/D1T/P, wherein T is real-time temperature, and P is real-time pressure; the average diameter of the through holes is D1, the average diameter of the thickness measuring holes is D2, wherein alpha is an empirical constant and ranges from 1.5 to 5.1;

step S303: substituting the real-time growth thickness h in step S302 into the formula: d2 × h tan (θ) + D0, where θ is the angle of the expanding growth, and D0 is the initial diameter of the crystal, i.e., the diameter of the seed crystal; and D is the real-time growth diameter of the crystal.

10. The method according to claim 9, wherein the step S4 is adjusted as follows: the preset growth data is a preset real-time growth diameter, and when the real-time growth diameter of the crystal is smaller than the preset real-time growth diameter, the temperature of the cavity is increased at the speed of 1-5 ℃/min or the pressure of the cavity is reduced at the speed of 10-20 Pa/h;

when the real-time growth diameter of the crystal is higher than the preset real-time growth diameter, cooling the cavity at the rate of 1-5 ℃/min, or boosting the cavity at the rate of 10-20 Pa/h;

the temperature and pressure of the chamber are maintained when the real-time growth diameter of the crystal is the same as the predetermined real-time growth diameter.

Technical Field

The invention relates to the technical field of crystal growth, in particular to a crystal growth chamber and a method for preparing silicon carbide by using the same.

Background

The silicon carbide single crystal has unique properties of large forbidden band width, high breakdown electric field, large thermal conductivity, small dielectric constant, stable physical and chemical properties and the like, and is considered as an ideal semiconductor material for manufacturing devices with high temperature, high voltage, high frequency, high power and the like.

The existing silicon carbide crystal growth is carried out in a closed black box, namely the whole growth process is completed in a closed graphite crucible, the crystal growth condition cannot be monitored in real time, only the graphite crucible is taken out and opened after cooling and stopping, the true condition of the crystal growth can be known, including the size information such as effective thickness and diameter, and effective judgment is made according to the information, so that the growth efficiency of the silicon carbide crystal is seriously influenced, and the problems of invalid growth of the silicon carbide crystal and incapability of meeting the customer requirements are easily caused.

Disclosure of Invention

The invention aims to provide a crystal growth chamber and a method for preparing silicon carbide by using the same, which solve the technical problems that the invalid growth of silicon carbide crystals is caused by the fact that the crystal growth cannot be monitored in the prior art. The preparation method can effectively improve the crystal quality of the silicon carbide and effectively improve the growth efficiency of the silicon carbide crystal.

The embodiment of the application discloses crystal growth room includes:

the crucible is cylindrical and is an accommodating cavity with an opening at the top, and the accommodating cavity is used for placing raw materials;

the crucible cover is arranged above the accommodating cavity and is provided with a channel in a through manner;

the heat preservation felt is arranged on the periphery of the crucible and the crucible cover, and is provided with a thickness measuring hole which is communicated with the channel;

the cavity is sleeved on the outer side of the heat preservation felt;

and the heating source is arranged on the outer side of the cavity or on the inner side of the cavity.

According to the embodiment of the application, the thickness measuring holes are formed and monitored, the growth rate, the thickness, the diameter and the like of the crystal in the crucible are obtained through subsequent analysis and calculation, and an operator can conveniently adjust the growth process explanation of the crystal, so that the growth efficiency and the yield of the crystal are improved.

On the basis of the technical scheme, the invention can be further improved as follows:

further, the channel is cylindrical or round table-shaped, and when the channel is cylindrical, the diameter of the cross section of the channel is 1-5 mm; when the channel is in a circular truncated cone shape, the diameter of the minimum position of the channel is 1-5mm, and the diameter of the maximum position of the channel is 1-10 mm.

Further, the thickness measuring hole is cylindrical or round table-shaped, and when the thickness measuring hole is cylindrical, the diameter of the cross section of the thickness measuring hole is 1-10 mm; when the thickness measuring hole is in a circular truncated cone shape, the diameter of the minimum position of the thickness measuring hole is 1-5mm, and the diameter of the maximum position of the channel is 1-10 mm.

Further, the diameter of the top of the channel is not larger than the diameter of the bottom of the thickness measuring hole; the method has the advantage of facilitating subsequent detection.

Furthermore, the channel keeps a through state during crystal growth, the thickness measuring hole changes from the through state to a closed state during crystal growth, and the beneficial effect of the step is that the subsequent operators can calculate the growth data of the crystal conveniently through the thickness measuring hole.

The embodiment of the application also discloses a method for preparing silicon carbide crystals by using the crystal growth chamber, which comprises the following steps:

step S1: placing the pretreated silicon carbide raw material into a crucible of a crystal growth chamber, placing the pretreated seed crystal into the inner side of a crucible cover of the crystal growth chamber, placing a heat-insulating felt with a thickness measuring hole on the outer sides of the crucible and the crucible cover, and finally placing the heat-insulating felt in a cavity;

step S2: heating and depressurizing the cavity to make the temperature and pressure reach the initial technological parameters required by crystal growth, and then carrying out crystal growth on the silicon carbide;

step S3, monitoring the thickness measuring holes of the heat preservation felt in real time, and calculating to obtain real-time growth data of the silicon carbide;

step S4: comparing the real-time growth data of the silicon carbide in the step S3 with preset real-time growth data, and then adjusting the technological parameters of the silicon carbide crystal growth;

step S5: and (5) repeating the steps S3-S4 until the thickness measuring hole on the crucible cover is completely sealed, cooling and inflating the cavity, opening the cavity when the temperature in the cavity is reduced to room temperature and the pressure reaches the atmospheric pressure, taking out the grown silicon carbide crystal, and finishing the crystal growth operation.

On the basis of the technical scheme, the invention can be further improved as follows:

further, the specific steps of step S3 are as follows:

s301, acquiring an image of the thickness measuring hole, and analyzing the real-time percentage A of the crystalline area of the cross section of the thickness measuring hole to the average sectional area of the whole thickness measuring hole;

step S302: substituting the real-time percentage a in step S301 into the formula: obtaining the real-time growth thickness h of the silicon carbide crystal from h alpha A D2/D1T/P, wherein T is real-time temperature, and P is real-time pressure; the average diameter of the through holes is D1, the average diameter of the thickness measuring holes is D2, wherein alpha is an empirical constant and ranges from 1.5 to 5.1;

step S303: and calculating the growth thickness increment delta h of the time period according to the real-time growth thickness h every fixed time period delta t, and calculating the average growth rate v in the fixed time period by substituting v into delta h/delta t.

Further, the specific steps of the adjustment in step S4 are as follows: the preset growth data is a preset growth rate, and when the average growth rate of the crystal is lower than the preset growth rate, the temperature of the cavity is increased according to the rate of 1-5 ℃/min, or the pressure of the cavity is reduced according to the rate of 10-20 Pa/h;

when the average growth rate of the crystal is higher than the preset growth rate, cooling the cavity at the rate of 1-5 ℃/min, or boosting the pressure of the cavity at the rate of 10-20 Pa/h;

maintaining the temperature and pressure within the chamber when the average growth rate of the crystal is the same as the predetermined growth rate; the method has the beneficial effect that the adjustment is carried out according to the real-time growth data of the silicon carbide crystal.

Further, the specific steps of step S3 are as follows:

s301, acquiring an image of the thickness measuring hole, and analyzing the real-time percentage A of the crystalline area of the cross section of the thickness measuring hole to the average sectional area of the whole thickness measuring hole;

step S302: substituting the real-time percentage a in step S301 into the formula: obtaining the real-time growth thickness h of the silicon carbide crystal from h alpha A D2/D1T/P, wherein T is real-time temperature, and P is real-time pressure; the average diameter of the through holes is D1, the average diameter of the thickness measuring holes is D2, wherein alpha is an empirical constant and ranges from 1.5 to 5.1;

step S303: substituting the real-time growth thickness h in step S302 into the formula: d2 × h tan (θ) + D0, where θ is the angle of the expanding growth, and D0 is the initial diameter of the crystal, i.e., the diameter of the seed crystal; d is the real-time growth diameter of the crystal; the method has the beneficial effect that the calculation of the growth data is completed through the data of the thickness measuring hole which is closed in real time.

Further, the specific steps of the adjustment in step S4 are as follows: the preset growth data is a preset real-time growth diameter, and when the real-time growth diameter of the crystal is smaller than the preset real-time growth diameter, the temperature of the cavity is increased at the speed of 1-5 ℃/min or the pressure of the cavity is reduced at the speed of 10-20 Pa/h;

when the real-time growth diameter of the crystal is higher than the preset real-time growth diameter, cooling the cavity at the rate of 1-5 ℃/min, or boosting the cavity at the rate of 10-20 Pa/h;

the temperature and pressure of the chamber are maintained when the real-time growth diameter of the crystal is the same as the predetermined real-time growth diameter.

Compared with the prior art, the invention has the following technical effects:

1. according to the invention, through holes are formed on the crucible and the heat preservation felt, the uncrystallized area of the cross section of the thickness measurement hole is monitored in real time, and the crystal growth rate, the thickness and the diameter in the crucible are obtained through analysis, so that the subsequent operators can conveniently adjust the crystal growth process parameters. Meanwhile, the silicon carbide raw material is decomposed into gaseous Si, Si at high temperature₂C,SiC₂And C in the solid state. Because the graphite crucible is positioned in the cavity, the pressure in the crucible is the same as the pressure in the cavity, and under the driving of the temperature gradient, partial Si steam can overflow the crucible through the through hole on the crucible, but cannot overflow the cavity. Due to Si₂C and SiC₂Is an unstable material and is very easy to react with high-temperature graphite, so that the crucible can not overflow basically and the cavity can not overflow. The overflowing Si steam is at the thickness measuring hole of the heat preservation felt, and because the temperature is lower than the melting point of Si, the Si steam is sublimated to form solid crystals, so that the cross sectional area in the thickness measuring hole is changed. Therefore, the invention realizes the real-time monitoring of the crystal growth rate while ensuring the safe use of the crystal growth chamber, and better prepares the silicon carbide crystal.

2. According to the invention, through summary and research, the crystallization speed or area change of the uncrystallized area of the cross section of the thickness measuring hole on the crystal growth chamber is in direct proportion to the growth speed of the crystal, so that the growth condition of the crystal can be calculated by detecting the crystallization state of the uncrystallized area of the cross section around the thickness measuring hole. The operator can adjust the crystal growth process parameters accordingly, so that the invalid growth of the silicon carbide crystal or the condition that the product parameters after the growth can not meet the customer requirements can be avoided, and the yield of the crystal growth can be improved.

3. The crystal growth chamber and the preparation method of the silicon carbide can realize the controllability of the crystal growth process, achieve the closed loop and automatic control of the growth, and greatly improve the growth efficiency and yield of the silicon carbide crystal.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of a crystal growth chamber according to one embodiment of the present invention;

1-a crucible; 2-crucible cover; 3-heat preservation felt; 4-a cavity; 5-a heating source; 6-silicon carbide raw material; 7-seed crystal;

101-a housing cavity; 201-channel; 301-thickness measuring hole.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the invention pertains.

In the description of the present application, it is to be understood that the terms "top," "inner," "outer," and the like are used in the positional or orientational relationships shown in the drawings for the purpose of convenience in describing the invention and simplifying the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular orientation, and thus should not be construed as limiting the invention.

In order to better understand the technical solutions, the technical solutions will be described in detail below with reference to the drawings and the detailed description.

Example 1:

a crystal growth chamber, comprising:

the crucible 1 is cylindrical, the crucible 1 is an accommodating cavity 101 with an opening at the top, and the accommodating cavity 101 is used for accommodating raw materials;

the crucible cover 2 is arranged above the accommodating cavity 101, and a channel 201 is formed in the crucible cover 2 in a penetrating manner;

the heat preservation felt 3 is arranged on the periphery of the crucible 1 and the crucible cover, a thickness measurement hole 301 is formed in the heat preservation felt 3, and the thickness measurement hole 301 is communicated with the channel 201; the channel 201 is convenient for Si steam generated after the silicon carbide raw material is heated to overflow so as to realize crystallization of the subsequent thickness measuring hole 301, and real-time growth data of the silicon carbide crystal is calculated; when crystals grow, the thickness measuring holes 301 are completely crystallized and sealed along with the continuous growth of the crystals due to the desublimation crystallization of Si steam inside the thickness measuring holes;

the cavity 4 is sleeved with the outer side of the heat preservation felt 3; the cavity 4 can be an existing stainless steel cavity or an existing quartz tube and is used for providing a growing environment;

the heating source 5 is disposed outside the cavity 4 or inside the cavity 4, the heating source 5 may be an inductive heating mode formed by an induction coil or a resistive heating mode formed by graphite, and the specific position thereof may be outside the cavity 4 or inside the cavity 4, and fig. 1 shows a condition that the heating source 5 is outside the cavity.

According to the embodiment of the application, the thickness measuring hole 301 is formed and monitored, the growth rate of the crystal in the crucible is obtained through subsequent analysis and calculation, and an operator can conveniently adjust the growth environment of the crystal, so that the growth efficiency of the crystal is improved.

In one embodiment, the channel 201 is cylindrical or truncated cone-shaped, that is, the channel 201 has two types, the first type is cylindrical, that is, when the channel has an equal diameter from top to bottom, the diameter of the cross section of the channel is 1-5mm, specifically, 1mm, 3mm or 5 mm; the second type is a round table type, and the diameter of the smallest position of the channel is only required to be 1-5mm no matter the upper part is large or the lower part is small or the upper part is large, and the diameter of the largest position of the channel is only required to be 1-10 mm.

The thickness measuring hole 301 is cylindrical or truncated cone-shaped, that is, the thickness measuring hole 301 has two types, which are similar to the channel 201, the first type is cylindrical, that is, when the diameter is equal from top to bottom, the diameter of the cross section of the channel is 1-10mm, specifically, 1mm, 3mm, 5mm and 10 mm; the second type is a round table type, and the diameter of the minimum position of the thickness measuring hole 301 is only required to be 1-5mm no matter the upper part is large or the lower part is small or the upper part is large, and the diameter of the maximum position of the thickness measuring hole 301 is 1-10 mm.

Specifically, the diameter of the top of the channel 201 is smaller than or equal to the diameter of the bottom of the thickness measuring hole 301, so that the Si vapor can be effectively crystallized at the thickness measuring hole 301, that is, the channel 201 is ensured to maintain a through state during crystal growth, and the thickness measuring hole 301 is changed from the through state to a closed state during crystal growth.

Example 2:

the embodiment of the application discloses a method for preparing silicon carbide crystals by adopting a crystal growth chamber, which particularly aims at the condition of equal-diameter growth and comprises the following steps:

step S1: putting the pretreated silicon carbide raw material into a crucible of a crystal growth chamber, putting the pretreated seed crystal into the inner side of a crucible cover of the crystal growth chamber, wherein a through hole of the crucible is cylindrical and has the diameter of 3mm, putting a heat-insulating felt with a thickness measuring hole on the outer sides of the crucible and the crucible cover, and finally putting the heat-insulating felt into a cavity, wherein the thickness measuring hole of the heat-insulating felt is cylindrical and has the diameter of 3 mm; the pretreatment of the silicon carbide raw material and the pretreatment of the seed crystal can be carried out by adopting the existing treatment mode.

Step S2: heating and depressurizing the cavity to make the temperature and pressure reach initial technological parameters required by crystal growth, and then carrying out crystal growth on the silicon carbide, wherein the initial technological parameters are specifically; the temperature is 2200 ℃ and the pressure is 500 Pa;

step S3, monitoring the thickness measuring holes of the heat preservation felt in real time, and calculating to obtain real-time growth data of the silicon carbide; the method comprises the following specific steps:

step S301: and acquiring images at the thickness measuring holes, and analyzing the real-time percentage A of the crystallization area of the cross section of the thickness measuring holes to the average sectional area of the open pores of the whole thickness measuring holes, wherein the specific analysis mode can be that the real-time monitoring of the temperature and the open pore crystallization change is carried out on the circular open pore area of the detected heat-insulating felt by adopting the video signal acquisition software of an infrared thermometer. The acquired image is subjected to gridding processing, and the crystallization area and the number of grids occupied by the crystallization area are analyzed to obtain real-time percentage;

step S302: substituting the real-time percentage a in step S301 into the formula: obtaining the real-time growth thickness h of the silicon carbide crystal from h ═ α × a × D2/D1 × T/P, wherein T is real-time temperature, P is real-time pressure, the average diameter of the through holes is D1 (the average value of the maximum diameter of the through holes and the minimum diameter of the through holes is referred to in the application), the average diameter of the thickness measuring holes is D2 (the average value of the maximum diameter of the thickness measuring holes and the minimum diameter of the thickness measuring holes is referred to in the application), and α is an empirical constant; at the moment, the through hole of the crucible is cylindrical, the average diameter D1 is 3mm, the thickness measuring hole of the heat-insulating felt is cylindrical, the average diameter D2 is 3mm, and alpha is 5.1;

step S303: and calculating the growth thickness increment delta h of the period according to the real-time growth thickness h every fixed period delta t, wherein the fixed period delta t is 1h or 2h and the like, and substituting v into delta h/delta t to calculate the average growth rate v in the fixed period.

Step S4: comparing the growth data of the silicon carbide in the step S3 with preset growth data, and then adjusting the technological parameters of the silicon carbide crystal growth; the specific steps of the step adjustment are as follows: the preset growth data is a preset growth rate of 300um/h, and when the average growth rate of the crystal is lower than the preset growth rate, the temperature of the cavity is increased according to the rate of 3 ℃/min, or the pressure of the cavity is reduced according to the rate of 15 Pa/h;

when the average growth rate of the crystal is higher than the preset growth rate, cooling the cavity at the rate of 3 ℃/min, or boosting the pressure of the cavity at the rate of 15 Pa/h;

the temperature and pressure within the chamber are maintained when the average growth rate of the crystal is the same as the predetermined growth rate.

Step S5: and (5) repeating the steps S3-S4 until the thickness measuring hole on the crucible cover is completely sealed, cooling and inflating the cavity, opening the cavity when the temperature in the cavity is reduced to room temperature and the pressure reaches the atmospheric pressure, taking out the grown silicon carbide crystal, and finishing the crystal growth operation.

Example 3:

the embodiment of the application discloses a method for preparing a silicon carbide crystal by adopting a crystal growth chamber, wherein the average diameter D1 of a through hole of a crucible is 1 mm; the average diameter D2 of the thickness measuring holes of the heat preservation felt is 3 mm; and the empirical constant a is chosen to be 1.5 accordingly.

Adjusting step S4, wherein the preset growth data is a preset growth rate of 300um/h, and when the average growth rate of the crystal is lower than the preset growth rate, the cavity is heated at a rate of 1 ℃/min or is depressurized at a rate of 10 Pa/h;

when the average growth rate of the crystal is higher than the preset growth rate, cooling the cavity at the rate of 1 ℃/min, or boosting the pressure of the cavity at the rate of 10 Pa/h;

the temperature and pressure within the chamber are maintained when the average growth rate of the crystal is the same as the predetermined growth rate.

The remaining steps were the same as in example 2.

Example 4:

the embodiment of the application discloses a method for preparing silicon carbide crystals by adopting a crystal growth chamber; wherein the average diameter D1 of the through holes of the crucible is 5 mm; the average diameter D2 of the thickness measuring holes of the heat preservation felt is 10 mm; and the empirical constant a is chosen to be 3.5 accordingly.

Adjusting step S4, wherein the preset growth data is a preset growth rate of 300um/h, and when the average growth rate of the crystal is lower than the preset growth rate, the cavity is heated at a rate of 5 ℃/min or is depressurized at a rate of 20 Pa/h;

when the average growth rate of the crystal is higher than the preset growth rate, cooling the cavity at the rate of 5 ℃/min, or boosting the cavity at the rate of 20 Pa/h;

the temperature and pressure within the chamber are maintained when the average growth rate of the crystal is the same as the predetermined growth rate.

The remaining steps were the same as in example 2.

Example 5:

the embodiment of the application discloses a method for preparing a silicon carbide crystal by adopting a crystal growth chamber, which particularly aims at the condition of expanding growth and comprises the following steps:

step S1: placing the pretreated silicon carbide raw material into a crucible of a crystal growth chamber, placing the pretreated seed crystal into the inner side of a crucible cover of the crystal growth chamber, placing a heat-insulating felt with a thickness measuring hole on the outer sides of the crucible and the crucible cover, and finally placing the heat-insulating felt in a cavity; the pretreatment of the silicon carbide raw material and the pretreatment of the seed crystal can be carried out by adopting the existing treatment mode.

Step S2: heating and depressurizing the cavity to make the temperature and pressure reach initial technological parameters required by crystal growth, and then carrying out crystal growth on the silicon carbide, wherein the initial technological parameters are specifically; the temperature is 2200 ℃ and the pressure is 500 Pa;

step S3, monitoring the thickness measuring holes of the heat preservation felt in real time, and calculating to obtain real-time growth data of the silicon carbide; the method comprises the following specific steps:

s301, acquiring an image of the thickness measuring hole, and analyzing the real-time percentage A of the crystalline area of the cross section of the thickness measuring hole to the average sectional area of the whole thickness measuring hole;

step S302: substituting the real-time percentage a in step S301 into the formula: obtaining the real-time growth thickness h of the silicon carbide crystal from h alpha A D2/D1T/P, wherein T is real-time temperature, and P is real-time pressure; the average diameter of the through holes is D1, the average diameter of the thickness measuring holes is D2, wherein alpha is an empirical constant; at the moment, the through hole of the crucible is cylindrical, the average diameter D1 is 3mm, the thickness measuring hole of the heat-insulating felt is cylindrical, the average diameter D2 is 3mm, and alpha is 5.1.

Step S303: substituting the real-time growth thickness h in step S302 into the formula: d2 × h tan (θ) + D0, where θ is the angle of the expanding growth, and D0 is the initial diameter of the crystal, i.e., the diameter of the seed crystal; d is the real-time growth diameter of the crystal; and (4) finishing the calculation of the growth data through the data of the thickness measuring hole which is closed in real time.

Step S4: comparing the real-time growth data of the silicon carbide in the step S3 with preset real-time growth data, and then adjusting the technological parameters of the silicon carbide crystal growth; the specific steps of the adjustment are as follows: the preset real-time growth data is a preset growth diameter, the preset growth data is a preset real-time growth diameter, and when the real-time growth diameter of the crystal is smaller than the preset real-time growth diameter, the temperature of the cavity is increased at the rate of 3 ℃/min or the pressure of the cavity is reduced at the rate of 15 Pa/h;

when the real-time growth diameter of the crystal is higher than the preset real-time growth diameter, cooling the cavity at the rate of 3 ℃/min, or boosting the cavity at the rate of 15 Pa/h;

the temperature and pressure of the chamber are maintained when the real-time growth diameter of the crystal is the same as the predetermined real-time growth diameter.

Step S5: and (5) repeating the steps S3-S4 until the thickness measuring hole on the crucible cover is completely sealed, cooling and inflating the cavity, opening the cavity when the temperature in the cavity is reduced to room temperature and the pressure reaches the atmospheric pressure, taking out the grown silicon carbide crystal, and finishing the crystal growth operation.

Example 6:

the embodiment of the application discloses a method for preparing a silicon carbide crystal by adopting a crystal growth chamber, which particularly aims at the condition of expanding growth; the average diameter D1 of the through holes of the crucible is 1 mm; the average diameter D2 of the thickness measuring holes of the heat preservation felt is 3 mm; and the empirical constant a is chosen to be 1.5 accordingly.

Adjusting step S4, wherein the preset growth data is a preset real-time growth diameter, and when the real-time growth diameter of the crystal is lower than the preset real-time growth diameter, the temperature of the cavity is increased at the rate of 1 ℃/min or the pressure of the cavity is reduced at the rate of 10 Pa/h;

when the real-time growth diameter of the crystal is higher than the preset real-time growth diameter, cooling the cavity at the rate of 1 ℃/min, or boosting the cavity at the rate of 10 Pa/h;

the temperature and pressure of the chamber are maintained when the real-time growth diameter of the crystal is the same as the predetermined real-time growth diameter.

The remaining steps were the same as in example 5.

Example 7

The embodiment of the application discloses a method for preparing a silicon carbide crystal by adopting a crystal growth chamber, in particular to the condition of expanding growth, wherein the average diameter D1 of a through hole of a crucible is 5 mm; the average diameter D2 of the thickness measuring holes of the heat preservation felt is 10 mm; and the empirical constant a is chosen to be 3.5 accordingly.

Adjusting step S4, wherein the preset growth data is a preset real-time growth diameter, and when the real-time growth diameter of the crystal is lower than the preset real-time growth diameter, the temperature of the cavity is increased at the rate of 5 ℃/min or the pressure of the cavity is reduced at the rate of 20 Pa/h;

when the real-time growth diameter of the crystal is higher than the preset real-time growth diameter, cooling the cavity at the rate of 5 ℃/min, or boosting the cavity at the rate of 20 Pa/h;

the temperature and pressure of the chamber are maintained when the real-time growth diameter of the crystal is the same as the predetermined real-time growth diameter.

The remaining steps were the same as in example 5.

Comparative example 1:

and (3) isometric growth: the existing silicon carbide crystal growth adopts silicon carbide powder as a raw material, and the initial temperature parameter is as follows: and (3) carrying out crystal growth at the temperature of 2200 ℃ and under the pressure of 500Pa, and finally, stopping the furnace.

Comparative example 2:

expanding growth, namely, the existing silicon carbide crystal growth adopts silicon carbide powder as a raw material, adopts an expanding grinding tool, and has the following initial temperature parameters: and (3) carrying out crystal growth at the temperature of 2200 ℃ and under the pressure of 500Pa, and finally, stopping the furnace.

The products obtained according to the six examples, and the two products obtained according to the conventional methods on the market, are used as a control group, and the table is as follows:

TABLE 1 isometric growth

TABLE 2 isometric growth

From the table 1 and the table 2, when the equal-diameter growth is carried out, the adjustment is carried out by adopting the mode of the embodiment 2-4, and the final growth thickness is always larger than the requirement of a customer, so that the crystal growth quality is ensured; during expanding growth, the method of the embodiment 5-7 is adopted for adjustment, and finally the actual growth diameter is always larger than the requirement of a customer, so that the quality of crystal growth is ensured.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.