阅读说明：本技术 元件侦测方法 (Element detection method ) 是由 倪崇胜 魏智斌 于 2020-06-10 设计创作，主要内容包括：本发明涉及一种元件侦测方法,执行于电子装置的电脑辅助设计软件,侦测方法包含：建立最大包络空间,其中最大包络空间的体积不小于结构组件的体积,根据最大包络空间建立侦测空间模型,其中侦测空间模型包含结构组件的待侦测面,选取位于结构组件的表面的元件,以取得结构组件的元件的元件信息,其中侦测空间模型包含元件的至少一部分,以及汇出包含元件信息的元件清单。(The invention relates to a component detection method, which is executed in computer aided design software of an electronic device and comprises the following steps: establishing a maximum envelope space, wherein the volume of the maximum envelope space is not less than the volume of the structural component, establishing a detection space model according to the maximum envelope space, wherein the detection space model comprises a surface to be detected of the structural component, selecting an element positioned on the surface of the structural component to obtain element information of the element of the structural component, wherein the detection space model comprises at least one part of the element, and summarizing an element list comprising the element information.)

1. A component detection method implemented in computer aided design software of a computer readable recording medium, the component detection method comprising:

establishing a maximum envelope space, wherein the volume of the maximum envelope space is not less than the volume of the structural component;

establishing a detection space model according to the maximum envelope space, wherein the detection space model comprises a surface to be detected of the structural component;

selecting an element on the surface of the structural component to obtain element information of the element of the structural component, wherein the detection space model comprises at least one part of the element; and

and drawing out a component list containing the component information.

2. The method of claim 1, wherein the maximum envelope space has a surface, and modeling the detection space according to the maximum envelope space comprises:

establishing an initial space model adjacent to the maximum envelope space, wherein an initial surface of the initial space model is attached to the surface of the maximum envelope space; and

moving the initial surface toward the surface to be detected to make the initial space model include the surface to be detected, and defining the initial space model including the surface to be detected as the detection space model.

3. The method as claimed in claim 2, wherein moving the initial surface toward the surface to be detected comprises:

moving the initial surface through the surface to be detected to form the detection space model, and defining the initial surface of the detection space model as a detection surface.

4. The method as claimed in claim 3, wherein moving the initial surface through the surface to be detected to form the detection space model comprises:

moving the initial surface to make the detecting surface and the surface to be detected have a preset distance.

5. The method as claimed in claim 4, wherein the surface of the structural member to be detected includes a substrate, the predetermined distance is a thickness of the substrate, and the thickness direction is parallel to the detection surface.

6. The method of claim 1, further comprising, after obtaining the device information and before compiling the device list including the device information:

and screening the component list related to the structural component from a pre-stored component list according to the component information.

7. The device detection method as claimed in claim 1, wherein after obtaining the device information, the detection method further comprises:

judging whether a pre-stored element list contains the element information or not; and

when the pre-stored component list is judged not to contain the component information, the pre-stored component list is updated according to the component information.

8. The method of claim 7, wherein when the pre-stored device list is determined not to contain the device information, the method further comprises:

storing the computer aided design file related to the element information into a memory.

9. The method of claim 1, wherein obtaining the maximum envelope space comprises:

establishing a coordinate system containing the structural component; and

the space occupied by the structural component is taken as the maximum envelope space, or the surface of the structural component is expanded towards the direction far away from the structural component, so as to define the maximum envelope space in the coordinate system.

Technical Field

The present invention relates to a device detection method, and more particularly, to a device detection method capable of rapidly detecting a device.

Background

Computer Aided Design (CAD) refers to a Computer drawing software by which a user can draw a complicated one-dimensional or multi-dimensional Design drawing, and thus, the CAD software has been widely used for drawing model drawings such as mechanical drawings, architectural drawings, and electrical drawings.

In addition, when the outer package is designed according to the shape of the structural component, users often use computer aided design software to assist in the outer package design of the structural component. However, the existing computer aided design software cannot quickly determine and select the components located on the outer surface of the structural component, and the execution mode of the existing computer aided design software for determining the surface components of the structural component still depends on the user to manually select the components one by one in the computer aided design software, so that the whole design process is time-consuming and labor-consuming, and the risk of misjudgment caused by manual operation exists. In particular, when the structural component is, for example, a server board, the outer surface thereof usually has a more complex structure due to the arrangement of various elements, for example, the elements have different sizes, shapes, heights, etc., thereby further increasing the time for judging the surface elements of the structural component.

Disclosure of Invention

In view of the foregoing, the present invention provides a device detection method that satisfies the above-mentioned needs.

According to an embodiment of the present invention, a method for detecting a device, executed on computer aided design software of an electronic device, includes: establishing a maximum envelope space, wherein the volume of the maximum envelope space is not less than the volume of the structural component; establishing a detection space model according to the maximum envelope space, wherein the detection space model comprises a surface to be detected of the structural component; selecting an element on the surface of the structural component to obtain element information of the element of the structural component, wherein the detection space model comprises at least one part of the element; and drawing out a component list containing the component information.

In summary, according to the device detection method shown in one or more embodiments of the present invention, the devices on the surface of the structural component can be rapidly detected to determine which devices are on the surface of the structural component, and meanwhile, the risk of erroneous determination caused by manual operation is reduced. Therefore, when the outer package of the structural component is designed and the outer surface of the structural component has a more complex structure, compared with the prior art in which the elements are manually selected one by one, the element detection method of the present invention can speed up obtaining the element list on the surface of the structural component, thereby greatly reducing the time for detecting the elements and generating the element list and understanding the outer package of the structural component more quickly. In addition, according to the component detection method of one or more embodiments of the present invention, when other components that are easily loosened are disposed around the component, the component information may help a user design an outer package of the structural component.

The foregoing description of the disclosure and the following description of the embodiments are provided to illustrate and explain the spirit and principles of the invention and to provide further explanation of the invention as claimed.

Drawings

Fig. 1 is a flowchart illustrating a device detection method according to an embodiment of the invention.

Fig. 2 is a detailed flowchart according to step S10 of fig. 1.

Fig. 3A and 3B are schematic diagrams illustrating a device detection method according to an embodiment of the invention.

Fig. 3C is a side view illustrating fig. 3B.

Fig. 4A is a detailed flowchart illustrating step S20 of fig. 1.

Fig. 4B is a detailed flowchart illustrating step S201 of fig. 4A.

Fig. 5 is a flowchart illustrating a device detection method according to another embodiment of the invention.

Description of reference numerals:

100 structural assembly

110 surface to be detected

120 element

200 maximum envelope space

210 noodles

300a initial space model

310a initial surface

300b detection space model

310b detection surface

320 preset distance

X-Y-Z coordinate system

Detailed Description

The detailed features and advantages of the present invention are described in detail in the following embodiments, which are sufficient for anyone skilled in the art to understand the technical contents of the present invention and to implement the present invention, and the related objects and advantages of the present invention can be easily understood by anyone skilled in the art from the disclosure of the present specification, the claims and the drawings. The following examples further illustrate aspects of the invention in detail, but are not intended to limit the scope of the invention in any way.

The element detection method disclosed by the invention can be used for detecting one or more elements on the surface of the structural component and obtaining an element list of the elements. Taking a server motherboard as an example of a structural component, the surface of the server motherboard has components such as a chip, a passive component, a connection port, etc., and the component detection method disclosed by the invention can be used for detecting the components on the surface so as to obtain a list of the components on the surface of the server motherboard.

In addition, the device detection method disclosed in the present invention is preferably implemented in Computer Aided Design (CAD) software of an electronic device. For example, the electronic device is a computer, and the computer is equipped with computer aided design software, wherein the computer aided design software is AutoCAD, Pro/Engineer, SolidWorks, etc., and the invention does not limit the type of the computer aided design software. In order to facilitate understanding of the present invention, the following description will be made by using an electronic device to execute the device detection method of the present invention.

Referring to fig. 1, fig. 1 is a flowchart illustrating a device detection method according to an embodiment of the invention.

Step S10: a maximum envelope space is established.

When the electronic device obtains the computer aided design file of the structural component, the electronic device can establish the maximum envelope space for coating the structural component, and the volume of the maximum envelope space is not less than that of the structural component. In other words, the volume of the maximum envelope space is preferably larger than the volume of the structural element, so that the maximum envelope space encloses the entire structural element, but when the maximum envelope space encloses the structural element completely, the volume of the maximum envelope space may be the same as the volume of the structural element. The manner in which the maximum envelope space is established will be described in further detail below in conjunction with fig. 2.

Step S20: and establishing a detection space model according to the maximum envelope space.

That is, after the electronic device obtains the maximum envelope space, the detection space model may be established according to the maximum envelope space, so that the detection space model includes a to-be-detected surface of the structural element, and by making the detection space model include the to-be-detected surface of the structural element, the detection space model may further include at least a portion of the component located on the surface of the structural element.

In particular, at least a portion of the element is, for example, a surface, a protrusion, etc. of the element, and the detection space model includes, for example, at least a portion of the element including a partial structure of the element or contacting a portion of the element (for example, detecting the space model contacts a surface, a line segment, a point, etc. of the element), and the detection space model may also include the whole element. The detailed implementation of step S20 will be described in detail later.

Step S30: selecting a component on the surface of the structural component to obtain component information.

Since the detection space model includes at least a portion of the components on the surface of the structural component, the electronic device can select the components included in the detection space model and obtain component information, wherein the component information includes, for example, names, types, sizes, and installation positions of the components. In addition, the element information may also contain element information for other elements surrounding the element, and thus may assist a user in designing an outer package for the structural assembly when there are more easily releasable elements surrounding the element.

Step S40: and drawing out a component list containing component information.

For example, when the components included in the detection space model are multiple components, the electronic device extracts the component list, for example, the component information of the multiple components included in the detection space model is integrated into the component list, and the component list is extracted. The exported component list can be output to the terminal device for presentation or stored in a memory for later access. In addition, the memory may be pre-stored with a pre-stored component list, and the pre-stored component list may include, for example, component names and the like of all components to be disposed in the structural component, so that the electronic device may screen out component information associated with the structural component from the pre-stored component list according to the component information to establish and export the component list.

Since the component list contains component information, the component list can be applied to the packaging design of the structural component. For example, the component list may be used to determine whether there is a particularly protruding or easily-falling portion on the structural component, so as to understand the structure of the outer package of the structural component more quickly, but the application of the component list is not limited by the present invention.

Referring to fig. 2, fig. 2 is a detailed flowchart according to step S10 of fig. 1, wherein step S10 of fig. 1 is "establish maximum envelope space", which includes step S101, step S103 and step S105.

Step S101: a coordinate system is established that includes the structural component.

That is, as shown in fig. 3A, the electronic device first establishes an X-Y-Z coordinate system according to the structural component 100, so as to subsequently establish a maximum envelope space, various space models, and the like, wherein the X-Y-Z coordinate system is only an example, that is, the coordinate system is preferably a three-dimensional coordinate system, but may also be a one-dimensional or two-dimensional coordinate system, and the invention does not limit the dimensions of the coordinate system.

Step S103: the space occupied by the structural components is taken as the maximum envelope space.

After establishing the X-Y-Z coordinate system, the electronic device can use the space occupied by the structural component 100 as the maximum envelope space 200 to define the maximum envelope space 200 in the X-Y-Z coordinate system. In other words, the volume of the maximum envelope space 200 may be the same as the volume of the structural component 100, such that the maximum envelope space 200 may at least envelop the entire structural component 100.

Step S105: with the surface of the structural component expanding in a direction away from the structural component.

That is, the maximum envelope space 200 may be established in such a manner that, in addition to the space occupied by the structural component 100 as the maximum envelope space 200 shown in step S103, the outer surface of the structural component 100 is expanded in a direction away from the structural component 100, and the volume of the maximum envelope space 200 formed is larger than that of the structural component 100, so as to define the maximum envelope space 200 that can enclose the entire structural component 100 in the X-Y-Z coordinate system.

After the maximum envelope space 200 is defined (step S10 shown in fig. 1), the electronic device may perform step S20 shown in fig. 1: and establishing a detection space model according to the maximum envelope space. An embodiment of establishing the detection space model (step S20 shown in fig. 1) will be described below with reference to fig. 3A, 3B, and 3C and fig. 4A and 4B. Please refer to fig. 3A-3C and fig. 4A together, wherein fig. 3A and 3B are schematic diagrams illustrating a device detection method according to an embodiment of the invention; fig. 3C is a side view showing fig. 3B; fig. 4A is a detailed flowchart illustrating step S20 of fig. 1, which includes step S201 and step S203.

Step S201: an initial spatial model is established adjacent to the maximum envelope space.

In detail, as shown in fig. 3A, the maximum envelope space 200 has a surface 210, and the initial surface 310a of the initial space model 300a is attached to the surface 210 of the maximum envelope space 200, and the area of the initial surface 310a is preferably not smaller than the area of the surface 210 of the maximum envelope space 200. In other words, the initial spatial model 300a has an initial surface 310a, and the initial surface 310a and the surface 110 to be detected of the structural component 100 are respectively located on two different sides of the surface 210 of the maximum envelope space 200 (the surface 110 to be detected of the structural component 100 is located on one side of the surface 210, and the initial surface 310a of the initial spatial model 300a may be adjacent to the surface 210 and located on the other side of the surface 210).

Step S203: and moving the initial surface towards the surface to be detected, and defining an initial space model containing the surface to be detected as a detection space model.

When the initial surface 310a of the initial spatial model 300a is adjacent to the surface 210, the electronic device may move the initial surface 310a toward the surface 110 to be detected, such that the initial spatial model 300a includes the detection surface 110, and define the initial spatial model 300a including the detection surface 110 as the detection spatial model 300 b. That is, when the initial surface 310a and the surface to be detected 110 are both located on the same side of the surface 210 of the maximum envelope space 200, and the initial spatial model 300a includes a portion of the device 120, the initial spatial model 300a can be used as the detection spatial model 300B shown in fig. 3B and 3C.

After obtaining the detection space model 300b, the electronic device may execute step S30 shown in fig. 1 to select the component 120 located on the surface of the structural component 100 to obtain component information. That is, after obtaining the detection space model 300B, since the detection space model 300 includes at least a portion of the component 120 (e.g., the gray portion of the component 120 shown in fig. 3B and 3C), the electronic device can determine that the surface of the structural component 100 at least includes the component 120, and can determine the boundary position of the component 120, and accordingly obtain the component information of the component 120.

In addition, the component 120 shown in fig. 3A-3C is disposed on the surface of the structural component 100, however, the component 120 may also be a connection port, a slot, etc., and the electronic device may determine the component information of the connection port, the slot, etc. by determining that the surface of the structural component 100 included in the detection space model 300b is not a continuous surface.

Please refer to fig. 3A-3C and fig. 4B, wherein fig. 4B shows a detailed flowchart of step S203 of fig. 4A, which includes step S2031 and step S2033. The manner in which the electronic device performs step S203 (moving the initial surface 310a toward the surface to be detected 110 and defining the initial spatial model 300a including the surface to be detected 110 as the detected spatial model 300B) can be implemented by steps S2031 and S2033 shown in fig. 4B.

Step S2031: and moving the initial surface to pass through the surface to be detected to form a detection space model.

As shown in fig. 3A and 3B, the electronic device establishes an initial spatial model 300a, and an initial surface 310a of the initial spatial model 300a moves from the surface 210 attached to the maximum envelope space 200 as shown in fig. 3A toward the surface to be detected 110, and moves the initial surface 310a through the surface to be detected 110 to form a detection spatial model 300B.

Step S2033: defining an initial surface of the detection space model as a detection surface.

After the initial surface 310a passes through the surface to be detected 110 and forms the detection space model 300b, the electronic device may define the initial surface 310a of the detection space model 300b as the detection surface 310 b. In other words, the electronic device may define the initial surface 310a passing through the surface to be detected 110 as the detection surface 310 b.

In other words, the initial spatial model 300a (corresponding to the initial surface 310a) and the detection spatial model 300b (corresponding to the detection surface 310b) may have the same shape, which is different only in the relative position with respect to the detection surface 100. The initial spatial model 300a and the detection spatial model 300b may have different shapes, that is, the electronic device may not move the position of the entire initial spatial model 300a, but only expand the initial surface 310a of the initial spatial model 300a to a position where the surface to be detected 110 is located on the same side of the surface 210 of the maximum envelope space 200, so as to obtain the detection surface 310b, where the volume of the detection spatial model 300b is larger than that of the initial spatial model 300 a.

Whether the detection space model 300b is formed by moving the entire initial space model 300a or by expanding only the initial surface 310a of the initial space model 300a, the detection space model 300b is preferably formed to include a portion of the device 120 to form a device list. Therefore, as shown in fig. 3B, the initial surface 310a passing through the surface to be detected 110 can be used as the detection surface 310B, and the initial spatial model 300a having the initial surface 310a can be used as the detection spatial model 300B.

Referring to fig. 4A and 4B, it should be noted that if the initial surface 310a of the initial spatial model 300a is formed at the position of the detection surface 310B, the electronic device may omit step S201 and directly execute step S203 to use the initial surface 310a as the detection surface 310B.

In addition, the "movement" in step S2031 may be that the initial surface 310a passes through a moving path to move the initial surface 310a to the position of the detection surface 310b, or that the initial surface 310 directly jumps to the position of the detection surface 310 b. To describe step S2031 (moving the initial surface 310a through the surface to be detected 110 to form the detection space model 300B) in more detail, please refer to fig. 3C, and fig. 3C shows a side view of fig. 3B.

In detail, the electronic device can move the initial surface 310a through the surface to be detected 110, so that the detecting surface 310b has a predetermined distance from the surface to be detected 110. The predetermined distance 320 may be a distance set according to a user instruction, or a thickness of the substrate of the structural assembly 100 may be used as the predetermined distance 320. For example, the surface 110 to be detected of the structural component 100 has a substrate for carrying the element 120, and the distance between the element 120 and the surface 110 to be detected is determined by the thickness of the substrate. Therefore, the electronic device can obtain the predetermined distance 320 according to the thickness of the substrate, so that the detection space model 300b can include at least a portion of the component 120.

In addition, the present invention is only described with reference to one of the surfaces (the surface 100 to be detected) of the structural component 100, however, the electronic device may also establish an initial/detection space model including the remaining five surfaces of the structural component 100 or an initial/detection space model including one or more line segments of the structural component 100 to accurately detect the components on the surface of the structural component 100, and the electronic device may also detect the components on the surface 110 to be detected, in addition to the components 120. In other words, when the electronic device selects the component 120 located on the surface of the structural component 100, the electronic device may also select the component on the surface to be detected 110 and the component on the surface adjacent to the surface to be detected 110.

Referring to fig. 5, fig. 5 is a flowchart illustrating a device detection method according to another embodiment of the invention. After obtaining the component information in step S30 shown in fig. 1, the electronic device may perform step S50, step S51 and step S52 in addition to step S40 to directly export the component list.

S50: and judging whether the pre-stored element list contains element information.

When the electronic device determines that the pre-stored component list includes component information, the electronic device can screen out the component information associated with the structural component from the pre-stored component list, and execute step S40 to obtain the component list.

On the contrary, when the electronic device determines that the pre-stored component list does not include the component information, the electronic device may execute step S51: and updating the pre-stored element list with the element information. Taking the components 120 shown in fig. 3A-3C as an example, when the electronic device determines that the pre-stored component list does not include the component information of the components 120, the electronic device can add the component information of the components 120 to the pre-stored component list to update the pre-stored component list. Accordingly, in the process of the element detection method executed later, if the element 120 is detected, the electronic device can directly screen out the element information of the element 120 from the pre-stored element list and export the element list, without updating the pre-stored element list with the element information of the element 120 again.

In addition, when the pre-stored component list is determined not to contain component information in step S50, it indicates that the memory of the electronic device may not store the computer aided design file associated with the component information. Therefore, when it is determined that the pre-stored component list does not include component information, the electronic device may perform step S52.

Step S52: and storing the computer aided design file related to the element information into a memory.

Continuing with the example of the component 120 shown in fig. 3A-3C, if the pre-stored component list does not include the component information of the component 120, it indicates that the computer aided design file of the component 120 should not be stored in the memory. Therefore, by storing the computer aided design file of the component 120 in the memory accessible to the electronic device, the user can not only open the computer aided design file of the component 120 at any time without establishing the computer aided design file of the component 120 again, but also effectively save the storage space of the memory by only storing the computer aided design file of the component 120.

Please refer to fig. 5, it should be noted that the step S51 shown in fig. 5 is executed before the step S52, but the step S51 may be executed after the step S52. In addition, when the electronic device determines in step S50 that the pre-stored component list does not include component information, the electronic device may perform step S40 of exporting the component list after step S51 or step S52 is completed, and the execution sequence of steps S40, S51, and S52 is not limited.

When the electronic device executes the computer aided design software, the electronic device preferably further presents a user interface for receiving a user instruction, so that a user can select and adjust the position and the direction of the initial surface by himself or herself, and can select whether to display the initial/detection space model and the initial/detection surface at each position and direction on the screen.

In summary, according to the device detection method shown in one or more embodiments of the present invention, the devices on the surface of the structural component can be rapidly detected to determine which devices are on the surface of the structural component, and meanwhile, the risk of erroneous determination caused by manual operation is reduced. Therefore, when the outer package of the structural component is designed and the outer surface of the structural component has a more complex structure, compared with the prior art in which the elements are manually selected one by one, the element detection method of the present invention can also speed up obtaining the element list on the surface of the structural component, thereby greatly reducing the time for detecting the elements and generating the element list and understanding the outer package of the structural component more quickly. In addition, according to the component detection method of one or more embodiments of the present invention, when other components that are easily loosened are disposed around the component, the component information may help a user design an outer package of the structural component.

In an embodiment of the present invention, the server of the present invention may be used for Artificial Intelligence (AI) operation and Edge Computing (Edge Computing), and may also be used as a 5G server, a cloud server or a car networking server.